Precision two-stage integrated motor control

Abstract

The apparatus and associated method relate to a motor driver module package (MDP) for efficient control of an N-phase motor system. In one illustrative example, the MDP may include N power transistors, a microcontroller unit (MCU), and a sense circuit. For example, the MDP may be a single module package. The sensing circuit may include N inductive field effect transistors (SENSEFETs). Each SENSEFET is coupled to one of the N power transistors and is configured to generate a response corresponding to a drain output of the corresponding power transistor. In some embodiments, in a high frequency mode, the MCU may generate N high frequency injection waveforms to each N power transistor. For example, the MCU may generate N high frequency injection waveforms according to the response of each N-phase. Various embodiments may advantageously provide an efficient solution for motor control applications.

Description

Technical Field

[0001] The various embodiments generally relate to motor control systems for controlling motor functions with enhanced accuracy and efficiency. Background Technology

[0002] Direct current (DC) motors are fundamental components in a wide range of applications across various industries, converting electrical energy into mechanical rotation. DC motors are known for their simple design and ease of control; for example, they are used in a variety of applications, from household appliances to industrial machinery.

[0003] Brushless DC (BLDC) motors are a type of DC motor. For example, BLDC motors eliminate mechanical brushes by using electronic commutation to control the motor's phase. This reduces mechanical wear. BLDC motors are suitable for precision applications, including electric vehicles, power tools, drones, and medical devices where high precision is required.

[0004] In some examples, the phase of a DC motor can be critical in motor control operation. For instance, the timing relationship between the rotor and the current supplied to the motor can sometimes affect motor efficiency. For example, during initial startup, motor control can establish the correct phase-current relationship. For example, the phase-current relationship can affect the efficiency of the motor rotor. For example, without proper phase alignment, the motor may experience inefficient operation, excessive noise, and / or startup failure. In some examples, proper phase control / measurement can be important in precision applications to avoid system damage and / or provide the precise control required for delicate operation. Summary of the Invention

[0005] The apparatus and related methods of the present invention relate to a motor drive module package (MDP) for efficient control of an N-phase motor system. In one example, the MDP may include N power transistors, a microcontroller unit (MCU), and sensing circuitry. For example, the MDP may be a single module package. The sensing circuitry may include N sensing field-effect transistors (SENSEFETs). Each SENSEFET is coupled to one phase of the N power transistors and configured to generate a response corresponding to the drain output of the respective power transistor. In some embodiments, in high-frequency mode, the MCU may generate N high-frequency injection waveforms, which are injected into the N power transistors respectively. For example, the MCU may generate N high-frequency injection waveforms based on the response of each of the N phases. Various embodiments can advantageously provide effective solutions for motor control applications.

[0006] Various embodiments can achieve one or more advantages. For example, N high-frequency injection waveforms can advantageously facilitate the detection of the motor's initial position and / or the determination of the motor's north and south poles. For example, the ITSDM 105 can advantageously reduce errors associated with high-frequency signal injection patterns. In some examples, the ITSDM 105 can advantageously provide smoother motor starting and control of the motor system 100. In some examples, the ITSDM 105 can advantageously simplify PCB layout complexity. For example, the ITSDM 105 can enhance power density, making it suitable for compact motor applications. For example, the ITSDM 105 can advantageously be used in space-constrained motor installations.

[0007] Details of various embodiments are set forth in the accompanying drawings and the description below. Other features and advantages will be apparent from the specification, drawings, and claims. Attached Figure Description

[0008] Figure 1 An integrated two-level driver module (ITSDM) is described in an exemplary use case.

[0009] Figure 2 This is a block diagram depicting an exemplary ITSDM.

[0010] Figure 3 An electrical schematic diagram of an exemplary ITSDM package is depicted.

[0011] Figure 4 This is a flowchart illustrating an exemplary sensorless waveform control initialization method.

[0012] The same reference symbols in the various figures denote the same elements. Detailed Implementation

[0013] Figure 1 An integrated two-stage drive module (ITSDM) is depicted for use in an exemplary application scenario. In this example, motor system 100 can be embedded in an electric vehicle (EV 110). Motor system 100 includes an ITSDM 105 and a brushless DC motor (BLDC motor 115). As shown, ITSDM 105 is coupled to BLDC motor 115. BLDC motor 115 is connected to a power source 120. For example, power source 120 can be a battery pack. Power source 120 can include multiple rechargeable batteries configured to store and supply electrical energy to BLDC motor 115. Power source 120 can include a battery management system (BMS) configured to monitor and regulate the voltage, current, temperature, and state of charge of the batteries. Power source 120 can include a cooling system configured to maintain optimal operating temperatures for the batteries and BMS.

[0014] In this example, ITSDM 105 includes a microcontroller unit (MCU 125) and a drive unit 130. In some embodiments, MCU 125 may be configured to generate control signals to control the BLDC motor 115. For example, drive unit 130 may generate control signals based on inputs to MCU 125. In some implementations, drive unit 130 may include (e.g., three-phase, six-phase, twelve-phase) gate drivers electrically connected to one or more power transistors. For example, ITSDM 105 may include one power transistor for each motor phase. For example, the gate driver may generate signals to control the gate voltage of the power transistor for the corresponding phase. In some examples, the power transistors may generate drain currents based on the gate voltage received from the (three-phase) gate driver.

