Array substrate, display panel and display device

Abstract

The invention relates to an array substrate, a display panel and a display device. The array substrate comprises a substrate; the driving layer group is located on one side of the substrate, the driving layer group comprises at least two metal layers, the at least two metal layers comprise a first metal layer and a second metal layer which are arranged in an insulating mode, and the second metal layer is located on the side, close to or away from the substrate, of the first metal layer; at least part of the first metal layer comprises a first sub-metal layer and a second sub-metal layer which are stacked, the first sub-metal layer is located between the substrate and the second sub-metal layer, and the orthographic projection of the second sub-metal layer on the substrate and the orthographic projection of the first sub-metal layer on the substrate are at least partially overlapped. According to the array substrate adopting the technical scheme, when the screen body of the display panel is impacted, at least part of the first metal layer is of a double-layer film design, so that fracture extension of the film layer can be blocked, the fracture influence of the film layer can be reduced, the impact resistance is improved, the functionality of the film layer is ensured, and wide application is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an array substrate, a display panel and a display device. BACKGROUND

[0002] With the continuous iteration of display panels, consumers have increasingly high requirements for various performance of products, among which the demand for mechanical performance is particularly strong. However, the impact resistance of the screen body of the traditional display panel is still weak and needs to be further improved. SUMMARY

[0003] Therefore, it is necessary to provide an array substrate, a display panel and a display device for improving the impact resistance.

[0004] An array substrate comprises:

[0005] a substrate; and

[0006] a driving layer group located on one side of the substrate, the driving layer group comprising at least two metal layers, the at least two metal layers comprising a first metal layer and a second metal layer arranged in an insulating manner, the second metal layer being located on the side of the first metal layer close to or away from the substrate;

[0007] wherein at least part of the first metal layer comprises a first sub-metal layer and a second sub-metal layer arranged in a stacked manner, the first sub-metal layer being located between the substrate and the second sub-metal layer, and the second sub-metal layer on the substrate and the first sub-metal layer on the substrate at least partially overlap in orthographic projection.

[0008] The array substrate of the present application has the advantages that when the screen body of the display panel is impacted, the at least partially double-layered first metal layer can block the extension of the film layer fracture and reduce the influence of the film layer fracture, thereby improving the impact resistance, ensuring the functionality of the film layer, and being conducive to wide application.

[0009] In a feasible implementation manner, at least part of the second metal layer comprises a third sub-metal layer and a fourth sub-metal layer arranged in a stacked manner, the third sub-metal layer being located between the substrate and the fourth sub-metal layer, and the fourth sub-metal layer on the substrate and the third sub-metal layer on the substrate at least partially overlap in orthographic projection.

[0010] In a feasible implementation manner, the orthographic projection of the second sub-metal layer on the substrate covers the orthographic projection of the first sub-metal layer on the substrate.

[0011] Preferably, a normal projection of the second sub-metal layer on the substrate coincides with a normal projection of the first sub-metal layer on the substrate; or, a normal projection of the first sub-metal layer on the substrate is located within a normal projection of the second sub-metal layer on the substrate.

[0012] In one possible implementation, along the first direction, the first sub-metal layer comprises a plurality of spaced metal blocks, and the second sub-metal layer covers surfaces of the metal blocks and fills in spaces between adjacent metal blocks.

[0013] Preferably, the cross-sectional shape of the metal blocks has an undercut structure.

[0014] In one possible implementation, along the first direction, the first sub-metal layer comprises a plurality of spaced metal blocks, and a connecting portion is arranged between adjacent metal blocks, and the second sub-metal layer covers surfaces of the metal blocks and surfaces of the connecting portion and fills in spaces between adjacent metal blocks.

[0015] Preferably, a normal projection of the first sub-metal layer on the substrate comprises a comb-tooth structure.

[0016] Preferably, the cross-sectional shape of the metal blocks has a top cut structure.

[0017] In one possible implementation, the first metal layer comprises a gate and a first plate, the second metal layer comprises a second plate, and the first plate and the second plate constitute a capacitor.

[0018] In one possible implementation, the material of the first sub-metal layer and the material of the second sub-metal layer are the same.

