Air uniformizing device and semiconductor gluing and developing equipment
By using a combination design of the first and second air distribution plates in the air box, along with a baffle plate, the problems of inconsistent airflow and resonance caused by the narrow flow channel in the air box were solved, achieving uniform airflow output and improved process yield.
CN121432811APending Publication Date: 2026-01-30KINGSEMI CO LTD
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Patent Information
- Application Number
- CN202511777386.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-28
- Publication Date
- 2026-01-30
AI Technical Summary
Technical Problem
Existing air boxes suffer from inconsistent airflow due to narrow local channels, which can easily cause resonance and abnormal noise, affecting process yield.
Method used
The design employs a combination of the first and second air distribution plates, along with a baffle plate, to form a resistance chain of "inlet flow restriction - mid-section release - tail compensation," ensuring uniform airflow output and avoiding narrow throats and resonance.
Benefits of technology
It achieves uniformity of ambient airflow, eliminates resonance and abnormal noise, and improves process yield.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN121432811A_ABST
Abstract
The invention provides an air uniformizing device and semiconductor gluing and developing equipment, and relates to the technical field of semiconductor manufacturing. Comprising an air box with an air inlet formed in one side face and a plurality of air outlets formed in the bottom face; the first air uniformizing plate is installed in the air box, one end of the first air uniformizing plate is connected with the bottom of the air inlet, a first inclination angle is formed between the first air uniformizing plate and the bottom face of the air box, a plurality of first air uniformizing through holes are formed in the first air uniformizing plate, and the distribution density of the first air uniformizing through holes is gradually increased from the end close to the air inlet to the end away from the air inlet; the second air uniformizing plate is installed in the air box, one end of the second air uniformizing plate is connected with the bottom of the inner side wall, away from the air inlet, of the air box, the other end of the second air uniformizing plate is connected with the inner side wall of the top of the air box, and a second dip angle is formed between the second air uniformizing plate and the bottom face of the air box. Uniform air outlet of the bottom face of the air box can be achieved, local high-speed whistling and plate resonance are avoided, and abnormal sound and particle pollution are prevented.
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