Multi-layer subpad for chemical mechanical polishing process

Abstract

The invention provides a multi-layer subpad for a chemical mechanical polishing process. An apparatus includes: a top pad including a plurality of protrusions and a plurality of grooves between the plurality of protrusions; a first adhesive film under the top pad; and a first deformation resistant layer under the top pad and attached to the top pad by a first adhesive film. The first deformation resistant layer has a first hardness. The device also includes a second adhesive film underneath the first deformation resistant layer and a main support layer underneath and attached to the top mat by the second adhesive film. The main support layer has a second hardness lower than the first hardness.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor device technology, and more specifically to multilayer subpads for chemical mechanical polishing processes. Background Technology

[0002] With the continuous development of advanced manufacturing processes, the pursuit of smaller pitches necessitates an increasing emphasis on wafer surface planarization, particularly in photolithography. This underscores the growing importance of increasing precision in chemical mechanical polishing (CMP) processes. Consequently, there is a need for apparatus designed for CMP processes to achieve the precision required in CMP. Summary of the Invention

[0003] In one aspect, an apparatus is provided, comprising: a top pad including a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; a first adhesive film beneath the top pad; an anti-deformation layer beneath the top pad and attached to the top pad via the first adhesive film, wherein the anti-deformation layer has a first hardness; a second adhesive film beneath the anti-deformation layer; and a main support layer beneath the anti-deformation layer and attached to the anti-deformation layer via the second adhesive film, wherein the main support layer has a second hardness lower than the first hardness.

[0004] In one aspect, an apparatus is provided, comprising: a top pad including a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; an anti-deformation layer below the top pad, wherein the anti-deformation layer has a first compressibility value; and a main support layer below the anti-deformation layer, wherein the main support layer has a second compressibility value greater than the first compressibility value.

[0005] In one aspect, an apparatus is provided, comprising: a top pad including a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; a first adhesive film beneath the top pad; and a grooved main support layer beneath the top pad and attached to the top pad via the first adhesive film, wherein the grooved main support layer includes a plurality of second protrusions and a plurality of second grooves between the plurality of second protrusions. Attached Figure Description

[0006] The various aspects of this disclosure can be best understood by reading in conjunction with the accompanying drawings through the following detailed description. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, for clarity of discussion, the dimensions of the various features may be arbitrarily enlarged or reduced.

[0007] Figure 1 A bottom view of the buckle and sub-pad of an apparatus for a chemical mechanical polishing (CMP) process according to some embodiments is shown.

[0008] Figure 2A cross-sectional view of a polishing pad including multi-planar sub-pads according to some embodiments is shown.

[0009] Figure 3 A cross-sectional view of a polishing head pressed against a polishing pad comprising multi-planar sub-pads, according to some embodiments, is shown.

[0010] Figure 4 The layers in a polishing pad comprising multi-planar sub-pads are shown according to some embodiments.

[0011] Figure 5 A cross-sectional view of a polishing pad including grooved sub-pads according to some embodiments is shown.

[0012] Figure 6 A cross-sectional view of a polishing head pressed against a polishing pad including a grooved sub-pad, according to some embodiments, is shown.

[0013] Figure 7 The images show the layers in a polishing pad including grooved sub-pads according to some embodiments.

[0014] Figure 8 A cross-sectional view of a polishing pad including a hybrid sub-pad according to some embodiments is shown.

[0015] Figure 9 A cross-sectional view of a polishing head pressed against a polishing pad including a hybrid sub-pad, according to some embodiments, is shown.

[0016] Figure 10 The individual layers of a polishing pad including a hybrid sub-pad are shown according to some embodiments.

[0017] Figures 11 to 19 A view of some layers in a sub-pad according to some embodiments is shown.

[0018] Figures 20 to 22 A cross-sectional view of a grooved main support layer according to some embodiments is shown. Detailed Implementation

[0019] The following disclosure provides numerous different embodiments or examples for implementing various features of the invention. Specific examples of components and arrangements are described below to simplify this disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature on or over a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features may be formed between the first and second features such that the first and second features may not be in direct contact. Reference numerals and / or letters may be repeated in various examples in this disclosure. Such repetition is for the purpose of brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0020] Furthermore, spatially related terms (e.g., "below," "under," "lower," "overlapping," "upper," etc.) may be used herein to readily describe the relationship of one element or feature shown in the figures relative to another element(s) or feature(s). In addition to the orientations depicted in the figures, spatially related terms are also intended to encompass different orientations of the device during use or operation. The device may be oriented in other directions (rotated 90 degrees or in other orientations), and the spatially related descriptors used herein may be interpreted similarly accordingly.