[0019] Preferably, the material of the first sub-metal layer and the material of the second sub-metal layer both comprise molybdenum.

[0020] In one possible implementation, the thickness of the first sub-metal layer is 30% to 60% of the thickness of the first metal layer.

[0021] Preferably, the thickness of the first metal layer is 2500 angstroms to 3000 angstroms.

[0022] A display panel comprises the array substrate.

[0023] The display panel of the technical scheme comprises the array substrate, when a screen body of the display panel is impacted, since at least part of the first metal layer is designed as a double-layer film, film layer fracture extension can be blocked, film layer fracture influence can be reduced, impact resistance can be improved, film layer functionality can be ensured, and the technical scheme is conducive to wide application.

[0024] The display device comprises the display panel.

[0025] The display device of the technical scheme of the present application comprises the display device, when the screen body of the display panel is impacted, since at least part of the first metal layer is designed as a double-layer film, the film layer fracture extension can be blocked, the film layer fracture influence is reduced, the impact resistance is improved, the film layer functionality is ensured, and the display device is beneficial to wide application. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A schematic diagram of an array substrate of an embodiment of the present application;

[0027] Figure 2 A front view of an array substrate of a first embodiment of the present application;

[0028] Figure 3 A side view of an array substrate of the first embodiment of the present application;

[0029] Figure 4 A top view of an array substrate of the first embodiment of the present application;

[0030] Figure 5 A front view of an array substrate of a second embodiment of the present application;

[0031] Figure 6 A side view of an array substrate of the second embodiment of the present application;

[0032] Figure 7 A schematic diagram of positions of a substrate, a first sub-metal layer and a second sub-metal layer in an array substrate of the second embodiment of the present application;

[0033] Figure 8 A front view of an array substrate of a third embodiment of the present application;

[0034] Figure 9 A side view of an array substrate of the third embodiment of the present application;

[0035] Figure 10 A schematic diagram of positions of a substrate, a first sub-metal layer and a second sub-metal layer in an array substrate of the third embodiment of the present application;

[0036] Figure 11 A front view of an array substrate of a fourth embodiment of the present application;

[0037] Figure 12 A side view of an array substrate of the fourth embodiment of the present application;

[0038] Figure 13 A schematic diagram of positions of a substrate, a first sub-metal layer and a second sub-metal layer in an array substrate of the fourth embodiment of the present application;

[0039] Figure 14 A front view of the array substrate of the fifth embodiment of the present application;

[0040] Figure 15 A side view of the array substrate of the fifth embodiment of the present application;

[0041] Figure 16 A schematic diagram of the positions of the substrate, the first sub-metal layer and the second sub-metal layer in the array substrate of the fifth embodiment of the present application;

[0042] Figure 17 A flow chart of the manufacturing method of the array substrate of an embodiment of the present application;

[0043] Figure 18 A process flow chart of the array substrate of the first embodiment of the present application;

[0044] Figure 19 A process flow chart of the array substrate of the second embodiment of the present application;

[0045] Figure 20 A process flow chart of the array substrate of the third embodiment of the present application;

[0046] Figure 21 A process flow chart of the array substrate of the fourth embodiment of the present application;

[0047] Figure 22 A process flow chart of the array substrate of the fifth embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other different ways than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0049] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. The use herein of the terms "and / or" includes a set of one or more associated listed items.

[0051] See Figure 1 The array substrate 10 of an embodiment includes a substrate 11 and a driving layer group 12 located on one side of the substrate 11. The driving layer group 12 includes at least two metal layers, which include a first metal layer (M1) 13 and a second metal layer (M2) 14 arranged in an insulating manner, and the second metal layer 14 is located on the side of the first metal layer 13 close to or away from the substrate 11. That is, in the array substrate 10 of the embodiment, the positions of the first metal layer 13 and the second metal layer 14 can be interchanged.

[0052] At least part of the first metal layer 13 includes a first sub-metal layer and a second sub-metal layer arranged in a laminated manner, the first sub-metal layer is located between the substrate 11 and the second sub-metal layer, and the orthographic projection of the second sub-metal layer on the substrate 11 at least partially overlaps the orthographic projection of the first sub-metal layer on the substrate 11.

