Bonding system and bonding method for bonding lens with image sensor

Abstract

The embodiment of the invention provides a bonding system and a bonding method for bonding a lens with an image sensor. The bonding system includes a detection system for detecting the position and inclination of the lens and / or the image sensor in order to improve alignment between the lens and the image sensor during bonding. The detection system comprises an optical device used for detecting the position of the lens and / or the image sensor, and a sensing device used for detecting the inclination of the lens and / or the image sensor relative to a reference plane. The optical adjusting device is used for guiding light beams reflected by the lens and / or the image sensor to the optical device and the sensing device, so that the position and the inclination of the lens and / or the image sensor are detected at the same time through the optical device and the sensing device respectively.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the alignment of a lens and an image sensor during a bonding process, and more particularly, to a detection system for simultaneously measuring the position and tilt of a lens or an image sensor to improve the alignment of the lens and the image sensor during the bonding process. BACKGROUND

[0002] In the assembly process of a complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) camera module, a lens is typically bonded to an image sensor. The lens is mounted on a lens holder, which is gripped by a bonder head during the bonding process. The performance, including accuracy and repeatability, of the bonding process depends on whether a precise alignment between the image sensor and the lens can be achieved. During the bonding process, the actual position and tilt of the image sensor when bonded to a substrate, the actual position and tilt of the lens when gripped by the bonder head, and the uniformity of the adhesive layer formed between the image sensor and the lens all affect the alignment between the image sensor and the lens. Therefore, it is important to perform position detection and tilt measurement of the image sensor and the lens before bonding to ensure good bonding quality and performance of the camera module. In addition, after the bonding is completed, the tilt of the optical path formed between the lens and the image sensor can also be measured to analyze the quality of the bonded package assembly.

[0003] However, in the conventional bonding process, the position and tilt detection of the image sensor and the lens are typically performed on different platforms. Specifically, the position detection is performed in situ by optical means in the bonding system, while the tilt is measured by a measurement device outside the bonding system, such as by a Z-scope measurement on a separate platform. Since it is time-consuming to transfer the substrate with the bonded image sensor from the bonding platform to the tilt measurement platform, the bonding efficiency is low. In addition, a complex calibration process is required to compensate for the measurement error caused by the module separation.

[0004] Therefore, it is necessary to develop a detection system for detecting the position and tilt of the lens and / or the image sensor before or after bonding to improve the alignment accuracy between the lens and the image sensor, thereby effectively solving the problems encountered in the aforementioned prior art bonding process. SUMMARY

[0005] Therefore, the object of this disclosure is to provide a detection system included in a bonding system for simultaneously detecting the position and tilt of a lens and / or an image sensor before or after bonding. The detection system is used to simultaneously detect the position and tilt of the image sensor before bonding, or to detect the position and tilt of the bonded lens and image sensor after bonding. The detection system may also cooperate with a bonding head of the bonding system to detect the position and tilt of the lens before bonding to align the lens relative to the image sensor, or to dispense adhesive material via a dispensing device of the bonding system to uniformly distribute the adhesive material onto the bonding surface of the image sensor before bonding.

[0006] According to a first aspect of this disclosure, a bonding system for bonding a lens to an image sensor is provided, the bonding system including a detection system. The detection system includes: an optical device for detecting the position of the lens and / or image sensor; a sensing device for detecting the tilt of the lens and / or image sensor relative to a reference plane; and an optical adjustment device for guiding a light beam reflected from the lens and / or image sensor to the optical device and the sensing device, so as to simultaneously detect the position and tilt of the lens and / or image sensor by the optical device and the sensing device, respectively. It should be noted that the position and tilt of the lens and / or image sensor include the position and tilt of the bonding package assembly formed after the lens and image sensor are bonded.

