Electric connector, signal transmission device and dilution refrigerator

Abstract

The invention provides an electric connector, a signal transmission device and a dilution refrigerator, and relates to the technical field of quantum computing, and the electric connector comprises a heat sink housing which is provided with a through accommodation space in an insertion direction and is suitable for being installed on a cold disc of the dilution refrigerator of a superconducting quantum computer; the heat conduction assembly is mounted in the accommodating space and comprises a plurality of heat conduction insulating sheets which are arranged in parallel at intervals; and the plurality of electric connection assemblies are respectively arranged in two adjacent heat-conducting insulating sheets and are configured to respectively electrically connect the plurality of terminals of the two plugs inserted into the accommodating space in opposite directions and transmit the heat of the terminals to the cold disc through the heat-conducting insulating sheets and the heat sink shell, and the cold disc can fully cool the plurality of terminals of the two plugs.

Description

Technical Field

[0001] This invention relates to the field of quantum computing technology, and more specifically, to an electrical connector, a signal transmission device, and a dilution refrigerator. Background Technology

[0002] The dilution refrigerator is a crucial component of the superconducting quantum computer. The quantum computing chip is located in a low-temperature region at the bottom of the dilution refrigerator, on the order of mK (millikelvin). The quantum computing chip requires a vacuum and extremely low-temperature operating environment to achieve its ideal performance. The quantum computing chip is connected to the cold plate of the dilution refrigerator and to the control and testing components, which are at room temperature, via signal transmission cables. These signal transmission cables are also located in a vacuum and extremely low-temperature environment. They pass through the extremely low-temperature internal space of the quantum computer from the outside and connect to the quantum computing chip. Since the external environment is at room temperature, heat from the external environment is transferred into the interior of the dilution refrigerator through thermal conduction. Furthermore, when current flows through the signal transmission cables, the resistance causes the cables themselves to generate heat.

[0003] Currently, signal transmission cables are cooled by passing through the cold plate of the dilution refrigerator. However, the contact area between the signal transmission cable and the cold plate is small, resulting in an unsatisfactory cooling effect. Moreover, a single signal transmission cable is composed of multiple parts, with each detachable connector being a contact point. Existing single signal transmission cables have as many as 48 contact points, and the contact resistance at the connectors can severely affect signal transmission and increase signal loss. Summary of the Invention

[0004] To address at least one of the technical problems in the prior art, embodiments of the present invention provide an electrical connector, a signal transmission device, and a dilution refrigeration unit, wherein the cold plate is capable of sufficiently cooling multiple terminals of two plugs.

[0005] The present invention provides an electrical connector comprising: a heat sink housing having a through-space in the insertion direction, suitable for mounting on a cold plate of a dilution refrigerator for a superconducting quantum computer; a thermally conductive assembly mounted within the through-space, comprising a plurality of parallel-spaced thermally conductive insulating sheets; and a plurality of electrical connection assemblies respectively mounted in two adjacent thermally conductive insulating sheets, configured to electrically connect the plurality of terminals of two plugs inserted into the through-space in opposite directions, and to transfer heat from the terminals to the cold plate through the thermally conductive insulating sheets and the heat sink housing.

[0006] Optionally, each of the above-mentioned electrical connection components includes: a support housing having a U-shaped cross-section, the support housing being mounted between two adjacent thermally conductive insulating sheets and configured to receive terminals of the plug; a first thermally conductive block disposed within the support housing, configured to be electrically connected to the terminals of the two plugs and to transfer heat from the terminals to the thermally conductive insulating sheets through the support housing; and an elastic sheet disposed between the first thermally conductive block and the bottom of the support housing, so that when the terminals are inserted into the support housing, the first thermally conductive block conforms to the terminals.

[0007] Optionally, each of the aforementioned support housings has a limiting piece at both ends that bends toward the two support arms of the aforementioned support housing, the limiting piece being configured to restrict the first heat-conducting block and the elastic piece between the two support arms.

[0008] Optionally, the first heat-conducting block has a groove, which is configured to absorb the deformation of the first heat-conducting block due to temperature changes.

[0009] Optionally, the above-mentioned heat-conducting component further includes: a plurality of limiting members, respectively disposed between two adjacent heat-conducting insulating sheets, to limit the spacing between the two adjacent heat-conducting insulating sheets.

[0010] Another embodiment of the present invention provides a signal transmission device, comprising: the aforementioned electrical connector; two transmission components, each of the transmission components comprising a connecting wire and a plug connected to the end of the connecting wire, the two plugs being inserted into the electrical connector in opposite directions, such that multiple wires belonging to two sets of the connecting wires are electrically connected respectively.

[0011] Optionally, each set of the above-mentioned connecting lines further includes: two first shielding layers stacked on top of each other; a plurality of second shielding layers, which are arranged in parallel and spaced apart between the two of the above-mentioned first shielding layers, and each of the above-mentioned conductors is arranged in a space defined by the two adjacent of the two above-mentioned second shielding layers and the two above-mentioned first shielding layers.

[0012] Optionally, both the first shielding layer and the second shielding layer are made of superconducting materials and are configured to enter the superconducting state in response to the external environment decreasing to the superconducting transition temperature, so as to shield the external magnetic field.