[0053] That is, the first metal layer 13 of the embodiment is designed as a double-layer film. Compared with the conventional single-layer film of the metal layer, when the screen body of the display panel is impacted, the array substrate 10 of the embodiment can block the film layer fracture extension and reduce the film layer fracture influence, thereby improving the impact resistance, ensuring the film layer functionality, and being conducive to wide application.

[0054] On the basis of the foregoing embodiment, the first metal layer 13 includes a gate 131 and a first plate 132, the second metal layer 14 includes a second plate 141, and the first plate 132 and the second plate 141 constitute a capacitor device. Any one or more of the gate 131, the first plate 132, and the second plate 141 can be designed as a double-layer film, specifically including a first sub-metal layer and a second sub-metal layer arranged in a laminated manner, the first sub-metal layer is located between the substrate 11 and the second sub-metal layer, and the orthographic projection of the second sub-metal layer on the substrate 11 at least partially overlaps the orthographic projection of the first sub-metal layer on the substrate 11.

[0055] On the basis of the foregoing embodiment, the orthographic projection of the second sub-metal layer on the substrate 11 covers the orthographic projection of the first sub-metal layer on the substrate 11. Preferably, the orthographic projection of the second sub-metal layer on the substrate 11 coincides with the orthographic projection of the first sub-metal layer on the substrate 11; or the orthographic projection of the first sub-metal layer on the substrate 11 is located within the orthographic projection of the second sub-metal layer on the substrate 11.

[0056] The structure of the first metal layer in the array substrate of the present application will be further described below in combination with specific embodiments.

[0057] Please refer to Figures 2-4 The array substrate 100 of the first embodiment of the present application comprises a substrate 110 and a first metal layer 120. The substrate 110 is configured to provide support for the first metal layer 120.

[0058] The first metal layer 120 comprises a first sub-metal layer 121 and a second sub-metal layer 122 arranged in a stack, the first sub-metal layer 121 is located between the substrate 110 and the second sub-metal layer 122, and the orthographic projection of the second sub-metal layer 122 on the substrate 110 covers the orthographic projection of the first sub-metal layer 121 on the substrate 110. Specifically, in the array substrate 100 of the present embodiment, the orthographic projection of the second sub-metal layer 122 on the substrate 110 coincides with the orthographic projection of the first sub-metal layer 121 on the substrate 110, i.e. the area of the orthographic projection of the second sub-metal layer 122 on the substrate 110 is equal to the area of the orthographic projection of the first sub-metal layer 121 on the substrate 110.

[0059] When the screen body of the display panel is impacted, the array substrate 100 of the present embodiment can block the extension of the film layer fracture and reduce the impact of the film layer fracture, thereby improving the impact resistance and ensuring the functionality of the film layer, which is conducive to wide application.

[0060] On the basis of the foregoing embodiment, please refer to Figures 1-3 At least part of the second metal layer 14 comprises a third sub-metal layer 142 and a fourth sub-metal layer 143 arranged in a stack, the third sub-metal layer 143 is located between the substrate 110 and the fourth sub-metal layer 143, and the orthographic projection of the fourth sub-metal layer 143 on the substrate 110 at least partially overlaps with the orthographic projection of the third sub-metal layer 142 on the substrate 110. In the present embodiment, the orthographic projection of the fourth sub-metal layer 143 on the substrate 110 coincides with the orthographic projection of the third sub-metal layer 142 on the substrate 110. Since at least part of the second metal layer 14 is designed as a double-layer film, the extension of the film layer fracture can be better blocked, the impact of the film layer fracture can be reduced, and the impact resistance can be improved. It should be noted that in other embodiments, the orthographic projection of the fourth sub-metal layer 143 on the substrate 110 can also be located within the orthographic projection of the third sub-metal layer 142 on the substrate 110.

[0061] In the embodiment, the first sub-metal layer 121 is integrated. Preferably, the first sub-metal layer 121 is in a strip shape along a direction parallel to the surface of the substrate 110, as shown in Figure 4 .