[0015] For example, the control signal can be configured to control the speed and / or torque output of the BLDC motor 115. The drive unit 130 is connected to the MCU 125. For example, the drive unit 130 can receive control signals from the MCU 125. In some embodiments, the drive unit 130 can generate a gate drive signal to the BLDC motor 115 as a function of the received control signal. In some examples, the drive unit 130 may include a power transistor (e.g., a power MOSFET). For example, the power transistor can generate a power signal to the BLDC motor 115.

[0016] In some embodiments, drive unit 130 may be configured to modulate the power delivered from power supply 120 to BLDC motor 115. For example, drive unit 130 may be configured to ensure synchronous switching of power transistors. For example, drive unit 130 may reduce power losses in motor system 100.

[0017] As shown in the figure, MCU 125 may include memory 135 and processor 140. In this example, MCU 125 includes a signal modulation unit (SMU 145). For example, SMU 145 may include a space vector pulse width modulation (SVPWM) unit. For example, SMU 145 may include a sinusoidal pulse width modulation (SPWM) unit. For example, SMU 145 may include six-step commutation control. For example, SMU 145 may adjust the phase error and frequency error of BLDC motor 115. Based on the phase and / or frequency of BLDC motor 115, for example, processor 140 may execute a control algorithm stored in SMU 145 to generate control signals to drive unit 130.

[0018] In some implementations, in high-frequency injection mode, SMU 145 can generate periodic (e.g., quasi-sine wave, trapezoidal wave) waveforms to BLDC motor 115. For example, SMU 145 can use trapezoidal control waves to drive unit 130. For example, SMU 145 can generate sinusoidal control waves to drive unit 130. In various implementations, ITSDM 105 can advantageously provide sensorless motor control waveforms (e.g., trapezoidal waves, sine waves, near-sine waves, other custom waveforms) to BLDC motor 115 to determine the initial position (e.g., north and south pole information) during motor startup.

[0019] In this example, ITSDM 105 includes a low-loss, high-frequency sensor (LLHFS150). For example, LLHFS 150 may include transistor circuitry (e.g., current sensing circuitry, sensing field-effect transistor (SENSEFET) circuitry). For example, LLHFS150 may generate a high-frequency feedback signal based on measurements from drive unit 130 (e.g., a power transistor). In various examples, LLHFS150 may generate both high-frequency and low-frequency feedback signals based on measurements from drive unit 130. In various implementations, ITSDM 105 may be a single package (integrated circuit (IC) package) of MCU 125, drive unit 130, and LLHFS150. For example, ITSDM 105 may advantageously mitigate errors associated with high-frequency signal injection modes. In some examples, ITSDM 105 may advantageously provide smoother motor starting and control of motor system 100. In some examples, ITSDM 105 may advantageously simplify PCB layout complexity. For example, ITSDM 105 may enhance power density, making it suitable for compact motor applications. For example, the ITSDM 105 can be advantageously suited for motor installations in space-constrained environments.

[0020] In this example, the ITSDM 105 also includes a low-frequency signal port (LFSP 155). As shown, the LFSP 155 can receive feedback signals from the BLDC motor 115. For example, the MCU 125 can receive low-frequency feedback signals from the LFSP 155. For example, the MCU 125 can determine the current phase and angular velocity of the BLDC motor 115 based on the received low-frequency feedback signals.

[0021] In this example, MCU 125 includes a feedback controller 160 connected to LFSP 155. In various embodiments, feedback controller 160 may include a proportional-integral (PI) controller. For example, feedback controller 160 may include a proportional-integral-derivative (PID) controller. In some embodiments, in steady-state mode, feedback controller 160 may receive a low-frequency feedback signal from BLDC motor 115 and generate a control signal to drive unit 130.

[0022] As a non-limiting example, the motor system 100 can be activated from a deactivated state. For example, the BLDC motor 115 may be in an unknown phase and have no speed in the deactivated state. During activation, the motor system 100 can be configured to enter a high-frequency injection mode. For example, in high-frequency injection mode, the SMU 145 is configured to inject a high-frequency periodic signal into the BLDC motor 115. In some examples, the SMU 145 can determine the initial phase (e.g., initial position) of the BLDC motor 115.

[0023] In some examples, the initial phase can be determined based on the response of the BLDC motor 115 to an injected high-frequency signal. For example, the SMU 145 can be configured to analyze the current response measured in the LLHFS 150. For example, the initial phase can be determined corresponding to the current (and / or voltage) response. For example, the SMU 145 can determine the initial phase of the BLDC motor 115 based on the responses of different phases of the drive unit 130.

[0024] In some implementations, based on the initial phase, MCU 125 can generate control signals to provide energy to BLDC motor 115. For example, MCU 125 can determine the correct sequence to provide energy to the correct phase to start motor rotation. After motor rotation starts, for example, LFSP 155 can continue to measure motor speed (e.g., as a function of a measured back electromotive force (EMF) signal). In some implementations, MCU 125 can switch from high-frequency injection mode to steady-state mode when the motor reaches a predetermined operating frequency (e.g., 100 rpm, 300 rpm, 500 rpm, 1000 rpm).

