Active heat dissipation sound box capable of adjusting sound production angle

Abstract

The invention relates to the field of sound box heat dissipation, and particularly discloses an active heat dissipation sound box with an adjustable sound production angle, which comprises a base, a water storage assembly is movably arranged on the base, a sound box body is arranged on the water storage assembly, a sound production assembly is arranged on the sound box body, and a heat conduction insulation assembly is arranged in the sound box body. A power amplifier circuit board connected with the heat conduction and insulation assembly is arranged in the sound box body, and a primary heat dissipation assembly is arranged on the heat conduction and insulation assembly. According to the invention, the multi-stage heat dissipation effect of the sound box body can be realized, the device is adaptively adjusted according to the heat dissipation temperature, the quick response switching effect of multiple modes is realized, and the dynamic adjustment effect based on the temperature gradient is realized, so that the phenomena of excessive cooling and insufficient cooling are avoided, the control and adjustment capability of the system is improved, and the energy waste is avoided. The heat dissipation efficiency and the heat dissipation effect of the system are improved, the heat dissipation system is protected, and the service life of the heat dissipation system is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sound box heat dissipation, and particularly relates to an active heat dissipation sound box with adjustable sound emission angle. BACKGROUND

[0002] The sound box is the terminal of the entire sound system, which converts audio electric energy into corresponding sound energy and radiates it to the space, and is an extremely important part of the sound system, which is responsible for supplying the sound signal to the ear of the person for direct listening. The sound box usually includes a box body, a loudspeaker, an amplifier and a frequency divider, and is divided into a small sound box and a large sound box. The small sound box, such as a household sound box, generally does not need to be cooled, and natural cooling is sufficient. However, the large sound box needs to be cooled, and poor cooling performance can cause the circuit board to overheat and burn out.

[0003] In the prior art patent CN114125606A, a sound box with high heat dissipation is disclosed, which comprises an upper shell, a lower shell is fixedly connected to the bottom of the upper shell through a support, and clean water is filled in the lower shell. A power amplifier circuit board is installed inside the upper shell. An aluminum plate is fixedly connected to the lower side of the power amplifier circuit board. A plurality of heat dissipation aluminum sheets are uniformly arranged on the lower side of the aluminum plate, and the heat dissipation aluminum sheets extend into the lower shell and are inserted into the water. By injecting clean water into the lower shell and making the water cover the heat dissipation aluminum sheets, the heat generated on the power amplifier circuit board can be conducted to the water through the aluminum plate and the heat dissipation aluminum sheets during normal operation of the sound box, which can greatly improve the heat dissipation effect of the sound box and avoid the problem of circuit board burnout caused by poor heat dissipation. At the same time, the evaporation of water in the lower shell can also provide a humidifying function for the room, improving the practical value of the sound box.

[0004] In the above structure, the heat dissipation effect of the sound box can be achieved, but when the heat dissipation is realized, the water and the heat dissipation aluminum sheet are combined to realize high-efficiency heat dissipation. However, once the heat dissipation function is started, the heat dissipation effect remains constant regardless of the temperature, that is, both low temperature and high temperature will be high-efficiency heat dissipation. It is impossible to adaptively adjust the sound box according to the heat dissipation temperature, and the constant high-efficiency heat dissipation mode lacks thermal responsiveness, which cannot realize heat dissipation according to the demand, resulting in continuous high-load operation or low-load operation of the system. Overcooling may occur during low-load operation, and insufficient cooling may occur during high-load operation, which reduces the dynamic adjustment capability of the system, wastes energy, reduces the system efficiency, and causes the equipment to run at high load for a long time, which aggravates the damage of the heat dissipation equipment and reduces the service life of the heat dissipation system.

[0005] Therefore, how to provide an active heat dissipation sound box with adjustable sound emission angle is a problem that those skilled in the art need to solve. SUMMARY

[0006] The application aims to provide an active heat dissipation sound box with adjustable sound emission angle.

[0007] Preferably, the water storage assembly comprises a rotating disc rotatably arranged on the base, the rotating disc is in close contact with the base, a water storage tank is arranged on the rotating disc, and a plug rod is arranged on the water storage tank and inserted into the sound box body.