[0062] On the basis of the foregoing embodiment, the cross section of the first sub-metal layer 121 is rectangular, right trapezoidal or inverted trapezoidal along a direction perpendicular to the extension direction of the first metal layer 120. In the embodiment, the cross section of the first sub-metal layer 121 is right trapezoidal along a direction perpendicular to the extension direction of the first metal layer 120, as shown in Figure 1 .

[0063] On the basis of the foregoing embodiment, the material of the first sub-metal layer 121 is the same as that of the second sub-metal layer 122. Preferably, the material of the first sub-metal layer 121 and the material of the second sub-metal layer 122 both include molybdenum.

[0064] On the basis of the foregoing embodiment, the thickness of the first sub-metal layer 121 is 30% to 60% of the thickness of the first metal layer 120, and the thickness of the first metal layer 120 is 2500 angstroms to 3000 angstroms. Further, the thickness of the first sub-metal layer 121 can be, but is not limited to, 30%, 35%, 40%, 45%, 50%, 55% or 60% of the thickness of the first metal layer 120, and the thickness of the first metal layer 120 can be, but is not limited to, 2500 angstroms, 2600 angstroms, 2700 angstroms, 2800 angstroms, 2900 angstroms or 3000 angstroms. In this way, it is beneficial to block the extension of film layer fracture, reduce the influence of film layer fracture, thereby improving the impact resistance, and ensuring the functionality of the film layer.

[0065] When the screen of the display panel is impacted, the array substrate 100 of the foregoing first embodiment can block the extension of film layer fracture, reduce the influence of film layer fracture, thereby improving the impact resistance, ensuring the functionality of the film layer, and being beneficial to wide application.

[0066] Please refer to Figures 5-7The array substrate 200 of the second embodiment of the present application comprises a substrate 210 and a first metal layer 220. The first metal layer 220 comprises a first sub-metal layer 221 and a second sub-metal layer 222 which are arranged in a stack, and the first sub-metal layer 221 is located between the substrate 210 and the second sub-metal layer 222, and the orthographic projection of the first sub-metal layer 221 on the substrate 210 is located within the orthographic projection of the second sub-metal layer 222 on the substrate 210. That is, in the array substrate 200 of the present embodiment, the area of the orthographic projection of the second sub-metal layer 222 on the substrate 210 is greater than the area of the orthographic projection of the first sub-metal layer 221 on the substrate 210. At this time, the first sub-metal layer 221 is located in the inner region of the second sub-metal layer 222.

[0067] In the present embodiment, the first sub-metal layer 221 is in a strip shape along the direction parallel to the surface of the substrate 210, as shown in FIG. 2B. Figure 7

[0068] In the present embodiment, the cross section of the first sub-metal layer 221 is a right trapezoid along the direction perpendicular to the extending direction of the first metal layer 220, as shown in FIG. 2C. Figure 5

[0069] The array substrate 200 of the present embodiment can block the extension of the film layer rupture and reduce the influence of the film layer rupture when the screen body of the display panel is impacted, thereby improving the anti-impact ability, ensuring the functionality of the film layer, and being conducive to wide application.

[0070] Please refer to Figures 8-10 The array substrate 300 of the third embodiment of the present application comprises a substrate 310 and a first metal layer 320. The first metal layer 320 comprises a first sub-metal layer 321 and a second sub-metal layer 322 which are arranged in a stack, and the first sub-metal layer 321 is located between the substrate 310 and the second sub-metal layer 322, and the orthographic projection of the first sub-metal layer 321 on the substrate 310 is located within the orthographic projection of the second sub-metal layer 322 on the substrate 310. That is, in the array substrate 300 of the present embodiment, the area of the orthographic projection of the second sub-metal layer 322 on the substrate 310 is greater than the area of the orthographic projection of the first sub-metal layer 321 on the substrate 310. At this time, the first sub-metal layer 321 is located in the inner region of the second sub-metal layer 322.