[0025] In steady-state mode, for example, feedback controller 160 can receive feedback signals from LFSP 155. For example, a PID controller can generate control signals to drive unit 130 based on the feedback signals.

[0026] In various embodiments, the motor driver IC package (e.g., ITSDM 105) may include transistor sensing circuitry (e.g., LLHFS150, SENSEFET) configured to measure the initial position of the motor during startup of the motor (e.g., BLDC motor 115). In some embodiments, the motor driver IC package may be configured to operate in two modes. In high-frequency injection mode, the motor driver IC package may inject a high-frequency periodic waveform (e.g., quasi-sine wave, trapezoidal wave) to control the motor. The motor driver IC package may include low-loss high-frequency sensing circuitry configured to measure the phase current response of the motor without using a current sensing resistor. The motor driver IC package may, for example, determine the initial phase of the motor to start the motor by adjusting a control signal. After the motor reaches a predetermined speed (e.g., 500 RPM), the motor driver IC package may switch to a steady-state mode. In steady-state mode, the motor driver IC package may control the motor using an error correction controller (e.g., feedback controller 160, PI controller, PID controller). In some embodiments, the ITSDM 105 may advantageously reduce errors associated with high-frequency signal injection. For example, the ITSDM 105 can enable smoother motor starts (e.g., BLDC motor 115).

[0027] Figure 2 This is a block diagram depicting an exemplary ITSDM. As shown, ITSDM 105 includes MCU 125 and LLHFS 150. For example, MCU 125 may generate a PWM control signal 205. For example, the PWM control signal 205 may be generated based on the output of MCU 145 and / or feedback controller 160. Driver module 210 receives the PWM control signal 205 to generate gate signals (G1-G6). In some embodiments, driver module 210 may amplify the PWM control signal 205. For example, the gate signals may be generated as a function of the PWM control signal 205. For example, G1-G6 may be generated as periodic waves. As shown, G1-G3 are power gate signals 220. Each G1-3 may be connected to the gate terminal of one of the three power transistors Q1, Q3, and Q5 of power transistor circuit 215. For example, each Q1, Q3, and Q5 may be connected to a different phase of MCU 125. For example, power transistor circuit 215 can generate control signals u, v, and w to MCU 125 based on gate signals G1-3. In various examples, drive unit 130 ( Figure 1 It may include a drive module 210 and a power transistor circuit 215.

[0028] As shown in the figure, the LLHFS150 also includes three sensing transistors (Q2, Q4, and Q6). For example, the sensing transistors may include a SENSEFET. For example, each single phase of the power transistor circuit 215 may be electrically connected to one sensing transistor. In some embodiments, the sensing gate signals 225, G4-6 of the SENSEFET may be proportional to the corresponding signals of the power gate signals 220. For example, G1 = k * G4, where k is a positive number. For example, the power gate signals 220 and the sensing gate signals 225 may be synchronously related.

[0029] As shown in the figure, the source terminal of each sensing transistor is connected to the drain terminal of one of the power transistors Q1, Q3, and Q5. In this example, the source terminal of Q2 is connected to the drain terminal of Q1, the source terminal of Q4 is connected to the drain terminal of Q3, and the source terminal of Q6 is connected to the drain terminal of Q5.

[0030] In various implementations, the sensing transistors can be significantly smaller than the power transistors, resulting in lower power consumption. In some examples, sensing transistors Q2, Q4, and Q6 can be configured to generate responses with predetermined relationships between the corresponding power transistors. For example, the predetermined relationships can be configured based on power gate signal 220 and sensing gate signal 225. As shown, the LLHFS150 can generate a sensing output S. For example, the sensing output S can include a combination of sensing currents from each sensing transistor Q2, Q4, and Q6. For example, the MCU 125 can receive the sensing output S.

[0031] Therefore, for example, the MCU 125 can accurately determine the signal phase at u, v, and w by processing the current sensing response at input S. For example, the LLHFS150 can advantageously provide smaller, integrated versions of the main power transistors with proportional current paths. For example, the LLHFS150 can allow real-time monitoring of the current through the power transistors without introducing significant losses through bulky resistors designed for the higher power of power transistors Q1, Q3, and Q5.

[0032] For example, the ITSDM 105 can eliminate the need for an additional current sensing resistor to enable a high-frequency current response at the sensing control signal output. In some implementations, by eliminating the need for an additional high-current sensing resistor, the ITSDM 105 can advantageously reduce power waste and improve efficiency gain.

[0033] In this example, the ITSDM 105 also includes a low-dropout regulator (LDO regulator 230). For example, the LDO regulator 230 can generate a stable voltage to the MCU 125, the PWM control signal 205, and the power transistor circuit 215, as well as other integrated circuits of the ITSDM 105.

[0034] In some implementations, the ITSDM 105 can advantageously provide a sensorless field-oriented control (FOC) chip based on current response. For example, the ITSDM 105 can determine the detection phase of the BLDC motor 115 based on the signal output of the LLHFS 150. In some implementations, the MCU 125 can independently control the amplitude and phase of the motor current based on the detection phase, thereby inferring the stator and rotor positions of the BLDC motor 115. As an example, the MCU 125 can generate a PWM control signal 205 based on the sensing output S of the LLHFS 150, which may be directly related to the phase information of the MCU 125. In some examples, the MCU 125 can be configured to maintain an orthogonal angle between the stator and rotor. Various embodiments can advantageously enhance the torque and speed regulation of the BLDC motor 115.