[0013] Optionally, each of the plugs includes: a support assembly including a base and support portions extending parallel to and spaced apart from the base, wherein the portion of the connecting wire extending beyond the second shielding layer is attached to the side of the support portion facing the first heat-conducting block of the electrical connection assembly to form a terminal; and a second heat-conducting block configured to connect the end of the connecting wire to the base via a first connector and to the heat sink housing via a second connector to transfer heat from the connecting wire to the heat sink housing.

[0014] Another embodiment of the present invention provides a dilution refrigerator, comprising: a multi-stage cold plate; a quantum computing chip disposed below the multi-stage cold plate; and a plurality of signal transmission devices, wherein electrical connectors of the signal transmission devices are respectively mounted on the cold plate, so as to realize signal transmission between the multi-stage cold plate and the quantum computing chip through the signal transmission devices, and to transfer the heat of the connection wires of the signal transmission devices to the cold plate through the electrical connectors.

[0015] According to an embodiment of the present invention, an electrical connector, a signal transmission device, and a dilution refrigerator are provided. The heat sink housing has a through-space in the insertion direction, suitable for installation on the cold plate of a dilution refrigerator for a superconducting quantum computer. A heat-conducting component is installed in the through-space and includes a plurality of parallel spaced heat-conducting insulating sheets. A plurality of electrical connection components are respectively installed in two adjacent heat-conducting insulating sheets and configured to electrically connect the plurality of terminals of two plugs inserted into the through-space in opposite directions, and to transfer the heat of the terminals to the cold plate through the heat-conducting insulating sheets and the heat sink housing. While realizing the electrical connection of the two plugs, the cold plate can fully cool the plurality of terminals of the two plugs. Attached Figure Description

[0016] Figure 1 This is a partial perspective view of a dilution refrigeration machine according to an embodiment of the present invention;

[0017] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;

[0018] Figure 3 This is a perspective view of an electrical connector according to an embodiment of the present invention;

[0019] Figure 4 This is a perspective view of a heat sink housing according to an embodiment of the present invention;

[0020] Figure 5 This is a perspective view of a heat-conducting component according to an embodiment of the present invention;

[0021] Figure 6 This is a perspective view of an electrical connection assembly according to an embodiment of the present invention;

[0022] Figure 7 This is a side view of an electrical connection assembly according to an embodiment of the present invention;

[0023] Figure 8 yes Figure 7 Cross-sectional view in the DD direction;

[0024] Figure 9This is a perspective view of a signal transmission device according to an embodiment of the present invention;

[0025] Figure 10 yes Figure 9 A magnified view of a section at point B in the middle;

[0026] Figure 11 This is a side view of a signal transmission device according to an embodiment of the present invention;

[0027] Figure 12 yes Figure 11 Cross-sectional view in the FF direction;

[0028] Figure 13 yes Figure 12 A magnified view of a section at point C;

[0029] Figure 14 This is a partially enlarged view of the connecting line according to an embodiment of the present invention;

[0030] Figure 15 This is a cross-sectional view of the connecting line according to an embodiment of the present invention;

[0031] Figure 16 yes Figure 9 A magnified view of a section at point E in the middle;

[0032] Figure 17 yes Figure 16 A magnified view of a section at point G.

[0033] In the accompanying drawings, the meanings of the reference numerals are as follows:

[0034] 1. Cold dishes;

[0035] 2. Heat sink shell;

[0036] 21. Main body;

[0037] 22. Installation Department;

[0038] 23. Install the ear;

[0039] 24. First through hole;

[0040] 25. Second through hole;

[0041] 26. Third through hole;

[0042] 3. Connecting cable;

[0043] 32. First shielding layer;

[0044] 33. Second shielding layer;

[0045] 34. Wire;

[0046] 341. Wire core;

[0047] 342. Insulation layer

[0048] 31. Plug;

[0049] 310. Terminal;

[0050] 4. Second heat-conducting block;

[0051] 5. Support components;

[0052] 51. Base;

[0053] 52. Support section;

[0054] 6. Thermally conductive insulating sheet;

[0055] 7. Limiting components;

[0056] 8. First heat-conducting block;

[0057] 9. Elastic components;

[0058] 10. Support shell;

[0059] 100. Bending section;

[0060] 101. Limiting plate;

[0061] 11. Thermal conductive components;

[0062] 110. Fourth through hole;

[0063] 12. Electrical connection components;

[0064] 13. Screws;

[0065] 14. First connecting component;

[0066] 15. Second connector. Detailed Implementation

[0067] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the invention. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the invention for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0068] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0069] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0070] When using expressions such as "at least one of A, B, and C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.). When using expressions such as "at least one of A, B, or C," the expression should generally be interpreted in accordance with the meaning commonly understood by a person skilled in the art (e.g., "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0071] The temperature of the cold plate in the dilution refrigerator of a superconducting quantum computer is generally 40mK or 50mK, while the operating temperature of the quantum computing chip located at the bottom of the dilution refrigerator is generally 10mK. The signal transmission cable connecting the multi-stage cold plate and the quantum computing chip transmits signals, which presents the problem of heat transfer from the high-temperature region to the low-temperature region. Although the signal transmission cable is cooled by passing through the cold plate of the dilution refrigerator, the contact area between the signal transmission cable and the cold plate is small, and the cooling effect is not ideal.

