Round cobweb type micro-channel radiator

Abstract

The invention belongs to the technical field of MEMS heat dissipation, and provides a circular cobweb-shaped micro-channel radiator which comprises a hollow annular radiator partition plate, an annular upper bottom plate, a circular lower bottom plate, a side wall circular water outlet, a central circular water inlet and a plurality of cobweb-shaped copper cylinder micro-arrays connected with a circular lower cover plate. The cobweb-shaped copper column array firstly partitions the micro-channel area, a cooling medium can sufficiently flow from the center position to the periphery along different paths partitioned by the copper columns, the cooling medium impacts the copper columns to achieve better heat exchange, and the pressure drop distribution condition is effectively improved under the condition that the heat dissipation capacity is improved. The design of high and dense central copper columns and low and sparse peripheral copper columns enables the circular power chip in the center of the circular lower bottom plate to be uniformly radiated, the radiating performance of the micro-channel radiator is improved, the structure of the radiator is optimized, and the micro-channel radiator has a good enterprise prospect in the radiating field of high-power devices.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of power device micro-channel heat dissipation, in particular to a circular spiderweb micro-channel heat sink related to micro-fluidic heat dissipation. BACKGROUND

[0002] Due to the integration and complexity of devices and the continuous improvement of MEMS technology, the heat flux generated by electronic components is also increasing, which brings more severe heat management problems, and the progress of heat dissipation capacity helps to facilitate the application of higher performance electronic components.

[0003] At present, the main cooling methods include air-cooled heat sinks, micro heat pipes, heat cold micro-channel heat sinks, micro injection devices, etc. In the research on micro-channel heat dissipation, some heat sinks need to consider the influence of micro-fluidic flow of the working fluid due to their excessively small size. In ordinary straight channel heat dissipation devices, it may produce excessive pressure drop, which is not conducive to heat dissipation. Some heat dissipation devices are applied to the heat dissipation of power chips, and the cooling working fluid may evaporate to form bubbles to produce two-phase flow. Due to the piston effect, the bubbles cannot be well discharged, so that the transportation of the working fluid is blocked, which affects the heat dissipation performance. In the improvement of the heat dissipation device, the hydrophobic and hydrophilic properties of the wall material can be optimized, or the TIM layer between the heat sink and the chip can be optimized, or embedded cooling can be used, or fins can be introduced into the heat dissipation device, and the specific design scheme of the device can also be considered. The flow path of the cooling medium can be planned. The above-mentioned technologies are considered to redesign the heat sink to improve its performance.

[0004] In the process of implementing the present application, the inventors have found that at least the following technical problems exist in the prior art: The heat source is concentrated in the center position, and local high temperature is easy to occur in the center position, which leads to poor heat dissipation performance. Higher temperature can cause damage to the heat source device. Ordinary micro-channel heat sinks can produce a large pressure drop, which is not conducive to heat dissipation. At the same time, various heat sinks are designed to be complex when considering the setting of the buffer cavity and the liquid partition device. When solving the heat dissipation problem of small-sized chips, the structure of the heat sink needs to be simplified to make the structure more compact. Usually, the performance of the heat dissipation device is analyzed by simulation and experiment, and a high-performance heat dissipation device is obtained by improvement. SUMMARY

[0005] To solve at least part of the above problems in the prior art, the present application provides a spiderweb micro-channel heat sink with a device, comprising: a fluid inlet; a fluid outlet; a device overall cover part, including a heat sink remaining outer cover and a micro-channel chamber partition, the partition and the heat sink upper cover are connected by support columns; cooling medium; and The cooling device body comprises a spider-web-shaped micro-channel heat dissipation chamber made of copper columns, and the outer surface of the circular bottom cold plate is connected with a circular heat source.

[0006] Further, the micro-channel heat sink has a size of micrometer scale, and the axial size of the annular heat sink is much larger than the radial size.

[0007] Further, the micro-channel heat sink has a size of micrometer scale, and the axial size of the annular heat sink is much larger than the radial size.

[0008] Further, the micro-channel heat sink has a size of micrometer scale, and the axial size of the annular heat sink is much larger than the radial size. The annular cavity is connected with the micro-channel cavity outside and the water outlet on the side wall. The support column penetrates the upper cover plate and the partition plate.

[0009] Further, the micro-channel heat sink has a size of micrometer scale, and the axial size of the annular heat sink is much larger than the radial size.

[0010] Further, the micro-channel heat sink has a size of micrometer scale, and the axial size of the annular heat sink is much larger than the radial size.