[0007] According to a second aspect of this disclosure, a bonding method for bonding a lens to an image sensor is provided. The bonding method includes: simultaneously detecting the position and tilt of the image sensor using a first detection system; simultaneously detecting the position and tilt of the lens using a second detection system; and adjusting the position and tilt angle of the lens using a bonding head that clamps the lens, based on the position and tilt of the lens and the image sensor, so as to align the lens relative to the image sensor before bonding it to the image sensor. Each of the first and second detection systems includes: an optical device for detecting the position of the lens and / or the image sensor; a sensing device for detecting the tilt of the lens and / or the image sensor relative to a reference plane; and an optical adjustment device for guiding a light beam reflected from the lens and / or the image sensor to the optical device and the sensing device.

[0008] In some embodiments of this disclosure, the bonding method further includes the step of simultaneously detecting the position and tilt of the bonding package assembly formed by the image sensor and the lens bonding after bonding.

[0009] According to a third aspect of this disclosure, a bonding method for attaching a lens to an image sensor is provided. The bonding method includes: simultaneously detecting the position and tilt of the image sensor using a detection system; and controlling the dispensing operation of a dispensing device based on the position and tilt of the image sensor before attaching the lens to the image sensor, to form an adhesive layer of uniform thickness on the bonding surface of the image sensor. The detection system includes: an optical device for detecting the position of the image sensor, a sensing device for detecting the tilt of the image sensor relative to a reference plane, and an optical adjustment device for guiding a light beam reflected from the image sensor to the optical device and the sensing device.

[0010] The technical features, aspects, and advantages of this disclosure can be more clearly understood through the specification, claims, and drawings. Attached Figure Description

[0011] Embodiments of this disclosure will now be described by way of example, in conjunction with the accompanying drawings, wherein:

[0012] Figure 1A A side view of a detection system included in a bonding system for bonding a lens to an image sensor according to a first embodiment of the present disclosure is shown;

[0013] Figure 1B A side view of a detection system included in a bonding system for bonding a lens to an image sensor according to a second embodiment of the present disclosure is shown;

[0014] Figures 2A-2F A schematic diagram of a process for joining a lens to an image sensor using a joining system according to an embodiment of the present disclosure is shown, wherein the joining system includes a first detection system and a second detection system for aligning the lens with the image sensor prior to joining;

[0015] Figures 3A-3C A schematic diagram of a process for dispensing adhesive material onto an image sensor using a dispensing device and a detection system prior to attaching a lens to an image sensor, according to an embodiment of the present disclosure, is shown.

[0016] In the accompanying drawings, the same parts are indicated by the same reference numerals. Detailed Implementation

[0017] Figure 1AA side view of a detection system 100 included in a bonding system for bonding a lens to an image sensor according to a first embodiment of the present disclosure is shown. The detection system 100 can be used to cooperate with a bonding head in the bonding system to align the lens relative to the image sensor before bonding the lens to the image sensor, or the detection system 100 can be used to cooperate with a dispensing device in the bonding system to uniformly distribute adhesive material onto the image sensor before bonding. Furthermore, the detection system 100 can also be used to detect the tilt of the lens relative to the image sensor in the bonding and encapsulation assembly to identify the tilt of the optical path between the lens and the image sensor after bonding.

[0018] refer to Figure 1A The detection system 100 includes an optical device 10, a sensing device 20, and an optical adjustment device 30. In this embodiment, the optical device 10 and the sensing device 20 are located in two mutually perpendicular directions, namely the X-axis and Z-axis directions. Specifically, the arrangement of the optical device 10 and the sensing device 20 is such that the first incident light beam B1 received by the optical device 10 and the second incident light beam B2 received by the sensing device 20 are mutually perpendicular.

[0019] Optical device 10 may include a camera or vision system for detecting the position of a target object. The target object may include a lens and / or image sensor to be bonded, or a bonded packaged lens and image sensor. The position of the target object can be represented by coordinates (X,Y) or (X,Y,Z) in a Cartesian coordinate system, and a rotation angle (θ) about the Z-axis. Sensing device 20 is used to detect the tilt of the target object relative to a reference plane. The reference plane may be the plane on which the substrate is located, where the image sensor will be bonded to or has already been bonded to the substrate. This plane may be horizontal and can be represented by the XY plane in a Cartesian coordinate system. The tilt of the target object can be represented by the tilt angle and tilt direction relative to the reference plane. Sensing device 20 may include a laser displacement sensor, a confocal dispersion sensor, an interferometer, or a laser autocollimator.

