Optoelectronic module

Abstract

The photoelectric module is provided with a main wiring board (101), an optical circuit chip (102), an electronic circuit chip (103), an electronic component (104), an optical fiber (105), an auxiliary wiring board (121), and a housing (106). An auxiliary wiring board (121) is connected to the main wiring board (101) inside the housing (106), and the optical circuit chip (102) and the electronic circuit chip (103) are mounted on the auxiliary wiring board (121). In addition, the main wiring board (101) is provided with a protective film removal region (151). The protective film removal region (151) is a region where the protective film between the optical circuit chip (102) and the optical fiber extraction portion (112) is removed on the outermost surface of the main wiring board (101).

Description

TECHNICAL FIELD

[0001] The present application relates to an optoelectronic module. BACKGROUND

[0002] In recent years, the range of application of optical communication modules and devices is not only for long distance communication, and optical communication modules and devices are also used for links between data centers, between cell base stations, and between edge routers, and the demand for performance improvement thereof is gradually increasing. In order to improve the performance of optical communication modules and devices, it is necessary to arrange an integrated circuit (IC) that processes electrical signals (for example, a digital signal processor (DSP), a driver, and a trans-impedance amplifier (TIA)) and an optical circuit chip close to each other to improve high frequency characteristics, and the form of a co-packaged optical module (co-packaged optical component [CPO]) is also widely discussed (Non-Patent Literature 1 and Non-Patent Literature 2). In order to reduce the size of the CPO, it is necessary to ensure the quality of the optical fiber and optical connection inside the module.

[0003] As a conventional technology, Non-Patent Literature 1 discloses a CPO including an electronic IC obtained by combining a digital signal processing circuit chip (Fig. 4, XSR, TRX, CDR), a driver, and a trans-impedance amplifier, and a silicon photonics chip (Fig. 4, Si-Photonics IC). Such a CPO includes a plurality of silicon photonics chips (as shown in Fig. 6 (a) and Fig. 7 of Non-Patent Literature 1), but it is necessary to connect the same number of optical fibers as the number of these silicon photonics chips for optical input and output.

[0004] An optoelectronic module including a general optical transmission / reception function will be described below with reference to Figure 8A and Figure 8B An optoelectronic module including a general optical transmission / reception function will be described below with reference to

[0005] The optoelectronic module includes a wiring substrate 301, an optical circuit chip 302, an electronic circuit chip 303, an electronic component 304, an optical fiber 305, and a housing 306. The optical circuit chip 302, the electronic circuit chip 303, and the electronic component 304 are mounted on the wiring substrate 301. In a plan view, a part of the optical circuit chip 302 protrudes outside the wiring substrate 301.

[0006] A traveling wave electrode Mach-Zehnder modulator (MZM) is generally used as an optical transmitter of the optical circuit chip 302. In the conventional technology, flip-chip implementation is performed by flip-chip, and a transmission signal input terminal group, a reception signal output terminal group, and electrodes of the MZM of the optical circuit chip 302 are arranged on a lower surface (a surface facing the wiring substrate 301) of the optical circuit chip 302.

[0007] The electronic circuit chip 303 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a trans-impedance amplifier circuit (TIA). Although these components can be implemented as independent chips, in the present example, a case where these components are integrated on the electronic circuit chip 303 is shown. The DRV includes a function of amplifying a transmission signal output from the digital signal processing circuit, the TIA includes a function of amplifying a reception signal output from the optical circuit, and each of them includes a function of connecting with the digital signal processing circuit.

[0008] The electronic circuit chip 303 generally includes a plurality of terminals 308 for transmission signal output and reception signal input on a wiring side (i.e., a side of outputting a signal to an optical transmitter and a side of inputting a signal from an optical receiver). For example, a digital signal processing circuit chip based on the 400GBASE-DR4 standard includes eight transmission signal output terminals and reception signal input terminals of four channels x positive and negative.

[0009] The electronic component 304 is a group of components required to drive the optical circuit chip 302 and the electronic circuit chip 303, and can be a capacitor, an inductor, a resistor, and the like. In addition, the electronic component 304 can also be a control microcomputer, an AD converter, a DA converter, an electronic switch, and the like.

[0010] The wiring substrate 301 is a build-up substrate using a resin as a base material, and can have a multilayer wiring structure of about ten layers. The substrate internal wiring 309 is formed in each layer and between the layers of the wiring substrate 301, and outputs and inputs an electric signal to and from the outside via the input / output electric terminals 310.

[0011] The housing 306 surrounds the optical circuit chip 302 and the electronic circuit chip 303, and is fixed to the wiring substrate 301 to prevent dust from adhering to each chip. In addition, the housing 306 fixes the optical fiber extraction unit 312 to be described below. The housing 306 can be formed of, for example, aluminum, stainless steel, copper, or the like.

[0012] Optical fiber 305 is connected to optical circuit chip 302 for optical input and output. Optical fiber 305 can be in multiple arrays. In the case of 400GBASE-DR4, at least eight optical fibers 305 are required, including four transmitting fibers and four receiving fibers. Furthermore, in the case of continuous light supplied from an external source for optical transmission, at least one more fiber is added. For ease of handling, optical fibers 305 formed in multiple arrays are typically fixed together using adhesives or coatings through a method known as tapering or ribbonizing. The optical fiber can be made of quartz glass, plastic, etc.

[0013] Optical fiber 305 is fixed to one end of optical circuit chip 302 by fixing component 311. Since optical fiber 305 is connected to an optical waveguide formed near the lower surface of optical circuit chip 302, fixing component 311 protrudes downward from the lower surface of optical circuit chip 302. Therefore, in order to prevent interference (contact) between the lower part of fixing component 311 and wiring substrate 301, in the plan view, the end to which fixing component 311 of optical circuit chip 302 is fixed protrudes outside of wiring substrate 301.

[0014] A glass material, different from that used for optical fiber 305, is used to fix the assembly 311 and enhances the connection strength between optical fiber 305 and optical circuit chip 302. Furthermore, optical fiber 305 is optically connected to the outside of housing 306 via optical fiber extraction unit 312 mounted in housing 306. For optical fiber extraction unit 312, a resin-molded assembly, referred to as a protective sleeve including a through-hole through which optical fiber 305 passes, is used.

[0015] The optical fiber 305 and the fixing assembly 311 are attached to the central portion of the end surface of the optical circuit chip 302 using an optically transparent adhesive. The optical fiber 305 extends horizontally to the outside of the housing 306 (module) in the optical axis direction.

[0016] like Figure 9 As shown, in order to obtain twice the transmission capacity of 400GBASE-DR4, multiple optical circuit chips 302a and 302b and multiple electronic circuit chips 303a and 303b are mounted on the wiring substrate 301.

[0017] Reference List

[0018] Non-patent literature

[0019] Non-Patent Literature 1: R. Mahajan et al., “Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities”, Journal of Lightwave Technology, vol. 40, no. 2, pp. 379-392, 2022

[0020] Non-Patent Literature 2: R. Stone et al., “Co-packaged Optics for Data Center Switching”, European Conference on Optical Communications, 20446618, 2020. SUMMARY

[0021] PROBLEMS TO BE SOLVED BY THE INVENTION

[0022] Meanwhile, miniaturization of the module is an important technical challenge, but in order to further miniaturize the module (housing 306), it is essential to reduce the size of the housing 306 to be close to the size of the wiring substrate 301 or the like. Therefore, it is necessary to further reduce the distance between the fixing member 311 fixed to the opto circuit chip 302 installed to protrude outside the wiring substrate 301 and the fiber extraction unit 312.