[0072] Figure 1 This is a partial perspective view of a dilution refrigeration machine according to an embodiment of the present invention. Figure 2 yes Figure 1 A magnified view of a portion of point A in the middle. Figure 3 This is a perspective view of an electrical connector according to an embodiment of the present invention. Figure 4 This is a perspective view of a heat sink housing according to an embodiment of the present invention. Figure 5 This is a perspective view of a heat-conducting component according to an embodiment of the present invention.

[0073] An electrical connector provided according to an embodiment of the present invention, such as Figures 1 to 5As shown, the electrical connector includes a heat sink housing 2, a thermally conductive assembly 11, and multiple electrical connection assemblies 12. The heat sink housing 2 has a through-hole in the insertion direction, suitable for mounting on the cold plate 1 of the dilution refrigerator of a superconducting quantum computer. The thermally conductive assembly 11 is mounted within the through-hole and includes multiple parallel-spaced thermally conductive insulating sheets 6. The multiple electrical connection assemblies 12 are respectively mounted in two adjacent thermally conductive insulating sheets 6 and are configured to insert two plugs 31 into the through-hole in opposite directions (see...). Figure 9 and Figure 16 , Figure 9 and Figure 16 Multiple terminals (which will be described in detail below) are electrically connected, and the heat from the terminals is transferred to the cold plate 1 through the thermally conductive insulating sheet 6 and the heat sink housing 2.

[0074] According to embodiments of the present invention, such as Figures 2-5 and Figure 10 (As described in detail below), the heat sink housing 2 includes a main body 21, mounting portions 22, and two mounting ears 23. The main body 21 has a receiving space extending through the insertion direction of the plug 31. Multiple first through holes 24 are formed on the side wall of the main body 21, and the heat-conducting assembly 11 is mounted in the receiving space using bolts passing through the multiple first through holes 24. Two mounting portions 22 extend laterally along the insertion direction on the main body 21, each with a second through hole 25, to facilitate connecting the two plugs 31 inserted into the receiving space to the mounting portion 22 using bolts. Two mounting ears 23 extend laterally along the length direction on the main body 21, each with a third through hole 26. The main body 21 is mounted on the cold plate 1 of the dilution refrigerator of the superconducting quantum computer using bolts passing through the third through holes 26 of the two mounting ears 23.

[0075] According to an embodiment of the present invention, the main body 21 is also provided with a plurality of weight reduction holes to meet the lightweight design requirements of the cold plate 1 installed on the dilution refrigeration unit.

[0076] According to an embodiment of the present invention, the heat sink housing 2 is made of oxygen-free copper, and the heat conduction component 11 is made of sapphire glass sheet, which is made of single-crystal alumina.

[0077] According to embodiments of the present invention, such as Figure 2 , Figure 3 , Figure 5As shown, the heat-conducting assembly 11 includes multiple parallel, spaced-apart thermally conductive insulating sheets 6. A gap is formed between adjacent thermally conductive insulating sheets 6, allowing multiple terminals of the two plugs 31 to be inserted in opposite directions. The thermally conductive insulating sheets 6 electrically insulate adjacent terminals. The thermally conductive insulating sheets 6 are made of sapphire glass, and their thermal conductivity at low temperatures far exceeds that of ordinary insulating materials, providing good thermal conductivity while ensuring insulation. Multiple electrical connection assemblies 12 are respectively installed in the gaps between adjacent thermally conductive insulating sheets 6, electrically connecting the multiple terminals of the two plugs 31 inserted in opposite directions into the accommodating space. The heat from the terminals is transferred to the cold plate 1 through the thermally conductive insulating sheets 6 and the heat sink housing 2. The cold plate 1 effectively cools the multiple terminals of the two plugs 31 through the thermally conductive insulating sheets 6 and the heat sink housing 2.

[0078] According to an embodiment of the present invention, each thermally conductive insulating sheet 6 has a plurality of fourth through holes 110 at the positions corresponding to the plurality of first through holes 24 opened on the side wall of the main body 21, so as to facilitate installation in the accommodating space by screws, and the material of the screws can be oxygen-free copper.

[0079] Figure 6 This is a perspective view of an electrical connection assembly according to an embodiment of the present invention. Figure 7 This is a side view of an electrical connection assembly according to an embodiment of the present invention. Figure 8 yes Figure 7 Cross-sectional view in the DD direction.

[0080] According to embodiments of the present invention, such as Figure 2 , Figure 3 , Figure 6 , Figure 7 and Figure 8 As shown, each electrical connection assembly 12 includes a support housing 10, a first heat-conducting block 8, and an elastic sheet 9. The support housing 10 is formed by bending and folding a single piece of material and has a U-shaped cross-section. The support housing 10 is mounted between two adjacent thermally conductive insulating sheets 6 and is configured to receive the terminals of the plug 31. The first heat-conducting block 8 is disposed within the support housing 10 and is configured to electrically connect with the terminals of the two plugs 31 to achieve electrical connection between the two terminals and transfer heat from the terminals to the thermally conductive insulating sheets 6 through the support housing 10. The elastic sheet 9 is disposed between the first heat-conducting block 8 and the bottom of the support housing 10 so that when the terminals are inserted into the support housing 10, the first heat-conducting block 8 fits against the terminals, achieving good electrical contact between the first heat-conducting block 8 and the terminals.