[0071] Further, along the first direction (i.e. Figure 10 ​​(In the direction of the middle arrow), the first sub-metal layer 321 includes a plurality of spaced metal blocks 323, and the second sub-metal layer 322 covers the surface of the metal blocks 323 and fills the gaps between adjacent metal blocks 323. At this time, the plurality of spaced metal blocks 323 are embedded in the second sub-metal layer 322, increasing the bonding force between the metal blocks 323 and the second sub-metal layer 322. First, the spaced metal blocks 323 can reduce the impact of a single problem point on the whole, thus reducing functional failure. Second, in the direction parallel to the surface of the substrate 310, the failure threshold per unit length of the spaced metal blocks 323 is higher than the failure threshold per unit length of the overall structure. Third, when stretched, the spaced metal blocks 323 can give the film a spring-like deformation structure in the first direction. Furthermore, the Taper morphology of the first metal layer 320 in this invention differs from that of the first metal layer in conventional solutions, which is beneficial for improving the tensile strength and adhesion of the film in the direction parallel to the surface of the substrate 310.

[0072] In this embodiment, the cross-sectional shape of the metal block 323 has an undercut structure, such as... Figure 8 and Figure 9 As shown. At this time, the metal block 323 is larger at the top and smaller at the bottom, which helps to increase the bonding force between the first sub-metal layer 321 and the second sub-metal layer 322.

[0073] It should be noted that in the array substrate of the present invention, there are no restrictions on the size of the metal block 323 or the distance between two adjacent metal blocks 323.

[0074] When the display panel is impacted by the array substrate 300 of this embodiment, the first metal layer 320 is a double-layer film design and the first sub-metal layer 321 includes a plurality of spaced metal blocks 323. Therefore, it can block the film layer fracture extension, reduce the impact of film layer fracture, thereby improving the impact resistance, ensuring the functionality of the film layer, and facilitating its wide application.

[0075] Please see Figures 11-13 The array substrate 400 of the fourth embodiment of the present invention includes a substrate 410 and a first metal layer 420. The first metal layer 420 includes a first sub-metal layer 421 and a second sub-metal layer 422 stacked together. The first sub-metal layer 421 is located between the substrate 410 and the second sub-metal layer 422, and the orthographic projection of the first sub-metal layer 421 onto the substrate 410 lies within the orthographic projection of the second sub-metal layer 422 onto the substrate 410. Specifically, in the array substrate 400 of this embodiment, the orthographic projection area of ​​the second sub-metal layer 422 onto the substrate 410 is larger than the orthographic projection area of ​​the first sub-metal layer 421 onto the substrate 410. In this case, the first sub-metal layer 421 is located within the inner region of the second sub-metal layer 422.

[0076] In the embodiment, along the first direction (i.e. the direction of the arrow in the figure) Figure 13 In the embodiment, the first sub-metal layer 421 includes a plurality of spaced metal blocks 423, and the second sub-metal layer 422 covers the surface of the metal blocks 423 and fills the space between adjacent metal blocks 423. At this time, the plurality of spaced metal blocks 423 are embedded in the second sub-metal layer 422, which increases the bonding force between the metal blocks 423 and the second sub-metal layer 422. First, the spaced metal blocks 423 can reduce the impact of a single problem point on the whole, resulting in functional failure; second, in the first direction, the unit length failure threshold of the spaced metal blocks 423 is higher than the unit length failure threshold of the overall structure; third, the spaced metal blocks 423 can make the film layer have a spring-like deformation structure when stretched in the direction parallel to the surface of the substrate 410. In addition, the Taper topography of the first metal layer 420 of the technical solution of the present application is different from that of the conventional technical solution, which is beneficial to improve the tensile strength of the film layer and the threshold of the film layer adhesion in the direction parallel to the surface of the substrate 410.

[0077] Further, the cross-sectional shape of the metal block 423 of the embodiment has a top cut structure, as shown in Figure 11 and Figure 12 .

[0078] When the screen body of the display panel is impacted, the array substrate 400 of the embodiment can block the film layer from breaking and extending, reduce the impact of film layer breaking, improve the impact resistance, ensure the functionality of the film layer, and is beneficial to wide application.

[0079] It should be noted that the shape of the first sub-metal layer in the array substrate of the present application is not limited to this, and can also be other shapes.