[0023] As described above, in a configuration in which it is necessary to shorten the distance between the opto circuit chip 302 and the fiber extraction unit 312, the optical fiber 305 between the fixing member 311 and the fiber extraction unit 312 is severely bent due to buckling. In the optical fiber 305 in which such a large bend occurs, a portion in which the bend radius is small appears, and in such a portion, it is well known that the light loss in the optical fiber 305 increases. In addition, the optical fiber 305 can be broken at the portion in which the bend radius is small.

[0024] The bending state of the optical fiber 305 is determined by the distance (bending length) in the optical axis direction between the end of the fixing member 311 and the optical fiber extraction unit 312 and the distance (bending height) in the height direction of the housing 306 as viewed from the side of the mounting surface of the wiring substrate 301. In a case where the bending radius R of the bending portion determined by the bending length and the bending height is smaller than the radius that can ensure the quality of the optical fiber 305, characteristic deterioration (for example, an increase in loss and an increase in polarization extinction ratio) can occur due to leakage of propagating light from the core of the optical fiber 305 or microcracks generated by bending. In addition, in a case where a mechanical load or an environmental load (for example, stress concentration or vibration impact) is applied, the optical fiber 305 can be broken, and as a result, the function as an optoelectronic module is also lost.

[0025] In addition, in order to perform fitting of a slot or the like for implementing the optoelectronic module without positional deviation, as shown in FIG. 3B, the fixing member 311 can be connected to the end surface of the optoelectronic circuit chip 302 at a position deviated inward from the center of the end surface. Figure 9 As shown in FIG. 3C, the outer shape of the housing 306' can include a structure such as a cutout 341. In this case, in order to accommodate a plurality of chips in the housing 306', the fixing members 311a, 311b are not connected to the center of the end surface of the optoelectronic circuit chips 302a, 302b but are connected to positions deviated inward. Therefore, the optical fibers 305a, 305b are bent with respect to the optical axis direction in the plan view so as to reach the optical fiber extraction units 312a, 312b.

[0026] As described above, in a case where a plurality of optoelectronic circuit chips are arranged, the optical fibers 305a, 305b are bent and curved with respect to the optical axis in the plan view, and in addition to the bending length and the bending height, a factor of the bending width needs to be added, and there is a problem of an increased risk such as an increase in loss and breakage. In addition, since the arrayed optical fibers 305a and 305b are taped or ribbonized, it is difficult to bend the optical fibers in the width direction. If bending is forcibly attempted, not only the risk of breakage of the optical fibers is increased, but also excessive stress load is applied to the connection portions between the optoelectronic circuit chips 302a, 302b and the optical fibers 305a, 305b, which can cause influences such as an increase in connection loss and peeling of the adhesive.

[0027] As described above, in the related art, there is a problem that the optical fiber between the optoelectronic circuit chip and the optical fiber extraction unit in the module can be deteriorated in characteristics, broken, or the like.

[0028] The present application aims to solve the above-described problems, and an object of the present application is to reduce deterioration in characteristics, breakage, or the like of the optical fiber between the optoelectronic circuit chip and the optical fiber extraction unit in the module.

[0029] Solution to the problem

[0030] An optoelectronic module according to the present application includes a housing, a main wiring substrate accommodated in the housing, a sub wiring substrate connected to the main wiring substrate inside the housing, an optocircuit chip mounted on the sub wiring substrate inside the housing, an optical fiber having an optical input / output end optically connected to a side end surface of the optocircuit chip, a fixing assembly fixing the optical fiber to the optical input / output end, an optical fiber extraction unit fixed to a side surface portion of the housing facing the optical input / output end to extract the optical fiber to the outside of the housing, and a protective film removal area in which a protective film on an outermost surface of the main wiring substrate between the optocircuit chip and the optical fiber extraction unit is removed, wherein the optocircuit chip is mounted on the sub wiring substrate and one side of the optical input / output end protrudes beyond the sub wiring substrate.

[0031] An optoelectronic module according to the present application includes a housing, a main wiring substrate accommodated in the housing, a sub wiring substrate connected to the main wiring substrate inside the housing, an optocircuit chip mounted on the sub wiring substrate inside the housing, an optical fiber having an optical input / output end optically connected to a side end surface of the optocircuit chip, a fixing assembly fixing the optical fiber to the optical input / output end, an optical fiber extraction unit fixed to a side surface portion of the housing facing the optical input / output end to extract the optical fiber to the outside of the housing, and a wiring removal area in which a wiring layer on an outermost surface of the main wiring substrate between the optocircuit chip and the optical fiber extraction unit is removed, wherein the optocircuit chip is mounted on the sub wiring substrate and one side of the optical input / output end protrudes beyond the sub wiring substrate.

[0032] An optoelectronic module according to the present application includes a housing, a main wiring substrate accommodated in the housing, an optocircuit chip mounted on the main wiring substrate inside the housing, an optical fiber having an optical input / output end optically connected to a side end surface of the optocircuit chip, a fixing assembly fixing the optical fiber to the optical input / output end, an optical fiber extraction unit fixed to a side surface portion of the housing facing the optical input / output end to extract the optical fiber to the outside of the housing, and a recess formed in the main wiring substrate between the optocircuit chip and the optical fiber extraction unit, wherein the optocircuit chip is mounted on the main wiring substrate and one side of the optical input / output end protrudes beyond the main wiring substrate.

[0033] Advantages of the present application

[0034] As described above, according to the present application, since the optocircuit chip is mounted on the sub wiring substrate connected to the main wiring substrate, and further includes the protective film removal area or the wiring removal area, it is possible to reduce deterioration in characteristics, breakage, etc. of the optical fiber between the optocircuit chip and the optical fiber extraction unit in the module. Furthermore, according to the present application, since the recess is formed in the main wiring substrate between the optocircuit chip and the optical fiber extraction unit, it is possible to reduce deterioration in characteristics, breakage, etc. of the optical fiber between the optocircuit chip and the optical fiber extraction unit in the module. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1A This is a plan view showing the internal configuration of an optoelectronic module according to a first embodiment of the present invention.

[0036] Figure 1B This is a cross-sectional view showing the configuration of an optoelectronic module according to a first embodiment of the present invention.

[0037] Figure 2A This is a plan view showing the internal configuration of an optoelectronic module according to a second embodiment of the present invention.

[0038] Figure 2B This is a cross-sectional view showing the configuration of an optoelectronic module according to a second embodiment of the present invention.

[0039] Figure 3A This is a plan view showing a partial configuration of the optoelectronic module.

[0040] Figure 3B This is a cross-sectional view showing a partial configuration of an optoelectronic module according to a second embodiment of the present invention.

[0041] Figure 4A This is a plan view showing the internal configuration of an optoelectronic module according to a third embodiment of the present invention.