[0020] The optical adjustment device 30 is used to guide the light beam reflected by the target object to the optical device 10 and the sensing device 20, so that the optical device 10 and the sensing device 20 can simultaneously detect the position and tilt of the target object respectively.

[0021] like Figure 1AAs shown, in this embodiment, the optical adjustment device 30 includes a beam splitter 31 and an optical box 32. The optical box 32 includes a container for housing the beam splitter 31 and a diffuser for diffusing the light from the light source, thereby reducing stray light. The container of the optical box 32 can be a rectangular box. The optical device 10 can be mounted on the mounting bracket 11 and facing the side S1 of the optical box 32, so that the optical device 10 can receive a first incident light beam B1 along the X-axis direction. The sensing device 20 can be mounted on the mounting bracket 21 and facing the side S2 of the optical box 32, so that the sensing device 20 can receive a second incident light beam B2 along the Z-axis direction. In some embodiments, the side S1 and side S2 of the optical box 32 are perpendicular to each other.

[0022] The detection system 100 also includes a light panel 40 installed between the light box 32 and the sensing device 20. The sensing device 20 can be directly mounted on the light panel 40. Alternatively, the light panel 40 can also be directly mounted on the sensing device 20 on the light box 32.

[0023] In the first embodiment, the optical device 10 and the sensing device 20 of the detection system 100 are arranged in two mutually perpendicular directions, while in other embodiments of this disclosure, the optical device 10 and the sensing device 20 may be arranged in two parallel directions, for example, in two directions parallel to the X-axis direction.

[0024] Figure 1B A side view of a detection system 200 included in a bonding system for bonding a lens to an image sensor according to a second embodiment of the present disclosure is shown. Compared to detection system 100, detection system 200 includes different optical adjustment devices for guiding a light beam reflected from a target object to optical device 10 and sensing device 20. Figure 1B As shown, the optical adjustment device includes a beam splitter 30A and a beam guide 30B mounted on the beam splitter 30A. The beam splitter 30A and the beam guide 30B are stacked along the Z-axis. The beam splitter 30A generates a first incident beam and guides it into the optical device 10, while the beam guide 30B generates a second incident beam and guides it into the sensing device 20. The first and second incident beams are parallel to each other.

[0025] Beam splitting device 30A includes a beam splitter 31A and an optical box 32A. The optical box 32A includes a container for housing the beam splitter 31A and a diffuser for diffusing the light from the light source, thereby reducing stray light. The container can be a rectangular box. The beam splitter 31A splits the light beam reflected from the target object into a first incident beam B1 along the X-axis and a beam Bz along the Z-axis, and guides the first incident beam into the optical device 10. The optical device 10 can be mounted on a mounting bracket 11 and faces the side S1A of the optical box 32A, thereby enabling the optical device 10 to receive the first incident beam B1 along the X-axis. The side S1A of the optical box 32A is perpendicular to the first incident beam B1.

[0026] The beam guiding device 30B includes a beam splitter 31B and an optical box 32B. The optical box 32B includes a container for housing the beam splitter 31B and a diffuser for diffusing the light from the light source, thereby reducing stray light. The container can be a rectangular box. The beam splitter 31B receives the beam Bz from the beam splitter 30A along the Z-axis, guides the beam Bz to the X-axis to generate a second incident beam B2, and guides the second incident beam B2 into the sensing device 20. The sensing device 20 can be mounted on the mounting bracket 21 and faces the side S1B of the optical box 32B, so that the sensing device 20 can receive the second incident beam B2 along the X-axis. The side S1B of the optical box 32B is perpendicular to the second incident beam B2.

[0027] The detection system 200 also includes a light panel 40 mounted on the light box 32B. Alternatively, the light panel 40 can also be mounted on other parts of the bonding system and provide sufficient illumination for the detection system 200.

