Continuous preparation method of UTG finished product

Abstract

The invention relates to the field of material preparation, in particular to a continuous preparation method of a UTG finished product. The method comprises the following steps of: executing related procedures such as a carrier tape 1 treatment procedure, a double-sided coating procedure, a laser processing procedure and a post-treatment procedure in sequence, and further setting quality interlocking control, production system cooperative control, a process compensation mechanism and the like, so that parameters of each procedure are optimized and subjected to related control; the parameters include carrier tape binding force, coating speed and thickness, laser processing parameters, hydrofluoric acid processing parameters and the like. The continuous preparation device achieves the technical effects that continuous preparation of the UTG finished product is achieved, the stability and consistency of the product quality are guaranteed, and the production efficiency and the product performance are improved.

Description

Technical Field

[0001] This application relates to the field of ultrathin glass preparation technology, and in particular to a continuous preparation method for UTG finished products. Background Technology

[0002] With the continuous development of display technology, ultra-thin flexible glass (UTG), with its excellent flexibility, high transparency, and good chemical stability, has shown great application potential in emerging display fields such as foldable screen phones and wearable devices, becoming one of the research hotspots in the display industry. The emergence of UTG provides key material support for realizing foldable and bendable display devices, driving display technology towards thinner, more portable, and multifunctional directions, which is of great significance for improving the user's visual experience and expanding the application scenarios of display devices. As market demand for flexible display products continues to grow, higher requirements are being placed on the quality and production efficiency of UTG.

[0003] In the manufacturing process of UTG finished products, existing technologies offer a series of conventional solutions. Firstly, the main methods for manufacturing UTG substrates are thinning and Czochralski (CZ) drawing, with thinning being the most common method used in China. After the UTG substrate is completed, it needs to be cut into small pieces. To reduce edge chipping, optical adhesive is applied to both sides of the UTG substrate before cutting. Cutting methods include water jet cutting followed by edge trimming and immersion in HF (high-temperature fluoride), and laser cutting after applying optical adhesive to both sides before immersion in HF. Practice has shown that laser cutting offers better yield and reliability. The standard process for manufacturing UTG products using the thinning method is as follows: First, high-alumina float glass is immersed in HF using a blue-insertion method to eliminate stress and etching speed inconsistencies between the air and tin sides. Next, a UV release liner is applied to a substrate, and the glass is immersed in HF again. After cleaning and drying, acid-resistant adhesive is applied and cured. The substrate and release liner are then removed, and acid-resistant adhesive is applied and cured again. The glass is then laser-cut into small blue-insertion pieces, immersed in HF to remove micro-cracks from the cutting marks, and the acid-resistant adhesive is removed after demolding. Afterwards, cleaning, drying, chemical tempering, cleaning, inspection, and finally packaging are performed. Another process for manufacturing UTG products using a UTG substrate is as follows: Upon arrival, the glass is cleaned, then acid-resistant adhesive is applied to both sides and cured. Next, it is laser-cut into small blue-insertion pieces, immersed in HF to remove micro-cracks from the cutting marks, and the acid-resistant adhesive is removed after demolding. The subsequent processes are also cleaning, drying, chemical tempering, cleaning, inspection, and packaging.

[0004] However, existing methods for manufacturing UTG products have significant drawbacks, resulting in low production efficiency and yield. In traditional manufacturing processes, most steps are performed step-by-step and intermittently, making continuous production difficult and leading to low efficiency. Furthermore, the lack of effective quality control and uniformity assurance measures during manufacturing results in poor product quality stability and difficulty in effectively improving yield. Summary of the Invention

[0005] The purpose of this application is to overcome the above-mentioned technical problems and provide a continuous preparation method for UTG products. A continuous preparation method for UTG finished product, comprising the following related steps performed sequentially: (a) Carrier tape 1 processing step: High alumina glass with non-functional surfaces removed is attached to polytetrafluoroethylene carrier tape 1 coated with UV adhesive, and then thinned by continuous hydrofluoric acid to form UTG substrate roll. (b) Double-sided coating process: Acid-resistant adhesive is continuously coated on the A side of the UTG substrate and carrier tape 2 is covered. After UV debonding and peeling off carrier tape 1, acid-resistant adhesive coating is simultaneously completed on the B side. (c) Laser processing: The coated roll is peeled off with carrier tape 2, fixed by vacuum adsorption and laser cutting. The cut pieces are treated with hydrofluoric acid to remove microcracks. (d) Post-processing steps: After removing the acid-resistant adhesive, chemical tempering and cleaning are carried out in sequence to obtain the finished UTG.