[0042] Figure 4B This is a cross-sectional view showing the configuration of an optoelectronic module according to a third embodiment of the present invention.

[0043] Figure 5 This is a cross-sectional view showing the configuration of an optoelectronic module according to a fourth embodiment of the present invention.

[0044] Figure 6A This is a plan view showing the internal configuration of an optoelectronic module according to a fifth embodiment of the present invention.

[0045] Figure 6B This is a cross-sectional view showing the configuration of an optoelectronic module according to a fifth embodiment of the present invention.

[0046] Figure 7A This is a plan view showing the internal configuration of another optoelectronic module according to an embodiment of the present invention.

[0047] Figure 7B This is a cross-sectional view showing the configuration of another optoelectronic module according to an embodiment of the present invention.

[0048] Figure 8A This is a plan view showing the internal configuration of a conventional optoelectronic module.

[0049] Figure 8B This is a cross-sectional view showing the configuration of a conventional optoelectronic module.

[0050] Figure 9 This is a plan view showing the internal configuration of a conventional optoelectronic module. Detailed Implementation

[0051] The following is a description of an optoelectronic module according to an embodiment of the present invention.

[0052] [First Embodiment]

[0053] First, refer to Figure 1A and Figure 1B A photoelectric module according to a first embodiment of the present invention is described. Figure 1A The internal structure of the module is shown, and Figure 1B It shows along Figure 1A The cross section intercepted by line xx' in the middle.

[0054] The optoelectronic module includes a main wiring substrate 101, an optical circuit chip 102, an electronic circuit chip 103, an electronic component 104, an optical fiber 105, a fixing component 111, an optical fiber extraction unit 112, a sub-wiring substrate 121, and a housing 106. The optoelectronic module is, for example, a pigtail-type module. Although not shown, an optical connector, such as a multi-fiber push-in (MPO) connector, connects to the end of each optical fiber 105 outside the housing 106. The optoelectronic module is compatible with, for example, the 400GBASE-DR4 standard, and the optical fibers 105 may include eight fibers (four transmitting fibers and four receiving fibers), and at least one more fiber may be added to supply continuous light for external light transmission.

[0055] Sub-wiring substrate 121 is connected to main wiring substrate 101 inside housing 106. Furthermore, optical circuit chip 102 and electronic circuit chip 103 are mounted on sub-wiring substrate 121. Electronic component 104 may also be mounted on sub-wiring substrate 121. Optical circuit chip 102 is mounted on sub-wiring substrate 121, with one side of optical input / output terminal 131 protruding beyond sub-wiring substrate 121.

[0056] The main wiring substrate 101 is a multilayer substrate using resin as a substrate and may have a multilayer wiring structure with a thickness of about 1 mm and about ten layers. In-substrate wiring 109 is formed in each layer of the main wiring substrate 101 and between the layers of the main wiring substrate 101, and outputs electrical signals to and from the outside via input / output electrical terminals 110. The in-substrate wiring 109 may be, for example, copper wiring. The input / output electrical terminals 110 may have structures such as electrodes for a grid array (LGA) or ball grid array (BGA).

[0057] Substrate-to-substrate terminals 122 are formed on the main wiring substrate 101 to achieve electrical connection with the sub-wiring substrate 121. The sub-wiring substrate 121 is typically referred to as an interposer. The sub-wiring substrate 121 may have a multilayer wiring structure with a thickness of approximately 0.5 mm and approximately eight layers. The substrate-to-substrate terminals 122 may include BGA, copper pillars (CuP), solder, etc.

[0058] The optical circuit chip 102 includes optical circuitry comprising an optical waveguide formed from a silicon core and has, for example, a thickness of about 1 mm. The optical circuit chip 102 may also be formed from a quartz-based material or a compound semiconductor (e.g., InP). The optical circuit chip 102 is implemented on and electrically connected to the sub-wiring substrate 121 via a flip chip (FC) connection, for example, through optical circuitry terminals 107.

[0059] The optical circuit chip 102 may include, for example, an optical transmitter including an optical modulator, optical waveguide, beam splitter, optical attenuator, etc., and an optical receiver including a photodiode, optical waveguide, optical attenuator, etc. Signals from the electronic circuit chip 103 are input to the optical transmitter at least via the sub-wiring substrate 121, and received signals from the optical receiver are output to the TIA of the electronic circuit chip 103.

[0060] A traveling wave electrode Mach-Zehnder modulator (MZM) is typically used as the optical transmitter of the optical circuit chip 102. The transmit signal input terminal group, receive signal output terminal group, and electrodes of the MZM (optical circuit terminal 107) of the optical circuit chip 102, which is implemented by flip-chip bonding on the sub-wiring substrate 121, are arranged on the lower surface (the surface facing the sub-wiring substrate 121) of the optical circuit chip 102.

[0061] Electronic circuit chip 103 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a transimpedance amplifier circuit (TIA). Although these components can be implemented as separate chips, this example shows them integrated on electronic circuit chip 103. The DRV includes the function of amplifying the transmitted signal output from the digital signal processing circuit, the TIA includes the function of amplifying the received signal output from the optical circuit, and each of them includes a function for connecting to the digital signal processing circuit.

[0062] Electronic circuit chip 103 typically includes multiple electronic circuit terminals 108 for transmitting signal output and receiving signal input on the line side (i.e., the side that outputs signals to the optical transmitter and the side that inputs signals from the optical receiver). For example, a digital signal processing circuit chip based on the 400GBASE-DR4 standard includes eight transmit signal output terminals and receive signal input terminals with four channels × positive and negative terminals.

[0063] Electronic component 104 is a group of components required to drive optical circuit chip 102 and electronic circuit chip 103, and can be a capacitor, inductor, resistor, etc. Furthermore, electronic component 104 can also be a control microcomputer, AD converter, DA converter, electronic switch, etc. In the first embodiment, electronic component 104 is mainly mounted (implemented) on the main wiring substrate 101 or sub-wiring substrate 121 on the optical input / output terminal 131 side of optical circuit chip 102.

[0064] Furthermore, the main wiring substrate 101 includes a protective film removal area 151. The protective film removal area 151 is the area on the outermost surface of the main wiring substrate 101 where the protective film between the optical circuit chip 102 and the fiber extraction unit 112 is removed. It is well known that a protective film using solder resist or the like is formed on the surface of a mounting substrate such as the main wiring substrate 101 and the sub-wiring substrate 121. This protective film is typically formed in areas outside the connection terminals and protects the wiring patterns formed on the surface from corrosion, etc.

[0065] The housing 106 surrounds the optical circuit chip 102 and the electronic circuit chip 103 and is fixed to the main wiring substrate 101 to prevent dust from adhering to each chip. Furthermore, the housing 106 secures the fiber extraction unit 112. The housing 106 can be formed of, for example, aluminum, stainless steel, copper, etc.

[0066] Optical fiber 105 is connected to optical circuit chip 102 for optical input and output. Multiple optical fibers 105 can be arrayed. In the case of 400GBASE-DR4, at least eight optical fibers 105 are required, including four transmitting fibers and four receiving fibers. Furthermore, in the case of continuous light supplied from an external source for optical transmission, at least one more fiber is added. For ease of handling, optical fibers 105 formed into multiple arrays are typically fixed together using adhesives or coatings through a method known as tape bonding or ribbon bonding.

