Anti-warping CPU socket based on stress buffer fluorinated silicone rubber layer

Abstract

The invention discloses an anti-warping CPU socket based on a stress buffer fluorinated silicone rubber layer, which comprises an insulating base and a plurality of terminals mounted on the insulating base, a fluorinated silicone rubber layer is further fixed on the bottom surface of the insulating base, the insulating base is in contact with a PCB (printed circuit board) through the fluorinated silicone rubber layer, and after the insulating base is fixedly connected with the PCB, the terminal is fixed on the insulating base through the fluorinated silicone rubber layer. The fluorinated silicone rubber layer is extruded to deform so as to form joint gapless contact with the PCB, so that the joint between the bottom surface of the CPU socket and the PCB is smoother, the phenomenon of pseudo soldering or poor contact between the terminals in the CPU socket and the PCB is avoided, the conduction quality is ensured, and the service life of the CPU socket is prolonged. And after welding, the phenomenon that the CPU socket is separated from a welding spot of the PCB due to warping of the CPU socket in the later period is basically avoided, or the limitation that the terminal in the CPU socket is separated from the PCB due to warping of the CPU socket in the later period after the terminal in the CPU socket is in elastic contact with the PCB is avoided, and the product quality is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of CPU socket, in particular to an anti-warping CPU socket based on stress buffering fluorosilicone rubber layer. BACKGROUND

[0002] As the operation and control core of computer system, CPU (Central Processing Unit) is the final execution unit of information processing and program running. Since its appearance, CPU has made great progress in logic structure, operation efficiency and functional extension.

[0003] In specific use, CPU chip is generally installed on the mainboard through CPU socket to form electrical conduction. A CPU socket connector is disclosed in Chinese patent application with application publication number CN112397921A, which includes an insulating body and a plurality of conductive terminals arranged on the insulating body. The conductive terminals include a plurality of first terminals with a first pitch and a plurality of second terminals with a second pitch, and the first pitch is different from the second pitch. By arranging the conductive terminals with at least two different pitches, the layout of the conductive terminals is more reasonable and balanced. In specific assembly, the insulating body is installed on the PCB board, and the conductive terminals are all welded and fixed with the PCB board to form electrical conduction.

[0004] However, the above-mentioned CPU socket connector has some deficiencies. The above-mentioned insulating body has basically no elasticity. When the lower end surface of the CPU socket connector contacts the PCB board, a large gap may occur due to insufficient flatness of the two, which may cause the CPU socket connector to warp in the later period, resulting in virtual welding or separation of the welding points between the CPU socket connector and the PCB board, affecting product quality.

[0005] Therefore, the present application provides the following technical solutions. SUMMARY

[0006] The present application aims to overcome the deficiencies of the prior art and provide an anti-warping CPU socket based on stress buffering fluorosilicone rubber layer.

[0007] To solve the above technical problems, the present application adopts the following technical solutions: an anti-warping CPU socket based on stress buffering fluorosilicone rubber layer includes an insulating base for assembly with the PCB board and a plurality of terminals installed on the insulating base and used for connecting the PCB board and the CPU chip. The bottom surface of the insulating base is also fixed with a layer of fluorosilicone rubber. The insulating base contacts the PCB board through the fluorosilicone rubber layer, and after the insulating base is fixedly connected with the PCB board, the fluorosilicone rubber layer is deformed by extrusion to form a gapless contact with the PCB board.

[0008] Further, in the above technical solution, the fluorosilicone rubber layer is fixedly connected with the fluorosilicone rubber layer by a hot-pressing process, an ultrasonic process, a secondary bonding process, a two-color injection molding process or a secondary injection molding process.

[0009] Further, in the above technical solution, the insulating base is integrally formed of LCP material, and the fluorosilicone rubber layer is fixedly formed on the lower end of the insulating base by a secondary injection molding process to form an integral whole that cannot be disassembled; wherein the bottom surface of the already formed insulating base is subjected to instant plasma treatment to increase the surface energy and the chemical bonding capacity of the insulating base and the fluorosilicone rubber.

[0010] Further, in the above technical solution, when the fluorosilicone rubber layer is formed by a secondary injection molding process using a mold, the mold containing the insulating base is subjected to local precise cooling, so that the temperature of the area where the mold contacts the insulating base is maintained at 120-140℃, while the temperature of the cavity area where the fluorosilicone rubber material contacts is raised to 150-185℃, so as to form the fluorosilicone rubber layer on the bottom surface of the insulating base, wherein the fluorosilicone rubber material further contains a silane coupling agent.

[0011] Further, in the above technical solution, the bottom surface of the insulating base is further formed with a plurality of blind holes, and the fluorosilicone rubber layer is partially fused into the blind holes and forms connecting columns connected with the blind holes, which combine with the blind holes to form an interlocking structure.

[0012] Further, in the above technical solution, the peripheral area of the lower end surface of the fluorosilicone rubber layer is a stress concentration area, and a plurality of convexities are formed on this area and protrude downward, the convexities contact and are deformed by being pressed by the PCB board, and some of the convexities are in orthographic projection relationship with the connecting columns.