[0035] like Figure 2 As shown, the MCU 125 also includes additional input and output pins. For example, as an IC package, the ITSDM 105 can be configured to generate additional outputs and receive additional inputs. Various embodiments are described below in conjunction with... Figure 3 The following description is provided. Various embodiments can combine the basic components for driving a BLDC motor into a single package. For example, the single package of the ITSDM 105 can advantageously save space.

[0036] In some examples, the ITSDM 105 can be configured to sense the current flow at the drain terminals of each power transistor Q1, Q3, Q5 without using a current-sensing resistor (e.g., a shunt resistor). For example, the LLHFS150 can advantageously provide a low-loss and temperature-insensitive component for determining the current flow of power transistors Q1, Q3, Q5. In various examples, the LLHFS150 can include a stable operating temperature between -40°C and 125°C. For example, the MCU 125 can determine the initial phase of the BLDC motor 115 based on the current flow measured by the LLHFS150.

[0037] In various examples, high-frequency injection can impose constraints on PCB layout due to its sensitivity to signal integrity. For example, the MCU 125 may require high sensitivity in high-frequency signal injection mode to accurately determine the phase of the BLDC motor 115. For instance, the required sensitivity may introduce errors during high-frequency signal injection. For example, small errors in power transistor current measurements (e.g., timing, amplitude) can adversely affect the motor start-up stability of the BLDC motor 115. In some implementations, the LLHFS150 can improve accuracy and / or reduce the required sensitivity. In some examples, the LLHFS150 can reduce PCB layout design constraints, which may be crucial for mitigating these problems.

[0038] In various implementations, the motor drive module package (e.g., motor system 100) may include N phases (e.g., N = 1, 2, 3, 6, 12, etc.). Each N phase may include power transistors (e.g., Q1, Q3, Q5) configured to generate control signals to the motor (e.g., BLDC motor 115). In high-frequency signal injection mode, MCU 125 (e.g., by executing instructions from MCU 145) may generate N control waveforms configured to control the N power transistors of the N phases.

[0039] In this example, MCU 125 includes additional input / output pins (OIOPs 235). For example, MCU 125 may receive feedback signals from external circuitry. For example, the external circuitry may include a Hall sensor configured to measure the EMF of the BLDC motor 115. For example, OIOPs 235 may receive input from a temperature sensor. In some embodiments, OIOPs 235 may include communication pins. For example, communication pins may be configured to communicate with external devices or systems. For example, communication pins may support various communication protocols such as Serial Peripheral Interface (SPI), Inter-Integrated Circuit (I2C), Universal Asynchronous Receiver / Transmitter (UART), Controller Area Network (CAN), or LIN bus. For example, communication pins may transmit or receive data, commands, or status information to or from external controllers, sensors, displays, or user interface devices. Various embodiments of OIOPs 235 are described below. Figure 3 Describe it.

[0040] Figure 3 Exemplary electrical schematics of exemplary ITSDM packages are depicted. For example, ITSDM package 300 may be an IC circuit implemented in a single package. For example, ITSDM package 300 may include an MCU 125, a driver unit 130, and an LLHFS 150 for controlling a BLDC motor 115. In some examples, ITSDM package 300 may advantageously simplify layout complexity (e.g., for designing a printed circuit board (PCB)). In some examples, ITSDM package 300 may advantageously provide enhanced power density. For example, enhanced power density may improve the overall efficiency of motor system 100.

[0041] In this example, the ITSDM package 300 includes a power module 305 configured to power various modules within the ITSDM package 300. The ITSDM package 300 also includes logic control 310 and three pre-drivers 315a-c. Each pre-driver 315a-c is connected to one of a pair of power transistors and sensing transistors (Q1-2, Q3-4, Q5-6). For example, the logic controller 310 may include a processing unit (e.g., processor 140 of MCU 125). For example, the logic controller 310 may include a feedback controller 160 of MCU 125. For example, the logic control 310 may generate power gate signals 220 and sensing gate signals 225 to the corresponding pre-drivers 315a-c.

[0042] As an illustrative example, logic control 310 can generate G1 and G4 to pre-driver 315a, G2 and G5 to pre-driver 315b, and G3 and G6 to pre-driver 315c. As shown, power transistor circuit 215 (including Q1-3) can generate control signals u, v, and w. For example, SENSEFET Q4-6 can generate outputs CS1, CS2, and CS3, respectively.

[0043] In this example, the ITSDM package 300 can receive a low-frequency signal port 155. A Hall effect or inverse EMF module 325 can also receive the low-frequency signal port 155 to generate a steady-state error measurement for the logic control 310. For example, the low-frequency signal port 155 can be connected to a Hall sensor of a BLDC motor 115. For example, each phase of the BLDC motor 115 can generate two inputs to the low-frequency signal port 155. For example, the feedback controller 160 of the logic controller 310 can generate a PWM signal based on the steady-state error input.

