Directional crack induction assisted high-curvature snakelike double-lead structure micro-sensing device

Abstract

The invention discloses a directional crack induction assisted high-curvature snakelike double-lead structure micro-sensing device, and the device is characterized in that a conductive micro-ink layer and a conductive thin ink layer of a high-curvature snakelike double-lead structure micro-sensor have electromechanical characteristics of cooperatively realizing high-sensitivity resolution sensing, wide sensing range response and fatigue resistance; the characteristic is beneficial to preferential cracking of the conductive micro-ink layer during tensile strain, high-sensitivity resolution sensing is realized through directional micro-crack opening and closing deformation, and the conductive thin ink layer around the directional micro-crack opening and closing deformation is induced to form a snakelike conductive path; meanwhile, the conductive thin ink layer disperses stress through stretching and stretching, and the sensing ink layer of the high-curvature snakelike double-lead structure is integrally communicated, so that stable response in a wide sensing range is realized. The AQV212 relay integrated circuit has the characteristic of negative feedback regulation to intelligently control the operation of the sensing device, is connected with the high-curvature snakelike double-lead structure microsensor through a current collector wire, and can be used for biomedical monitoring and soft robots to adapt to driving sensing scenes of complex curved surfaces.

Description

Technical Field

[0001] This invention relates to the field of flexible electronic sensing equipment manufacturing technology, specifically to a microsensing device with a directional crack-induced assisted high curvature serpentine dual-lead structure. Background Technology

[0002] The rapid development of fields such as soft robotics, smart wearable devices, and biomedical monitoring urgently necessitates the further development of flexible, high-performance sensing devices capable of accurately sensing physical deformations and adapting to complex curved surfaces. These flexible sensors require both high-resolution sensing capabilities for minute deformations and the ability to measure large-scale deformations on complex surfaces. However, a key challenge currently is the difficulty in coordinating high sensitivity with a wide sensing range response capability in flexible, multifunctional sensing devices. This is because, on the one hand, high sensitivity requires the conductive network of the sensing material layer to form microscopically deformable conductive networks such as cracked, wrinkled, and gradient-variable structures; on the other hand, a wide sensing range response requires the sensing material layer to maintain stable conductive pathways under macroscopic deformation, which may limit the device's high sensitivity capability. Therefore, developing measurement sensing equipment with high-resolution sensing capabilities for minute deformations and adaptability to large-scale deformations on complex surfaces is a critical problem that urgently needs to be solved.

[0003] To address the above problems, this invention provides a directional crack-induced assisted high-curvature serpentine dual-lead microsensor, comprising a high-curvature serpentine dual-lead microsensor and an AQV212 relay integrated circuit. The conductive micro-ink layer and conductive thin ink layer of the high-curvature serpentine dual-lead microsensor possess synergistic electromechanical characteristics that enable high-sensitivity resolution sensing, wide-range response, and fatigue resistance. These characteristics are manifested in two ways: firstly, the conductive micro-ink layer preferentially cracks under tensile strain, achieving high-sensitivity resolution sensing through directional microcrack opening and closing deformation, and inducing the formation of a serpentine conductive path in the surrounding conductive thick and thin layers; secondly, the conductive thick ink layer disperses stress through tensile relaxation, maintaining the overall connectivity of the high-curvature serpentine dual-lead sensing ink layer, thereby achieving a stable response function over a wide sensing range. The AQV212 relay integrated circuit features negative feedback regulation for intelligent control of the sensing device's operation. Connected to the high-curvature serpentine dual-lead microsensor via a current collector wire, it can be used for high-resolution sensing and measurement of large-range deformations in biomedical monitoring and soft robots adapting to complex curved surfaces. The implementation of the above parts enables the present invention to have the ability to sense minute deformations and adapt to large-scale deformation measurement, which is of great value for the development of high-performance flexible electronic sensing equipment. Summary of the Invention

[0004] The purpose of this invention is to provide a directional crack-induced assisted high-curvature serpentine dual-lead structure microsensor. The fabrication method of this device is simple and environmentally friendly. The high-curvature serpentine dual-lead structure microsensor obtained by the fabrication has excellent electrical and mechanical properties. It is connected to the AQV212 relay integrated circuit and can be applied to daily biomedical monitoring and soft robot drive perception scenarios that adapt to complex curved surfaces.