[0081] According to an embodiment of the present invention, the support housing 10 has a U-shaped cross section, the support housing 10 is installed in the gap between two adjacent thermally conductive insulating sheets 6, a gap is also formed between the two support arms of the support housing 10, and it is configured to receive the terminals of two plugs 31 inserted into the accommodating space in opposite directions.

[0082] According to an embodiment of the present invention, the support housing 10 is made of niobium-titanium alloy, which can shield electromagnetic interference from the external environment.

[0083] According to an embodiment of the present invention, the first heat-conducting block 8 is made of oxygen-free copper and is electrically connected to the terminals of the two plugs 31. It transfers the heat from the terminals to the thermally conductive insulating sheet 6 via the supporting housing 10, then to the heat sink housing 2 via the thermally conductive insulating sheet 6, and finally to the cold plate 1, thereby cooling the terminals. Due to temperature changes in the external environment, if the terminals of the two plugs 31 are electrically connected through direct contact, they will expand or contract, causing the shape and size of the terminals to decrease and potentially break, affecting usability. Therefore, the terminals of the two plugs 31 are electrically connected through the first heat-conducting block 8. The first heat-conducting block 8 enables the electrical connection between the terminals of the two plugs 31. At this point, the terminals of the two plugs 31 have only two contact points with the first heat-conducting block 8, reducing contact resistance, improving signal transmission quality, and reducing signal transmission loss.

[0084] According to an embodiment of the present invention, the elastic sheet 9 is wavy and is configured such that when the terminal is inserted into the gap between the two support arms of the support housing 10, the first heat-conducting block 8 presses against the terminal and fits against the terminal. The first heat-conducting block 8 is in full contact with the surfaces of the terminals of the two plugs 31, so that the heat of the terminal is fully transferred to the support housing 10 through the first heat-conducting block 8 while ensuring a good electrical connection.

[0085] According to embodiments of the present invention, such as Figure 7 and Figure 8 As shown, the bottom of the U-shape of each support housing 10 is located at both ends in the insertion direction. Figure 7 Both ends of the first heat-conducting block 8 and the elastic sheet 9 are provided with limiting plates 101 that bend towards the two support arms of the support housing 10. The limiting plates 101 are configured to restrict the first heat-conducting block 8 and the elastic sheet 9 between the two support arms.

[0086] According to an embodiment of the present invention, the limiting pieces 101 disposed at both ends of the bottom of each support housing 10 can restrict the first heat-conducting block 8 and the elastic piece 9 from moving out of the upper end or the upper part of the support housing 10.

[0087] According to embodiments of the present invention, such as Figure 3 , Figure 6 and Figure 7 As shown, the two support arms of each support housing 10 are located at both ends in the insertion direction. Figure 7The upper and lower ends of the housing are provided with outwardly bent portions 100, for example, the bent portions 100 are arc-shaped. The bent portions 100 are configured to abut against (or hang on) the upper and / or lower edge of one of the two thermally conductive insulating sheets 6 and the lower and / or upper edge of the other thermally conductive insulating sheet 6 in the insertion direction when the support housing 10 is installed between two adjacent thermally conductive insulating sheets 6.

[0088] According to an embodiment of the present invention, by providing bends 100 at both ends of each support housing 10 in the insertion direction, the support housing 10 can be confined between two adjacent thermally conductive insulating sheets 6. During the process of inserting the terminals of the two plugs 31 between the two support arms of the support housing 10, movement of the support housing 10 relative to the thermally conductive insulating sheets 6 in the insertion direction can be prevented. In addition, since the bends 100 are arc-shaped, the terminals of the two plugs 31 can be guided to initially insert between the two support arms of the support housing 10, and an elastic clamping force can be applied to the plugs 31.

[0089] According to embodiments of the present invention, such as Figure 8 As shown, the first heat-conducting block 8 has a groove, which is configured to absorb the deformation of the first heat-conducting block 8 due to temperature changes.

[0090] According to an embodiment of the present invention, the groove can provide space for the first heat-conducting block 8 to expand or contract in response to temperature changes in the external environment.

[0091] According to embodiments of the present invention, such as Figure 5 As shown, the heat-conducting assembly 11 also includes a plurality of limiting members 7, which are respectively disposed between two adjacent heat-conducting insulating sheets 6 to limit the spacing between the two adjacent heat-conducting insulating sheets 6.

[0092] According to an embodiment of the present invention, a plurality of limiting members 7 are respectively disposed between two adjacent thermally conductive insulating sheets 6. Each limiting member 7 has a plurality of fifth through holes corresponding to the position of the fourth through hole 110 opened on each thermally conductive insulating sheet 6, so as to allow screws to pass through. By tightening the screws, the elastic sheet 9 provides a pre-tightening force to the first thermally conductive block 8. Under the elastic action of the elastic sheet 9, the first thermally conductive block 8 is tightly attached to the terminals of the two plugs 31, and always maintains good contact even in low temperature environments.

[0093] According to an embodiment of the present invention, the plurality of limiting members 7 are made of sapphire glass sheets, and the material of the sapphire glass sheets is single crystal alumina.