[0021] Polishing pads comprising multiple sub-pads are provided for polishing wafers in chemical mechanical polishing (CMP) processes. According to some embodiments, the multiple sub-pad may include a polishing layer and a deformation-resistant layer beneath the polishing layer. According to some embodiments, the multiple sub-pad may include a deformation-resistant layer beneath the polishing layer. The multiple sub-pad may also (or alternatively) include a grooved main support layer beneath the polishing layer. The deformation-resistant layer is harder than the upper polishing layer and the lower main support layer. Therefore, the deformation-resistant layer has high resistance to sub-pad compression caused by deformation and buckling. The grooves in the grooved main support layer are more densely distributed than in the polishing layer, thus creating characteristics similar to freestanding cylinders. Therefore, the grooved main support layer can provide additional support for the polishing layer. The deformation-resistant layer and the grooved main support layer may also be combined as a hybrid layer in the sub-pad.

[0022] The embodiments discussed herein are intended to provide examples enabling the making or use of the subject matter of this disclosure, and modifications that can be made while remaining within the intended scope of the different embodiments will be readily understood by those skilled in the art. In the various views and illustrative embodiments, the same reference numerals are used to denote the same elements. While method embodiments may be discussed as being performed in a particular order, other method embodiments may be performed in any logical order.

[0023] Figure 1 A bottom view of a portion of a polishing apparatus 10 according to some embodiments is shown. Figure 1 Some of the features shown are also Figure 3 As shown in the cross-sectional view, the buckle 20 is formed as a ring and surrounds the circular area. (See figure.) Figure 1 and Figure 3 As shown, the top ring 22 is formed as a circular pad and is fixed in the retaining ring 20. The film 24 is below and attached to the top ring 22 and is used for buffering and providing uniform pressure to the wafer 28 below. The retaining ring 20, the top ring 22, and the film 24 together form the various parts of the polishing head 26.

[0024] The wafer 28 is surrounded by retaining rings 20 and attached to the film 24 below it, for example by vacuum suction. During the CMP process, retaining rings 20 prevent the wafer 28 from sliding out of the area directly below the film 24.

[0025] Figure 2 A cross-sectional view of a polishing pad 30 including a multi-planar sub-pad 31 according to some embodiments is shown. The polishing pad 30 includes a top pad 32 (alternatively referred to as polishing layer 32) at the top. The top pad 32 includes protrusions 32A and a recess 32B between the protrusions 32A. The top pad 32 is configured to retain slurry and abrasive in the recess 32B, such that the wafer 28 in contact with the top pad 32 can be polished during CMP processes. Figure 1 and Figure 3 Polishing and etching are performed.

[0026] Adhesive films 38 (including 38-1, 38-2, 38-3, etc.) are used to bond multiple layers in the polishing pad 30 together. As an example, some properties of adhesive films 38 are discussed below. Unless otherwise stated, other adhesive films throughout this specification may be selected from the same group of candidate materials as the adhesive film 38 discussed, and have the same material (and therefore the same properties) as the adhesive film 38 discussed.

[0027] According to some embodiments, the adhesive film 38 may have a Shore A hardness in the range of about 1 to about 100. The thickness of the adhesive film 38 may be in the range of about 0.025 mm to about 2.54 mm. According to some embodiments where the adhesive film 38 has a sufficiently high Shore A hardness, the adhesive film 38 helps to provide support for the sub-pad 31.

[0028] The adhesive film 38-1 is located below the top pad 32. According to some embodiments, the adhesive film 38-1 comprises or may be formed of a material selected from the group consisting of acrylic resins, epoxy resins, polyurethanes, and combinations thereof. Alternatively, the adhesive film 38-1 may comprise other synthetic materials or combinations of other synthetic materials with the aforementioned materials.

[0029] The multi-planar sub-pad 31 is located below the top pad 32 and attached to the top pad 32 via an adhesive film 38-1. According to some embodiments, the multi-planar sub-pad 31 includes a deformation-resistant layer 34, a main support layer 36, and may or may not include a stabilizing layer 40. The main support layer 36 and the stabilizing layer 40 are also referred to individually and collectively as support layers.

[0030] The anti-deformation layer 34 can be adhered to the top pad 32 via the adhesive film 38-1. According to some embodiments, the anti-deformation layer 34 is harder than the top pad 32 above and the support layers 36 and / or 40 below, giving it excellent resistance to deformation.

[0031] The anti-deformation layer 34 has the function of resisting the downward pressure applied by the polishing head 26 and reducing the deformation of the polishing pad 30. The anti-deformation layer 34 has high toughness and support. Therefore, when subjected to pressure from the retaining ring 20 ( Figure 3 Under downward pressure, the anti-deformation layer 34 can effectively suppress deformation and produce a buffering effect. This reduces the degree of sub-pad compression caused by the retaining ring, and thus enables enhanced uniformity of wafer surface flatness.