[0028] exist Figure 1A and Figure 1B For ease of explanation, both detection systems 100 and 200 are configured as top-view detection systems. In use, top-view detection system 100 or top-view detection system 200 is positioned above the target object to detect its position and tilt. It should be understood that detection system 100 or detection system 200 can also be configured as a bottom-view detection system to detect target objects located above the detection system, for example, by... Figure 1A and Figure 1B The detection system shown can be rotated 180 degrees around the X-axis to obtain a bottom-view detection system. In the bonding system, detection system 100 or detection system 200 can be integrated with the bonding head to align the lens relative to the image sensor before bonding, or it can be integrated with a dispensing device to control the dispensing operation of the adhesive material to form a uniform adhesive layer on the image sensor before bonding.

[0029] Joint head and detection system

[0030] In some embodiments, detection system 100 and / or detection system 200 may be used with a bonding head for bonding a lens to an image sensor that has been bonded to a substrate. Figures 2A-2F A schematic diagram of a process for joining a lens 1 to an image sensor 2 using a joining system according to an embodiment of the present disclosure is shown, wherein the joining system includes a first detection system 100A and a second detection system 100B for aligning the lens 1 with the image sensor 2 prior to joining.

[0031] refer to Figures 2A-2F The first detection system 100A is configured as a top-view detection system for detecting the position and tilt of the image sensor 2; the second detection system 100B is configured as a bottom-view detection system for detecting the position and tilt of the lens 1 when it is clamped by the bonding head 4. The first detection system 100A is mounted on the moving guide rail 50 along the Y-axis, and the second detection system 100B is mounted on the moving guide rail (not shown) along the X-axis. It should be noted that, as long as it ensures that the lens 1 and image sensor 2 can be detected before or after bonding, the first detection system 100A and the second detection system 100B can be mounted on other mounting structures on the platform. The first detection system 100A includes an optical device 10 and a sensing device 20. The optical device 10 is used to detect the position of the image sensor 2 before bonding; the sensing device 20 is used to measure the tilt of the image sensor 2 before bonding, or to measure the tilt of the lens and image sensor in the bonding package assembly after bonding. The optical device 10 can also be used to detect the position of the bonding head 4 during bonding. The second detection system 100B includes an optical device 10 and a sensing device 20. The optical device 10 is used to detect the position of the lens 1, and the sensing device 20 is used to detect the tilt of the lens 1 when it is clamped by the bonding head 4 before bonding.

[0032] The following will refer to Figures 2A-2F The joining process is described in detail.

[0033] like Figure 2A As shown, in step 1, the first detection system 100A is used to detect the position and tilt of the image sensor 2. Specifically, the optical device 10 of the first detection system 100A is used to measure the X, Y, and θ positions of the image sensor 2, and the sensing device 20 of the first detection system 100A is used to measure the tilt direction and tilt angle of the image sensor 2 relative to the XY plane or horizontal plane where the substrate 3 is located. The position and tilt measurement results can be provided to the bonding head 4 so that the lens 1 can be aligned relative to the image sensor 2 before bonding. The X, Y, and θ positions of the image sensor 2 refer to the X and Y coordinate values ​​of the image sensor 2 and the rotation angle about the Z axis.

[0034] like Figure 2BAs shown, in step 2, the coupling head 4 moves the lens 1 to a position directly above the second detection system 100B. The second detection system 100B is used to detect the position of the lens 1, as well as its tilt or tilt direction / angle. Specifically, the optical device 10 of the second detection system 100B is used to measure the X, Y, and θ positions of the lens 1, and the sensing device 20 of the second detection system 100B is used to measure the tilt angle and tilt direction of the lens 1 relative to the XY plane or the horizontal plane. The position and tilt measurement results can be provided to the coupling head 4 so that the position and tilt of the lens 1 relative to the image sensor 2 can be adjusted before coupling.