[0094] Figure 9 This is a perspective view of a signal transmission device according to an embodiment of the present invention. Figure 10 yes Figure 9 A magnified view of a section at point B. Figure 11This is a side view of a signal transmission device according to an embodiment of the present invention. Figure 12 yes Figure 11 Cross-sectional view in the FF direction, Figure 13 yes Figure 12 A magnified view of a section at point C.

[0095] According to another embodiment of the present invention, a signal transmission device is provided, such as... Figure 9 , Figure 11 and Figure 12 As shown, the signal transmission device includes an electrical connector and two transmission components. Each of the two transmission components includes a connecting wire 3 and a plug 31 connected to the end of the connecting wire 3, as shown. Figure 10 As shown, the two plugs 31 are inserted into the electrical connectors in opposite directions, so that the multiple wires belonging to the two sets of connecting lines 3 are electrically connected respectively.

[0096] According to embodiments of the present invention, such as Figure 4 , Figure 5 and Figure 10 As shown, screw 13 passes through the first through hole 24 on the side wall of heat sink housing 2, through the fourth through hole 110 of multiple thermally conductive insulating sheets 6 and the fifth through hole of multiple limiting members 7, and installs the thermally conductive assembly 11 in the accommodating space.

[0097] According to embodiments of the present invention, such as Figures 2 to 8 As shown, when the terminals of the two plugs 31 are inserted into the gap between the two support arms of the support housing 10, the first heat-conducting block 8 is electrically connected to the terminals of the two plugs 31, and the conductive path between the terminals of the two plugs 31 is as follows. Figure 13 As indicated by the arrows, at this point, the terminals of the two plugs 31 have only two contact points with the first heat-conducting block 8, reducing contact resistance, improving signal transmission quality, and reducing signal transmission loss. Under the elastic action of the elastic sheet 9, the first heat-conducting block 8 is tightly attached to the terminals of the two plugs 31. The first heat-conducting block 8 transfers the heat from the terminals to the thermally conductive insulating sheet 6 through the supporting housing 10, and then from the thermally conductive insulating sheet 6 to the heat sink housing 2, and finally to the cold plate 1. The cold plate 1 can fully cool down the multiple terminals of the two plugs 31.

[0098] According to an embodiment of the present invention, the connecting line 3 in the transmission assembly is the largest source of heat leakage in the cryogenic platform. The heat leakage sources mainly include conductive heat leakage, Joule heating, radiative heat leakage, and contact heat leakage. Conductive heat leakage is the thermal conduction of the connecting line material and is the primary source of heat leakage. Joule heating is generated when current passes through the connecting line 3. Radiative heat leakage is the thermal radiation from the surface of the connecting line 3. Contact heat leakage is the thermal resistance of the contact surfaces between the connecting line 3 and the cold plate 1, and between the connecting line 3 and the quantum computing chip.

[0099] Figure 14This is a partially enlarged view of the connecting line according to an embodiment of the present invention.

[0100] According to embodiments of the present invention, in order to solve the problem of conductive heat leakage, such as Figure 12 and Figure 14 As shown, each set of connecting lines 3 also includes two first shielding layers 32 and multiple second shielding layers 33 stacked on top of each other. The multiple second shielding layers 33 are arranged in parallel and spaced between the two first shielding layers 32, and each conductor 34 is arranged within the space defined by the two adjacent second shielding layers 33 and the two first shielding layers 32.

[0101] According to an embodiment of the present invention, when the two first shielding layers 32 and the plurality of second shielding layers 33 are switched to the superconducting state, the thermal conductivity of the two first shielding layers 32 and the plurality of second shielding layers 33 will be significantly reduced compared with the non-superconducting state, thereby reducing the overall heat leakage. Furthermore, the connecting wire 3 is simple to manufacture and has high reliability.

[0102] According to an embodiment of the present invention, both the first shielding layer 32 and the second shielding layer 33 are made of superconducting materials and are configured to enter the superconducting state in response to the external environment decreasing to the superconducting transition temperature, so as to shield the external magnetic field.

[0103] According to an embodiment of the present invention, when the external environment is reduced to the superconducting transition temperature, the first shielding layer 32 and the second shielding layer 33 enter the superconducting state, have complete diamagnetism, and can completely shield external magnetic field interference.

[0104] According to an embodiment of the present invention, the superconducting material is any one of niobium, lead, tin, and niobium-titanium alloy.

[0105] According to embodiments of the present invention, some materials exhibit a sudden change in resistivity to zero and perfect diamagnetism when the temperature drops below a certain value (Tc). This state is called the superconducting state, and such materials are called superconducting materials. Tc is called the transition temperature of the superconducting material. Different superconducting materials have different transition temperatures. For example, the superconducting transition temperature of niobium (Nb) is 9.25 Kelvin (K), which is -263.9 degrees Celsius (°C); the superconducting transition temperature of lead (Pb) is 7.193 K; and the superconducting transition temperature of niobium-titanium alloy (Nb-Ti) is 9.5 K.