[0011] Further, the micro-channel heat sink has a size of micrometer scale, and the axial size of the annular heat sink is much larger than the radial size. The circular high-density copper column array is opposite to the center of the water inlet. The copper column with the same height and the uniform distribution inside the micro-channel cavity is used as the radius of the spider web. The copper column with the same height and the uniform distribution inside the micro-channel cavity is used as the radius of the spider web.

[0012] Further, the micro-channel heat sink has a size of micrometer scale, and the axial size of the annular heat sink is much larger than the radial size. The height of the copper column in the micro-channel cavity is 0.2-0.5 mm. The radius of the circular spider web in the micro-channel center is 2.5-4.5 mm. The height of the circular copper column in the micro-channel center is 0.5-1.5 mm. The radius of the circular bottom plate of the micro-channel is 26-40 mm. The radius of the microchannel circular base plate is 0.2-1 mm; and / or Furthermore, in the aforementioned microchannel heat sink, the circular copper pillars at the center of the spiderweb structure are arranged with an initial value of 1, and a certain value increasing in each circle with a tolerance.

[0013] Furthermore, in the aforementioned microchannel radiator, the number of the radial copper pillars in the spiderweb structure is the same as the number of fixed plates at the water outlet position of the partition, and the radial copper pillar array coincides with the phase relationship of the fixed plates.

[0014] The present invention has at least the following beneficial effects: The spider web microchannel heat sink disclosed in the present invention, (1) By designing a copper column array, the flow part of the microchannel working fluid becomes a parallel structure, which effectively reduces the pressure drop of the liquid working fluid in the microchannel region. The spider web structure is used to effectively partition the microchannel, which reduces the pressure drop while planning the flow path of the cooling working fluid. (2) By introducing baffles, the interior of the microchannel radiator is rationally utilized. The design of the central circular inlet buffer cavity and the outer annular outlet buffer cavity effectively reduces the radial dimension of the radiator and shrinks the size of the radiator from a design perspective. The existence of the support column not only provides positioning for the baffles, but also ensures that the microchannel radiator does not deform when impacted by water flow. (3) By designing spider web-shaped microchannel copper pillars, the water flow in the center collides more with the copper pillars while the collision around the perimeter is less, which effectively improves the problem of uneven heat dissipation temperature where the heat dissipation center is hot and the perimeter is cold. The spider web-shaped copper pillars in the microchannel area make the water flow evenly to the perimeter according to the different radii from the center of the heat sink. (4) By designing the height of the copper column at the center of the spider web into an inverted cone shape, a jet structure is formed, which works in conjunction with the axial water inlet buffer chamber, so that the cooling working fluid flows further towards the center of the radiator, thereby further improving the heat dissipation capacity of the radiator. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural schematic diagram of a circular microchannel heat sink according to the present invention; Figure 2 This is a side view of a microchannel heat sink, showing the location of the internal support pillars. Figure 3 This is a schematic diagram of the top view of a microchannel heat sink.

[0016] Figure 4 yes Figure 1 A cross-sectional view of a microchannel radiator along its diameter. Figure 5 This is a detailed schematic diagram of a microchannel copper pillar array; Figure 6This is a schematic diagram showing the details of the top cover plate of the copper pillar section of the microchannel radiator.

[0017] The components in the attached diagram are labeled as follows: Microchannel radiator chamber section 100; Cooling medium inlet 110, cooling medium outlet 120, microchannel chamber 130; chamber support column 131, chamber top cover plate 132, microchannel partition plate 133 above the copper column (top cover plate inlet groove 1331, outlet groove 1332, outlet 133 connected to the main outlet of the cooling medium), outlet buffer chamber 134, microchannel chamber 135; microchannel cover plate 200; cooling outer plate 210, microchannel copper column 220; array copper columns 221 located at the inlet (lowest copper column 2211, second lowest copper column 2212, second highest copper column 2213, highest copper column 2214), and spider web copper columns 222 located in the microchannel chamber (partitioned copper columns 2221, spider web copper columns 2222). Detailed Implementation

[0018] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0019] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0020] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0021] It should also be noted that, in the embodiments of the present invention, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, the required parts or components can be added as needed for specific scenarios.

[0022] It should also be noted that this application is not limited to the detailed structures or element arrangements described below or in the accompanying drawings. This application may be implemented in other ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes only and should not be construed as limiting. The terms "comprising," "including," "having," and similar expressions used herein mean that they include the items listed thereafter, their equivalents, and other additional items.

[0023] To address the issues of low heat dissipation efficiency, concentrated heat source temperature, and excessively high center temperature described in the background, this heat sink adopts a circular structure with central water inlet and peripheral water outlet, improving chip temperature uniformity. This embodiment includes a cooling medium inlet 110, a cooling medium outlet 120, a microchannel chamber 130, a cooling floor 210, and microchannel copper pillars 220.