[0006] By adopting the above technical solution, the roll-to-roll transport method enables continuous HF etching, coating of acid-resistant adhesive, and curing of acid-resistant adhesive. During the thinning process, continuous wafer etching ensures good uniformity of the produced UTG substrate. Direct winding after cleaning minimizes contamination of the UTG substrate. The continuous and uniform speed of coating and curing of acid-resistant adhesive ensures good coating uniformity and consistent curing of the acid-resistant adhesive. Ultimately, continuous preparation of UTG finished products is achieved, improving preparation efficiency and yield.

[0007] Preferably, the carrier tape 1 and carrier tape 2 satisfy the following: The silicone bonding strength of carrier tape 2 is 1.2-1.5 times that of the residual bonding strength of carrier tape 1 after UV debonding. The polytetrafluoroethylene film of carrier tape 1 is 20-50 μm thinner than the PET substrate of carrier tape 2.

[0008] By adopting the above technical solution, the silicone bonding force of carrier tape 2 is 1.2-1.5 times that of the residual bonding force of carrier tape 1 after UV debonding, which can ensure that carrier tape 2 can be smoothly coated on the UTG substrate and that carrier tape 1 can be easily peeled off; the thickness of the polytetrafluoroethylene film of carrier tape 1 is 20-50μm thinner than the PET substrate of carrier tape 2, which is beneficial to the handling of carrier tape and the conveying of roll material during continuous preparation, thereby improving the efficiency and quality of UTG finished product preparation.

[0009] Preferably, in the double-sided coating process: Synchronization of A-side coating speed with roll material conveying speed; The coating thickness on side B is dynamically compensated by ±3μm based on the thickness measurement value of side A.

[0010] By adopting the above technical solution, synchronizing the coating speed of side A with the roll material conveying speed can ensure the continuity and uniformity of the acid-resistant adhesive coating on side A; and by dynamically compensating the coating thickness of side B by ±3μm based on the thickness detection value of side A, it can ensure that the coating thickness of acid-resistant adhesive on both sides is uniform and meets the requirements, thereby improving the quality and performance of the UTG finished product.

[0011] Preferably, during the hydrofluoric acid treatment: The soaking time and laser cutting speed are controlled in relation to t=K / v, where K is 150-250mm·s; The HF concentration in the treatment tank is dynamically adjusted by ±0.5 mol / L based on the roughness test value of the cut surface.

[0012] By adopting the above technical solution, high-alumina glass with non-functional surfaces removed is attached to a polytetrafluoroethylene carrier tape 1 coated with UV-cured adhesive. After continuous hydrofluoric acid thinning, a UTG substrate roll is formed. Acid-resistant adhesive is continuously coated on side A of the UTG substrate and covered with carrier tape 2. After UV-cured adhesive removal of carrier tape 1, acid-resistant adhesive is simultaneously applied to side B. The coated roll is then subjected to carrier tape 2 peeling, vacuum adsorption fixation, and laser cutting. After cutting, the small pieces are treated with hydrofluoric acid to remove microcracks. After removing the acid-resistant adhesive, chemical tempering and cleaning are performed sequentially to obtain the finished UTG. During hydrofluoric acid treatment, the immersion time and laser cutting speed are controlled in a correlation with t=K / v, and the HF concentration in the treatment tank is dynamically adjusted according to the roughness detection value of the cut surface. This ensures the effectiveness of hydrofluoric acid treatment, making the removal of microcracks in the small pieces after cutting more reasonable and effective, and improving the quality and production efficiency of the UTG finished product.

[0013] Preferably, the demolding process employs: The concentration of the alkaline solution is directly proportional to the cumulative coating thickness of the acid-resistant adhesive, with a proportionality coefficient of 0.1 mol / L·μm; The ultrasonic power is set according to the residual colloid area as P=0.5A+20 (A is the area in cm², and P is the power in W).