[0106] According to an embodiment of the present invention, the superconducting material is preferably a niobium-titanium alloy. Niobium-titanium alloys are suitable for the extremely low-temperature environment of dilution refrigerators, exhibiting stable performance and durability under these conditions. Furthermore, niobium-titanium alloys possess high mechanical strength, good resistance to deformation and stress, and can effectively shield electromagnetic interference, ensuring the accuracy of signal transmission between the multi-stage cold plate 1 and the quantum computing chip. Both the first shielding layer 32 and the second shielding layer 33 are made of niobium-titanium alloy. Niobium-titanium alloys provide uniform electromagnetic shielding, and their low thermal conductivity reduces heat conduction through the connecting wires 3, lowering heat leakage and significantly improving the overall performance of the superconducting quantum computer. With reduced heat leakage, a higher-power quantum computing system can be installed on the existing refrigerator platform with the same cooling capacity.

[0107] Figure 15 This is a cross-sectional view of the connecting line according to an embodiment of the present invention.

[0108] According to embodiments of the present invention, such as Figure 15 As shown, the first shielding layer 32 located below each conductor 34, the second shielding layer 33 located on both sides of each conductor 34, and the first shielding layer 32 located above each conductor 34 form a shielding space, and the multiple shielding spaces respectively shield the multiple conductors 34 from the external magnetic field.

[0109] According to embodiments of the present invention, such as Figure 12 and Figure 15 As shown, multiple second shielding layers 33 are arranged parallel to each other on the first shielding layer 32. Multiple wires 34 are respectively arranged between two adjacent second shielding layers 33. Multiple shielding spaces shield the multiple wires 34 from external magnetic fields. Each wire 34 is independently shielded, ensuring uniform shielding and effectively reducing electromagnetic interference. Furthermore, the independently shielded and parallel-arranged multiple wires 34 connect the multi-stage cold disk 1 and the quantum computing chip, which can effectively control thermal contraction from high-temperature regions to low-temperature regions, reduce stress concentration, reduce the generation of hot spots, ensure uniform current distribution in each wire 34, avoid local overheating or superconducting state damage, and improve the durability of the connection line 3.

[0110] According to embodiments of the present invention, such as Figure 15 As shown, each conductor 34 includes a conductor 341 and an insulation layer 342. The insulation layer 342 covers the outside of the conductor 341, so that the conductor 341 is electrically insulated from the two first shielding layers 32 and the second shielding layers 33 on the adjacent sides.

[0111] According to an embodiment of the present invention, the wire core 341 is electrically insulated from the two first shielding layers 32 and the second shielding layers 33 on adjacent sides by an insulation layer 342, which can effectively prevent electrical short circuits, ensure the safety of signal transmission, reduce signal interference and crosstalk, and maintain the accuracy of signal transmission. Furthermore, the insulation layer 342 can improve corrosion resistance and maintain chemical stability in the extremely low temperature environment of the dilution refrigeration unit, ensuring the long-term reliability of the connecting wire 3.

[0112] According to an embodiment of the present invention, the core 341 is made of any one of constantan alloy, copper-nickel alloy and copper-chromium alloy.

[0113] According to embodiments of the present invention, constantan alloy comprises 55% copper and 45% nickel, copper-nickel alloy comprises 90% copper and 10% nickel, or 70% copper and 30% nickel, and copper-chromium alloy comprises 98.8% copper and 1.2% chromium, or 99.5% copper and 0.5% chromium.

[0114] According to an embodiment of the present invention, the core 341 is preferably made of constantan alloy. Constantan alloy has stable resistivity and low thermal conductivity. The lower the thermal conductivity, the weaker the ability to conduct heat. The thermal conductivity of constantan alloy is approximately 20~30 W / (m·K). If constantan alloy is used for core 341, heat loss can be effectively reduced when signal transmission occurs between the multi-stage cold disk 1 and the quantum computing chip. That is, the transfer of heat from the high-temperature region to the low-temperature region is reduced, so that the temperature of the low-temperature region is maintained at 10mK.

[0115] According to an embodiment of the present invention, the insulating layer 342 is made of any one of polyurethane, polyimide, polyesterimide, and polyurethaneimide.

[0116] According to embodiments of the present invention, polyurethane has the advantage of good high-frequency resistance, polyimide has the advantages of high temperature resistance and high mechanical strength, and polyurethane-imide has good heat resistance and excellent welding performance.

[0117] According to an embodiment of the present invention, the insulating layer 342 may also be made of polyester or polyamide.

[0118] According to embodiments of the present invention, such as Figure 12 , Figure 14 and Figure 15 As shown, the gap between each wire core 341 and the two adjacent second shielding layers 33 is controlled, and the gap is filled by the insulation layer 342 during the fabrication of the connecting wire 3. Figure 14 The first shielding layer 32 and the insulation layer 342 of the conductor 34 are not shown above each conductor 34.

[0119] According to an embodiment of the present invention, the thickness of the two first shielding layers 32 and each second shielding layer 33 ranges from 0.04 mm to 0.06 mm.

[0120] According to an embodiment of the present invention, the thickness of the two first shielding layers 32 and each second shielding layer 33 can be any value among 0.04mm, 0.042mm, 0.044mm, 0.046mm, 0.048mm, 0.05mm, 0.052mm, 0.054mm, 0.056mm, 0.058mm and 0.06mm.

[0121] According to an embodiment of the present invention, the thickness of the two first shielding layers 32 and each second shielding layer 33 is preferably 0.05 mm.