[0035] Although in this embodiment, the detection of image sensor 2 is performed before the detection of lens 1, this order is only for illustrative purposes. In other embodiments, the position and tilt measurements of image sensor 2 and lens 1 can be performed simultaneously or in a different order in conjunction with other processes.

[0036] like Figure 2C As shown, in step 3, based on the tilt measurement results, the tilt of lens 1 relative to the XY plane or horizontal plane is adjusted by the coupling head 4 to ensure that the tilt of lens 1 is aligned with the tilt of image sensor 2.

[0037] like Figure 2D As shown, in step 4, based on the position measurement results obtained in steps 1 and 2, the position and orientation of lens 1 are aligned with image sensor 2 via the coupling head 4. Specifically, based on the position of image sensor 2, the X, Y, and θ positions of lens 1 are adjusted via the coupling head 4 to achieve alignment between lens 1 and image sensor 2.

[0038] It is important to note that the position and tilt can be adjusted in different orders. For example, you can first adjust the position of lens 1 on the X and Y axes, then adjust the tilt of lens 1 relative to the XY plane, and finally determine the orientation of lens 1 in the XY plane.

[0039] like Figure 2E As shown, in step 5, the coupling head 4 moves the lens 1 onto the image sensor 2, so that the two are coupled.

[0040] like Figure 2F As shown, in step 6, the first detection system 100A is used to detect the position and tilt of the bonding package assembly including the lens 1 and the image sensor 2 to identify the optical path formed between the lens 1 and the image sensor 2. The measurement results are recorded for accuracy analysis.

[0041] Dispenser and detection system

[0042] In some embodiments, the detection system 100 or the detection system 200 may be used with a dispensing device for dispensing adhesive material onto the image sensor before the lens is bonded to the image sensor. Figures 3A-3C A schematic diagram of the process of dispensing adhesive material onto an image sensor 2 using a dispensing device 5 and a detection system 100A according to an embodiment of the present disclosure is shown.

[0043] refer to Figures 3A-3C The optical device 10 of the detection system 100A is used to detect and measure the X, Y, and θ positions of the image sensor 2. The sensing device 20 of the detection system 100A is used to measure the tilt direction and tilt angle of the image sensor 2 relative to the XY plane or horizontal plane. The dispensing operation of the dispensing device 5 is controlled based on the measurement results. In this embodiment, controlling the dispensing operation includes adjusting the dispensing height or position of the dispensing device 5 to ensure that the dispensing device 5 maintains a certain distance from the image sensor 2, thereby ensuring that the adhesive material dispensed onto the image sensor 2 maintains a uniform or consistent thickness. The dispensing device 5 includes a positioning stage for positioning the syringe 52 of the dispensing device 5 in the X, Y, and Z axis directions. Specifically, the positioning stage may include an X stage 53 for positioning the syringe 52 on the X axis, a Y stage 54 for positioning the syringe 52 on the Y axis, and a Z stage 55 for positioning the syringe 52 on the Z axis. In this embodiment, the detection system 100A is mounted on the Y stage 54. Alternatively, the detection system 100A can be mounted on the X-platform 53 and can be moved toward the image sensor 2 for detection.

[0044] The following will refer to Figures 3A-3C The allocation process is explained in detail.

[0045] refer to Figure 3A The detection system 100A is located directly above the image sensor 2 so as to simultaneously detect the position and measure the tilt of the image sensor 2.

[0046] refer to Figure 3B The detection system 100A can use the optical device 10 to detect the position of the image sensor 2, and simultaneously use the sensing device 20 to measure the tilt of the image sensor 2. The detection and measurement results are used to adjust the dispensing height of the dispensing device 5 in subsequent dispensing processes or operations.