[0014] By adopting the above technical solution and setting the concentration of alkaline solution and the cumulative coating thickness of acid-resistant adhesive in a direct proportional relationship, the concentration of alkaline solution can be precisely controlled according to the coating condition of acid-resistant adhesive, thereby improving the demolding efficiency. The ultrasonic power can be set according to the area of ​​residual adhesive, which can be adjusted for different residual adhesive areas to ensure effective removal of residual adhesive, thereby effectively removing the acid-resistant adhesive and providing a good foundation for subsequent chemical tempering and cleaning processes.

[0015] Preferably, the chemical tempering comprises: Molten salt temperature gradient control, with the initial temperature 50-80°C higher than the UTG substrate roll-up temperature; The ion exchange time is set according to the number of hydrofluoric acid treatments, using the formula T = 30n + 60 (where n is the number of treatments and T is the number of minutes).

[0016] By adopting the above technical solution, using molten salt temperature gradient control and setting the starting temperature 50-80°C higher than the UTG substrate curling temperature, the chemical tempering process can be better adapted to the characteristics of the UTG substrate. The ion exchange time can be set according to the number of hydrofluoric acid treatments, so that the ion exchange is more complete and reasonable, thereby improving the chemical tempering effect and quality of the UTG finished product.

[0017] Preferably, this includes collaborative control of the production system: The unwinding tension of carrier tape 1 and the traction force of the hydrofluoric acid tank are maintained at a ratio of 1:1.2-1.5; The temperature and conveyor speed of the coating drying oven are adjusted according to ΔT=0.5v (v is m / min, ΔT is ℃).

[0018] By adopting the above technical solution, high-alumina glass with non-functional surfaces removed is attached to a polytetrafluoroethylene carrier tape 1 coated with UV-cured adhesive. After continuous hydrofluoric acid thinning, a UTG substrate roll is formed. Acid-resistant adhesive is continuously coated on side A of the UTG substrate and covered with carrier tape 2. After UV-cured adhesive peeling off carrier tape 1, acid-resistant adhesive is simultaneously coated on side B. The coated roll is then subjected to carrier tape 2 peeling, vacuum adsorption fixation, and laser cutting. After cutting, the small pieces are treated with hydrofluoric acid to remove microcracks. After removing the acid-resistant adhesive, chemical tempering and cleaning are performed sequentially to obtain the finished UTG. At the same time, the unwinding tension of carrier tape 1 and the traction force of the hydrofluoric acid bath are maintained at a ratio of 1:1.2-1.5. The temperature of the coating drying oven and the conveyor speed are adjusted according to ΔT = 0.5V. This ensures the coordinated and stable operation of each process in the continuous preparation of the UTG finished product, improving production efficiency and product quality.

[0019] Preferably, a process compensation mechanism is set up: When the ambient humidity is greater than 60%, the thickness of the acid-resistant adhesive coating will automatically increase by 2-5 μm; When the temperature fluctuation is greater than ±3℃, the UV curing strength increases by 10-20mW / cm².

[0020] By adopting the above technical solution, the coating thickness of the acid-resistant adhesive is automatically increased when the ambient humidity is greater than 60%, which can compensate for the influence of humidity on the performance of the acid-resistant adhesive; when the temperature fluctuation is greater than ±3℃, the UV curing strength is increased accordingly, which can ensure the curing effect of the acid-resistant adhesive and thus ensure the product quality of the UTG finished product.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. The roll-to-roll transport method enables continuous HF etching, acid-resistant adhesive coating, and acid-resistant adhesive curing, improving the efficiency and yield of UTG finished products; 2. The thinning process uses continuous wafer etching, which produces UTG substrates with good uniformity. After cleaning, the substrates can be directly wound up, resulting in less contamination. 3. The application and curing of the acid-resistant adhesive are carried out continuously and at a uniform speed, resulting in better coating uniformity than sheet coating and better consistency after curing. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of glass thinning in the preparation method of the embodiments of this application.

[0023] Figure 2 This is a schematic diagram of the double-sided coating of acid-resistant adhesive on the UTG substrate in the preparation method of the embodiments of this application.

[0024] Figure 3 This is a schematic diagram of the double-sided coating of acid-resistant adhesive on the RTR UTG substrate in the preparation method of this application embodiment. Detailed Implementation

[0025] The following is in conjunction with the appendix Figures 1-3 This application will be described in further detail.

