Gluing process based on laminated spraying copper bar

Abstract

The invention relates to an adhesive technology based on a laminated spraying copper bar, and belongs to the technical field of copper bar production technologies, and the adhesive technology comprises the following steps: copper bar pretreatment: carrying out processing treatment on the copper bar according to the structural requirements of a design drawing; gluing and laminating are conducted, specifically, the surface of the spraying copper bar 1 and the surface of the insulating plate 2 are evenly smeared with adhesives, the adhesives are placed in an overlapped mode according to design requirements, and the adhesives make contact with one another and are tightly attached to one another; curing treatment is conducted, specifically, the stacked copper bars are put into a drying oven to be subjected to curing treatment; and in the performance test process, the sprayed copper bar is subjected to voltage withstanding alternating current for 10kv for 60s, so that no breakdown and no flashover are realized, and the partial discharge value is less than or equal to 10pC. The insulating plate needs to be selected with proper thickness and size according to electrical performance such as creepage distance and the like. The spraying thickness of the epoxy resin coated copper bar needs to be controlled according to insulation performance and the like. The finished adhesive copper bar has good electrical and insulating properties, and meets the requirements of the power industry for high-performance conductive parts.

Description

Technical Field

[0001] This application relates to the technical field of biological sample transportation, and in particular to an adhesive process based on laminated copper busbars. Background Technology

[0002] In power transmission and distribution systems, copper busbars are crucial conductive components, and their performance and structure have a critical impact on the system's reliability and efficiency. With the development of power technology, higher requirements are being placed on copper busbars in terms of current carrying capacity, insulation performance, heat dissipation performance, and space utilization.

[0003] Laminated copper busbars, as an improved structure, can effectively increase current carrying capacity and have a simpler layout with less space requirements. However, achieving reliable bonding and good insulation performance between the copper busbars during the fabrication process has become a critical technical challenge.

[0004] Therefore, developing an adhesive process suitable for laminated copper busbars to solve the problems existing in the current technology and improve the overall performance of laminated copper busbars is of great practical significance. Summary of the Invention

[0005] The purpose of this application is to provide an adhesive process based on laminated sprayed copper busbars.

[0006] The adhesive bonding process based on laminated sprayed copper busbars provided in this application adopts the following technical solution:

[0007] An adhesive bonding process based on laminated sprayed copper busbars includes the following steps:

[0008] Copper busbar pretreatment: The copper busbar is processed according to the design requirements;

[0009] Apply adhesive and layer it. Apply the adhesive evenly to the surface of the sprayed copper busbar and the surface of the insulating board, and place them in layers according to the design requirements so that the adhesives come into contact with each other and adhere tightly.

[0010] For the curing process, the stacked copper sheets are placed in an oven for curing.

[0011] As a preferred technical solution of this application, the copper busbar pretreatment process includes:

[0012] The copper busbar is processed into the designed structure by welding or bending.

[0013] A coating layer is formed on the surface of the copper busbar by spraying.

[0014] As a preferred technical solution of this application, the spraying process involves melting epoxy powder at high temperature and uniformly covering the surface of the copper busbar, which then solidifies to form a hard and dense insulating layer.

[0015] As a preferred technical solution of this application, the surface of the copper busbar is coated with epoxy powder with a thickness of 800μm-1200μm, and cured at 180°C for 25 minutes to form an insulating coating.

[0016] As a preferred technical solution of this application, when the sprayed copper busbar and the insulating board are laminated, pressure is applied to promote the uniform distribution and full wetting of the adhesive between the copper busbars, eliminate air bubbles, and improve the bonding quality.

[0017] As a preferred technical solution of this application, the coating process controls the coating thickness to 40μm, and the pressure applied after stacking is set to 0.6MPa.

[0018] As a preferred technical solution of this application, during the curing process, the curing temperature is 100℃-110℃, the curing time is 2-3 hours, and the curing is completed by natural cooling.

[0019] As a preferred technical solution of this application, it also includes a performance testing process, in which the coated copper busbar withstands AC voltage of 10kV for 60s without breakdown or flashover, and the partial discharge value is ≤10pC.

[0020] As a preferred technical solution of this application, the adhesive is S1103 silicone adhesive.

[0021] As a preferred technical solution of this application, the insulating board is an EPGC202 insulating board.

[0022] In summary, this application includes at least one of the following beneficial technical effects:

[0023] 1. The product of this application process has good insulation performance. First, epoxy powder is sprayed at high temperature on the surface of the copper busbar to form an insulating coating, and then combined with an adhesive with excellent insulation performance. This double protection ensures the insulation effect of the laminated copper busbar, effectively prevents leakage, and improves the safety of the power system.

[0024] 2. The product produced by the process described in this application has excellent dimensional stability and high temperature resistance. The components in the adhesive work synergistically to give the cured adhesive layer good dimensional stability. It is not easy to deform or crack under different temperature environments. Furthermore, the laminated copper busbar can maintain stable performance under high temperature environments, thus extending its service life.

[0025] 3. The process of this application is simple and low-cost. The adhesive process of this application is concise and clear, easy to operate and control, does not require complex equipment and process conditions, reduces production costs, and has good market application prospects. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the process of an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the product stacking process in the embodiments of this application;

[0028] In the diagram, 1 is a sprayed copper busbar; 2 is an insulating board. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1 -Appendix Figure 2 This application will be described in further detail below.