[0122] According to an embodiment of the present invention, each conductor 34 is configured as a sheet, and the thickness of each conductor 34 ranges from 0.04 mm to 0.06 mm.

[0123] According to an embodiment of the present invention, the thickness of each conductor 34 can be any value among 0.04mm, 0.042mm, 0.044mm, 0.046mm, 0.048mm, 0.05mm, 0.052mm, 0.054mm, 0.056mm, 0.058mm and 0.06mm.

[0124] According to an embodiment of the present invention, the thickness of each conductor 34 is preferably 0.05 mm.

[0125] According to an embodiment of the present invention, each wire 34 is constructed in a sheet shape, which ensures that the first shielding layer 32 located below each wire 34, the second shielding layer 33 located on both sides of each wire 34, and the first shielding layer 32 located above each wire 34 uniformly cover the wire, making the electromagnetic shielding more uniform and effective, and reducing electromagnetic signal interference. Furthermore, the parallel-arranged sheet-like wires 34 enhance the mechanical stability of the wires 34, reducing deformation and stress caused by temperature changes. The sheet-like wires 34 have better vibration resistance, making them suitable for high-precision quantum computing environments. The sheet-like wires 34 can reduce the generation of hot spots, ensuring that the current is uniformly distributed within the wires 34, avoiding local overheating or damage to the superconducting state. Simultaneously, the parallel-arranged sheet-like wires 34 connect the multi-stage cold disk 1 and the quantum computing chip, effectively controlling thermal contraction from high-temperature regions to low-temperature regions. The sheet-like structure can better disperse thermal stress, improving the durability of the connecting wires 3.

[0126] Figure 16 yes Figure 9 A magnified view of a section at point E in the middle. Figure 16 The plug is shown in the image. Figure 17 yes Figure 16 A magnified view of a section at point G. Figure 17 The terminals are shown in the diagram.

[0127] According to embodiments of the present invention, such as Figures 2 to 17 As shown, each plug 31 includes a support assembly 5 and a second heat-conducting block 4. The support assembly 5 includes a base 51 and support portions 52 extending parallel to and spaced apart from the base 51. The portion of the connecting wire 3 extending beyond the second shielding layer 33 is attached to the side of the support portion 52 facing the first heat-conducting block 8 of the electrical connection assembly 12 to form a terminal 310. The second heat-conducting block 8 is configured to connect the end of the connecting wire 3 to the base 51 via a first connector 14 (e.g., a bolt) and to the heat sink housing 2 via a second connector 15 (e.g., a bolt) to transfer heat from the connecting wire 3 to the heat sink housing 2.

[0128] According to an embodiment of the present invention, the support component 5 is made of carbon fiber plastic, and the portion of the connecting wire 3 extending out of the second shielding layer 33 is attached to the side of the first heat-conducting block 8 facing the electrical connection component 12 of the support portion 52 to form a terminal 310, so as to be inserted into the gap formed between the two support arms of the support housing 10.

[0129] According to embodiments of the present invention, such as Figures 14 to 17 As shown, the portion of the conductor 34 extending out of the second shielding layer 33 near the support portion 52 may not require the removal of the first shielding layer 32.

[0130] According to an embodiment of the present invention, the second heat-conducting block 4 is made of oxygen-free copper, such as... Figures 2 to 12 As shown, the second heat-conducting block 4 connects the end of the connecting wire 3 to the base 51 through the first connector 14, and is connected to the heat sink housing 2 through the second through hole 25 of the mounting part 22 via the second connector 15, so as to transfer the heat of the connecting wire 3 to the heat sink housing 2, and then from the heat sink housing 2 to the cold plate 1.

[0131] According to another aspect of the present invention, a dilution refrigeration machine is provided, such as... Figure 1 and Figure 2 As shown, the dilution refrigerator includes a multi-stage cold plate 1, a quantum computing chip, and multiple signal transmission devices. The quantum computing chip is located below the multi-stage cold plate 1. The electrical connectors of the signal transmission devices are respectively installed on the cold plate 1 to realize signal transmission between the multi-stage cold plate 1 and the quantum computing chip, and to transfer the heat of the connecting wires 3 of the signal transmission devices to the cold plate 1 through the electrical connectors.

[0132] According to embodiments of the present invention, such as Figure 1 and Figure 14 As shown, multiple signal transmission devices are arranged around the circumference of each cold plate 1. The multiple signal transmission devices in each group are arranged in parallel. The connection line 3 of the signal transmission devices has a large density, and the contact points between the single wire 34 in the connection line 3 and the electrical connector are few, which improves the quality of signal transmission.

[0133] According to embodiments of the present invention, the electrical signals between the multi-stage cold disk 1 and the quantum computing chip include control signals, read signals, synchronization signals, calibration signals, monitoring signals, and error correction signals. Signal transmission between the multi-stage cold disk 1 and the quantum computing chip ensures the normal operation and precise control of the quantum computing chip. Control signals are microwave pulse signals that manipulate the state of qubits or gating signals that control the operation of quantum logic gates. Read signals are quantum state read signals that read the state of qubits or feedback signals generated from read results. Synchronization signals are clock signals that synchronize the operation of various components in the quantum computing chip or trigger signals that trigger the measurement process. Calibration signals are signals that calibrate the frequency and coupling strength of qubits or debugging signals that debug and optimize the performance of the quantum computing chip. Monitoring signals are signals that monitor the temperature of the quantum computing chip or magnetic field monitoring signals that monitor the magnetic field around the quantum computing chip. Error correction signals are error detection signals that detect errors during the quantum computing process or error correction signals that correct detected errors to ensure the accuracy of the calculation results.