[0032] According to some embodiments, the anti-deformation layer 34 may include or may be formed of a material including polymers (e.g., polyurethane, polymethyl methacrylate, polytetrafluoroethylene, etc.), natural resins, and / or other synthetic resins. According to some embodiments, the anti-deformation layer 34 has a Shore A hardness in the range of about 40 to about 100. The compressibility of the anti-deformation layer 34 may be in the range of about 10% to about 60%, and may be greater than the compressibility values ​​of the top pad 32, the main support layer 36, and the stabilizing layer 40. Compressibility reflects the volume reduction of a material under pressure.

[0033] According to some embodiments, the deformation-resistant layer 34 may include closed-cell foam. Alternatively, the deformation-resistant layer 34 may include continuous channels between fibers. According to yet another alternative embodiment, the deformation-resistant layer 34 may also include openings oriented in the vertical direction.

[0034] The adhesive membrane 38-2 is located below the anti-deformation layer 34 and can be formed of a material selected from the same group of candidate materials as the adhesive membrane 38-2.

[0035] A support layer is formed beneath the deformation-resistant layer 34. According to some embodiments, the support layer includes a main support layer 36 and a stabilizing layer 40. The stabilizing layer 40 may or may not be formed, depending on whether the main support layer 36 can provide sufficient support on its own.

[0036] The main support layer 36 lies beneath the anti-deformation layer 34 and is attached to the anti-deformation layer 34 via an adhesive film 38-2. According to some embodiments, the main support layer 36 may comprise or be formed of a material selected from the group consisting of polymers (e.g., polyurethane, polymethyl methacrylate, polytetrafluoroethylene, etc.), natural resins, and / or combinations thereof. The main support layer 36 may comprise other synthetic materials or combinations of other synthetic materials with the aforementioned materials.

[0037] The main support layer 36 may include one or more layers, each of which has a flat and porous structure. The porous structure of the main support layer 36 may include: closed-cell foam, continuous channels between fibers, vertically oriented open pores, non-porous polymer sheets with a surface macrotexture, etc. The thickness of the main support layer 36 may be in the range of approximately 0.51 mm to approximately 2.54 mm.

[0038] The main support layer 36 may have a Shore A hardness in the range of about 10 to about 60. The main support layer 36 may be softer than the deformation-resistant layer 34, which has a harder hardness than the main support layer 36. For example, the Shore A hardness of the main support layer 36 may be lower than the Shore A hardness of the deformation-resistant layer 34 by a difference greater than about 5, greater than about 10, or greater than about 30.

[0039] The main support layer 36, which is softer than the anti-deformation layer 34, can have a deflection value greater than that of the anti-deformation layer 34 and the stabilizing layer 40. For example, the main support layer 36 can have a deflection value in the range of about 1.00 mm and about 2.41 mm. Furthermore, the main support layer 36 can have a compressibility in the range of about 40% and about 95%, which is greater than the compressibility of the anti-deformation layer 34, for example, a difference in the range of about 10% and about 80%.

[0040] The adhesive film 38-3 lies beneath the main support layer 36. According to some embodiments, the adhesive film 38-3 comprises or may be formed of a material selected from the group consisting of acrylic resins, epoxy resins, polyurethanes, and combinations thereof. Alternatively, the adhesive film 38-3 may comprise other synthetic materials or combinations of other synthetic materials with the aforementioned materials.

[0041] A stabilizing layer 40 (if formed) lies beneath the main support layer 36 and is attached to the main support layer 36 via an adhesive film 38-3. According to some embodiments, the stabilizing layer 40 may comprise or be formed of a material selected from the group consisting of polymers (e.g., polyurethane, polymethyl methacrylate, polytetrafluoroethylene, etc.), natural resins, another synthetic resin, and combinations thereof. The adhesive film 38-3 lies beneath the main support layer 36 and may be formed of a material selected from the same group of candidate materials as the adhesive film 38-2.

[0042] The stabilizing layer 40 provides long-term stability and support for high-quality polishing processes. The stabilizing layer 40 may comprise one or more layers and may have a flat and porous structure. The thickness of the stabilizing layer 40 may range from approximately 0.51 mm to approximately 2.54 mm.

[0043] The stabilizing layer 40 may be harder than the main support layer 36. For example, the stabilizing layer 40 may have a greater Shore A hardness than the main support layer 36. According to some embodiments, the stabilizing layer 40 has a Shore A hardness in the range of about 40 to about 100.

[0044] Furthermore, the deflection of the stabilizing layer 40 can be lower than that of the main support layer 36. According to some embodiments, the deflection of the stabilizing layer 40 can be in the range of approximately 0.25 mm to approximately 1.52 mm.

[0045] The compressibility of the stabilizing layer 40 can be less than that of the main support layer 36. For example, the compressibility of the stabilizing layer 40 can be in the range of about 10% to about 60%.