[0067] The optical fiber 105 is fixed to one end of the optical circuit chip 102 by a fixing component 111. Since the optical fiber 105 is connected to an optical waveguide formed near the lower surface of the optical circuit chip 102, the fixing component 111 protrudes downward from the lower surface of the optical circuit chip 102. To prevent interference (contact) between the lower part of the fixing component 111, which protrudes downward in this manner, and the sub-wiring substrate 121, in the plan view, the optical input / output terminal 131 to which the fixing component 111 of the optical circuit chip 102 is fixed protrudes outside the sub-wiring substrate 121. However, since the optical circuit chip 102 is mounted on the sub-wiring substrate 121, even if, for example, the optical circuit chip 102 is arranged in the central portion of the main wiring substrate 101, the lower part of the fixing component 111 and the main wiring substrate 101 will not interfere with each other.

[0068] A glass material, different from that used for optical fiber 105, is used to fix the assembly 111 and enhances the connection strength between optical fiber 105 and optical circuit chip 102. Furthermore, optical fiber 105 is optically connected to the outside of housing 106 via optical fiber extraction unit 112 mounted in housing 106. Optical fiber extraction unit 112 may be a resin-molded assembly, commonly referred to as a protective sleeve, and includes a through-hole through which optical fiber 105 passes.

[0069] The optical fiber 105 and the fixing assembly 111 are attached to the central portion of the end surface of the optical circuit chip 102 using an optically transparent adhesive. The optical fiber 105 extends horizontally to the outside of the housing 106 (module) in the optical axis direction.

[0070] According to this embodiment, since the optical circuit chip 102 is mounted on the sub-wiring substrate 121, the lower end of the fixing component 111 can be positioned away from the surface of the main wiring substrate 101. As a result, the degree of freedom in arranging the optical circuit chip 102 on the main wiring substrate 101 can be increased. Therefore, without hindering the miniaturization of the housing 106, the spacing between the optical input / output terminal 131 of the optical circuit chip 102 and the fiber extraction unit 112 can be increased. As a result, the optical fiber 105 between the fixing component 111 and the fiber extraction unit 112 can be longer, and the optical fiber 105 can be prevented from being severely bent due to compression.

[0071] Furthermore, by including a protective film removal region 151 in the area below the fiber extraction unit 112, in which the aforementioned protective film is removed, the main wiring substrate 101 and the fixing assembly 111 can be brought closer together, and the sub-wiring substrate 121 can be made thinner. By reducing the thickness of the sub-wiring substrate 121, propagation loss in the wiring within the substrate due to further miniaturization of the module and shortening of the electrical signal wiring can be reduced.

[0072] [Second Embodiment]

[0073] Next, we will refer to Figure 2A and Figure 2B A photoelectric module according to a second embodiment of the present invention is described. Figure 2A The internal structure of the module is shown, and Figure 2B It shows along Figure 2A The cross section intercepted by line xx' in the middle.

[0074] The optoelectronic module includes a main wiring substrate 101, an optical circuit chip 102, an electronic circuit chip 103, an electronic component 104, an optical fiber 105, a fixing component 111, an optical fiber extraction unit 112, a sub-wiring substrate 121, and a housing 106. The optoelectronic module is, for example, a pigtail-type module. Although not shown, an optical connector, such as a multi-fiber push-in (MPO) connector, connects to the end of each optical fiber 105 outside the housing 106. The optoelectronic module is compatible with, for example, the 400GBASE-DR4 standard, and the optical fibers 105 may include eight fibers (four transmitting fibers and four receiving fibers), and at least one more fiber may be added to supply continuous light for external light transmission.

[0075] Sub-wiring substrate 121 is connected to main wiring substrate 101 inside housing 106. Furthermore, optical circuit chip 102 and electronic circuit chip 103 are mounted on sub-wiring substrate 121. Electronic component 104 may also be mounted on sub-wiring substrate 121. Optical circuit chip 102 is mounted on sub-wiring substrate 121, with one side of optical input / output terminal 131 protruding beyond sub-wiring substrate 121.

[0076] The main wiring substrate 101 is a multilayer substrate using resin as a substrate and may have a multilayer wiring structure with a thickness of about 1 mm and about ten layers. In-substrate wiring 109 is formed in each layer of the main wiring substrate 101 and between the layers of the main wiring substrate 101, and outputs electrical signals to and from the outside via input / output electrical terminals 110. The in-substrate wiring 109 may be, for example, copper wiring. The input / output electrical terminals 110 may have structures such as electrodes for a grid array (LGA) or ball grid array (BGA).

[0077] Substrate-to-substrate terminals 122 are formed on the main wiring substrate 101 to achieve electrical connection with the sub-wiring substrate 121. The sub-wiring substrate 121 is typically referred to as an interposer. The sub-wiring substrate 121 may have a multilayer wiring structure with a thickness of approximately 0.5 mm and approximately eight layers. The substrate-to-substrate terminals 122 may include BGA, copper pillars (CuP), solder, etc.

[0078] The optical circuit chip 102 includes optical circuitry comprising an optical waveguide formed from a silicon core and has, for example, a thickness of about 1 mm. The optical circuit chip 102 may also be formed from a quartz-based material or a compound semiconductor (e.g., InP). The optical circuit chip 102 is implemented on and electrically connected to the sub-wiring substrate 121 via a flip chip (FC) connection, for example, through optical circuitry terminals 107.

[0079] The optical circuit chip 102 may include, for example, an optical transmitter including an optical modulator, optical waveguide, beam splitter, optical attenuator, etc., and an optical receiver including a photodiode, optical waveguide, optical attenuator, etc. Signals from the electronic circuit chip 103 are input to the optical transmitter via the main wiring substrate 101, and received signals from the optical receiver are output to the TIA of the electronic circuit chip 103.

[0080] A traveling wave electrode Mach-Zehnder modulator (MZM) is typically used as the optical transmitter of the optical circuit chip 102. The transmit signal input terminal group, receive signal output terminal group, and electrodes of the MZM (optical circuit terminal 107) of the optical circuit chip 102, which is implemented by flip-chip bonding on the sub-wiring substrate 121, are arranged on the lower surface (the surface facing the sub-wiring substrate 121) of the optical circuit chip 102.

[0081] Electronic circuit chip 103 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a transimpedance amplifier circuit (TIA). Although these components can be implemented as separate chips, this example shows them integrated on electronic circuit chip 103. The DRV includes the function of amplifying the transmitted signal output from the digital signal processing circuit, the TIA includes the function of amplifying the received signal output from the optical circuit, and each of them includes a function for connecting to the digital signal processing circuit.

[0082] Electronic circuit chip 103 typically includes multiple electronic circuit terminals 108 for transmitting signal output and receiving signal input on the line side (i.e., the side that outputs signals to the optical transmitter and the side that inputs signals from the optical receiver). For example, a digital signal processing circuit chip based on the 400GBASE-DR4 standard includes eight transmit signal output terminals and receive signal input terminals with four channels × positive and negative terminals.