[0030] Example: This application proposes an adhesive process based on laminated sprayed copper busbars, referring to... Figure 1 and 2 The process includes the following steps:

[0031] Copper busbar pretreatment: The copper busbar is processed according to the structural requirements of the design drawings;

[0032] Apply adhesive and layer it. Apply the adhesive evenly to the surface of the sprayed copper busbar 1 and the surface of the insulating board 2, and place them on top of each other according to the design requirements so that the adhesive can come into contact with each other and adhere tightly.

[0033] For the curing process, the stacked copper plates are placed in an oven for curing.

[0034] In the performance testing process, the coated copper busbar was subjected to a withstand voltage of 10kV AC for 60 seconds, achieving no breakdown or flashover and a partial discharge value of ≤10pC.

[0035] Furthermore, during the copper busbar pretreatment process, the copper busbar is processed into the structure shown in the drawings through welding or bending, and then electroplated and sprayed. The sprayed layer is required to be uniform and aesthetically pleasing, free from bubbles, dents, and scratches, and to meet the thickness and pressure resistance requirements. In the spraying process, epoxy powder is melted at high temperature and evenly covered on the surface of the copper busbar. After curing, a hard and dense insulating layer is formed on the surface of the copper busbar.

[0036] When applying epoxy resin powder coating to the surface of the copper busbar, the epoxy powder thickness is 800μm-1200μm. After the coating is completed, it is cured at 180℃ for 25 minutes to form an insulating coating.

[0037] Using epoxy resin as the insulation layer for copper busbars can improve the insulation performance of laminated copper busbars and prevent leakage between copper busbars.

[0038] Furthermore, during the lamination of copper busbar 1 and insulating board 2, pressure is applied to promote uniform distribution and full wetting of the adhesive between the copper busbars, eliminate air bubbles, and improve bonding quality. The adhesive coating thickness is controlled at 40 μm during the coating process, and the pressure applied after stacking is set to 0.6 MPa.

[0039] In this embodiment, S1103 silicone adhesive is used. The components in the adhesive work together to give the cured adhesive layer good dimensional stability and it is not easy to deform or crack under different temperature conditions.

[0040] An insulating coating is applied to the surface of the copper busbar, and then combined with an adhesive with excellent insulating properties, providing double protection for the insulation effect of the laminated copper busbar, effectively preventing leakage and improving the safety of the power system.

[0041] Furthermore, during the curing process, the curing temperature is 100℃-110℃, the curing time is 2.5 hours, and the material is allowed to cool naturally after curing. During the curing process, the curing agent in the adhesive undergoes a cross-linking reaction with the saturated polyester resin to form a stable three-dimensional network structure, which firmly bonds the copper busbars together. After curing, the stacked copper busbars are removed and allowed to cool naturally to room temperature.

[0042] Furthermore, the insulation board 2 is made of EPGC202 insulation board. The thickness and size of the insulation board 2 are designed appropriately to prevent changes in the creepage distance between copper busbars, which would affect the conductivity.

[0043] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. An adhesive process based on laminated sprayed copper busbars, characterized in that, Includes the following steps: Copper busbar pretreatment: The copper busbar is processed according to the design requirements; Apply adhesive and layer it. Apply the adhesive evenly to the surface of the sprayed copper busbar and the surface of the insulating board, and place them in layers according to the design requirements so that the adhesives come into contact with each other and adhere tightly. For the curing process, the stacked copper sheets are placed in an oven for curing.

2. The adhesive process based on laminated sprayed copper busbars according to claim 1, characterized in that, The copper busbar pretreatment process includes: The copper busbar is processed into the designed structure by welding or bending. A coating layer is formed on the surface of the copper busbar by spraying.

3. The adhesive process based on laminated sprayed copper busbars according to claim 2, characterized in that, The spraying process involves melting epoxy resin powder at high temperature and uniformly covering the surface of the copper busbar, which then cures to form a hard and dense insulating layer.

4. The adhesive process based on laminated sprayed copper busbars according to claim 3, characterized in that, The copper busbar surface is coated with epoxy powder with a thickness of 800μm-1200μm, and cured at 180℃ for 25 minutes to form an insulating coating.

5. The adhesive process based on laminated sprayed copper busbars according to claim 1, characterized in that, When the sprayed copper busbar and the insulating board are laminated, pressure is applied to promote the uniform distribution and full wetting of the adhesive between the copper busbars, eliminate air bubbles, and improve the bonding quality.

6. The adhesive process based on laminated sprayed copper busbars according to claim 5, characterized in that, The coating process controls the coating thickness to 40 μm, and the pressure applied after stacking is set to 0.6 MPa.

7. The adhesive process based on laminated sprayed copper busbars according to claim 1, characterized in that, During the curing process, the curing temperature is 100℃-110℃, the curing time is 2-3 hours, and the product is allowed to cool naturally after curing.

8. The adhesive process based on laminated sprayed copper busbars according to claim 1, characterized in that, It also includes a performance testing process, in which the coated copper busbars pass an AC withstand voltage of 10kV for 60 seconds without breakdown or flashover, and with a partial discharge value ≤10pC.

9. The adhesive process based on laminated sprayed copper busbars according to claim 1, characterized in that, The adhesive used is S1103 silicone adhesive.

10. The adhesive process based on laminated sprayed copper busbars according to claim 1, characterized in that, The insulating board is an EPGC202 insulating board.

Images