[0044] As shown, the ITSDM package 300 also includes an analog-to-digital converter (ADC 330). In some embodiments, the ADC 330 may receive an output from a Hall effect or back EMF module 325 and an external input indicating the speed and phase of the MCU 125. For example, the speed and phase information may be generated by a function of the SENSEFET outputs CS1-3. In this example, the ADC 330 may receive an external input from an external temperature sensor. For example, the ADC 330 may receive an external output from an external potentiometer. In some embodiments, the ADC 330 may be activated to generate an input to determine the initial phase of the BLDC motor 115 in high-frequency injection mode. For example, the logic controller 310 may receive the output of the ADC 330 and determine the initial phase of the BLDC motor 115. Various embodiments can advantageously mitigate the initial motor position error of the motor system 100. As shown, for example, reducing the use of current sensing resistors can advantageously provide lossless and temperature-constant current sensing circuitry.

[0045] The ITSDM package 300 also includes a communication port 335. For example, the communication port 335 can be used to communicate with other devices and / or controllers via analog and / or digital signals. An overcurrent protection module 340 can protect the ITSDM package 300 from overcurrent damage. For example, a thermal module 345 can generate a thermal compensation signal for the logic controller 310.

[0046] Figure 4 This is a flowchart describing an exemplary sensorless waveform control initialization method 400. For example, MCU 125 can use method 400 to start BLDC motor 115. In this example, method 400 begins when a signal to start the motor is received in step 405. For example, MCU 125 can receive a signal to start BLDC motor 115 when EV 110 is activated for movement.

[0047] Next, in step 410, the initial position of each phase of the motor is set. For example, MCU 125 can load the preset position of BLDC motor 115 from memory 135. For example, MCU 125 can load the position of each phase of BLDC motor 115 from memory 135 based on the last known position of the phase.

[0048] In step 415, motor control signals are generated in a high-frequency signal injection mode based on the position of each phase. For example, MCU 125 can activate SMU 145 to generate sensorless control waveforms (e.g., sine waves, trapezoidal waveforms) to driver unit 130. In some examples, SMU 145 can generate control waveforms based on the phases of BLDC motor 115 in high-frequency signal injection mode.

[0049] After generating the motor control signal, a feedback signal is received from the low-loss sensing circuit in step 420. For example, the MCU 125 can receive the feedback signal from the LLHFS150. For example, as referenced... Figure 2 As described, MCU 125 can receive sensor output S from LLHFS150.

[0050] In step 425, the current for each phase of the motor is determined based on the feedback signal and the current for each phase. For example, refer to... Figure 2-3As described, the LLHFS150 may include a SENSEFET that generates a sensing output S having a predetermined proportion of the drain current of a power transistor connected to the source terminal of the SENSEFET. In some embodiments, the current may be determined as a linear function of the sensing output S of the LLHFS150. In some embodiments, the current may be determined as a nonlinear function (e.g., a polynomial function, a discrete function, a logic function) of the sensing output S of the LLHFS150.

[0051] Next, in step 430, the position of each phase of the motor is updated based on the current. For example, MCU 125 can determine the position s of each phase of the BLDC motor 115 based on the current at the drain terminals (U, V, W) of power transistors Q1, Q3, and Q5. In step 435, the motor speed is determined. For example, MCU 125 can receive the speed of the BLDC motor 115 from LFSP 155. For example, MCU 125 can determine the speed based on the signal received at the Hall / inverse EMF module 325.

[0052] At decision point 440, it is determined whether the rotational speed is greater than a threshold. For example, the threshold could be 500 rpm. Alternatively, the threshold could be predetermined based on a motor speed controllable using a phase-locked loop (PLL). For example, if the motor speed is below the threshold, the motor may require the PI controller to generate additional control signals.

[0053] If the rotational speed is below the threshold, step 415 is repeated. If the rotational speed is above the threshold, in step 445, a motor control signal is generated in steady-state mode, and method 400 ends. For example, MCU 125 can generate a signal to driver unit 130 in steady-state mode.

[0054] Although various embodiments have been described with reference to the accompanying drawings, other embodiments are also possible. In some embodiments, the power transistor and sensing transistor may include field-effect transistors (FETs), such as MOSFETs. In some examples, the power transistor and sensing transistor may include bipolar junction transistors (BJTs). For example, the sensing transistor may be configured to generate a current proportional to the collector current of the BJT. In some examples, the power transistor and sensing transistor may include insulated-gate bipolar transistors (IGBTs). For example, the sensing transistor may be configured to generate a current proportional to the collector current of the IGBT.

[0055] Although an exemplary system has been described with reference to the accompanying drawings, other embodiments may be deployed in other industrial, scientific, medical, commercial and / or residential applications.

[0056] In various embodiments, some bypass circuitry embodiments can be controlled in response to signals from analog or digital components, which can be discrete, integrated, or a combination of both. Some embodiments may include programmable devices, or a combination of both (e.g., PLA, PLD, ASIC, microcontroller, microprocessor), and may include one or more data stores (e.g., cells, registers, blocks, pages) that provide single-level or multi-level digital data storage capabilities, and may be volatile, non-volatile, or a combination of both. Some control functions may be implemented in hardware, software, firmware, or any combination thereof.