[0008] Preferably, the sound emission assembly comprises an adjusting block rotatably connected to the sound box body, an electric push rod is hingedly connected to the sound box body, the adjusting block is hingedly arranged on the output end of the electric push rod, a sound emission horn is arranged on the adjusting block, and the sound emission horn is electrically connected with the sound box body and related sound emission elements.

[0009] Preferably, the first-stage heat dissipation assembly comprises a heat dissipation plate arranged on the water storage tank, a heat dissipation box is arranged on the heat dissipation plate, the heat dissipation box is hollow, a temperature control electromagnetic valve one is arranged at the water outlet of the heat dissipation box, and the periphery of the heat dissipation box is composed of heat dissipation fins.

[0010] Preferably, the heat conduction insulation assembly comprises a heat conduction mounting plate mounted on the bottom of the sound box body, the power amplifier circuit board is mounted on the heat conduction mounting plate, an upper heat conduction insulation plate is arranged on the heat conduction mounting plate, a lower heat conduction insulation plate is arranged on the heat dissipation plate, and the upper heat conduction insulation plate and the lower heat conduction insulation plate are filled with heat conduction gel.

[0011] Preferably, the secondary heat dissipation component includes an elastic tube disposed on the heat dissipation box, a baffle is disposed on the elastic tube, a water outlet is provided on the baffle, a water storage space is formed between the heat dissipation box, the elastic tube and the baffle, and a bimetallic plate is disposed between the baffle and the heat dissipation box.

[0012] Preferably, the support assembly includes an outer support rod disposed on the heat sink box, an inner support rod adapted to the outer support rod disposed on the baffle, the inner support rod being inserted into the outer support rod, and a support spring sleeved on the outer ring of the inner support rod being disposed between the outer support rod and the baffle.

[0013] Preferably, the circulation assembly includes a circulation pump installed inside the water storage tank. The input end of the circulation pump is connected to the water source in the water storage tank. The output end of the circulation pump is provided with a connecting pipe. The connecting pipe is provided with a first connecting pipe and a second connecting pipe. A first control valve is installed on the first connecting pipe, and a second control valve is installed on the second connecting pipe.

[0014] Preferably, the first connecting component includes a first connecting block disposed on the first connecting pipe, a first water guide pipe disposed on the first connecting block, a first heat exchange pipe disposed on the first water guide pipe, the first water guide pipe and the first heat exchange pipe being located between the upper thermally conductive insulating plate and the lower thermally conductive insulating plate, and a branch pipe disposed on the heat exchange pipe communicating with the heat dissipation box, the branch pipe passing through the lower thermally conductive insulating plate and the heat dissipation plate.

[0015] Preferably, the second connecting component includes a second connecting block disposed on the second connecting pipe, the second connecting block being provided with a second water guide pipe communicating with the elastic pipe, and the second water guide pipe being equipped with a second temperature-controlled solenoid valve.