[0005] The method for fabricating a directional crack-induced assisted high-curvature serpentine dual-lead structure microsensor device according to the present invention comprises the following steps: (1) A dual-lead microsensing device was fabricated using a method of self-assembly of a discrete mesh template induced by directional cracks. (2) A dual-liquid photosensitive emulsion array with a depth of 10-30μm was programmed and printed on the upper surface of the screen using a 3D coating machine to obtain a micro-convex photosensitive screen template; (3) The micro-convex photosensitive screen template and the high-curvature serpentine film are irradiated with ultraviolet light to induce a free radical chain chemical polymerization reaction of the two-liquid photosensitive emulsion, thereby achieving a tight bond between the micro-convex photosensitive screen template and the high-curvature serpentine film to obtain a pre-structured photosensitive screen template. (4) Immerse the pre-structured photosensitive screen template from step (3) in a neutral deionized aqueous solution, rinse the discrete mesh channels 2 to 5 times, take it out, and dry it at room temperature for 1 to 3 hours to obtain a high curvature serpentine structure photosensitive screen template. (5) The conductive composite ink is coated and fixed on the left side of the upper pattern of the high curvature serpentine photosensitive screen template, and the stretchable flexible substrate is fixed on the lower pattern surface of the high curvature serpentine photosensitive screen template. By applying a vertically downward stress field to the entire device along the directional printing, the conductive ink can selectively penetrate the photosensitive screen, arrange downward and gather, forming a high curvature serpentine dual-lead structure micro-sensor. (6) Connect the high curvature serpentine dual-lead structure microsensor in step (5) with the AQV212 relay integrated circuit through a current collector wire to obtain a high curvature serpentine dual-lead structure microsensing device. In step (4), the high curvature serpentine structure photosensitive screen template has a combination of high curvature serpentine dual-lead structure discrete mesh holes. The discrete mesh holes are composed of 15 to 39 small holes with a diameter of 20 to 50 μm and 80 to 160 large holes with a diameter of 100 to 150 μm. They are used to control the amount of conductive composite ink passing through and to programmatically print the high curvature serpentine dual-lead structure sensing ink layer. In step (5), the conductive composite ink is selected from one of the following: carbon-based (carbon black, carbon nanotubes, graphene) conductive ink, metal-based (gold powder, silver powder, copper powder) conductive ink, and polymer-based (polyaniline, polythiophene poly(3,4-ethylenedioxythiophene: polystyrene sulfonate) conductive polymers with excellent conductivity and mechanical properties. In step (5), the stretchable flexible substrate is selected from one of the following: thermoplastic polyurethane (TPU) film, aliphatic-aromatic random copolyester (Ecoflex) film, and natural rubber (NR) film, which have good biocompatibility and high air permeability, and has a thickness of 10 to 200 μm.

[0006] Furthermore, as an optimization, the small-aperture and large-aperture discrete mesh of the high-curvature serpentine structure photosensitive screen template are used to control the amount of conductive composite ink transferred per unit area. The small apertures penetrate to form a conductive micro-ink layer, and the large apertures penetrate to form a conductive thin ink layer, thereby arranging and combining them into a high-curvature serpentine dual-conductive structure sensing ink layer.

[0007] Furthermore, as an optimization, the conductive micro-ink layer and conductive thin ink layer of the high-curvature serpentine dual-lead structure have electromechanical properties that synergistically achieve high-sensitivity resolution sensing, wide-range sensing response, and fatigue resistance. On the one hand, this property is used for the conductive micro-ink layer to preferentially crack under tensile strain, achieving a high-sensitivity response through the opening and closing of directional micro-cracks, and inducing the formation of a serpentine conductive path in the surrounding conductive thin ink layer; on the other hand, it is used for the conductive thin ink layer to disperse stress through tensile relaxation, maintaining the overall connectivity of the sensing ink layer of the high-curvature serpentine dual-lead structure, thereby achieving a stable response function over a wide sensing range.

[0008] The high-curvature serpentine dual-lead microsensor includes a high-curvature serpentine dual-lead microsensor and an AQV212 relay integrated circuit. The high-curvature serpentine dual-lead microsensor has high-resolution sensing capability for minute deformations and adaptability to large-range deformation measurement. The AQV212 relay integrated circuit has the feature of negative feedback regulation and intelligent control of the sensor's operation. It is connected to the high-curvature serpentine dual-lead microsensor through a current collector wire. The high-curvature serpentine dual-lead microsensor can be used in daily biomedical monitoring and soft robot driving and sensing scenarios adapting to complex curved surfaces.