[0026] Example 1: Reference Figure 1 and Figure 2 and combined Figure 3 The continuous preparation method of UTG finished product provided in this application includes the following steps: (a) Carrier tape 1 processing step: High alumina glass with non-functional surfaces removed is attached to polytetrafluoroethylene carrier tape 1 coated with UV adhesive, and then thinned by continuous hydrofluoric acid to form UTG substrate roll. (b) Double-sided coating process: Acid-resistant adhesive is continuously coated on the A side of the UTG substrate and carrier tape 2 is covered. After UV debonding and peeling off carrier tape 1, acid-resistant adhesive coating is simultaneously completed on the B side. (c) Laser processing: The coated roll is peeled off with carrier tape 2, fixed by vacuum adsorption and laser cutting. The cut pieces are treated with hydrofluoric acid to remove microcracks. (d) Post-processing steps: After removing the acid-resistant adhesive, chemical tempering and cleaning are carried out in sequence to obtain the finished UTG.

[0027] Specifically, the carrier tape 1 processing step includes attaching high-alumina glass with non-functional surfaces removed to a polytetrafluoroethylene carrier tape 1 coated with UV adhesive, and then thinning it with hydrofluoric acid to form a UTG substrate roll.

[0028] High-alumina glass with non-functional surfaces removed is typically 0.2-0.3mm float high-alumina glass with the tin and air surfaces removed. This type of glass can better perform its functional properties after the non-functional surfaces are removed. PTFE carrier tape 1 has good chemical stability and corrosion resistance, making it suitable for use in the hydrofluoric acid thinning process. UV debonding adhesive can be used subsequently by UV irradiation to achieve debonding, facilitating the peeling of carrier tape 1. For example, other fluoride carrier materials with similar chemical stability and corrosion resistance can also be used to replace PTFE carrier tape 1. In actual UTG processing, high-alumina glass is attached to PTFE carrier tape 1 coated with UV debonding adhesive using a bonding equipment, and then enters a continuous hydrofluoric acid thinning equipment for thinning. The concentration of hydrofluoric acid in the thinning equipment is maintained within a certain range, and the hydrofluoric acid continuously acts during the thinning process, gradually thinning the high-alumina glass to form a UTG substrate roll. This continuous wafer etching process results in UTG substrates with excellent uniformity because the thinning process is continuous and stable, avoiding the unevenness problems that may occur with traditional intermittent thinning.

[0029] Specifically, the double-sided coating process includes continuously coating the A side of the UTG substrate with acid-resistant adhesive and covering it with carrier tape 2. After UV debonding and peeling off the carrier tape 1, the acid-resistant adhesive is simultaneously coated on the B side.

[0030] The acid-resistant adhesive protects the UTG substrate from excessive corrosion during subsequent hydrofluoric acid treatment. Carrier tape 2 is typically a PET carrier tape coated with silicone. The adhesion between the silicone and side A must be greater than the adhesion between the unbonded PTFE carrier tape 1 and the UTG substrate to ensure smooth peeling of carrier tape 1 after UV debonding. Alternatively, other adhesive materials with similar silicone properties can be coated onto carrier tapes of other materials to replace carrier tape 2. In actual UTG processing, when coating side A with the acid-resistant adhesive, continuous coating is performed using a coating machine. The coating speed is synchronized with the roll conveyor speed to ensure uniform coating. During operation, multiple adjustments and monitoring were conducted to ensure that the speed synchronization error between the two was within the specified range. After side A is coated, carrier tape 2 is placed on top, followed by UV irradiation to debond the UV debonding adhesive, and then the PTFE carrier tape 1 is peeled off. Next, the acid-resistant adhesive is simultaneously applied to side B. The coating thickness on side B is dynamically compensated by ±3μm based on the thickness measurement value of side A, further ensuring the uniformity and quality stability of the double-sided coating. The thickness of side A is monitored in real time, and the coating thickness on side B is adjusted according to the monitoring results.

[0031] Specifically, the laser processing steps include peeling the coated roll material from the carrier tape, vacuum adsorption fixation, and laser cutting. After cutting, the small pieces are treated with hydrofluoric acid to remove microcracks.