[0016] The beneficial effects of this invention are as follows: In use, the device is moved to the desired location, and the operator rotates the water storage component, forcing the speaker body and sound-emitting component to rotate to a suitable horizontal angle. Vertical adjustment is achieved through the angle adjustment of the sound-emitting component itself, thereby adjusting the sound-emitting angle. When the power amplifier circuit board is operating, it generates a large amount of heat, requiring heat dissipation. The heat from the power amplifier circuit board is transferred to the primary heat dissipation component through the thermally conductive insulation component. During low-temperature heat dissipation, the circulation component guides water into the primary heat dissipation component through the connecting component one, and the primary heat dissipation component then guides the water out of the water storage component, forming a loop. The connecting component one passes through the thermally conductive insulation component, forcing the primary heat dissipation component and the connecting component to simultaneously remove heat, causing the temperature of the thermally conductive insulation component to drop, which in turn causes the temperature of the power amplifier circuit board to drop, achieving the primary heat dissipation effect. As the temperature rises, during medium-temperature heat dissipation, the primary heat dissipation component shuts off, allowing water to continuously and rapidly flow into it until it is full. Then, the circulation component is disconnected from the primary heat dissipation component, improving the rapid heat dissipation capacity of the primary heat dissipation component. When the temperature continues to rise, the connecting component two connects to the secondary heat dissipation component, enabling the secondary heat dissipation component to... The device cools the heat generated by the primary heat dissipation component and the power amplifier circuit board. Water is led from the secondary heat dissipation component to the water storage component to form a loop, achieving heat dissipation and cooling on one side of the primary heat dissipation component, thus achieving a secondary heat dissipation effect. As the temperature continues to rise, the secondary heat dissipation component deforms, thereby compressing itself and forcing the water outlet path of the secondary heat dissipation component to increase. This causes the water to be sprayed onto the adjacent primary heat dissipation component, and the sprayed water forms a parabolic shape, expanding the coverage of the internal environment and improving the heat absorption capacity. At the same time, it achieves heat dissipation and cooling on the other side of the primary heat dissipation component, further improving the heat dissipation capacity of the primary heat dissipation component. This achieves a tertiary heat dissipation effect by cooling both sides of the primary heat dissipation component. This invention can achieve a multi-stage heat dissipation effect for the speaker body. The device can adaptively adjust according to the heat dissipation temperature, achieve a rapid response switching effect for multiple modes, and achieve a dynamic adjustment effect based on temperature gradient. This avoids over-cooling and under-cooling, improves the control and adjustment capability of the system, avoids energy waste, improves the system's heat dissipation efficiency and effect, helps protect the heat dissipation system, and extends the service life of the heat dissipation system. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 For the present invention Figure 1 Side view; Figure 3 This is a structural diagram of the water storage component of the present invention; Figure 4 This is a schematic diagram of the internal structure of the water storage tank of the present invention; Figure 5 For the present invention Figure 4 Side view; Figure 6 For the present invention Figure 5 Enlarged view of point A in the middle; Figure 7 This is a structural schematic diagram of the secondary heat dissipation component of the present invention; Figure 8 This is a structural entity diagram of the support component of the present invention; Figure 9 This is a partial structural diagram of the present invention; Figure 10 This is a diagram showing the connection relationship between the loop component, the first connecting component, and the second connecting component of the present invention.

[0019] In the diagram: 1. Base; 2. Water storage assembly; 201. Rotating disc; 202. Water tank; 203. Insert rod; 3. Speaker body; 4. Sound-generating assembly; 401. Adjusting block; 402. Electric push rod; 403. Speaker; 5. Thermally conductive and insulating assembly; 501. Thermally conductive mounting plate; 502. Upper thermally conductive and insulating plate; 503. Lower thermally conductive and insulating plate; 6. Power amplifier circuit board; 7. Primary heat dissipation assembly; 701. Heat sink; 702. Heat sink box; 703. Temperature control solenoid valve one; 8. Secondary heat dissipation assembly; 801. Flexible tube; 802. Baffle; 803. Water outlet; 8 04. Bimetallic plate; 9. Support assembly; 901. Outer support rod; 902. Inner support rod; 903. Support spring; 10. Circulation assembly; 1001. Circulation pump; 1002. Connecting pipe; 1003. Connecting pipe one; 1004. Connecting pipe two; 1005. Control valve one; 1006. Control valve two; 11. Connecting assembly one; 1101. Connecting block one; 1102. Water guide pipe one; 1103. Heat exchange pipe; 1104. Branch pipe; 12. Connecting assembly two; 1201. Connecting block two; 1202. Water guide pipe two; 1203. Temperature control solenoid valve two. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0021] Example 1: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 ,Figure 9 and Figure 10 As shown, an adjustable-angle active heat dissipation speaker of the present invention includes a base 1, a water storage component 2 movably disposed on the base 1, a speaker body 3 disposed on the water storage component 2, a sound-emitting component 4 disposed on the speaker body 3, a thermally conductive and insulating component 5 disposed inside the speaker body 3, an amplifier circuit board 6 connected to the thermally conductive and insulating component 5 disposed inside the speaker body 3, a primary heat dissipation component 7 disposed on the thermally conductive and insulating component 5, a secondary heat dissipation component 8 disposed on the primary heat dissipation component 7, and a support component 9 disposed between the primary heat dissipation component 7 and the secondary heat dissipation component 8. Component 2 includes a circulation component 10. A first communication component 11 is provided between the output end of the circulation component 10 and the first-stage heat dissipation component 7, and a second communication component 12 is provided between the output end of the circulation component 10 and the second-stage heat dissipation component 8. Specifically, during low-temperature heat dissipation, the first-stage heat dissipation component 7 is connected to the circulation component 10 to achieve first-stage heat dissipation. During medium-temperature heat dissipation, the second-stage heat dissipation component 8 is in a first state, which connects the second-stage heat dissipation component 8 to the circulation component 10 to achieve second-stage heat dissipation. During high-temperature heat dissipation, the second-stage heat dissipation component 8 is in a second state to achieve third-stage heat dissipation.