[0009] The beneficial effects of this invention are as follows: This invention provides a directional crack-induced assisted high-curvature serpentine dual-lead microsensor structure, comprising a high-curvature serpentine dual-lead microsensor structure and an AQV212 relay integrated circuit. The conductive micro-ink layer and conductive thin ink layer of the high-curvature serpentine dual-lead microsensor structure possess synergistic electromechanical characteristics that enable high-sensitivity resolution sensing, wide sensing range response, and fatigue resistance. These characteristics are manifested in two ways: firstly, the conductive micro-ink layer preferentially cracks under tensile strain, achieving high-sensitivity resolution sensing through directional microcrack opening and closing deformation, and inducing the formation of a serpentine conductive path in the surrounding conductive thin ink layer; secondly, the conductive thin ink layer disperses stress through tensile relaxation, maintaining the overall connectivity of the high-curvature serpentine dual-lead sensing ink layer, thereby achieving a stable response function over a wide sensing range. The AQV212 relay integrated circuit features negative feedback regulation for intelligent control of the sensing device's operation. Connected to the high-curvature serpentine dual-lead microsensor structure via a current collector wire, it can be used for high-resolution sensing and measurement of large-range deformations in biomedical monitoring and soft robots adapting to complex curved surfaces. The implementation of the above parts enables the present invention to have the ability to sense minute deformations and adapt to large-scale deformation measurement, which is of great value for the development of high-performance flexible electronic sensing equipment. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of a high-curvature serpentine dual-lead structure microsensor of a directional crack-induced assisted high-curvature serpentine dual-lead structure microsensing device according to the present invention. Figure 2 The stress distribution cloud map of the high-curvature serpentine dual-lead structure microsensor of the directional crack-induced assisted high-curvature serpentine dual-lead structure microsensor of the present invention achieves high-sensitivity resolution sensing and wide sensing range response through the coordinated use of the high-curvature serpentine dual-lead structure microsensor. Figure 3 This is a diagram showing the small and large aperture discrete mesh distribution of the high curvature serpentine structure photosensitive screen template in the directional crack-inducing assisted high curvature serpentine dual-lead structure microsensor of the present invention. Figure 4 This is a physical image of the high-curvature serpentine structure photosensitive screen template of the directional crack-inducing assisted high-curvature serpentine dual-lead structure microsensor device of the present invention; Among them: a conductive thin ink layer 101 with a high curvature serpentine dual-lead structure, a conductive micro ink layer 102 with a high curvature serpentine dual-lead structure, and a stretchable flexible substrate layer 103. Detailed Implementation

[0011] To facilitate understanding of the present invention, a more comprehensive description of the invention will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the invention. However, it should be understood that the drawings are provided only for a better understanding of the invention and should not be construed as limiting the invention.

[0012] Example 1

[0013] like Figures 1 to 4 As shown, a directional crack-induced assisted high-curvature serpentine dual-lead structure microsensor includes a high-curvature serpentine dual-lead structure microsensor and an AQV212 relay integrated circuit. The key feature is that the conductive micro-ink layer 102 and the conductive thin ink layer 101 of the high-curvature serpentine dual-lead structure microsensor possess synergistic electromechanical characteristics that enable high-sensitivity resolution sensing, wide sensing range response, and fatigue resistance. This characteristic, on the one hand, allows the conductive micro-ink layer 102 to preferentially crack under tensile strain, achieving high-sensitivity resolution sensing through directional microcrack opening and closing deformation, and inducing the surrounding conductive thin ink layer 101... 1. A serpentine conductive path is formed; on the other hand, the conductive thin ink layer 101 disperses stress by stretching and relaxing, maintaining the overall connectivity of the high-curvature serpentine dual-lead structure sensing ink layer, thereby achieving a stable response function with a wide sensing range; the AQV212 relay integrated circuit has the feature of negative feedback regulation to regulate the operation of the sensing device. The high-curvature serpentine dual-lead structure microsensor is connected to the AQV212 relay integrated circuit through a current collector wire, which can be used for daily biomedical monitoring and high-resolution driving perception scenarios for soft robots to adapt to complex curved surfaces with large-range deformation.

[0014] (1) A 3D coating machine was used to program and print a 10μm deep dual-liquid photosensitive adhesive array on a screen printing plate to obtain a micro-convex photosensitive screen template.

[0015] (2) The micro-convex photosensitive screen template and the high-curvature serpentine structure film are irradiated with ultraviolet light to induce a free radical chain chemical polymerization reaction of the two-liquid photosensitive emulsion, thereby achieving a tight bond between the micro-convex photosensitive screen template and the high-curvature serpentine structure film, and thus obtaining a pre-structured photosensitive screen template.

[0016] (3) The prestructured photosensitive screen template, which consists of 16 small holes with a diameter of 20 μm and 68 large holes with a diameter of 100 μm, is immersed in a neutral deionized water solution, rinsed three times to separate the mesh channels, and then taken out and dried at room temperature for 1 hour to obtain a high curvature serpentine structure photosensitive screen template with 16 small holes with a diameter of 20 μm and 68 large holes with a diameter of 100 μm.