[0046] Figure 3 Parts of the polishing head 26, wafer 28, and polishing pad 30 according to some embodiments are shown. (The text appears to be incomplete and contains several errors. A more accurate translation would require the full context.) Figure 1 The cross-sectional view is obtained by showing cross-section AA. (As shown) Figure 3 As shown, due to the downward pressure applied to the top pad 32 by the buckle 20, the top pad 32 and the lower sub-pad 31 are deformed and pressed downward.

[0047] Because the anti-deformation layer 34 is rigid, the portion of the anti-deformation layer 34 directly below the retaining ring 20 exhibits reduced deformation. Consequently, the bottom surface of the portion of the top pad 32 directly below the retaining ring 20 experiences less deformation. Therefore, the top surface of the portion of the top pad 32 near the wafer edge is pressed downwards less. Consequently, the contact between the top pad 32 and the edge portion of the wafer 28 is improved and becomes more uniform.

[0048] Figure 4 Examples of some embodiments are shown. Figure 2 and Figure 3 Possible stacking schemes for the multiplanar sub-pad 31 are shown. According to some embodiments, the deformation-resistant layer 34 has a single-layer structure. According to alternative embodiments, the deformation-resistant layer 34 has a multilayer structure comprising multiple stacked deformation-resistant layers 34. An additional adhesive film 38 may be present between the stacked deformation-resistant layers 34, bonding the multiple stacked deformation-resistant layers 34 into a multilayer structure. The number of stacked deformation-resistant layers 34 can be any number (L) in the range of 1 to 20.

[0049] According to some embodiments, the main support layer 36 has a single-layer structure. According to an alternative embodiment, the main support layer 36 has a multilayer structure comprising a plurality of stacked main support layers 36. An additional adhesive film 38 may be present between the stacked main support layers 36, and bond the plurality of stacked main support layers 36 into a multilayer structure. The number (M) of the plurality of stacked main support layers 36 may be any number in the range of 1 to 20.

[0050] According to some embodiments, the stabilizing layer 40 has a single-layer structure. According to an alternative embodiment, the stabilizing layer 40 has a multilayer structure comprising a plurality of stacked stabilizing layers 40. An additional adhesive film 38 may be present between the stacked stabilizing layers 40 and bond the plurality of stacked stabilizing layers 40 into a multilayer structure. The number (N) of the plurality of stacked stabilizing layers 40 may be any number in the range of 1 to 20.

[0051] According to some embodiments in which one or both of the anti-deformation layer 34 and the main support layer 36 include multiple stacked layers, all anti-deformation layers 34 can be placed on top of all main support layers 36, regardless of the number of anti-deformation layers 34 and the number of main support layers 36.

[0052] According to an alternative embodiment, one or more deformation-resistant layers 34 and one or more main support layers 36 can be arranged in units from top to bottom, regardless of the number of deformation-resistant layers 34 and the number of main support layers 36 in each unit. This unit can be repeated once or more, for example, up to about 10 times.

[0053] In some embodiments where one or both of the main support layer 36 and the stabilizing layer 40 include multiple stacked layers, all the main support layers 36 are placed on top of all the stabilizing layers 40, regardless of the number of main support layers 36 and stabilizing layers 40.

[0054] According to an alternative embodiment, one or more main support layers 36 and one or more stabilizing layers 40 can be arranged in units from top to bottom, regardless of the number of main support layers 36 and the number of stabilizing layers 40. This unit can be repeated once or more, for example, up to about 10 times. Figure 4 Additional main support layers 36 are shown to be formed beneath one or more stabilizing layers 40 within repeating units. Although not shown, further stabilizing layers 40 within the repeating units may be formed beneath the bottom main support layers 36 shown.

[0055] According to some embodiments where a stabilizing layer 40 is not formed, each sub-pad 31 may be a two-layer sub-pad. In these embodiments, the main support layer 36 may be a single layer or a unit comprising multiple main support layers (these multiple main support layers are bonded together as a unit).

[0056] Figure 5 A cross-sectional view of the grooved sub-pad 31 according to an alternative embodiment is shown. Unless otherwise stated, in these embodiments and discussed subsequently, Figures 6 to 22The materials, structures, and forming processes of the components in the illustrated embodiments are substantially the same as those of the same components indicated by the same reference numerals in the preceding embodiments. Where applicable, the details regarding materials, structures, and forming processes provided in each embodiment throughout this specification can be applied to any other embodiment.