[0083] Electronic component 104 is a group of components required to drive optical circuit chip 102 and electronic circuit chip 103, and can be a capacitor, inductor, resistor, etc. Furthermore, electronic component 104 can also be a control microcomputer, AD converter, DA converter, electronic switch, etc. In the second embodiment, electronic component 104 is mainly mounted (implemented) on the main wiring substrate 101 or sub-wiring substrate 121 on the optical input / output terminal 131 side of optical circuit chip 102.

[0084] In addition, the main wiring substrate 101 includes a wiring removal region 152. This region is obtained by removing a portion of the wiring layer between the optical circuit chip 102 and the fiber extraction unit 112 on the outermost surface of the main wiring substrate 101.

[0085] The housing 106 surrounds the optical circuit chip 102 and the electronic circuit chip 103 and is fixed to the main wiring substrate 101 to prevent dust from adhering to each chip. Furthermore, the housing 106 secures the fiber extraction unit 112. The housing 106 can be formed of, for example, aluminum, stainless steel, copper, etc.

[0086] Optical fiber 105 is connected to optical circuit chip 102 for optical input and output. Multiple optical fibers 105 can be arrayed. In the case of 400GBASE-DR4, at least eight optical fibers 105 are required, including four transmitting fibers and four receiving fibers. Furthermore, in the case of continuous light supplied from an external source for optical transmission, at least one more fiber is added. For ease of handling, optical fibers 105 formed into multiple arrays are typically fixed together using adhesives or coatings through a method known as tape bonding or ribbon bonding.

[0087] The optical fiber 105 is fixed to one end of the optical circuit chip 102 by a fixing component 111. Since the optical fiber 105 is connected to an optical waveguide formed near the lower surface of the optical circuit chip 102, the fixing component 111 protrudes downward from the lower surface of the optical circuit chip 102. To prevent interference (contact) between the lower part of the fixing component 111, which protrudes downward in this manner, and the sub-wiring substrate 121, in the plan view, the optical input / output terminal 131 to which the fixing component 111 of the optical circuit chip 102 is fixed protrudes outside the sub-wiring substrate 121. However, since the optical circuit chip 102 is mounted on the sub-wiring substrate 121, even if, for example, the optical circuit chip 102 is arranged in the central portion of the main wiring substrate 101, the lower part of the fixing component 111 and the main wiring substrate 101 will not interfere with each other.

[0088] A glass material, different from that used for optical fiber 105, is used to fix the assembly 111 and enhances the connection strength between optical fiber 105 and optical circuit chip 102. Furthermore, optical fiber 105 is optically connected to the outside of housing 106 via optical fiber extraction unit 112 mounted in housing 106. Optical fiber extraction unit 112 may be a resin-molded assembly, commonly referred to as a protective sleeve, and includes a through-hole through which optical fiber 105 passes.

[0089] The optical fiber 105 and the fixing assembly 111 are attached to the central portion of the end surface of the optical circuit chip 102 using an optically transparent adhesive. The optical fiber 105 extends horizontally to the outside of the housing 106 (module) in the optical axis direction.

[0090] According to this embodiment, since the optical circuit chip 102 is mounted on the sub-wiring substrate 121, the lower end of the fixing component 111 can be positioned away from the surface of the main wiring substrate 101. As a result, the degree of freedom in arranging the optical circuit chip 102 on the main wiring substrate 101 can be increased. Therefore, without hindering the miniaturization of the housing 106, the spacing between the optical input / output terminal 131 of the optical circuit chip 102 and the fiber extraction unit 112 can be increased. As a result, the optical fiber 105 between the fixing component 111 and the fiber extraction unit 112 can be longer, and the optical fiber 105 can be prevented from being severely bent due to compression.

[0091] Furthermore, by including a wiring removal region 152 in the area below the fiber extraction unit 112, in which a portion of the wiring layer on the outermost surface is removed, warping of the main wiring substrate 101 can be mitigated. When the wiring layer 101a on the outermost surface of the main wiring substrate 101 is copper wiring and the main wiring substrate 101 is a resin substrate, warping can occur due to differences in ambient temperature, such as... Figure 3A The main wiring substrate 101 is shown to be warped toward the fixing component 111. When the main wiring substrate 101 warps as described above, contact occurs between the fixing component 111 and the main wiring substrate 101, causing a problem.

[0092] On the other hand, such as Figure 3B As shown, by including the wiring removal region 152, warping of the main wiring substrate 101 can be prevented, and contact between the fixing component 111 and the main wiring substrate 101 due to warping can be prevented. As a result, for example, the main wiring substrate 101 and the fixing component 111 can be brought closer to each other, and the sub-wiring substrate 121 can be made thinner. By reducing the thickness of the sub-wiring substrate 121, propagation loss in the wiring within the substrate due to further miniaturization of the module and shortening of the electrical signal wiring can be reduced.

[0093] [Third Embodiment]

[0094] Next, we will refer to Figure 4A and Figure 4B A photoelectric module according to a third embodiment of the present invention is described. Figure 4A The internal structure of the module is shown, and Figure 4B It shows along Figure 2A The cross section intercepted by line xx' in the middle.

[0095] The optoelectronic module includes a main wiring substrate 101, an optical circuit chip 102, an electronic circuit chip 103, an electronic component 104, an optical fiber 105, and a housing 106. The optical circuit chip 102, the electronic circuit chip 103, and the electronic component 104 are mounted on the main wiring substrate 101.

[0096] The optoelectronic module is, for example, a pigtail-type module. Although not shown, an optical connector, such as a multi-fiber push-in (MPO) connector, connects to the end of each optical fiber 105 outside the housing 106. The optoelectronic module is compatible with, for example, the 400GBASE-DR4 standard, and the optical fibers 105 may include eight optical fibers (four transmitting fibers and four receiving fibers), and at least one more fiber may be added to supply continuous light for external light transmission.

[0097] The main wiring substrate 101 is a multilayer substrate using resin as a substrate and may have a multilayer wiring structure with a thickness of about 1 mm and about ten layers. In-substrate wiring 109 is formed in each layer of the main wiring substrate 101 and between the layers of the main wiring substrate 101, and outputs electrical signals to and from the outside via input / output electrical terminals 110. The in-substrate wiring 109 may be, for example, copper wiring. The input / output electrical terminals 110 may have structures such as electrodes for a grid array (LGA) or ball grid array (BGA).

[0098] The optical circuit chip 102 includes optical circuitry comprising an optical waveguide formed from a silicon core, and has, for example, a thickness of about 1 mm. The optical circuit chip 102 may also be formed from a quartz-based material or a compound semiconductor (e.g., InP). The optical circuit chip 102 is implemented on and electrically connected to the main wiring substrate 101 via a flip chip (FC) connection, for example, through optical circuit terminals 107.

[0099] The optical circuit chip 102 may include, for example, an optical transmitter including an optical modulator, optical waveguide, beam splitter, optical attenuator, etc., and an optical receiver including a photodiode, optical waveguide, optical attenuator, etc. Signals from the electronic circuit chip 103 are input to the optical transmitter via the main wiring substrate 101, and received signals from the optical receiver are output to the TIA of the electronic circuit chip 103.