[0017] (4) The conductive polymer ink of polythiophene poly(3,4-ethylenedioxythiophene):polystyrene sulfonate is coated and fixed on the left side of the upper pattern of the photosensitive screen template with a high curvature serpentine structure having 16 small holes with a diameter of 20 μm and 68 large holes with a diameter of 100 μm. Thermoplastic polyurethane (TPU) film is fixed as a stretchable flexible substrate layer 103 on the lower pattern surface of the photosensitive screen template with a high curvature serpentine structure having 16 small holes with a diameter of 20 μm and 68 large holes with a diameter of 100 μm. By applying a vertically downward stress field to the entire device along the directional printing, the conductive ink of polythiophene poly(3,4-ethylenedioxythiophene):polystyrene sulfonate can selectively penetrate the photosensitive screen template, arrange downward and aggregate to form a high curvature serpentine dual-lead structure microsensor.

[0018] (5) Connect the high curvature serpentine dual-lead structure microsensor to the AQV212 relay integrated circuit through the current collector wire to obtain the high curvature serpentine dual-lead structure microsensing device.

[0019] Example 2

[0020] like Figures 1 to 4 As shown, a directional crack-induced assisted high-curvature serpentine dual-lead structure microsensor includes a high-curvature serpentine dual-lead structure microsensor and an AQV212 relay integrated circuit. The key feature is that the conductive micro-ink layer 102 and the conductive thin ink layer 101 of the high-curvature serpentine dual-lead structure microsensor possess synergistic electromechanical characteristics that enable high-sensitivity resolution sensing, wide sensing range response, and fatigue resistance. This characteristic, on the one hand, allows the conductive micro-ink layer 102 to preferentially crack under tensile strain, achieving high-sensitivity resolution sensing through directional microcrack opening and closing deformation, and inducing the surrounding conductive thin ink layer 101... 01 forms a serpentine conductive path; on the other hand, the conductive thin ink layer 101 disperses stress by stretching and relaxing, maintaining the overall connectivity of the high-curvature serpentine dual-lead structure sensing ink layer, thereby achieving a stable response function with a wide sensing range; the AQV212 relay integrated circuit has the characteristic of negative feedback regulation and intelligent control of the sensing device operation, and the high-curvature serpentine dual-lead structure micro-sensor is connected to the AQV212 relay integrated circuit through a current collector wire, used for daily biomedical monitoring and high-resolution driving perception scenarios for soft robots to adapt to large-range deformation of complex curved surfaces.

[0021] (1) A 20μm deep dual-liquid photosensitive adhesive array was printed on a screen printing plate using a 3D coating machine to obtain a micro-convex photosensitive screen template.

[0022] (2) The micro-convex photosensitive screen template and the high-curvature serpentine structure film are irradiated with ultraviolet light to induce a free radical chain chemical polymerization reaction of the two-liquid photosensitive emulsion, thereby achieving a tight bond between the micro-convex photosensitive screen template and the high-curvature serpentine structure film, and thus obtaining a pre-structured photosensitive screen template.

[0023] (3) The prestructured photosensitive screen template, which consists of 24 small holes with a diameter of 40 μm and 88 large holes with a diameter of 120 μm, is immersed in a neutral deionized water solution, rinsed 5 times for discrete mesh channels, and then taken out and dried at room temperature for 3 hours to obtain a high curvature serpentine structure photosensitive screen template with 24 small holes with a diameter of 40 μm and 88 large holes with a diameter of 120 μm.

[0024] (4) Carbon nanotube conductive ink is coated and fixed on the left side of the upper pattern of a photosensitive screen template with a high curvature serpentine structure having 24 small holes with a diameter of 40 μm and 88 large holes with a diameter of 120 μm. An aliphatic-aromatic random copolyester (Ecoflex) film is fixed as a stretchable flexible substrate 103 on the lower pattern surface of the photosensitive screen template with a high curvature serpentine structure having 24 small holes with a diameter of 40 μm and 88 large holes with a diameter of 120 μm. By applying a vertically downward stress field to the entire device along the directional printing, the carbon nanotube conductive ink can selectively penetrate the photosensitive screen template, arrange downwards and aggregate to form a high curvature serpentine dual-lead structure microsensor.

[0025] (5) Connect the high curvature serpentine dual-lead structure microsensor to the AQV212 relay integrated circuit through the current collector wire to obtain the high curvature serpentine dual-lead structure microsensing device.