[0057] Figure 5 The polishing pad 30 shown is essentially the same as Figure 2 The polishing pad 30 shown is the same, but Figure 2 The flat main support layer 36 is replaced by a slotted main support layer 36 (hereinafter referred to as the slotted main support layer 36), and the deformation-resistant layer 34 is not used. According to some embodiments, the grooved sub-pad 31 therefore includes the slotted main support layer 36, and may or may not include the stabilizing layer 40. Figure 5 The remaining features can be basically related to Figures 2 to 5 The corresponding features shown are the same, and can be referenced. Figures 2 to 4 The discussion uncovered the details of these characteristics.

[0058] According to some embodiments, the slotted main support layer 36 includes a plurality of protrusions 36A and a plurality of recesses 36B separating the protrusions 36A. The top view shape of the protrusions 36A may include discrete cylinders, protruding rings, etc. The top view shape of the recesses 36B may include recessed rings, recessed grids, etc. The shapes of the protrusions 36A and recesses 36B can be found in the figures discussed later.

[0059] According to some embodiments, protrusions 36A penetrating the slotted main support layer 36 have equal widths, and / or recesses 36B penetrating the slotted main support layer 36 have equal widths. According to alternative embodiments, protrusions 36A may have different widths, and / or recesses 36B may have different widths to improve the uniformity of the polishing process. Protrusions 36A and recesses 36B can be divided into multiple regions (groups) based on their widths, wherein the widths of protrusions 36A (or recesses 36B) in the same region are equal to each other, while the widths of protrusions 36A (or recesses 36B) in different regions are different from each other. Different regions correspond to different locations on the wafer surface. According to some embodiments, the width of recesses 36B may be in the range of approximately 0.25 mm to approximately 2.54 mm.

[0060] The grooved main support layer 36 may include one or more layers, each of which has a flat (but grooved) and porous structure. The porous structure of the grooved main support layer 36 may include: closed-cell foam, continuous channels between fibers, vertically oriented open pores, non-porous polymer sheets with a surface macrotexture, etc. Figure 2The candidate material group of the main support layer 36 shown is the same as that of the candidate material group.

[0061] According to some embodiments, the grooves 36B in the main support layer 36 are more densely distributed than the grooves 32B in the top pad 32. For example, the spacing P1 of the grooves 32B can be greater than the spacing P2 of the grooves 36B. The dense protrusions 36A and grooves 36B of the grooved main support layer 36 cause the characteristics of the grooved main support layer 36 to be similar to those of an independent cylinder, and it has the ability to isolate downward forces.

[0062] The adhesive film 38-2 adheres the grooved main support layer 36 to the top pad 32. According to some embodiments, the adhesive film 38-2 is a continuous film when viewed in cross-section. Therefore, the adhesive film 38-2 can be a uniform thickness layer extending to the opposite edges of the top pad 32 and the grooved main support layer 36. Thus, some portions of the adhesive film 38-2 (as an example, in the illustrated region 39) are directly above and exposed to the groove 36B.

[0063] According to an alternative embodiment, the adhesive film 38-2 includes discrete portions covering (and overlapping) the protrusion 36A, but does not include portions that overlap at least some or all of the groove 36B (in region 39). Therefore, the bottom surface of the top pad 32 can be exposed to the groove 36B.

[0064] Figure 6 Parts of the polishing head 26, wafer 28, and polishing pad 30 according to some embodiments are shown. (The text appears to be incomplete and contains several errors. A more accurate translation would require the full context.) Figure 1 The cross-sectional view is obtained by showing cross-section AA. (As shown) Figure 6 As shown, due to the downward pressure applied to the top pad 32 by the retaining ring 20, the top pad 32 and the underlying sub-pad 31 deform and are pressed downwards. The grooved main support layer 36 can support the top pad 32 and distribute the downward pressure applied from the polishing head 26. The grooved main support layer 36 distributes the deformation of the top pad 32, thus reducing the deformation of the top pad 32. The grooved main support layer 36 has high toughness and support, and can provide shock absorption and anti-interference capabilities. Therefore, the grooved main support layer 36 can have better conformity with the edge portion of the wafer 28 and the shape of the retaining ring 20.

[0065] The slotted main support layer 36 has several advantageous features. It provides multiple discrete support points for the top pad 32, with each protrusion providing one or more support points. Each support point can individually withstand downward pressure, ensuring better conformity with the shape of the wafer 28 and the retaining ring 20. Therefore, the slotted main support layer 36 can support different regions with different shapes during CMP processes.

[0066] Furthermore, since each support point is independent of the others, there is minimal interference, reducing the non-contact area (between top pad 32 and wafer 28) and achieving enhanced uniformity in wafer surface flatness.

[0067] Furthermore, due to the characteristics of the independent cylinder, each layer of the sub-pad 31 can be made of a softer material, which effectively helps to reduce the downward pressure exerted by the buckle 20, and thus reduces the occurrence and severity of top pad deformation caused by the buckle.