[0080] Please refer to Figures 14-16 , the array substrate 500 of the fifth embodiment of the present application includes a substrate 510 and a first metal layer 520. The first metal layer 520 includes a first sub-metal layer 521 and a second sub-metal layer 522 arranged in layers, the first sub-metal layer 521 is located between the substrate 510 and the second sub-metal layer 522, and the orthographic projection of the first sub-metal layer 521 on the substrate 510 is located within the orthographic projection of the second sub-metal layer 522 on the substrate 510. Specifically, in the array substrate 500 of the embodiment, the orthographic projection area of the second sub-metal layer 522 on the substrate 510 is greater than the orthographic projection area of the first sub-metal layer 521 on the substrate 510. At this time, the first sub-metal layer 521 is located in the inner region of the second sub-metal layer 522.

[0081] In the embodiment, along the first direction (i.e. Figure 16 In the arrow direction, the first sub-metal layer 521 comprises a plurality of spaced metal blocks 523, and a connecting portion 524 is arranged between adjacent metal blocks 523. The second sub-metal layer 522 covers the surfaces of the metal blocks 523 and the surfaces of the connecting portions 524 and fills the spaces between the adjacent metal blocks 523.

[0082] Preferably, the orthographic projection of the first sub-metal layer 521 on the substrate 510 comprises a comb-like structure, as shown in Figure 16 Firstly, the comb-like structure of the first sub-metal layer 521 can reduce the influence of a single problem point on the whole, thereby causing functional failure. Secondly, in the first direction, the unit length failure threshold of the comb-like structure of the first sub-metal layer 521 is higher than that of the strip-shaped first sub-metal layer. Thirdly, when the first sub-metal layer 521 of the comb-like structure is stretched, the film layer can have a structure similar to spring deformation in the direction parallel to the surface of the substrate 510. The above-mentioned whole can improve the stretching threshold of the film layer in the direction parallel to the surface of the substrate 510, thereby improving the impact failure threshold of the screen body.

[0083] In the embodiment, the cross-sectional shape of the metal block 523 has a top cut structure, as shown in Figure 14 and Figure 15

[0084] When the screen body of the display panel is impacted, the array substrate 500 of the embodiment can block the extension of the film layer rupture, reduce the influence of the film layer rupture, thereby improving the impact resistance, ensuring the functionality of the film layer, and being conducive to wide application.

[0085] It should be further explained that in the array substrate of the present application, the second metal layer can also be the double-layer film design of the second embodiment to the fifth embodiment, which is conducive to blocking the extension of the film layer rupture, reducing the influence of the film layer rupture, thereby improving the impact resistance and ensuring the functionality of the film layer.

[0086] Please refer to Figure 17 The preparation method of the array substrate of the embodiment of the present application comprises the following steps:

[0087] S10, providing a substrate.

[0088] ​S20, forming a driving layer group on the substrate, the driving layer group is located on one side of the substrate, the driving layer group comprises at least two metal layers, the at least two metal layers comprise a first metal layer and a second metal layer arranged in an insulating mode, the second metal layer is located on the side of the first metal layer close to or away from the substrate; wherein at least part of the first metal layer comprises a first sub-metal layer and a second sub-metal layer arranged in a laminated mode, the first sub-metal layer is located between the substrate and the second sub-metal layer, and the orthographic projection of the second sub-metal layer on the substrate at least partially overlaps the orthographic projection of the first sub-metal layer on the substrate.

[0089] The preparation method of the array substrate will be further described in combination with specific embodiments.

[0090] Please refer to Figure 18 The preparation method of the array substrate 100 of the first embodiment of the present application comprises the following steps:

[0091] S1, forming a first sub-metal material layer 121' on the substrate 110.

[0092] For example, the first sub-metal material layer 121' can be formed on the substrate 110 by using a metal sputtering film forming mode.

[0093] S2, forming an integral layer of positive photoresist on the first sub-metal material layer 121', and then exposing and developing the positive photoresist to obtain a patterned positive photoresist 130.

[0094] S3, etching the first sub-metal material layer 121' to obtain a first sub-metal layer 121.