[0057] A computer program product may contain a set of instructions that, when executed by a processor device, cause the processor to perform a specified function. These functions may be performed in conjunction with a controlled device having processor-operable communications. The computer program product (which may include software) may be stored on a storage medium, such as an electronic, magnetic, or rotating storage device, and may be fixed or removable (e.g., hard disk, floppy disk, USB flash drive, CD, DVD).

[0058] It can accept temporary auxiliary energy input, such as from a rechargeable or disposable battery, which allows it to be used in portable or remote applications. Some embodiments can operate with other DC voltage sources, such as (nominal) batteries. It can accept alternating current (AC) input, such as from a 50 / 60Hz power port or a portable generator, via a rectifier and appropriate scaling. The supply for the AC (e.g., sine wave, square wave, triangle wave) input may include a line frequency transformer to provide voltage boost, buck, and / or isolation.

[0059] Some systems can be configured as computer systems that can be used with various embodiments. For example, various embodiments may include digital circuits, analog circuits, computer hardware, firmware, software, or combinations thereof. Apparatus may be embodied in an information carrier, such as a machine-readable storage device, for execution by a programmable processor; methods may be implemented by a programmable processor executing instructions to perform the functions of various embodiments by manipulating input data and generating output. Various embodiments may advantageously be implemented in one or more computer programs that can be executed on a programmable system including at least one programmable processor, coupled to the processor to receive data and instructions from a data storage system, at least one input device, and / or at least one output device. A computer program is a set of instructions that can be used directly or indirectly in a computer to perform certain activities or produce certain results. Computer programs can be written in any form of programming language, including compiled or interpreted languages, and can be deployed in any form, including as a standalone program or as a module, component, subroutine, or other unit suitable for use in a computing environment.

[0060] Processors suitable for executing instruction programs include, for example, general-purpose and special-purpose microprocessors, which may comprise a single processor or multiple processors in any type of computer. Typically, the processor receives instructions and data from read-only memory or random access memory, or both. The fundamental elements of a computer are a processor for executing instructions and one or more memories for storing instructions and data. Typically, a computer will also include, or be operatively coupled to, one or more mass storage devices for storing data files; these devices include disks, such as internal hard disks and removable disks; magneto-optical disks; and optical disks. Suitable non-volatile memories for embodying computer program instructions and data include, for example, semiconductor memory devices such as EPROM, EEPROM, and flash memory devices; disks such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks. The processor and memory may be supplemented or incorporated into ASICs (Application-Specific Integrated Circuits).

[0061] In some embodiments, each system may be programmed with the same or similar information and / or initialized with substantially the same information stored in volatile and / or non-volatile memory. For example, a data interface may be configured to perform automatic configuration, automatic download, and / or automatic update functions when coupled to an appropriate host device (e.g., a desktop computer or server).

[0062] Examples of various modules can be implemented using circuitry, including a wide range of electronic hardware. By way of example and not limitation, hardware may include transistors, resistors, capacitors, switches, integrated circuits, other modules, or combinations thereof. In various examples, modules may include analog logic, digital logic, discrete components, traces and / or memory circuits fabricated on a silicon substrate, including various integrated circuits (e.g., FPGAs, ASICs), or combinations thereof. In some embodiments, a module may relate to software that executes pre-programmed instructions, is executed by a processor, or a combination thereof. For example, various modules may relate to both hardware and software.

[0063] In one illustrative aspect, the motor drive module package may include a gate drive circuit that may include N phases. For example, N may be an integer greater than or equal to 1, and each i-th phase (1 <= i <= N) of the N phases may include a corresponding power transistor (Pi), which may include a gate terminal and a drain terminal. For example, Pi may be configured to generate a motor control signal for the i-th phase at the drain terminal.

[0064] For example, a motor drive module package may include a logic control circuit coupled to a gate drive circuit. For example, the logic control circuit may include a microcontroller unit. For example, the logic control circuit may include a signal modulation engine. For example, the signal modulation engine may include an instruction program. For example, the microcontroller unit may be configured to execute the signal modulation engine to generate N control waveforms W1, W2, ..., Wi, ..., WN. For example, Wi corresponds to the i-th phase and can be received by the gate terminal of Pi.

[0065] For example, a motor drive module package may include a low-loss, high-frequency sensing circuit coupled to a logic control circuit. For example, the low-loss, high-frequency sensing circuit may include, for each Pi, a sensing field-effect transistor (SENSEFET) Si. For example, Si may include a source terminal connected to the drain terminal of Pi. For example, Si may include a gate terminal coupled to the logic control circuit. For example, the signal received at the gate terminal may be synchronously correlated with the signal received at the gate terminal of Pi.

[0066] For example, in operation, a low-loss, high-frequency sensing circuit can be configured to generate a sensing output comprising multiple current-sensing outputs, each corresponding to the current output of the sensing terminal of each N-phase SENSEFET. For instance, the current output of the sensing terminal of Si could be a positive fraction of the current input to the Si source terminal.

[0067] For example, the logic control circuitry can be configured to determine phase information based on the sensed output in a high-frequency signal injection mode. For example, the signal modulation engine can be configured to generate N control waveforms based on the phase information. For example, the logic control circuitry, gate drive circuitry, and low-loss high-frequency sensing circuitry can be integrated into a single modular package.