[0024] Please see Figure 1 The microchannel heat sink is sized at the micrometer scale, and the liquid flowing through it belongs to the category of microfluidics. The axial dimension of the annular heat sink is much larger than its radial dimension, which allows it to dissipate heat on a smaller scale. The copper pillar part of the heat sink microchannel is manufactured using micromachining technology.

[0025] Please see Figure 2 The outlet buffer chamber 134 is located on the side wall, and the water inlet 110 is located at the radiator top cover plate 132, connected to the upper partition plate 133 of the copper pillar as a whole. The lower surface of the partition plate 133 and the upper surface of the copper pillar are completely overlapped, creating a microchannel chamber. The partition plate and the top cover plate are connected by a support column 131. The presence of the support column can ensure that the chamber does not deform as much as possible, and at the same time, it positions the internal partition plate 133 above the copper pillar.

[0026] The length of the inlet 110 is greater than the radial length of the heat sink. The inlet is located at the top, with the inlet water storage chamber being the circular portion at the center of the microchannel chamber, and the outlet buffer chamber surrounding the inlet buffer chamber. The width of the inlet is close to the size of the heat sink chip. When the coldest cooling medium enters through the inlet, it first fully fills the central circular chamber, exchanges heat thoroughly with the taller copper pillar at the center, and then gradually flows along the copper pillar into the microchannels, allowing for more efficient heat dissipation of the central chip portion of the heat sink.

[0027] Please see Figure 3 The internal partition is connected to the top cover plate by support columns to form a whole. In this embodiment, nine structural support columns 131 are used for support. The presence of structural support columns saves materials, ensures the volume of the outlet buffer chamber, and connects the entire radiator chamber 100 into a whole.

[0028] Please see Figure 4 All the copper pillars 222 in the microchannel chamber are of the same size, all being cuboids penetrating the chamber. However, the copper pillar 221 at the center of the spiderweb-like structure connected to the water inlet buffer chamber has been redesigned, with its height gradually decreasing from the inlet edge to the center. This design allows the copper pillars at the inlet to form a jet structure. Since the copper pillars are at the micrometer level, water films may form between the microchannels of different heights, enveloping the copper pillars and creating a conical structure conducive to jet flow. When the cooling medium flows down from the inlet, it will first flow towards the center of the radiator due to the jet structure, ensuring good heat dissipation for the hottest part of the radiator. Simultaneously, the existence of the jet structure suppresses the reverse transport of any air bubbles that may be generated towards the inlet. When the liquid undergoes a two-phase flow phase change due to excessively high temperatures, the liquid can still flow normally downwards from the upper inlet and enter the microchannel normally, ensuring the stability of the radiator.

[0029] The microchannel radiator is divided by a partition 133 above the copper pillar. The outlet of the microchannel chamber is located around the annular perimeter and is directly connected to the outlet buffer chamber. When the cooling medium flows out from the perimeter of the circular microchannel, it can flow into the outlet buffer chamber 134. The outlet buffer chamber 134 is located at the upper end of the microchannel, which is conducive to the full flow of liquid in the microchannel.

[0030] When the cooling medium flows into the annular microchannel radiator, its main path is sequentially through the cooling medium inlet 110, which also serves as the water inlet buffer chamber. The cooling medium then collides with the spiderweb-like circular copper column array 221 below the inlet, entering the channels formed by the microcopper column array through the jet structure created by the circular copper columns. Due to water pressure, it flows into the microchannel chamber. After exchanging heat with the copper columns 222 within the circular microchannels, it flows outwards, flowing upwards through the opening slot at the outlet of the device's cover plate into the outlet water storage buffer chamber 134. Finally, it flows out of the radiator through the cooling medium outlet 120, located on the side wall and connected to the outlet buffer chamber 134. It is particularly noteworthy that the microchannel chamber partition 133 above the copper columns defines the volume of the microchannel chamber 135. As the cooling water flows from the inlet into the water storage chamber, it continuously collides with and exchanges heat with all the copper columns within the chamber, enhancing heat dissipation.

[0031] Please see Figure 5 , Figure 5 This is a schematic diagram of the copper pillar distribution in the microchannel radiator. The spiderweb structure consists of an array of copper pillars 221 inside the inlet. The number of copper pillars forming each new ring increases progressively with an initial value of 1 and a tolerance of 5. The copper pillar array has 5 columns entirely composed of copper pillars, forming the dividing edge copper pillars 2221 of the spiderweb structure, separating the microchannels. Within the microchannel area formed by the cover plate of the microchannel chamber, the copper pillars are distributed in a spiderweb-like structure of copper pillars 2222. The circular core of the spiderweb structure is located near the inlet.