[0047] refer to Figure 3CThe dispensing device 5 can be used to distribute adhesive material onto the top surface or mating surface of the image sensor 2. By adjusting the dispensing height of the dispensing device 5 to correspond as closely as possible to the position and tilt angle of the image sensor 2, the amount of adhesive material dispensed at each target point on the mating surface of the image sensor 2 is ensured to be consistent, thereby obtaining an adhesive layer 41 of consistent thickness on the mating surface of the image sensor 2. The dispensing height of the dispensing device 5 can be adjusted by raising or lowering the syringe 52 of the dispensing device 5 along the Z-axis direction, depending on the position of each target point on the mating surface of the image sensor 2 and the tilt angle of the image sensor 2.

[0048] As can be understood from the above description, embodiments of this disclosure provide a detection system that can be integrated with a bonding head and / or a dispensing device for bonding a lens to an image sensor. The detection system includes optics, sensing devices, and optical adjustment devices for guiding a laser beam reflected from a target object (e.g., an image sensor, or a lens, or a bonding package assembly of an image sensor and a lens) to the optics and sensing devices, thereby enabling the detection system to simultaneously detect the position and tilt of the target object. When the detection system is used to detect the image sensor during bonding, it is configured as a top-view detection system to measure the position and tilt of the image sensor before bonding the lens to the image sensor using the bonding head or before dispensing adhesive material onto the image sensor. The top-view detection system may include a top-view sensing device. When the detection system is used to detect the lens during bonding, it can also be configured as a bottom-view detection system to measure the position and tilt of the lens before bonding. The bottom-view detection system may include a bottom-view sensing device. Those skilled in the art will understand that the lens can be mounted on a lens holder, which is held by the bonding head during bonding.

[0049] Using the detection system provided in the embodiments of this disclosure, the bonding head can effectively resolve or compensate for any relative positional offset and tilt between the lens and image sensor to be bonded. This is achieved by detecting the image sensor using a top-view detection system and simultaneously detecting the lens using a bottom-view detection system, adjusting the position and tilt of the lens on the bonding head. Compared to conventional bonding systems, using a bonding head with an integrated detection system avoids transferring the substrate from the bonding platform to a tilt measurement platform to measure the tilt of the image sensor before bonding. Therefore, complex software calibration is not required to compensate for any transfer errors caused by the separation of the measurement module from the bonding platform. Furthermore, the bottom-view detection system can also measure the position and tilt of the bonded package assembly after bonding for further accuracy analysis. Therefore, the efficiency and performance of the bonding process are significantly improved.

[0050] Compared to conventional adhesive material dispensing processes, the detection system of this disclosure enables the dispensing device to dynamically and precisely dispense adhesive material by simultaneously detecting the position and tilt of the image sensor. This means that even if the image sensor is tilted relative to the horizontal plane on which the substrate to which the image sensor is attached, an adhesive layer of uniform thickness can be applied to the top / bonding surface of the image sensor. A uniformly thick adhesive layer also helps ensure alignment between the lens and the image sensor during bonding.

[0051] Although embodiments of the present disclosure have been described in considerable detail, other embodiments are also possible. Therefore, the spirit and scope of the claims of this disclosure should not be limited to the description of the embodiments.

Claims

1. A bonding system for joining a lens to an image sensor, characterized in that, The joining system includes a detection system, the detection system comprising: Optical device for detecting the position of the lens and / or the image sensor; A sensing device for detecting the tilt of the lens and / or the image sensor relative to a reference plane; An optical adjustment device is provided for guiding a light beam reflected from the lens and / or the image sensor to the optical device and the sensing device, so as to simultaneously detect the position and tilt of the lens and / or the image sensor by the optical device and the sensing device, respectively.

2. The joining system according to claim 1, characterized in that, The optical device is used to receive a first incident light beam from the optical adjustment device, and the sensing device is used to receive a second incident light beam from the optical adjustment device, wherein the first incident light beam and the second incident light beam are perpendicular to each other.

3. The joining system according to claim 2, characterized in that, The optical adjustment device includes a beam splitter for splitting a light beam reflected from the lens and / or the image sensor into a first incident light beam suitable for reception by the optical device and a second incident light beam suitable for reception by the sensing device.