[0095] S4, forming a second sub-metal material layer 122' on the substrate 110 and the first sub-metal layer 121.

[0096] S5, forming an integral layer of positive photoresist on the second sub-metal material layer 122', and then exposing and developing the positive photoresist to obtain a patterned positive photoresist 140.

[0097] S6, etching the second sub-metal material layer 122' to obtain a second sub-metal layer 122.

[0098] Please refer to Figure 19 The preparation method of the array substrate 200 of the second embodiment of the present application comprises the following steps:

[0099] S1, forming a first sub-metal material layer 221' on the substrate 210.

[0100] S2, forming an integral layer of positive photoresist on the first sub-metal material layer 221', and then exposing and developing the positive photoresist to obtain a patterned positive photoresist 230.

[0101] S3, etching the first sub-metal material layer 221', to obtain a first sub-metal layer 221.

[0102] S4, forming a second sub-metal material layer 222' on the substrate 210 and the first sub-metal layer 221.

[0103] S5, forming an integral layer of positive photoresist on the second sub-metal material layer 222', and then exposing and developing the positive photoresist, to obtain a patterned positive photoresist 240.

[0104] S6, etching the second sub-metal material layer 222', to obtain a second sub-metal layer 222.

[0105] Please refer to Figure 20 The preparation method of the array substrate 300 of the third embodiment of the present application comprises the following steps:

[0106] S1, forming a first sub-metal material layer 321' on the substrate 310.

[0107] S2, forming an integral layer of negative photoresist on the first sub-metal material layer 321', and then exposing and developing the negative photoresist, to obtain a patterned negative photoresist 330.

[0108] S3, etching the first sub-metal material layer 321', to obtain a first sub-metal layer 321.

[0109] S4, forming a second sub-metal material layer 322' on the substrate 310 and the first sub-metal layer 321.

[0110] S5, forming an integral layer of positive photoresist on the second sub-metal material layer 322', and then exposing and developing the positive photoresist, to obtain a patterned positive photoresist 340.

[0111] S6, etching the second sub-metal material layer 322', to obtain a second sub-metal layer 322.

[0112] Please refer to Figure 21 The preparation method of the array substrate 400 of the fourth embodiment of the present application comprises the following steps:

[0113] S1, forming a first sub-metal material layer 421' on the substrate 410.

[0114] S2, forming an integral layer of positive photoresist on the first sub-metal material layer 421', and then exposing and developing the positive photoresist, to obtain a patterned positive photoresist 430.

[0115] S3, etching the first sub-metal material layer 421', to obtain a first sub-metal layer 421.

[0116] S4. Forming a second sub-metal material layer 422' on the substrate 410 and the first sub-metal layer 421.

[0117] S5. Forming an integral layer of positive photoresist on the second sub-metal material layer 422', and then performing exposure and development on the positive photoresist to obtain a patterned positive photoresist 440.

[0118] S6. Etching the second sub-metal material layer 422' to obtain a second sub-metal layer 422.

[0119] Referring to Figure 22 The preparation method of the array substrate 500 of the second embodiment of the present application comprises the following steps:

[0120] S1. Forming a first sub-metal material layer 521' on the substrate 510.

[0121] S2. Forming an integral layer of positive photoresist on the first sub-metal material layer 521', and then performing exposure and development on the positive photoresist to obtain a patterned positive photoresist 530.

[0122] S3. Etching the first sub-metal material layer 521' to obtain a first sub-metal layer 521.

[0123] S4. Forming a second sub-metal material layer 522' on the substrate 510 and the first sub-metal layer 521.

[0124] S5. Forming an integral layer of positive photoresist on the second sub-metal material layer 522', and then performing exposure and development on the positive photoresist to obtain a patterned positive photoresist 540.

[0125] S6. Etching the second sub-metal material layer 522' to obtain a second sub-metal layer 522.

[0126] The preparation method of the array substrate of the technical solution of the present application is simple in process, and when the screen body of the display panel is impacted, since the array substrate prepared by the above preparation method has at least part of the first metal layer designed as a double-layer film, the film layer fracture extension can be blocked, the film layer fracture influence can be reduced, the impact resistance can be improved, the film layer functionality can be ensured, and the array substrate is conducive to wide application.