[0068] Figure 7 Examples of some embodiments are shown. Figure 5 and Figure 6 The diagram illustrates possible stacking schemes for grooved sub-pads 31. According to some embodiments, the grooved main support layer 36 has a single-layer structure. According to alternative embodiments, the grooved main support layer 36 has a multi-layer structure comprising a plurality of grooved main support layers 36. An additional adhesive film 38 may be present between the stacked grooved main support layers 36, bonding the plurality of stacked grooved main support layers 36 into a multi-layer structure. The number (M) of the plurality of stacked grooved main support layers 36 can be any number ranging from 1 to 20.

[0069] In the grooved pad 31, the stabilizing layer 40 may consist of multiple layers (number N) (e.g., including about 1 to about 20 layers), which are bonded together by an attached adhesive film 38.

[0070] According to some embodiments where one or both of the slotted main support layer 36 and the stabilizing layer 40 include multiple stacked layers, all the slotted main support layers 36 can be placed on top of all the stabilizing layers 40, regardless of the number of slotted main support layers 36 and the number of stabilizing layers 40.

[0071] According to some embodiments, the grooved main support layer 36 may be a single layer or may have a multi-layer structure including multiple main support layers (the multiple main support layers are bonded together as a unit).

[0072] According to an alternative embodiment, one or more slotted main support layers 36 and one or more stabilizing layers 40 can be arranged in units from top to bottom, regardless of the number of main support layers 36 and stabilizing layers 40. This unit can be repeated once or multiple times, for example, up to about 10 times. Figure 7 Further main support layers 36 are shown to be formed beneath the stabilizing layer 40, and these main support layers 36 are in one or more repeating units. Although not shown, further stabilizing layers 40 in one or more repeating units may be formed beneath the bottom main support layer 36 shown.

[0073] Figure 8A cross-sectional view of the sub-pad 31 according to an alternative embodiment is shown. Figure 8 The polishing pad 30 shown is essentially the same as... Figure 2 and Figure 5 The polishing pad 30 shown is the same, but it has both an anti-deformation layer 34 and a grooved main support layer 36 formed. Therefore, Figure 8 The illustrated embodiment is Figure 2 and Figure 5 The illustrated embodiment is a hybrid, and the corresponding sub-pad 31 is referred to as hybrid sub-pad 31. According to some embodiments, the illustrated hybrid sub-pad 31 includes a deformation-resistant layer 34 and a grooved main support layer 36, and may or may not include a stabilizing layer 40. Figure 8 Details of the features shown can be found in Figures 2 to 7 The details are found in the embodiments discussed shown in the document and will not be repeated here.

[0074] According to some embodiments, the deformation-resistant layer 34 is formed on the grooved main support layer 36. According to an alternative embodiment, the deformation-resistant layer 34 may be formed under the grooved main support layer 36.

[0075] Figure 9 Parts of the polishing head 26, wafer 28, and polishing pad 30 according to some embodiments are shown. (The text appears to be incomplete and contains several errors. A more accurate translation would require the full context.) Figure 1 The cross-sectional view is obtained from the cross-section AA shown. Figure 3 and Figure 6 As can be appreciated from the discussion of the illustrated embodiments, the reduced deformation resulting from the anti-deformation layer and the grooved main support layer 36 can improve the contact between the top pad 32 and the wafer 28, and improve the uniformity of the CMP process.

[0076] Figure 10 A stacking scheme of layers in a hybrid sub-pad 31 according to some embodiments is shown. The deformation-resistant layer 34 may have a flat and porous structure, while the support layer may include one or more slotted main support layers 36 and one or more stabilizing layers 40. The one or more main support layers 36 have a grooved structure, and the one or more stabilizing layers 40 have a flat and porous structure.

[0077] According to some embodiments, each of the deformation-resistant layer 34, the grooved main support layer 36, and the stabilizing layer 40 may have a single-layer structure or a multi-layer structure. Details (e.g., the number) of the multi-layer structure of the deformation-resistant layer 34 and the stabilizing layer 40 have been referenced. Figure 4 The details (e.g., number) of the multi-layered structure of the slotted main support layer 36 and the stabilizing layer 40 have been discussed and will not be repeated here. Figure 7 This has been discussed, and will not be repeated here.

[0078] According to some embodiments, the topmost sub-pad, located immediately below the top pad 32 and connected to the top pad 32 via an adhesive film, can be a non-grooved main support layer 36 (e.g., ...). Figure 2 (as shown) or the grooved main support layer 36 (e.g.) Figure 5 (As shown).

[0079] According to some embodiments in which one or both of the anti-deformation layer 34 and the slotted main support layer 36 include multiple stacked layers, all anti-deformation layers 34 can be placed on all slotted main support layers 36, regardless of the number of anti-deformation layers 34 and the number of slotted main support layers 36.