[0022] Working principle: When in use, the device is moved to the desired position. The operator rotates the water storage component 2, forcing the speaker body 3 and the sound-emitting component 4 to rotate to a suitable horizontal angle. Vertical adjustment is achieved through the angle adjustment of the sound-emitting component 4, thereby adjusting the sound emission angle. When the power amplifier circuit board 6 is working, it generates a large amount of heat, requiring heat dissipation. The heat from the power amplifier circuit board 6 is transferred to the primary heat dissipation component 7 through the thermally conductive insulation component 5. During low-temperature heat dissipation, the circulation component 10 guides water into the primary heat dissipation component 7 through the connecting component 11, and the primary heat dissipation component 7 then guides the water out of the water storage component 2. A loop is formed, and the connecting component 11, through the thermally conductive and insulating component 5, forces the primary heat dissipation component 7 and the connecting component to simultaneously remove heat, causing the temperature of the thermally conductive and insulating component 5 to drop, which in turn causes the temperature of the power amplifier circuit board 6 to drop, achieving the primary heat dissipation effect. When the temperature rises, during medium-temperature heat dissipation, the primary heat dissipation component 7 is shut off, allowing water to be continuously and rapidly injected into the primary heat dissipation component 7 until it is full. Then, the circulation component 10 is disconnected from the primary heat dissipation component 7, improving the rapid heat dissipation capacity of the primary heat dissipation component 7. When the temperature continues to rise, the connecting component 12 connects with the secondary heat dissipation component 8, enabling the secondary heat dissipation component... Component 8 cools the heat generated by the primary heat dissipation component 7 and the power amplifier circuit board 6. Water is led from the secondary heat dissipation component 8 to the water storage component 2 to form a loop, achieving heat dissipation and cooling on one side of the primary heat dissipation component 7, thus achieving a secondary heat dissipation effect. As the temperature continues to rise, the secondary heat dissipation component 8 deforms, thereby compressing itself and forcing the water outlet path of the secondary heat dissipation component 8 to increase. This causes the water to be sprayed onto the adjacent primary heat dissipation component 7, forming a parabolic shape, expanding the coverage of the internal environment, improving the heat absorption capacity, and simultaneously achieving heat dissipation and cooling on the other side of the primary heat dissipation component 7, further enhancing the effect. The higher-level heat dissipation component 7 has a heat dissipation capacity that cools the heat dissipation on both sides of the first-level heat dissipation component 7, achieving a three-level heat dissipation effect. In summary, the adjustable sound emission angle active heat dissipation speaker of this application can achieve a multi-level heat dissipation effect on the speaker body 3. The device can be adaptively adjusted according to the heat dissipation temperature, achieving a rapid response switching effect of multiple modes and a dynamic adjustment effect based on temperature gradient. This avoids over-cooling and under-cooling, improves the control and adjustment capability of the system, avoids energy waste, improves the system's heat dissipation efficiency and effect, helps protect the heat dissipation system, and extends the service life of the heat dissipation system.