[0100] A traveling wave electrode Mach-Zehnder modulator (MZM) is typically used as the optical transmitter of the optical circuit chip 102. The transmit signal input terminal group, receive signal output terminal group, and electrodes of the MZM (optical circuit terminal 107) of the optical circuit chip 102, which is implemented by flip-chip bonding on the main wiring substrate 101, are arranged on the lower surface (the surface facing the sub-wiring substrate 101) of the optical circuit chip 102.

[0101] Electronic circuit chip 103 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a transimpedance amplifier circuit (TIA). Although these components can be implemented as separate chips, this example shows them integrated on electronic circuit chip 103. The DRV includes the function of amplifying the transmitted signal output from the digital signal processing circuit, the TIA includes the function of amplifying the received signal output from the optical circuit, and each of them includes a function for connecting to the digital signal processing circuit.

[0102] Electronic circuit chip 103 typically includes multiple electronic circuit terminals 108 for transmitting signal output and receiving signal input on the line side (i.e., the side that outputs signals to the optical transmitter and the side that inputs signals from the optical receiver). For example, a digital signal processing circuit chip based on the 400GBASE-DR4 standard includes eight transmit signal output terminals and receive signal input terminals with four channels × positive and negative terminals.

[0103] Electronic component 104 is a group of components required to drive optical circuit chip 102 and electronic circuit chip 103, and can be a capacitor, inductor, resistor, etc. Furthermore, electronic component 104 can also be a control microcomputer, AD converter, DA converter, electronic switch, etc. In the third embodiment, electronic component 104 is mainly mounted (implemented) on the main wiring substrate 101 or sub-wiring substrate 121 on the optical input / output terminal 131 side of optical circuit chip 102.

[0104] The housing 106 surrounds the optical circuit chip 102 and the electronic circuit chip 103 and is fixed to the main wiring substrate 101 to prevent dust from adhering to each chip. Furthermore, the housing 106 secures the fiber extraction unit 112. The housing 106 can be formed of, for example, aluminum, stainless steel, copper, etc.

[0105] Optical fiber 105 is connected to optical circuit chip 102 for optical input and output. Multiple optical fibers 105 can be arrayed. In the case of 400GBASE-DR4, at least eight optical fibers 105 are required, including four transmitting fibers and four receiving fibers. Furthermore, in the case of continuous light supplied from an external source for optical transmission, at least one more fiber is added. For ease of handling, optical fibers 105 formed into multiple arrays are typically fixed together using adhesives or coatings through a method known as tape bonding or ribbon bonding.

[0106] Optical fiber 105 is fixed to one end of optical circuit chip 102 via fixing assembly 111. A glass material, different from that of optical fiber 105, is used for fixing assembly 111 and serves to enhance the connection strength between optical fiber 105 and optical circuit chip 102. Furthermore, optical fiber 105 is optically connected to the outside of housing 106 via optical fiber extraction unit 112 mounted in housing 106. Optical fiber extraction unit 112 may be a resin-molded assembly, commonly referred to as a protective sleeve, and includes a through-hole through which optical fiber 105 passes.

[0107] The optical fiber 105 and the fixing assembly 111 are attached to the central portion of the end surface of the optical circuit chip 102 using an optically transparent adhesive. The optical fiber 105 extends horizontally to the outside of the housing 106 (module) in the optical axis direction.

[0108] Since the optical fiber 105 is connected to an optical waveguide formed near the lower surface of the optical circuit chip 102, the fixing component 111 protrudes downward from the lower surface of the optical circuit chip 102. To prevent interference (contact) between the lower portion of the downwardly protruding fixing component 111 and the main wiring substrate 101, a recess 153 is included. The recess 153 is formed on the main wiring substrate 101 between the optical circuit chip 102 and the optical fiber extraction unit 112. In a plan view, the recess 153 may be formed in the area including the location of the fixing component 111.

[0109] With the depth of the recess 153 set to 0.5 mm and the length from the center of the optical axis of the fiber 105 to the lower end of the fixing assembly 111 set to 0.3 mm, the electrical clearance between the lower end of the fixing assembly 111 and the bottom surface of the recess 153 is approximately 0.2 mm.

[0110] By including the recess 153 as described above, the lower end of the fixing component 111 can be prevented from contacting the main wiring substrate 101, and the degree of freedom in arranging the optical circuit chip 102 on the main wiring substrate 101 can be increased. Therefore, without hindering the miniaturization of the housing 106, the spacing between the optical input / output terminal 131 of the optical circuit chip 102 and the fiber extraction unit 112 can be increased. As a result, the optical fiber 105 between the fixing component 111 and the fiber extraction unit 112 can be longer, and severe bending of the optical fiber 105 due to compression can be prevented. According to this example, by using the recess 153, the sub-wiring substrate 121 of the first and second embodiments described above is unnecessary.

[0111] [Fourth Embodiment]

[0112] Next, we will refer to Figure 5A photoelectric module according to a fourth embodiment of the present invention is described. The photoelectric module includes a main wiring substrate 101, an optical circuit chip 102, an electronic circuit chip 103, an electronic component 104, an optical fiber 105, a fixing component 111, an optical fiber extraction unit 112, a sub-wiring substrate 121, a protective film removal area 151, and a housing 106. These configurations are similar to those of the first embodiment described above.

[0113] In the fourth embodiment, a reinforcement component 118 is also included to enhance the fixing component 111 included in the protrusion of the optical circuit chip 102. The reinforcement component 118 can be attached and fixed to the back surface of the optical circuit chip 102 and the side surface of the fixing component 111. For example, if the length of the optical circuit chip 102 protruding from the sub-wiring substrate 121 is set to 1.5 mm, a reinforcement component 118 with a length of 1 mm in the protrusion direction can be used.

[0114] By using the reinforcement component 118, the optical waveguide and optical fiber 105 of the optical circuit chip 102 can be more firmly fixed, thereby enhancing the resistance to stress caused by buckling and further improving the quality.

[0115] [Fifth Embodiment]

[0116] Next, we will refer to Figure 6A and Figure 6B A photoelectric module according to a fifth embodiment of the present invention is described. Figure 6A The internal structure of the module is shown, and Figure 6B It shows along Figure 6A The cross-section is taken from line xx' in the diagram. The optoelectronic module includes a main wiring substrate 101, an optical circuit chip 102, an electronic circuit chip 103, an electronic component 104, an optical fiber 105, a fixing component 111, a sub-wiring substrate 121, a housing 106, an optical fiber extraction unit 112, and a protective film removal area 151. These configurations are similar to those in the first embodiment described above. Furthermore, in this example, similar to the second embodiment, the main wiring substrate 101 may include a wiring removal area.

[0117] In the fifth embodiment, a sub-substrate 123 is also included, connected to the main wiring substrate 101. The sub-substrate 123 is disposed inside the housing 106 between the fiber extraction unit 112, which serves as a fiber extraction unit, and the sub-wiring substrate 121. For example, an electronic component 104 is mounted on the sub-substrate 123. Furthermore, the sub-substrate 123 can be mounted with its protrusion from the main wiring substrate 101 on one side facing the fiber extraction unit 112.