[0032] Vacuum adsorption fixation is used to ensure the stability of the UTG substrate during laser cutting, preventing its movement from affecting cutting quality. The laser cutting equipment cuts the roll material along a preset path, forming small pieces. For example, the laser cutting path can be adjusted according to different product requirements. In UTG processing, the laser cutting path is adjusted according to the requirements of different UTG finished product specifications. After cutting, the small pieces are treated with hydrofluoric acid to remove microcracks. The immersion time is controlled in relation to the laser cutting speed according to t = K / v, where K is 150-250 mm·s. The HF concentration in the treatment tank is dynamically adjusted according to the ambient temperature and humidity to maintain a stable proportion between 15% and 20%. This allows for precise control of the hydrofluoric acid treatment parameters based on the cutting situation, better removal of microcracks, and improved product quality. The surface roughness of the cut is monitored in real time, and the HF concentration in the treatment tank is dynamically adjusted based on the monitoring results.

[0033] Specifically, the post-processing steps include removing the acid-resistant adhesive and then performing chemical tempering and cleaning to obtain the finished UTG.

[0034] Acid-resistant adhesive removal typically employs a stripping method using an alkaline solution. The concentration of the alkaline solution is directly proportional to the cumulative coating thickness of the acid-resistant adhesive, with a proportionality coefficient of 0.1 mol / L·μm. The ultrasonic power is set according to the residual adhesive area using the formula P = 0.5A + 20 (where A is the area in cm², and P is the power in W). This allows for precise control of the stripping parameters based on the actual condition of the acid-resistant adhesive, ensuring effective stripping. In actual UTG processing, the alkaline solution concentration is precisely configured based on the cumulative coating thickness of the acid-resistant adhesive, and the ultrasonic power is adjusted according to the residual adhesive area. Chemical tempering enhances the strength and hardness of the UTG, making it more suitable for the finished product's usage requirements. Cleaning removes impurities remaining from the chemical tempering process, ensuring the cleanliness of the finished product. During chemical tempering, a molten salt temperature gradient is used for control, with the initial temperature being 50-80°C higher than the UTG substrate curling temperature. The ion exchange time is set according to the number of hydrofluoric acid treatments using T = 30n + 60 (where n is the number of treatments and T is minutes). Specific cleaning equipment and cleaning agents are used to remove impurities during cleaning.

[0035] The implementation principle of this embodiment is as follows: This embodiment adopts a roll-to-roll continuous manufacturing method, enabling each process to be carried out continuously, avoiding the inefficiency problems of traditional step-by-step and intermittent production methods, and greatly improving production efficiency. Simultaneously, a series of quality control and uniformity assurance measures are set up in each process, such as carrier tape treatment, coating speed control, laser cutting parameter control, and post-processing parameter control, making product quality more stable and effectively improving yield. Compared with existing technologies, this method achieves continuous and high-quality production of UTG finished products, representing a significant improvement over existing technologies.

[0036] Example 2: The difference between this embodiment and the above embodiment is that the silicone bonding force of carrier tape 1 and carrier tape 2 is 1.2 to 1.5 times that of the residual bonding force of carrier tape 1 after UV debonding, and the polytetrafluoroethylene film of carrier tape 1 is 20 to 50 μm thinner than the PET substrate of carrier tape 2.

[0037] In UTG processing, carrier tape 1 and carrier tape 2 undergo rigorous performance testing and screening. When selecting carrier tapes, it is ensured that the silicone bonding strength of carrier tape 2 is within 1.2 to 1.5 times the residual bonding strength of carrier tape 1 after UV debonding. Simultaneously, the PTFE film thickness of carrier tape 1 is 20 to 50 μm thinner than the PET substrate of carrier tape 2. This parameter setting between carrier tapes ensures smooth peeling of carrier tape 1 after UV debonding, while carrier tape 2 maintains stable adhesion to the UTG substrate. The appropriate bonding strength ratio allows carrier tape 2 to provide sufficient tensile force when peeling carrier tape 1, while the thinner thickness of carrier tape 1 facilitates its operation during hydrofluoric acid thinning and subsequent peeling.

[0038] The implementation principle of this embodiment is as follows: by rationally setting the bonding force and thickness of carrier tape 1 and carrier tape 2, the performance of the carrier tape in the entire production process is optimized, ensuring the smooth progress of each process and improving product quality and production efficiency. Compared with the prior art, this optimized setting of carrier tape parameters is a further improvement to the UTG finished product preparation method.