[0023] Example 2: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10As shown, the present invention provides an active heat dissipation speaker with adjustable sound emission angle. The water storage component 2 includes a rotating disk 201 rotatably mounted on a base 1. The rotating disk 201 is in close contact with the base 1. A water storage tank 202 is mounted on the rotating disk 201. A plug 203 is mounted on the water storage tank 202 and inserted into the speaker body 3.

[0024] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides an adjustable sound-emitting angle active heat dissipation speaker. The sound-emitting component 4 includes an adjustment block 401 that is connected to the speaker body 3 by a bearing. An electric push rod 402 is hinged to the speaker body 3. The adjustment block 401 is hinged to the output end of the electric push rod 402. A sound-emitting horn 403 is mounted on the adjustment block 401. The sound-emitting horn 403 is electrically connected to the speaker body 3 and related sound-emitting elements.

[0025] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides an adjustable sound-emitting angle active heat dissipation speaker. The primary heat dissipation component 7 includes a heat dissipation plate 701 disposed on a water storage tank 202, a heat dissipation box 702 disposed on the heat dissipation plate 701, the heat dissipation box 702 being hollow inside, a temperature control solenoid valve 703 disposed at the water outlet of the heat dissipation box 702, and heat dissipation fins forming the perimeter of the heat dissipation box 702.

[0026] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10As shown, the present invention discloses an active heat dissipation speaker with adjustable sound emission angle. The thermally conductive insulation component 5 includes a thermally conductive mounting plate 501 installed at the bottom of the speaker body 3, an amplifier circuit board 6 installed on the thermally conductive mounting plate 501, an upper thermally conductive insulation plate 502 provided on the thermally conductive mounting plate 501, a lower thermally conductive insulation plate 503 provided on the heat dissipation plate 701, and thermally conductive gel filling the space between the upper thermally conductive insulation plate 502 and the lower thermally conductive insulation plate 503.

[0027] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides an active heat dissipation speaker with adjustable sound emission angle. The secondary heat dissipation component 8 includes an elastic tube 801 disposed on a heat dissipation box 702, a baffle 802 disposed on the elastic tube 801, and a water outlet 803 formed on the baffle 802. A water storage space is formed between the heat dissipation box 702, the elastic tube 801 and the baffle 802, and a bimetallic plate 804 is disposed between the baffle 802 and the heat dissipation box 702.

[0028] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, an active heat dissipation speaker with adjustable sound emission angle according to the present invention includes a support assembly 9 comprising an outer support rod 901 disposed on a heat dissipation box 702, an inner support rod 902 disposed on a baffle 802 adapted to the outer support rod 901, the inner support rod 902 being inserted into the outer support rod 901, and a support spring 903 sleeved on the outer ring of the inner support rod 902 being disposed between the outer support rod 901 and the baffle 802.

[0029] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10As shown, the present invention discloses an active heat dissipation speaker with adjustable sound emission angle. The circulation component 10 includes a circulation pump 1001 installed inside a water tank 202. The input end of the circulation pump 1001 is connected to the water source in the water tank 202. The output end of the circulation pump 1001 is provided with a connecting pipe 1002. The connecting pipe 1002 is provided with a first connecting pipe 1003 and a second connecting pipe 1004. A first control valve 1005 is installed on the first connecting pipe 1003, and a second control valve 1006 is installed on the second connecting pipe 1004.

[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, an adjustable sound-emitting angle active heat dissipation speaker of the present invention includes a connecting component 11 comprising a connecting block 1101 disposed on a connecting pipe 1003, a water guide pipe 1102 disposed on the connecting block 1101, a heat exchange pipe 1103 disposed on the water guide pipe 1102, the water guide pipe 1102 and the heat exchange pipe 1103 being located between an upper thermally conductive insulating plate 502 and a lower thermally conductive insulating plate 503, and a branch pipe 1104 disposed on the heat exchange pipe 1103 communicating with a heat dissipation box 702, the branch pipe 1104 penetrating the lower thermally conductive insulating plate 503 and the heat dissipation plate 701.