[0032] The copper pillars located inside the microchannel are fabricated using micromachining techniques and arranged in a spiderweb pattern. The design includes copper pillars 2222 forming the spiderweb section and five rows of copper pillars 2221 with equal radii dividing the chamber into five flow domains. This partitioning further plans the flow direction of the cooling medium microfluidic. The annular copper pillar array and the lower cover plate of the heat sink form a single unit, effectively increasing the contact area between the fluid and the heat sink wall. As the liquid flows from the center outwards, it continuously impacts the pillar surfaces, effectively facilitating heat exchange. Simultaneously, due to the obstruction of the spiderweb-forming copper pillars 2222, the cooling medium flows in a circular pattern from the center of the heat sink outwards. This embodiment can be modified to accommodate different chip sizes; the density of the copper pillars 2222 within the spiderweb framework inside the microchannel can be varied to ensure uniform heat dissipation from the heat sink.

[0033] To form the jet structure, the height of the central copper column at the inlet varies, with four levels: the lowest copper column 2211, the second lowest copper column 2212, the second highest copper column 2213, and the highest copper column 2214.

[0034] Please see Figure 6 The annular outlet groove 1332 is hollowed out, preventing water from flowing along this path. Therefore, the outlet of the upper cover plate is divided into 5 equal parts, and connection points are set at the five divisions for easy fixation, aligning with the phase relationship of the aforementioned 5 columns of copper pillars. The notch 1333 corresponds to the outlet position.

[0035] In this specific embodiment, the radiator chamber portion 100 and the copper pillar lower cover portion 200 need to be welded together to form a single component of the microchannel radiator, so that the radiator has high stability when it is working.

Claims

1. A circular spiderweb microchannel heat sink, characterized in that, include: fluid inlet; Fluid outlet; The overall cover plate of the device includes the remaining outer cover plate of the radiator and the microchannel chamber partition. The partition and the upper cover plate of the radiator are connected by support columns. Cooling medium; as well as The main body of the cooling device includes a spiderweb-like microchannel heat dissipation chamber made of copper pillars, and the outer surface of the circular bottom cold plate is in contact with the circular heat source.

2. A microchannel heat sink according to claim 1, characterized in that, The dimensions are on the micrometer scale, and the axial dimension of the annular heat sink is much larger than its radial dimension.

3. A microchannel heat sink according to claim 1, characterized in that, The inlet diameter is larger than the radial length of the radiator, and it passes directly out from the top cover of the radiator. The inlet is connected to the center of the microchannel chamber.

4. A microchannel heat sink according to claim 1, characterized in that, The partition divides the interior of the device into two parts: a microchannel chamber and an outlet buffer chamber. The outlet buffer chamber includes: The annular cavity is connected to the outside of the microchannel cavity at the bottom and to the outlet located on the side wall at the side. Support column, penetrating the radiator top cover and partition.

5. A microchannel heat sink according to claim 4, characterized in that, The partition has a hollowed-out annular outlet, and the annular outlet is connected to the side wall by fixing plates at equal intervals.

6. A microchannel heat sink according to claim 1, characterized in that, The microchannel section specifically includes an array of annular copper pillars arranged in a spiderweb pattern, fabricated using microfabrication technology. The copper pillars penetrate the microchannel chamber partition and the radiator base plate.

7. A microchannel heat sink according to claim 6, characterized in that, The copper pillars within the microchannel chamber are of three types: A circular array of tall, dense copper pillars is positioned directly opposite the center of the water inlet, with the pillars arranged in an inverted cone shape, lower in the middle and higher around the edges. Copper pillars of equal height and uniformly distributed throughout the microchannel chamber, serving as the spiderweb radius; and The microchannel chamber contains equidistant, spiderweb-like copper pillars of equal height that penetrate the entire chamber.

8. A microchannel heat sink according to claim 6, characterized in that, The thickness of the cover plate above the microchannel is 0.2-0.8 mm; and / or The height of the copper pillars within the microchannel chamber is 0.2-0.5 mm; and / or The microchannel's central circular spiderweb forms a circle with a radius of 2.5-4.5 mm; and / or The height of the circular copper pillar at the center of the microchannel is 0.5-1.5 mm; and / or The microchannel circular base plate has a radius of 26-40 mm; and / or The radius of the microchannel circular base plate is 0.2-1mm.

9. A microchannel heat sink according to claim 7, characterized in that, The circular copper pillars at the center of the spider web structure are arranged with an initial value of 1, and the value increases in increments of a certain tolerance in each circle.

10. A microchannel heat sink according to claim 7, characterized in that, The number of copper pillars in the radius of the spider web structure is the same as the number of fixed plates at the outlet of the baffle, and the radial copper pillar array coincides with the phase relationship of the fixed plates.

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