[0039] Example 4: The difference between this embodiment and the above embodiments is that: in the double-sided coating process, the coating speed of side A is synchronized with the roll material conveying speed; the coating thickness of side B is dynamically compensated ±3μm based on the thickness detection value of side A.

[0040] In actual UTG processing, high-precision speed sensors and thickness detection equipment are used to ensure the control of these parameters. The speed sensor monitors the coating speed on side A and the roll material conveying speed in real time, ensuring that the synchronization error is within the specified range. The thickness detection equipment detects the thickness on side A in real time and dynamically adjusts the coating thickness on side B based on the detected value, keeping its thickness deviation within ±3μm. This synchronization error control between the coating speed on side A and the roll material conveying speed ensures the uniformity of the coating on side A, avoiding uneven coating caused by speed asynchrony. Dynamic compensation of the coating thickness on side B based on the detected thickness value on side A ensures the uniformity of the coating thickness on both sides, further improving product quality.

[0041] The implementation principle of this embodiment is as follows: by precisely controlling the coating speed and thickness in the double-sided coating process, the uniformity and quality stability of the coating are improved. This precise control mechanism can better meet product quality requirements and is an important improvement to the coating process in existing UTG finished product preparation methods.

[0042] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A continuous preparation method for a UTG product, characterized in that, Execute the following related processes in sequence: (a) Carrier tape 1 processing step: High alumina glass with non-functional surfaces removed is attached to polytetrafluoroethylene carrier tape 1 coated with UV adhesive, and then thinned by continuous hydrofluoric acid to form UTG substrate roll. (b) Double-sided coating process: Acid-resistant adhesive is continuously coated on the A side of the UTG substrate and carrier tape 2 is covered. After UV debonding and peeling off carrier tape 1, acid-resistant adhesive coating is simultaneously completed on the B side. (c) Laser processing: The coated roll is peeled off with carrier tape 2, fixed by vacuum adsorption and laser cutting. The cut pieces are treated with hydrofluoric acid to remove microcracks. (d) Post-processing steps: After removing the acid-resistant adhesive, chemical tempering and cleaning are carried out in sequence to obtain the finished UTG.

2. The method according to claim 1, characterized in that, The carrier belt 1 and carrier belt 2 satisfy the following: The silicone bonding strength of carrier tape 2 is 1.2-1.5 times that of the residual bonding strength of carrier tape 1 after UV debonding. The polytetrafluoroethylene film of carrier tape 1 is 20-50 μm thinner than the PET substrate of carrier tape 2.

3. The method according to claim 1, characterized in that, In the double-sided coating process: Synchronization of A-side coating speed with roll material conveying speed; The coating thickness on side B is dynamically compensated by ±3μm based on the thickness measurement value of side A.

4. The method according to claim 1, characterized in that, During the hydrofluoric acid treatment: The soaking time and laser cutting speed are controlled in relation to t=K / v, where K is 150-250mm·s; The HF concentration in the treatment tank is dynamically adjusted based on ambient humidity and temperature, so that the HF concentration ratio is between 15% and 20%.

5. The method according to claim 1, characterized in that, The decoction process employs: The concentration of the alkaline solution is directly proportional to the cumulative coating thickness of the acid-resistant adhesive, with a proportionality coefficient of 0.1 mol / L·μm; The ultrasonic power is set according to the residual colloid area as P=0.5A+20 (A is the area in cm², and P is the power in W).

6. The method according to claim 1, characterized in that, The chemical tempering includes: Molten salt temperature gradient control, with the initial temperature 50-80°C higher than the UTG substrate roll-up temperature; The ion exchange time is set according to the number of hydrofluoric acid treatments, using the formula T = 30n + 60 (where n is the number of treatments and T is the number of minutes).

7. The method according to claim 1, characterized in that, Including collaborative control of the production system: The unwinding tension of carrier tape 1 and the traction force of the hydrofluoric acid tank are maintained at a ratio of 1:1.2-1.5; The temperature and conveyor speed of the coating drying oven are adjusted according to ΔT=0.5v (v is m / min, ΔT is ℃).

8. The method according to claim 1, characterized in that, Set up a process compensation mechanism: When the ambient humidity is greater than 60%, the thickness of the acid-resistant adhesive coating will automatically increase by 2-5 μm; When the temperature fluctuation is greater than ±3℃, the UV curing strength increases by 10-20mW / cm².

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