[0031] like ​ , ​ , ​ , ​ , ​ , ​ , ​ , ​ , ​ and ​ As shown, the present invention provides an active heat dissipation speaker with adjustable sound emission angle. The second connecting component 12 includes a second connecting block 1201 disposed on the second connecting pipe 1004. The second connecting block 1201 is provided with a second water guide pipe 1202 that communicates with the elastic pipe 801. A second temperature control solenoid valve 1203 is installed on the second water guide pipe 1202.

[0032] Working principle: When in use, move the device to the operating position. Under the action of the base 1, the operator rotates the speaker body 3 or the water tank 202, causing the rotating disk 201 to rotate. The rotating disk 201 drives the water tank 202 and the plug rod 203 to rotate. The rotation of the speaker body 3 drives the adjusting block 401, the electric push rod 402 and the speaker 403 to rotate, thereby adjusting the horizontal angle of the speaker 403. Due to the weight of the speaker body 3 and the close contact between the rotating disk 201 and the base 1, the rotating disk 201 will not easily rotate, thus keeping the horizontal angle of the speaker 403 unchanged. Activating the electric push rod 402 causes the output end of the electric push rod 402 to drive the adjusting block 401 to rotate vertically, forcing the speaker 403 to rotate synchronously, thereby adjusting the vertical direction and adjusting the sound angle of the speaker 403, thus completing the angle adjustment. When the power amplifier circuit board 6 is working, it generates a large amount of heat, which needs to be dissipated. The heat from the power amplifier circuit board 6 is transferred to the thermally conductive mounting plate 501, which then transfers the heat to the upper thermally conductive insulating plate 502. Through the thermally conductive gel, the heat is transferred to the lower thermally conductive insulating plate 503, which then transfers the heat to the heat sink 701. The heat sink 701 then transfers the heat to different heat sink boxes 702. Since the heat sink 701 and heat sink boxes 702 are located above the water storage tank 202, the heat is transferred into the water storage tank 202. During low-temperature heat dissipation, the temperature control solenoid valve 1 703 and control valve 1 1005 are opened, while the temperature control solenoid valve 2 1203 and control valve 2 1006 are closed. The circulation pump 1001 operates, causing the input end of the circulation pump 1001 to pump water from the water storage tank 202. Water is led out into the connecting pipe 1002, and then into the connecting block 1101 and the water guide pipe 1102 through the connecting pipe 1003. Water is then led into the heat exchange pipe 1103 through the water guide pipe 1102, and into the heat dissipation box 702 through the branch pipe 1104. As the temperature control solenoid valve 703 is opened, water is led out into the water storage tank 202 through the outlet of the heat dissipation box 702, thus forming a loop. The heat exchange pipe 1103 exchanges heat with the upper thermally conductive insulating plate 502, the thermally conductive gel and the lower thermally conductive insulating plate 503, so that the heat is exchanged with the water. This causes the water to cool the thermally conductive mounting plate 501, the upper thermally conductive insulating plate 502, the thermally conductive gel and the lower thermally conductive insulating plate 503, forcing the temperature of the power amplifier circuit board 6 to drop, thus achieving the heat dissipation and cooling effect of the power amplifier circuit board 6, and achieving the first-level heat dissipation effect. After the temperature rises, during medium-temperature heat dissipation, the temperature-controlled solenoid valve 703 first closes, allowing water to be continuously and rapidly injected into the heat sink 702 until the heat sink 702, branch pipe 1104, heat exchange pipe 1103, and water pipe 1102 are full of water. Then, the control valve 1005 is disconnected. Because the heat sink 702 is full of water, the heat exchange capacity is improved, thereby enhancing the rapid heat dissipation capacity of the heat sink 702. When the temperature continues to rise, the temperature-controlled solenoid valve 1203 and the control valve 1006 open. Water is introduced into connecting pipe 1004 and connecting block 1201 through connecting pipe 1002 and circulating pump 1001, and then into elastic pipe 801 through water guide pipe 1202. Water is then discharged into water storage tank 202 through baffle 802 and water outlet 803, forming a water circuit. At this time, water is gushing out of water from water outlet 803, and the water in elastic pipe 801 will dissipate heat and cool down heat dissipation box 702, so that one side of heat dissipates heat and achieves a two-stage heat dissipation effect. As the temperature continues to rise, the bimetallic plate 804 gradually bends, causing the baffle 802 to approach the heat sink 702. The inner support rod 902 moves within the outer support rod 901, compressing the support spring 903 and forcing the elastic tube 801 to compress, increasing the pressure inside the spring tube. Meanwhile, the output pressure of the circulation pump 1001 remains unchanged, increasing the pressure of the water from the outlet 803 and increasing the water outlet distance. This causes the water to spray onto the next heat sink 702, forming a parabolic shape, similar to a water curtain. This expands the water's coverage of the air inside the water tank 202, increases the contact area between air and water, and makes heat exchange more thorough, improving heat absorption capacity. At the same time, it cools down the other side of the next heat sink 702, further improving the heat dissipation capacity of the heat sink 702. This achieves a three-stage heat dissipation effect by cooling both sides of the heat sink 702. The above three stages enable rapid cooling and heat dissipation. After prolonged operation, when the internal water temperature of the heat sink 702 and heat exchange tube 1103 rises, it needs to be released. This causes the temperature control solenoid valve 703 and control valve 1005 to reopen, replenishing the water inside the heat sink 702 and heat exchange tube 1103. This allows the heat sink 702, heat exchange tube 1103, and elastic tube 801 to work synchronously, achieving a four-stage heat dissipation effect. It should be noted that if the temperature continues to rise after the first stage of heat dissipation, the second stage of heat dissipation will begin, and so on. If the temperature continues to rise after the second stage, the third stage of heat dissipation will begin, and so on, until the temperature drops, at which point the corresponding heat dissipation level will be activated. This achieves a cyclical adaptive state of first-stage, second-stage, third-stage, and fourth-stage heat dissipation, improving the heat dissipation regulation capability.