[0080] According to an alternative embodiment, one or more deformation-resistant layers 34 and one or more slotted main support layers 36 can be arranged in units from top to bottom, regardless of the number of deformation-resistant layers 34 and the number of main support layers 36. This unit can be repeated once or multiple times, for example, up to about 10 times. Figure 10 More slotted main support layers 36 are shown in one or more repeating units.

[0081] According to some embodiments where one or both of the main support layer 36 and the stabilizing layer 40 include multiple stacked layers, all the main support layers 36 can be placed on top of all the stabilizing layers 40, regardless of the number of slotted main support layers 36 and the number of stabilizing layers 40.

[0082] Figures 11 to 20 Views of some layers in a multilayer sub-pad 31 according to some embodiments are shown. Figure 11 The image shows perspective views of an anti-deformation layer 34, a main support layer 36, and / or a stabilizing layer 40 according to some embodiments. These layers may be circular plates with uniform thickness. Top views of the anti-deformation layer 34, the (ungrooved) main support layer 36, the grooved main support layer 36, and / or the stabilizing layer 40 are shown respectively. Figure 13 , Figure 14 , Figure 15 and Figure 16 As shown in the image.

[0083] Figure 12 A top view of a slotted main support layer 36 according to some embodiments is shown. The slotted main support layer 36 includes a plurality of concentric protrusions 36A. Figure 5 as well as Figures 20 to 22 ) and multiple grooves 36B between multiple concentric protrusions 36A.

[0084] Figure 13 , Figure 14 , Figure 15 and Figure 16 The deformation-resistant layer 34 and the non-groove main support layer 36 are shown according to some embodiments. Figure 2), grooved main support layer 36 ( Figure 5 as well as Figures 20 to 22 Top view of the 40 and stabilizing layer. The diameter R of these features can range from approximately 10 inches to approximately 50 inches.

[0085] Grooved main support layer 36 ( Figure 15 The protrusions 36A and grooves 36B can have different shapes. For example, as shown... Figure 12 and Figure 15 As shown, protrusion 36A and groove 36B can have a concentric circle shape. Figure 17 and Figure 18 Top and perspective views of the slotted main support layer 36 according to some embodiments are shown respectively. The protrusions 36A may be formed in an array pattern, and the grooves 36B are interconnected to form a grid pattern (continuous grooves) that separates the protrusions 36A into discrete portions.

[0086] Figure 19 A top view of a slotted main support layer 36 including protrusions 36A and recesses 36B is shown. The protrusions 36A and recesses 36B form concentric rings. The number of protrusions 36A can range from 2 to approximately 20. According to some embodiments, the protrusions 36A can form multiple groups, each group including multiple protrusions 36A, with the intra-group spacing of the protrusions 36A being smaller than the inter-group spacing. According to an alternative embodiment, the protrusions 36A have uniform spacing.

[0087] Figures 20 to 22 Cross-sectional views of some protrusions 36A and grooves 36B in a slotted main support layer 36 according to some embodiments are shown. The grooves 36B can have shapes such as square, trapezoidal, inverted trapezoidal, etc. For example... Figure 20 The square groove 36B shown has a depth D that can be between approximately 0.25 mm and approximately 2.54 mm, and a width W1 that can be between approximately 0.25 mm and approximately 2.54 mm.

[0088] For example Figure 21 The trapezoidal groove 36B shown has a depth D that can be between approximately 0.25 mm and approximately 2.54 mm, a top width W2 that can be between approximately 0.25 mm and 1.52 mm, and a bottom width W3 that can be between approximately 1.00 mm and approximately 2.54 mm.

[0089] For example Figure 22 The inverted trapezoidal groove 36B shown has a depth D that can range between approximately 0.25 mm and approximately 2.54 mm, a top width W4 that can range between approximately 1.00 mm and approximately 2.54 mm, and a bottom width W5 that can range between approximately 0.25 mm and approximately 1.52 mm.

[0090] The embodiments of this disclosure have several advantageous features. The deformation resistance of the sub-pads is improved by forming a multi-layer sub-pad comprising one or more deformation-resistant layers 34 and / or one or more grooved main support layers. The uniformity of the CMP process can be improved.

[0091] According to some embodiments of this disclosure, an apparatus includes: a top pad including a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; a first adhesive film beneath the top pad; an anti-deformation layer beneath the top pad and attached to the top pad via the first adhesive film, wherein the anti-deformation layer has a first hardness; a second adhesive film beneath the anti-deformation layer; and a main support layer beneath the anti-deformation layer and attached to the anti-deformation layer via the second adhesive film, wherein the main support layer has a second hardness lower than the first hardness.