[0118] Sub-substrate 123 can be connected to main wiring substrate 101 via a well-known inter-substrate connector. Furthermore, sub-substrate 123 can also be connected to main wiring substrate 101 via a cable formed from a flexible printed circuit board. Additionally, from the perspective of main wiring substrate 101, sub-substrate 123 can be positioned above optical fiber 105 between fixing assembly 111 and optical fiber extraction unit 112.

[0119] As described above, the optical fiber 105 between the fixing component 111 and the optical fiber extraction unit 112 can be made longer by using the sub-wiring substrate 121. Therefore, the space between the fixing component 111 and the optical fiber extraction unit and the optical fiber 105 for bridging is larger, and the sub-sub-substrate 123 can be easily installed.

[0120] Furthermore, the sub-substrate 123 can be inserted between the main wiring substrate 101 and the fixing assembly 111. With the thickness of the sub-substrate 121 set to 0.5 mm, the length from the optical axis center of the optical fiber 105 to the lower end of the fixing assembly 111 set to 0.3 mm, and the sub-substrate 123 inserted under the fixing assembly 111, the electrical clearance in the height direction can be set to approximately 0.05 mm. As described above, by appropriately setting the thickness of the sub-substrate 121, the space between the main wiring substrate 101 and the optical fiber 105 and the fixing assembly 111 can be increased, and the sub-substrate 123 can be inserted under the fixing assembly 111, and for example, the area of ​​the sub-substrate 123 can be increased.

[0121] In addition, such as Figure 7A and Figure 7B As shown, by including multiple sets of optical circuit chips and fiber extraction units, the transmission capacity of 400GBASE-DR4 can be doubled. Figure 7A The internal structure of the module is shown, and Figure 7B It shows along Figure 7A The cross section intercepted by line xx' in the middle.

[0122] In this example, multiple optical circuit chips 102a and 102b, and multiple electronic circuit chips 103a and 103b are mounted on the sub-wiring substrate 121. Optical fibers 105a and 105b are connected to and fixed to the optical circuit chips 102a and 102b via fixing components 111a and 111b. Furthermore, the main wiring substrate 101 includes a protective film removal area 151 similar to that described in the first embodiment.

[0123] Furthermore, each of the other ends of optical fibers 105a and 105b is connected to and secured to first optical connectors 113a and 113b. First optical connectors 113a and 113b can be connected to second optical connectors 114a and 114b. Second optical connectors 114a and 114b include external optical fibers.

[0124] Optical fiber 105 is optically connected to the outside of housing 106 via first optical connectors 113a and 113b installed (fixed) in housing 106. One end of each optical fiber 105 is connected to the optical input / output terminal 131 of optical circuit chip 102, and the other end is fixed to the first optical connectors 113a and 113b. Furthermore, the first optical connectors 113a and 113b can be connected to second optical connectors 114a and 114b. Through the connection of the first optical connectors 113a and 113b and the second optical connectors 114a and 114b, optical fiber 105 is optically connected to an external optical fiber.

[0125] The first optical connectors 113a and 113b can be, for example, sockets, and the second optical connectors 114a and 114b can be plugs. The first optical connectors 113a and 113b and the second optical connectors 114a and 114b can be, for example, mechanical transfer (MT) ferrules. Furthermore, a guide pin 116 can be included in the first optical connectors 113a and 113b formed as MT ferrules, and a guide pin guide hole 117 can be included in the second optical connectors 114a and 114b formed as MT ferrules. The first optical connectors 113a and 113b and the second optical connectors 114a and 114b are connected by inserting the guide pin 116 into the guide pin guide hole 117. This connection enables precise alignment between the optical fiber 105 and the external optical fiber. Furthermore, the connectors are not limited to MT ferrules and can also be LC connectors.

[0126] Furthermore, in this example, cutout 141 is included on the external shape of housing 106'. Cutout 141 is used to perform adaptation with slots or the like for implementing optoelectronic modules without causing positional displacement. As described above, even though housing 106' includes cutout 141 protruding inward, optical circuit chips 102a, 102b can be mounted away from the first optical connectors 113a, 113b, allowing fixing components 111a, 111b to be connected to the center of the optical input / output terminals of optical circuit chips 102a, 102b. Therefore, optical fibers 105a, 105b can reach the first optical connectors 113a, 113b without bending relative to the optical axis in the plan view. As a result, risks such as increased fiber loss or breakage due to buckling and bending relative to the optical axis in the plan view can be prevented.

[0127] Furthermore, when the first optical connectors 113a and 113b are sockets as described above, the optical fiber 105 is generally secured more firmly than in the case of a protective sleeve, etc. Even in such cases, similar to the first embodiment described above, the optical fiber 105 between the fixing component 111 and the first optical connectors 113a and 113b can be made longer, and the optical fiber 105 can be prevented from being severely bent due to compression.

[0128] Furthermore, the first optical connectors 113a and 113b, which serve as the fiber extraction unit, can be movable in the optical axis direction. For example, by including movable guide rails on each side of the housing 106 and the first optical connectors 113a and 113b, the first optical connectors 113a and 113b can be movable relative to each other. After connecting and securing the other end of the optical fiber 105 to the first optical connectors 113a and 113b, the first optical connectors 113a and 113b are moved to a suitable position. Then, the first optical connectors 113a and 113b are fixed to the housing 106 using adhesive or the like. This can be similarly applied to the fiber extraction unit 112 according to the first embodiment.

[0129] When assembling this type of module, the length of the optical fiber can vary due to the influence of processing precision. For example, the length of the optical fiber may have a dimensional error of ±1mm relative to the median value of 30mm. In this case, if the fiber extraction unit is completely fixed to the housing, sufficient bending length and bending height may not be guaranteed due to the dimensional error. On the other hand, by moving the fiber extraction unit after connecting the optical fiber, the optical fiber can be fixed while ensuring good quality in terms of length.

[0130] It should be noted that the configurations of the above embodiments can be combined with each other. For example, also in reference Figure 7A and Figure 7B The described optoelectronic module may include a wiring removal area instead of the protective film removal area 151, as in the second embodiment described above. Furthermore, also in reference... Figure 7A and Figure 7B In the described optoelectronic module, a recess can be formed in the main wiring substrate 101 between the optical circuit chips 102a, 102b and the first optical connectors 113a, 113b (fiber extraction units), instead of using the sub-wiring substrate 121.

[0131] As described above, according to the present invention, since the optical circuit chip is mounted on a sub-wiring substrate connected to the main wiring substrate, and a protective film removal area or wiring removal area is included, the characteristic degradation and breakage of the optical fiber between the optical circuit chip and the optical fiber extraction unit in the module can be reduced. Furthermore, according to the present invention, since a recess is formed in the main wiring substrate between the optical circuit chip and the optical fiber extraction unit, the characteristic degradation and breakage of the optical fiber between the optical circuit chip and the optical fiber extraction unit in the module can be reduced. When the length specification of the module is limited to further achieve miniaturization, it is necessary to shorten the length of the optical fiber, and there is a problem of module quality degradation due to fiber bending; however, this problem can be solved according to the present invention.

[0132] Some or all of the above embodiments will be described again in the following supplementary description, but are not limited thereto.