[0134] Those skilled in the art will understand that the features described in the various embodiments and / or claims of the present invention can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention can be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All such combinations and / or combinations fall within the scope of the present invention.

[0135] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings and are not intended to limit the scope of protection of the present invention. Throughout the accompanying drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding the present invention, and the shapes and dimensions of the components in the drawings do not reflect actual size and proportion, but are only schematic representations of the embodiments of the present invention.

[0136] Unless otherwise stated, the numerical parameters in this specification and the appended claims are approximate values ​​and can be varied according to the desired characteristics obtained from the content of this invention. Specifically, all figures used in the specification and claims to indicate the content of components, reaction conditions, etc., should be understood to be modified by the term "about" in all cases. Generally, this means that there may be variations of ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments.

[0137] The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify the corresponding elements does not imply that the element has any ordinal number, nor does it represent the order of one element with another element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a named element to be clearly distinguished from another element with the same name.

[0138] Furthermore, unless specifically described or required to occur in a specific order, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the desired design. Moreover, the above embodiments can be used in combination with each other or with other embodiments based on design and reliability considerations; that is, technical features from different embodiments can be freely combined to form more embodiments.

[0139] The embodiments of the present invention have been described above. However, these embodiments are merely illustrative and not intended to limit the scope of the invention. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of the invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the invention, and all such substitutions and modifications should fall within the scope of the invention.

Claims

1. An electrical connector, characterized by, The heat sink shell has a receiving space through which a plug is inserted in a direction of insertion, and is adapted to be mounted on a cold plate of a dilution refrigerator of a superconducting quantum computer. The heat conducting assembly is mounted in the receiving space and includes a plurality of heat conducting insulation sheets arranged in parallel and spaced apart. The plurality of electrical connection assemblies are respectively mounted in two adjacent heat conducting insulation sheets and are configured to respectively electrically connect a plurality of terminals of two plugs inserted into the receiving space in opposite directions and to transfer heat of the terminals to the cold plate through the heat conducting insulation sheets and the heat sink shell. Each of the electrical connection assemblies includes:

2. The electrical connector of claim 1, wherein, a support shell having a U-shaped cross section, the support shell being mounted between two adjacent heat conducting insulation sheets and being configured to receive the terminals of the plugs; a first heat conducting block disposed in the support shell and configured to electrically connect the terminals of the two plugs and to transfer heat of the terminals to the heat conducting insulation sheets through the support shell; a resilient sheet disposed between the first heat conducting block and a bottom of the support shell to allow the first heat conducting block to conform to the terminals when the terminals are inserted into the support shell. Each of the support shells has two ends provided with limiting sheets bent towards two support arms of the support shell, the limiting sheets being configured to limit the first heat conducting block and the resilient sheet between the two support arms.

3. The electrical connector of claim 2, wherein, The first heat conducting block has a groove configured to absorb deformation of the first heat conducting block due to temperature changes.

4. The electrical connector of claim 2, wherein, The heat conducting assembly further includes:

5. The electrical connector of any of claims 1-4, wherein, a plurality of limiting members respectively disposed between two adjacent heat conducting insulation sheets to limit a spacing between the two adjacent heat conducting insulation sheets. The electrical connector includes:

6. A signal transmission device, characterized by comprising: two transmission assemblies, each of the transmission assemblies including a connection wire and a plug connected to an end of the connection wire, the two plugs being inserted into the electrical connector in opposite directions so that a plurality of conductive wires belonging to two groups of the connection wires are respectively electrically connected. Each of the connection wires further includes: two first shielding layers stacked on each other; 7. The signal transmission device of claim 6, wherein, a plurality of second shielding layers arranged in parallel and spaced apart between the two first shielding layers, each of the conductive wires being arranged in a space defined by two adjacent second shielding layers and two first shielding layers. The first shielding layers and the second shielding layers are made of superconducting material and are configured to enter a superconducting state in response to an external environment being lowered to a superconducting transition temperature to shield an external magnetic field. Each of the plugs includes:

8. The signal transmission device of claim 7, wherein, a support assembly including a base and support portions extending from the base in parallel and spaced apart, portions of the connection wires extending out of the second shielding layers being attached to sides of the support portions facing the first heat conducting blocks of the electrical connection assemblies to form terminals; 9. The signal transmission device of claim 7, wherein, a second heat conducting block configured to couple an end of the connection wire to the base through a first connecting member and to the heat sink shell through a second connecting member to transfer heat of the connection wire to the heat sink shell. The cold plate includes: a plurality of stages; 10. A dilution refrigerator, characterized by, a quantum computing chip disposed below the plurality of stages. ​ ​ A plurality of signal transmission devices according to any one of claims 6-9, an electrical connector of the signal transmission device is respectively mounted on the cold plate to realize signal transmission between the cold plate and the quantum computing chip through the signal transmission device, and heat of a connecting line of the signal transmission device is transmitted to the cold plate through the electrical connector.

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