[0068] For example, the N control waveforms may include trapezoidal waves. For example, the signal modulation engine may include a space vector modulation engine. For example, the logic control circuitry may include a feedback controller configured to generate an error signal. For example, in steady-state mode, the signal modulation engine may be configured to generate N control waveforms based on the error signal, independent of the sensed output.

[0069] The motor drive module package may include a speed input connected to logic control circuitry. For example, the speed input may be configured to receive a speed signal representing the rotational speed of a motor connected to the motor drive module package. For example, the logic control circuitry may be configured to operate in a high-frequency signal injection mode when the rotational speed is less than a predetermined threshold.

[0070] For example, the predetermined threshold may include 500 rpm. For example, the logic control circuit may be configured to transition from a high-frequency signal injection mode to a steady-state mode when the motor speed is higher than the predetermined threshold.

[0071] For example, N>=3. For example, the sensing output of a low-loss high-frequency sensing circuit is insensitive to temperature between -40°C and 125°C.

[0072] In one illustrative aspect, the motor drive module package may include a gate drive circuit. For example, the gate drive circuit may include N phases. For example, N may be an integer greater than or equal to 1, and each i-th phase (1 <= i <= N) of the N phases may include a corresponding power transistor (Pi), which may include a gate terminal and a drain terminal. For example, Pi may be configured to generate a motor control signal and a drain output current based on a gate signal received at the gate terminal.

[0073] For example, a motor drive module package may include a logic control circuit coupled to the gate terminal of each power transistor P1, P2, ..., PN. For example, the logic control circuit may be configured to generate a gate signal for each power transistor Pi, where 1 <= i <= N. For example, a motor drive module package may include a low-loss, high-frequency sensing circuit coupled to the logic control circuit. For example, the low-loss, high-frequency sensing circuit may be configured to generate a sensing output comprising multiple current-sensing outputs (O1, O2, ..., Oi, ..., ON), each output corresponding to one of N phases.

[0074] For example, Oi can be a positive fraction of the drain output current of Pi. For example, in high-frequency signal injection mode, the logic control circuit can be configured to generate a gate signal for each N phase based on the sensed output.

[0075] For example, a motor drive module package may include logic control circuitry, gate drive circuitry, and low-loss high-frequency sensing circuitry, all integrated into a single module package.

[0076] For example, a low-loss, high-frequency sensing circuit may include a sensing field-effect transistor (SENSEFET) for each N phase. For example, the SENSEFET may include a sensing source terminal connected to the drain terminal of the corresponding power transistor. For example, the SENSEFET may include a sensing gate terminal coupled to logic control circuitry. For example, the signal received at the sensing gate terminal may be synchronously correlated with the gate signal of the corresponding power transistor. For example, the SENSEFET may include a sensing terminal configured to generate one of the corresponding current-sensing outputs.

[0077] For example, the logic control circuit may include a microcontroller unit and a signal modulation engine, which includes an instruction program. For example, the microcontroller unit may be configured to execute the signal modulation engine to generate a gate signal based on a sensed input. For example, the gate signal may include a control waveform.

[0078] For example, the control waveform may include a trapezoidal wave. For example, the signal modulation engine may include a space vector pulse width modulation (SVPWM) engine. For example, the logic control circuitry may include a feedback controller configured to generate an error signal, wherein in steady-state mode, the SVPWM engine generates the control waveform based on the error signal, independent of the sensed output.

[0079] The motor drive module package may include a speed input connected to logic control circuitry. For example, the speed input may be configured to receive a speed signal representing the rotational speed of a motor connected to the motor drive module package. For example, the logic control circuitry may be configured to operate in a high-frequency signal injection mode when the rotational speed is less than a predetermined threshold.

[0080] For example, the predetermined threshold may include 500 rpm. For example, the logic control circuit may be configured to transition from a high-frequency signal injection mode to a steady-state mode when the motor speed exceeds the predetermined threshold. For example, N>=3. For example, the sensing output of a low-loss high-frequency sensing circuit is temperature-insensitive between -40°C and 125°C.

[0081] Many implementations have been described herein. However, it should be understood that various modifications can be made. For example, advantageous results can be obtained by performing the steps of the disclosed technique in a different order, by combining the components of the disclosed system in a different manner, or by supplementing the components with other components. Therefore, other implementations can be considered within the scope of the following claims.