[0133] [Supplementary Note 1]

[0134] An optoelectronic module includes: a housing; a main wiring substrate housed within the housing; a sub-wiring substrate connected to the main wiring substrate inside the housing; an optical circuit chip mounted on the sub-wiring substrate inside the housing; an optical fiber optically connected to an optical input / output terminal on a side surface of the optical circuit chip; a fixing assembly for fixing the optical fiber to the optical input / output terminal; and an optical fiber extraction unit fixed to a side portion of the housing facing the optical input / output terminal to extract the optical fiber to the outside of the housing; and

[0135] In the protective film removal area, the protective film on the outermost surface of the main wiring substrate between the optical circuit chip and the optical fiber extraction unit is removed. The optical circuit chip is mounted on the sub-wiring substrate, and one side of the optical input / output end protrudes beyond the sub-wiring substrate.

[0136] [Supplementary Note 2]

[0137] An optoelectronic module includes: a housing; a main wiring substrate housed within the housing; a sub-wiring substrate connected to the main wiring substrate inside the housing; an optical circuit chip mounted on the sub-wiring substrate inside the housing; an optical fiber optically connected to an optical input / output terminal on a side surface of the optical circuit chip; a fixing assembly fixing the optical fiber to the optical input / output terminal; an optical fiber extraction unit fixed to a side portion of the housing facing the optical input / output terminal to extract the optical fiber to the outside of the housing; and a wiring removal region in which a wiring layer on the outermost surface of the main wiring substrate between the optical circuit chip and the optical fiber extraction unit is removed, wherein the optical circuit chip is mounted on the sub-wiring substrate, and one side of the optical input / output terminal protrudes beyond the sub-wiring substrate.

[0138] [Supplementary Note 3]

[0139] An optoelectronic module includes: a housing; a main wiring substrate housed within the housing; an optical circuit chip mounted on the main wiring substrate inside the housing; an optical fiber optically connected to an optical input / output terminal on a side surface of the optical circuit chip; a fixing assembly for fixing the optical fiber to the optical input / output terminal; an optical fiber extraction unit fixed to a side portion of the housing facing the optical input / output terminal to extract the optical fiber to the outside of the housing; and a recess formed in the main wiring substrate between the optical circuit chip and the optical fiber extraction unit, wherein the optical circuit chip is mounted on the main wiring substrate, and one side of the optical input / output terminal protrudes beyond the main wiring substrate.

[0140] [Supplementary Note 4]

[0141] According to Supplementary Note 1 or 2, the optoelectronic module further includes: a sub-substrate, which is connected to the main wiring substrate inside the housing between the optical fiber extraction unit and the sub-wiring substrate.

[0142] [Supplementary Note 5]

[0143] According to any one of Supplementary Notes 1 to 4, the optoelectronic module wherein the optical fiber extraction unit includes a socket.

[0144] [Supplementary Note 6]

[0145] According to any one of the supplementary descriptions 1 to 5, in the optoelectronic module, the optical fiber extraction unit is movable in the optical axis direction.

[0146] [Supplementary Note 7]

[0147] The optoelectronic module according to any one of Supplementary Notes 1 to 6 further includes: an enhancement component, which enhances the fixing component included in the protruding portion of the optical circuit chip.

[0148] [Supplementary Note 8]

[0149] The optoelectronic module according to any one of Supplementary Notes 1 to 7 includes: multiple sets of optical circuit chips and an optical fiber extraction unit.

[0150] The present invention is not limited to the above embodiments, and it is clear that those skilled in the art can make various modifications and combinations without departing from the technical spirit of the present invention.

[0151] List of reference numerals

[0152] 101 Main wiring board

[0153] 102 Optical Circuit Chip

[0154] 103 Electronic Circuit Chips

[0155] 104 Electronic Components

[0156] 105 fiber optic cable

[0157] 106 Casing

[0158] 107 Optical Circuit Terminal

[0159] 108 Electronic Circuit Terminals

[0160] 109 In-board wiring

[0161] 110 Input / Output Terminals

[0162] 111 Fixing Components

[0163] 112 Fiber Extraction Unit

[0164] 121 Sub-wiring substrate

[0165] 122 Base board - base board terminal

[0166] 131 Optical Input / Output Terminal

[0167] 151 Protective film removal area

[0168] 152 Wiring Removal Area

[0169] 153. Depression.

Claims

1. A photoelectric module, comprising: case; The main wiring board is housed within the housing. Sub-wiring substrate, connected to the main wiring substrate inside the housing; An optical circuit chip is mounted on the sub-wiring substrate inside the housing; An optical fiber is optically connected to the optical input / output terminal on the side surface of the optical circuit chip; A fixing component is used to fix the optical fiber to the optical input / output end; An optical fiber extraction unit is fixed to the side portion of the housing facing the optical input / output end to extract the optical fiber to the outside of the housing; as well as In the protective film removal area, the protective film on the outermost surface of the main wiring substrate between the optical circuit chip and the optical fiber extraction unit is removed. The optical circuit chip is mounted on the sub-wiring substrate, and one side of the optical input / output terminal protrudes beyond the sub-wiring substrate.

2. An optoelectronic module, comprising: case; The main wiring board is housed within the housing. Sub-wiring substrate, connected to the main wiring substrate inside the housing; An optical circuit chip is mounted on the sub-wiring substrate inside the housing; An optical fiber is optically connected to the optical input / output terminal on the side surface of the optical circuit chip; A fixing component is used to fix the optical fiber to the optical input / output end; An optical fiber extraction unit is fixed to the side portion of the housing facing the optical input / output end to extract the optical fiber to the outside of the housing; as well as In the wiring removal area, the wiring layer on the outermost surface of the main wiring substrate between the optical circuit chip and the optical fiber extraction unit is removed. The optical circuit chip is mounted on the sub-wiring substrate, and one side of the optical input / output terminal protrudes beyond the sub-wiring substrate.

3. A photoelectric module, comprising: case; The main wiring board is housed within the housing. An optical circuit chip is mounted on the main wiring substrate inside the housing; An optical fiber is optically connected to the optical input / output terminal on the side surface of the optical circuit chip; A fixing component is used to fix the optical fiber to the optical input / output end; An optical fiber extraction unit is fixed to the side portion of the housing facing the optical input / output end to extract the optical fiber to the outside of the housing; as well as A recess is formed in the main wiring substrate between the optical circuit chip and the optical fiber extraction unit. The optical circuit chip is mounted on the main wiring substrate, and one side of the optical input / output terminal protrudes beyond the main wiring substrate.

4. The photoelectric module according to claim 1 or 2, further comprising: The sub-substrate is connected to the main wiring substrate inside the housing between the optical fiber extraction unit and the sub-wiring substrate.

5. The optoelectronic module according to any one of claims 1 to 3, wherein, The fiber extraction unit includes a socket.

6. The optoelectronic module according to any one of claims 1 to 3, wherein, The optical fiber extraction unit is movable in the optical axis direction.

7. The photoelectric module according to any one of claims 1 to 3, further comprising: Enhancement components reinforce the fixing components included in the protruding portion of the optical circuit chip.

8. The photoelectric module according to claim 1, wherein, Multiple sets of optical circuit chips and optical fiber extraction units are set up.

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