[0033] This solution enables multi-level heat dissipation of the speaker body 3, adaptively adjusting the device according to the heat dissipation temperature, achieving rapid response switching between multiple modes, and realizing dynamic adjustment based on temperature gradient. This avoids over-cooling and under-cooling, improves the system's control and adjustment capabilities, avoids energy waste, improves the system's heat dissipation efficiency and effect, helps protect the heat dissipation system, and extends the service life of the heat dissipation system.

[0034] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An actively cooled speaker with adjustable sound emission angle, characterized in that, The system includes a base (1), on which a water storage component (2) is movably mounted. A speaker body (3) is mounted on the water storage component (2), and a sound-generating component (4) is mounted on the speaker body (3). A thermally conductive and insulating component (5) is disposed inside the speaker body (3). An amplifier circuit board (6) connected to the thermally conductive and insulating component (5) is disposed inside the speaker body (3). A primary heat dissipation component (7) is mounted on the thermally conductive and insulating component (5), and a secondary heat dissipation component (8) is mounted on the primary heat dissipation component (7). A support component (9) is disposed between the primary heat dissipation component (7) and the secondary heat dissipation component (8). The water storage component (2) contains... A circulation component (10) is provided, and a first communication component (11) is provided between the output end of the circulation component (10) and the first-level heat dissipation component (7), and a second communication component (12) is provided between the output end of the circulation component (10) and the second-level heat dissipation component (8); wherein, when heat dissipating at low temperature, the first-level heat dissipation component (7) is connected to the circulation component (10) to achieve first-level heat dissipation; when heat dissipating at medium temperature, the second-level heat dissipation component (8) is in a first state, so that the second-level heat dissipation component (8) is connected to the circulation component (10) to achieve second-level heat dissipation; when heat dissipating at high temperature, the second-level heat dissipation component (8) is in a second state to achieve third-level heat dissipation.

2. The adjustable sound emission angle active heat dissipation speaker according to claim 1, characterized in that, The water storage component (2) includes a rotating disk (201) rotatably mounted on the base (1), the rotating disk (201) being in close contact with the base (1), a water storage tank (202) being mounted on the rotating disk (201), and a plug (203) being mounted on the water storage tank (202), the plug (203) being inserted into the speaker body (3).