Claims

1. A motor drive module package, comprising: A gate drive circuit includes N phases, where N is an integer greater than or equal to 1, and each i-th phase (1<=i<=N) of the N phases includes a corresponding power transistor (Pi), which includes a gate terminal and a drain terminal, wherein Pi is configured to generate a motor control signal for the i-th phase at the drain terminal; A logic control circuit, coupled to a gate drive circuit, includes: A microcontroller unit; and, A signal modulation engine includes an instruction program, wherein a microcontroller unit is configured to execute the signal modulation engine to generate N control waveforms W1, W2, ..., Wi, ..., WN, where Wi corresponds to the i-th phase and is received by the gate terminal of Pi; and, A low-loss, high-frequency sensing circuit is coupled to a logic control circuit, wherein the low-loss, high-frequency sensing circuit includes, for each Pi, a sensing field-effect transistor (SENSEFET) Si, wherein Si comprises: A source terminal is connected to the drain terminal of Pi; A gate terminal is coupled to a logic control circuit, wherein the signal received at the gate terminal is synchronously correlated with the signal received at the gate terminal of Pi; and, In operation, the low-loss high-frequency sensing circuit is configured to generate a sensing output comprising multiple current sensing outputs, each corresponding to the current output of the sensing terminal of each N-phase SENSEFET, wherein the current output of the sensing terminal of Si is a positive fraction of the current input of the Si source terminal, where: The logic control circuit is configured to determine phase information based on the inductive output in high-frequency signal injection mode; The signal modulation engine is configured to generate N control waveforms based on phase information; and, The logic control circuit, gate drive circuit, and low-loss high-frequency sensing circuit are integrated into a single modular package.

2. The motor drive module package of claim 1, wherein the N control waveforms include trapezoidal waves.

3. The motor drive module package of claim 1, wherein the signal modulation engine includes a space vector modulation engine.

4. The motor drive module package of claim 1, wherein the logic control circuit further includes a feedback controller configured to generate an error signal, wherein in steady-state mode, the signal modulation engine is configured to generate N control waveforms based on the error signal, without relying on the sensing output.

5. The motor drive module package of claim 4 further includes a speed input connected to a logic control circuit, wherein the speed input is configured to receive a speed signal representing the rotational speed of a motor connected to the motor drive module package, and wherein the logic control circuit is configured to operate a high-frequency signal injection mode when the rotational speed is less than a predetermined threshold.

6. The motor drive module package of claim 5, wherein the predetermined threshold includes 500 rpm.

7. The motor drive module package of claim 5, wherein the logic control circuit is configured to transition from a high-frequency signal injection mode to a steady-state mode when the motor speed is higher than a predetermined threshold.

8. The motor drive module package according to claim 1, wherein N>=3.

9. The motor drive module package of claim 1, wherein the sensing output of the low-loss high-frequency sensing circuit is insensitive to temperature between -40°C and 125°C.

10. A motor drive module package, comprising: A gate drive circuit includes N phases, where N is an integer greater than or equal to 1, and each i-th phase (1<=i<=N) of the N phases includes a corresponding power transistor (Pi), which includes a gate terminal and a drain terminal, wherein Pi is configured to generate a motor control signal and a drain output current according to a gate signal received at the gate terminal; A logic control circuit is coupled to the gate terminal of each power transistor P1, P2, ..., PN, wherein the logic control circuit is configured to generate a gate signal for each power transistor Pi, 1 <= i <= N; as well as, A low-loss, high-frequency sensing circuit is coupled to a logic control circuit, wherein the low-loss, high-frequency sensing circuit is configured to generate a sensed output, including multiple current-sensing outputs (O1, O2, ..., Oi, ..., ON), each output corresponding to one of N phases, wherein: Oi is a positive fraction of the drain output current of Pi; In high-frequency signal injection mode, the logic control circuit is configured to generate gate signals for each N-phase based on the sensed output; and, The logic control circuit, gate drive circuit, and low-loss high-frequency sensing circuit are integrated into a single modular package.

11. The motor drive module package of claim 10, wherein the low-loss high-frequency sensing circuit includes, for each N phase, a sensing field-effect transistor (SENSEFET), wherein the SENSEFET comprises: A sensor source terminal is connected to the drain terminal of the corresponding power transistor; A sensed gate terminal is coupled to a logic control circuit, wherein the signal received at the sensed gate terminal is synchronously correlated with the gate signal of the corresponding power transistor; as well as, A sensing terminal is configured to generate the corresponding one of multiple current sensing outputs.

12. The motor drive module package of claim 10, wherein the logic control circuitry includes a microcontroller unit and a signal modulation engine, the engine including an instruction program, wherein the microcontroller unit is configured to execute the signal modulation engine to generate a gate signal based on a sensed input, wherein the gate signal includes a control waveform.

13. The motor drive module package of claim 12, wherein the control waveform includes a trapezoidal wave.

14. The motor drive module package of claim 12, wherein the signal modulation engine includes a space vector pulse width modulation engine.

15. The motor drive module package of claim 12, wherein the logic control circuit further includes a feedback controller configured to generate an error signal, wherein in steady-state mode, the SVPWM engine generates a control waveform based on the error signal, without relying on the induction output.

16. The motor drive module package of claim 15 further includes a speed input connected to a logic control circuit, wherein the speed input is configured to receive a speed signal representing the rotational speed of a motor connected to the motor drive module package, and wherein the logic control circuit is configured to operate a high-frequency signal injection mode when the rotational speed is less than a predetermined threshold.

17. The motor drive module package of claim 16, wherein the predetermined threshold includes 500 rpm.

18. The motor drive module package of claim 16, wherein the logic control circuit is configured to transition from a high-frequency signal injection mode to a steady-state mode when the motor speed is higher than a predetermined threshold.

19. The motor drive module package of claim 10, wherein N>=3.

20. The motor drive module package of claim 10, wherein the sensing output of the low-loss high-frequency sensing circuit is temperature insensitive between -40°C and 125°C.

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