[0026] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above. Those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the substantive content of the present invention. In the absence of conflict, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

Claims

1. A method for preparing a high-curvature serpentine double-lead structure micro-sensing device with the assistance of a directional crack-inducing method, comprising the following steps: (1) preparing a double-lead structure micro-sensing device by using a method of self-assembly of discrete mesh templates with the assistance of a directional crack-inducing method; (2) printing an array of 10-30 μm deep double-liquid photosensitive glue on the end face of a silk screen by using a 3D coater to obtain a micro-protruding photosensitive silk screen template; (3) irradiating the micro-protruding photosensitive silk screen template and a high-curvature serpentine structure film through a UV lamp to induce a free radical chain chemical polymerization reaction of the double-liquid photosensitive glue, so as to realize the close combination of the micro-protruding photosensitive silk screen template and the high-curvature serpentine structure film, and obtain a pre-structure photosensitive silk screen template; (4) immersing the pre-structure photosensitive silk screen template obtained in step (3) in a neutral deionized water solution, taking it out after washing the discrete mesh channels for 2-5 times, and drying it at room temperature for 1-3 h to obtain a high-curvature serpentine structure photosensitive silk screen template; (5) coating and fixing a conductive composite ink on the left side of the upper end pattern of the high-curvature serpentine structure photosensitive silk screen template, and fixing a stretchable flexible substrate layer on the lower end pattern surface of the high-curvature serpentine structure photosensitive silk screen template, and applying a vertical downward stress field to the whole device by directional printing, so as to realize the selective penetration of the conductive ink through the photosensitive silk screen and arrange and gather it downward to form a high-curvature serpentine double-lead structure micro-sensor; and (6) connecting the high-curvature serpentine double-lead structure micro-sensor obtained in step (5) with an AQV212 relay integrated circuit through a current collector wire to obtain a high-curvature serpentine double-lead structure micro-sensing device. The high-curvature serpentine structure photosensitive silk screen template in step (4) has a high-curvature serpentine double-lead structure discrete mesh which is composed of 15-39 small holes with a diameter of 20-50 μm and 80-160 large holes with a diameter of 100-150 μm, and is used for regulating the amount of conductive composite ink and programming and printing a high-curvature serpentine double-lead structure sensing ink layer. The conductive composite ink in step (5) is selected from one of carbon-based (carbon black, carbon nanotube, graphene) conductive ink, metal-based (gold powder, silver powder, copper powder) conductive ink, and polymer-based (polyaniline, polythiophene poly 3,4-ethylenedioxythiophene: polystyrene sulfonate) conductive polymer. The small holes and large holes of the high-curvature serpentine structure photosensitive silk screen template are used for regulating the amount of the conductive composite ink transferred per unit area, penetrating the small holes to form a conductive micro-ink layer, and penetrating the large holes to form a conductive thin ink layer, so as to arrange and combine them into a high-curvature serpentine double-lead structure sensing ink layer. ​ ​ ​ 2. The method for fabricating a directional crack-induced assisted high-curvature serpentine dual-lead structure microsensor device according to claim 1, characterized in that, ​ 3. The method for fabricating a directional crack-induced assisted high-curvature serpentine dual-lead structure microsensor device according to claim 1, characterized in that, ​ 4. The method of claim 2, wherein the method further comprises: forming a plurality of microsensors on the substrate; and forming a plurality of microsensors on the substrate. ​ 5. The method of claim 2, wherein the method further comprises: The conductive micro-ink layer and the conductive thin-ink layer of the high-curvature serpentine double-lead structure have the characteristics of high sensitivity, wide sensing range and anti-fatigue, which can be used for preferential cracking of the conductive micro-ink layer during tensile strain, high sensitivity response through directional micro-crack opening and closing, and induction of the surrounding conductive thin-ink layer to form a serpentine conductive path; on the other hand, the conductive thin-ink layer can disperse stress through stretching and relaxation, keep the whole conductive ink layer of the high-curvature serpentine double-lead structure connected, and realize the function of wide sensing range and stable response.

6. A micro-sensor device of a guided crack-induced assisted high-curvature serpentine dual-lead structure manufactured by the method of claims 1 to 5. The device comprises a high-curvature serpentine double-lead structure micro-sensor and an AQV212 relay integrated circuit. The high-curvature serpentine double-lead structure micro-sensor has the characteristics of high resolution sensing ability for small deformation and wide range deformation measurement. The AQV212 relay integrated circuit has the characteristics of negative feedback regulation and intelligent control of the working operation of the sensing device. The device can be used for daily biological medical monitoring and driving sensing of soft robots on complex surfaces.

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