[0092] In one embodiment, the first hardness is greater than the second hardness by a Shore A difference, which is greater than approximately 30. In another embodiment, the device further includes: a third adhesive film beneath the main support layer; and a stabilizing layer, beneath the main support layer and attached to the main support layer via the third adhesive film. In another embodiment, the stabilizing layer has a third hardness greater than the second hardness. In another embodiment, the deformation-resistant layer is a non-grooved layer. In another embodiment, the main support layer is a non-grooved layer.

[0093] In one embodiment, the main support layer includes a plurality of second protrusions and a plurality of second grooves between the plurality of second protrusions. In another embodiment, the plurality of first grooves have a first spacing, and the plurality of second grooves have a second spacing, the second spacing being smaller than the first spacing. In another embodiment, the second adhesive film is a uniform thickness film continuously extending over the plurality of second grooves and the plurality of second protrusions. In yet another embodiment, the second adhesive film includes a plurality of discrete portions overlapping and contacting the plurality of second protrusions.

[0094] In one embodiment, the bottom surface of the anti-deformation layer is exposed to a plurality of second grooves. In another embodiment, the device further includes a plurality of units beneath and attached to the anti-deformation layer, wherein each of the plurality of units includes an adhesive film and an additional anti-deformation layer. In yet another embodiment, the device further includes a plurality of units beneath and attached to a main support layer, wherein each of the plurality of units includes an adhesive film and an additional main support layer.

[0095] According to some embodiments of this disclosure, an apparatus includes: a top pad including a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; a deformation-resistant layer beneath the top pad, wherein the deformation-resistant layer has a first compressibility value; and a main support layer beneath the deformation-resistant layer, wherein the main support layer has a second compressibility value greater than the first compressibility value. In embodiments, the deformation-resistant layer comprises a polymer and has a hardness greater than that of the main support layer.

[0096] In one embodiment, the main support layer includes a plurality of second protrusions and a plurality of second grooves separating the plurality of second protrusions. In another embodiment, the plurality of second protrusions and the plurality of second grooves have a concentric ring pattern. In yet another embodiment, the plurality of second protrusions are discrete features, and the plurality of second grooves are interconnected to form a continuous groove surrounding the plurality of protrusions.

[0097] According to some embodiments of this disclosure, an apparatus includes: a top pad including a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; a first adhesive film beneath the top pad; and a grooved main support layer beneath the top pad and attached to the top pad via the first adhesive film, wherein the grooved main support layer includes a plurality of second protrusions and a plurality of second grooves between the plurality of second protrusions. In embodiments, the plurality of first grooves have a first spacing, and the plurality of second grooves have a second spacing, the second spacing being smaller than the first spacing.

[0098] The foregoing summary outlines features of several embodiments, enabling those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art should appreciate that they can readily use this disclosure as a basis for designing or modifying other processes and structures for performing the same purposes and / or achieving the same advantages of the embodiments described herein. Those skilled in the art should also recognize that these equivalent constructions do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and modifications can be made without departing from the spirit and scope of this disclosure.

Claims

1. An apparatus comprising: The top pad includes a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; The first adhesive film beneath the top pad; An anti-deformation layer is attached to the top pad below the top pad and through the first adhesive film, wherein the anti-deformation layer has a first hardness; The second adhesive film beneath the anti-deformation layer; and A main support layer is attached to the anti-deformation layer below it and through a second adhesive film, wherein the main support layer has a second hardness lower than the first hardness.

2. The apparatus according to claim 1, wherein, The first hardness is greater than the second hardness by a Shore A difference, which is greater than approximately 30.

3. The apparatus according to claim 1, further comprising: A third adhesive film beneath the main support layer; as well as A stabilizing layer is attached to the main support layer below the main support layer and through the third adhesive film.

4. The apparatus according to claim 3, wherein, The stabilizing layer has a third hardness greater than the second hardness.

5. The apparatus according to claim 1, wherein, The deformation-resistant layer is a non-grooved layer.

6. The apparatus according to claim 1, wherein, The main support layer is a layer without grooves.

7. The apparatus according to claim 1, wherein, The main support layer includes: Multiple second prominences; and Multiple second grooves between the multiple second protrusions.

8. The apparatus according to claim 7, wherein, The plurality of first grooves have a first spacing, and the plurality of second grooves have a second spacing, the second spacing being smaller than the first spacing.

9. An apparatus comprising: The top pad includes a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; A deformation-resistant layer beneath the top pad, wherein the deformation-resistant layer has a first compressibility value; and The main support layer beneath the deformation-resistant layer has a second compressibility value that is greater than the first compressibility value.

10. An apparatus comprising: The top pad includes a plurality of first protrusions and a plurality of first grooves between the plurality of first protrusions; The first adhesive film beneath the top pad; as well as A grooved main support layer is attached to the top pad below the top pad via the first adhesive film, wherein the grooved main support layer includes a plurality of second protrusions and a plurality of second grooves between the plurality of second protrusions.

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