[0127] The display panel of one embodiment comprises any of the above array substrates.

[0128] The display panel of the technical solution of the present application comprises the above array substrate, and when the screen body of the display panel is impacted, since the first metal layer is designed as a double-layer film, the film layer fracture extension can be blocked, the film layer fracture influence can be reduced, the impact resistance can be improved, the film layer functionality can be ensured, and the display panel is conducive to wide application.

[0129] The display device of one embodiment includes the display panel described above. The display device can be a foldable display device, for example.

[0130] The display device of the technical scheme of the present application includes the display device described above. When the screen body of the display panel is impacted, the first metal layer is designed as a double-layer film, so that the film layer fracture extension can be blocked, the film layer fracture influence can be reduced, the impact resistance can be improved, the film layer functionality can be ensured, and the display device is conducive to wide application.

[0131] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0132] The above-described embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be subject to the appended claims.

Claims

1. An array substrate, characterized in that, The array substrate includes: Substrate; and A driving layer group is located on one side of the substrate. The driving layer group includes at least two metal layers, and the at least two metal layers include a first metal layer and a second metal layer that are insulated from each other. The second metal layer is located on the side of the first metal layer that is close to or far from the substrate. Wherein, at least a portion of the first metal layer includes a first sub-metal layer and a second sub-metal layer stacked together, the first sub-metal layer being located between the substrate and the second sub-metal layer, and the orthographic projection of the second sub-metal layer on the substrate at least partially overlapping the orthographic projection of the first sub-metal layer on the substrate.

2. The array substrate according to claim 1, characterized in that, At least a portion of the second metal layer includes a third sub-metal layer and a fourth sub-metal layer stacked together, the third sub-metal layer being located between the substrate and the fourth sub-metal layer, and the orthographic projection of the fourth sub-metal layer on the substrate at least partially overlapping the orthographic projection of the third sub-metal layer on the substrate.

3. The array substrate according to claim 1, characterized in that, The orthographic projection of the second sub-metal layer on the substrate overlaps the orthographic projection of the first sub-metal layer on the substrate; Preferably, the orthographic projection of the second sub-metal layer on the substrate coincides with the orthographic projection of the first sub-metal layer on the substrate; Alternatively, the orthographic projection of the first sub-metal layer on the substrate lies within the orthographic projection of the second sub-metal layer on the substrate.

4. The array substrate according to any one of claims 1 to 3, characterized in that, Along a first direction, the first sub-metal layer includes a plurality of spaced metal blocks, and the second sub-metal layer covers the surface of the metal blocks and fills the gaps between adjacent metal blocks; Preferably, the cross-sectional shape of the metal block has an undercut structure.

5. The array substrate according to any one of claims 1 to 3, characterized in that, Along a first direction, the first sub-metal layer includes a plurality of spaced metal blocks, and a connecting portion is provided between adjacent metal blocks. The second sub-metal layer covers the surface of the metal blocks and the surface of the connecting portion and fills the gap between adjacent metal blocks. Preferably, the orthographic projection of the first sub-metal layer onto the substrate includes a comb-like structure; Preferably, the cross-sectional shape of the metal block has a top-cut structure.

6. The array substrate according to any one of claims 1 to 3, characterized in that, The first metal layer includes a gate and a first electrode plate, and the second metal layer includes a second electrode plate. The first electrode plate and the second electrode plate constitute a capacitor.

7. The array substrate according to any one of claims 1 to 3, characterized in that, The material of the first sub-metal layer is the same as the material of the second sub-metal layer; Preferably, the materials of both the first sub-metal layer and the second sub-metal layer include molybdenum.

8. The array substrate according to any one of claims 1 to 3, characterized in that, The thickness of the first sub-metal layer is 30% to 60% of the thickness of the first metal layer; Preferably, the thickness of the first metal layer is 2500 angstroms to 3000 angstroms.

9. A display panel, characterized in that, The array substrate includes any one of claims 1 to 8.

10. A display device, characterized in that, Includes the display panel as described in claim 9.

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