3. The adjustable sound emission angle active heat dissipation speaker according to claim 2, characterized in that, The sound-generating component (4) includes an adjustment block (401) with a bearing connected to the speaker body (3). An electric push rod (402) is hinged to the speaker body (3). The adjustment block (401) is hinged to the output end of the electric push rod (402). A sound-generating horn (403) is mounted on the adjustment block (401). The sound-generating horn (403) is electrically connected to the speaker body (3) and related sound-generating elements.

4. The adjustable sound emission angle active heat dissipation speaker according to claim 3, characterized in that, The primary heat dissipation component (7) includes a heat dissipation plate (701) disposed on the water storage tank (202), a heat dissipation box (702) disposed on the heat dissipation plate (701), the heat dissipation box (702) is hollow inside, a temperature control solenoid valve (703) is disposed at the water outlet of the heat dissipation box (702), and the heat dissipation box (702) is composed of heat dissipation fins around its perimeter.

5. The adjustable sound emission angle active heat dissipation speaker according to claim 4, characterized in that, The thermally conductive insulation component (5) includes a thermally conductive mounting plate (501) installed at the bottom of the speaker body (3), the power amplifier circuit board (6) is installed on the thermally conductive mounting plate (501), an upper thermally conductive insulation plate (502) is provided on the thermally conductive mounting plate (501), a lower thermally conductive insulation plate (503) is provided on the heat sink plate (701), and thermally conductive gel is filled between the upper thermally conductive insulation plate (502) and the lower thermally conductive insulation plate (503).

6. The adjustable sound emission angle active heat dissipation speaker according to claim 5, characterized in that, The secondary heat dissipation component (8) includes an elastic tube (801) disposed on the heat dissipation box (702), a baffle (802) disposed on the elastic tube (801), a water outlet hole (803) being provided on the baffle (802), a water storage space being formed between the heat dissipation box (702), the elastic tube (801) and the baffle (802), and a bimetallic plate (804) being disposed between the baffle (802) and the heat dissipation box (702).

7. The adjustable sound emission angle active heat dissipation speaker according to claim 6, characterized in that, The support assembly (9) includes an outer support rod (901) disposed on the heat sink box (702), an inner support rod (902) adapted to the outer support rod (901) disposed on the baffle (802), the inner support rod (902) being inserted into the outer support rod (901), and a support spring (903) sleeved on the outer ring of the inner support rod (902) being disposed between the outer support rod (901) and the baffle (802).

8. The adjustable sound emission angle active heat dissipation speaker according to claim 7, characterized in that, The circulation assembly (10) includes a circulation pump (1001) installed inside the water storage tank (202). The input end of the circulation pump (1001) is connected to the water source in the water storage tank (202). The output end of the circulation pump (1001) is provided with a connecting pipe (1002). The connecting pipe (1002) is provided with a connecting pipe one (1003) and a connecting pipe two (1004). A control valve one (1005) is installed on the connecting pipe one (1003), and a control valve two (1006) is installed on the connecting pipe two (1004).

9. An actively cooled speaker with adjustable sound emission angle according to claim 8, characterized in that, The first connecting component (11) includes a first connecting block (1101) disposed on the first connecting pipe (1003), a first water pipe (1102) disposed on the first connecting block (1101), a first heat exchange pipe (1103) disposed on the first water pipe (1102), the first water pipe (1102) and the first heat exchange pipe (1103) being located between the upper thermally conductive insulating plate (502) and the lower thermally conductive insulating plate (503), and a branch pipe (1104) disposed on the heat exchange pipe (1103) communicating with the heat dissipation box (702), the branch pipe (1104) penetrating the lower thermally conductive insulating plate (503) and the heat dissipation plate (701).

10. An actively cooled speaker with adjustable sound emission angle according to claim 9, characterized in that, The second connecting component (12) includes a second connecting block (1201) disposed on the second connecting pipe (1004), the second connecting block (1201) is provided with a second water guide pipe (1202) communicating with the elastic pipe (801), and a second temperature control solenoid valve (1203) is installed on the second water guide pipe (1202).

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