4. The joining system according to claim 3, characterized in that, The optical adjustment device further includes an optical box for housing a beam splitter, the sensing device is mounted facing a first side of the optical box, and the optical device is mounted facing a second side of the optical box, with the first and second sides perpendicular to each other.

5. The joining system according to claim 4, characterized in that, The optical box includes a container for housing the beam splitter and a diffuser for diffusing the light from the light source.

6. The joining system according to claim 1, characterized in that, The optical device is used to receive a first incident light beam from the optical adjustment device, and the sensing device is used to receive a second incident light beam from the optical adjustment device, wherein the first incident light beam and the second incident light beam are parallel to each other.

7. The joining system according to claim 6, characterized in that, The optical adjustment device includes a beam splitter and a beam guide arranged in a direction perpendicular to the first incident beam and the second incident beam. The beam splitter is used to generate the first incident beam and guide it into the optical device, and the beam guide is used to generate the second incident beam and guide it into the sensing device.

8. The joining system according to claim 7, characterized in that, The beam splitting device includes a first beam splitter for splitting a light beam from the lens and / or the image sensor to generate the first incident light beam and guide it into the optical device.

9. The joining system according to claim 8, characterized in that, The beam splitting device further includes a first optical box for housing the first beam splitter, the optical device being mounted facing a first surface of the first optical box, the first surface being perpendicular to the first incident beam.

10. The joining system according to claim 7, characterized in that, The beam guiding device includes a second beam splitter, which is used to receive a beam from the beam splitter, generate the second incident beam, and guide it into the sensing device.

11. The joining system according to claim 10, characterized in that, The beam guiding device further includes a second optical box for housing the second beam splitter, and the sensing device is mounted facing a second side of the second optical box, the second side being perpendicular to the second incident beam.

12. The joining system according to claim 1, characterized in that, The detection system includes a top-view detection system mounted above the image sensor for detecting the image sensor before the lens is attached to the image sensor, or for detecting the attached image sensor.

13. The joining system according to claim 12, characterized in that, The sensing device of the top-down detection system includes a tilt measurement sensor for detecting the tilt angle of the lens and / or the image sensor.

14. The joining system according to claim 12, characterized in that, The top-view detection system is mounted on a positioning platform, which is also equipped with a dispensing device for dispensing adhesive material onto the image sensor.

15. The joining system according to claim 1, characterized in that, The detection system includes a bottom-view detection system, which is installed below the lens when the lens is held by the coupling head of the coupling system, for detecting the lens before it is coupled to the image sensor.

16. The joining system according to claim 15, characterized in that, The sensing device of the upward detection system includes a tilt measurement sensor for detecting the tilt angle of the lens held by the coupling head.

17. A bonding method for bonding a lens to an image sensor, characterized in that, The joining method includes: The first detection system simultaneously detects the position and tilt of the image sensor; The second detection system simultaneously detects the position and tilt of the lens, wherein each detection system includes: an optical device for detecting the position of the lens and / or the image sensor, a sensing device for detecting the tilt of the lens and / or the image sensor relative to a reference plane, and an optical adjustment device for guiding a light beam reflected from the lens and / or the image sensor to the optical device and the sensing device. Before attaching the lens to the image sensor, the position and tilt angle of the lens are adjusted by a clamping head holding the lens, based on the position and tilt of the image sensor and the lens, so that the lens is aligned with the image sensor.

18. The joining method according to claim 17, characterized in that, Also includes: After the lens is engaged, the position and tilt of the lens and / or the image sensor are detected using the first detection system.

19. A bonding method for bonding a lens to an image sensor, characterized in that, The joining method includes: The detection system simultaneously detects the position and tilt of the image sensor, wherein the detection system includes: an optical device for detecting the position of the image sensor, a sensing device for detecting the tilt of the image sensor relative to a reference plane, and an optical adjustment device for guiding a light beam reflected from the image sensor to the optical device and the sensing device. Before attaching the lens to the image sensor, the dispensing operation of the dispensing device is controlled according to the position and tilt angle of the image sensor to form an adhesive layer of uniform thickness on the bonding surface of the image sensor.

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