[0013] Further, in the above technical solution, the terminal includes a main body portion fixedly inserted into the insulating base, first and second elastic arms integrally formed on the upper end of the main body portion and spaced apart and in a curved shape, a first connecting arm integrally connected with the upper ends of the first and second elastic arms, and a first arc-shaped contact portion formed by bending on the upper end of the first connecting arm and protruding upward, third and fourth elastic arms integrally formed on the lower end of the main body portion and spaced apart and in a curved shape, a second connecting arm integrally connected with the lower ends of the third and fourth elastic arms, and a second arc-shaped contact portion formed by bending on the upper end of the second connecting arm and protruding downward, the first and second arc-shaped contact portions respectively protrude out of the upper end surface of the insulating base and the lower end surface of the fluorosilicone rubber layer to respectively contact the contacts of the CPU chip and the contacts of the PCB board, so as to make the CPU chip and the PCB board conductive.

[0014] Further, in the technical scheme, the terminal includes a main body part fixedly inserted into the insulating base, first and second elastic arms integrally formed on the upper end of the main body part and spacedly distributed and in a curved shape, a first connecting arm integrally connected with the upper ends of the first and second elastic arms, a first arc-shaped contact part bent and formed on the upper end of the first connecting arm and upwardly protruding, a soldering leg integrally formed on the lower end of the main body part, and a tin ball arranged on the lower end of the soldering leg, the first arc-shaped contact part extends into a mounting groove on the upper end face of the insulating base and contacts a contact of a CPU chip mounted in the mounting groove, and the tin ball protrudes out of the lower end face of the fluorosilicone rubber layer to contact and be fixedly welded with a pad of a PCB board, so that the CPU chip and the PCB board are in conduction.

[0015] Further, in the technical scheme, the upper and lower end faces of the PCB board are fixedly mounted with upper and lower support frames through screws or rivets, the upper and lower support frames contact the upper and lower end faces of the PCB board through upper and lower gaskets, respectively, the insulating base is mounted in a mounting position of the upper support frame, the upper support frame is provided with a plurality of support springs and a plurality of guide rods, a heat sink is sleeved on the guide rods through guide holes thereof, the lower end face of the heat sink contacts the upper end face of the CPU chip, the peripheral part of the lower end face of the heat sink contacts the support springs, the heat sink is fastened with the upper support frame through adjusting screws, the support springs are compressed to elastically support the heat sink, the planeness of the lower end face of the heat sink contacting the CPU chip is adjusted, and the CPU chip is pressed downward by the heat sink to stably conduct with the terminal.

[0016] Further, in the technical scheme, the lower end of the insulating base is further formed with a plurality of positioning columns, the fluorosilicone rubber layer further wraps the outer surfaces of the positioning columns to form a wrapped column layer, and the outer part of the wrapped column layer is further formed with a plurality of limiting convex ribs, the PCB board is provided with positioning holes, and the positioning columns and the wrapped column layers wrapped outside thereof are embedded in the positioning holes.

[0017] Compared with the prior art, the application has the following beneficial effects: the insulating base is additionally provided with a fluorosilicone rubber layer on the bottom surface, the CPU socket is installed on the PCB by the fluorosilicone rubber layer, the fluorosilicone rubber layer is deformed after the insulating base is fixed on the PCB, and the CPU socket is in close contact with the PCB without gap, so that the CPU socket is in close contact with the PCB without terminal virtual welding or poor contact, the conduction quality is ensured, the CPU socket is not warped after welding, the CPU socket and the PCB are not separated, the CPU socket is not separated from the PCB after the terminal of the CPU socket is in elastic contact with the PCB, and the product quality is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is an assembly structure diagram of the application; Figure 2 is an assembly structure diagram of the application from another perspective; Figure 3 is an exploded view of the application; Figure 4 is an assembly diagram of the insulating base and the CPU chip in the application; Figure 5 is a perspective view of the application; Figure 6 is a perspective view of the application from another perspective; Figure 7 is a sectional view (partly) of the application; Figure 8 is a perspective view (partly) of the fluorosilicone rubber layer in the application; Figure 9 is a perspective view (partly) of the fluorosilicone rubber layer from another perspective in the application; Figure 10 is a perspective view of the terminal in the application; Figure 11 is a perspective view of the terminal from another perspective in the application; Figure 12 is a perspective view of another structure of the application; Figure 13 is a perspective view of the terminal in another structure of the application. DETAILED DESCRIPTION

[0019] The application will be further described below in combination with specific embodiments and the drawings.

[0020] See Figures 1-13As shown, it is a kind of anti-warping CPU socket based on stress buffering fluorine-containing silicone rubber layer, and it is worth mentioning that: in order to avoid too dense lines, only part of the terminals are drawn in the drawings such as FIGS. Figure 3 、 Figure 5 、 Figure 6 、 Figure 8 、 Figure 9 、 Figure 12 In the actual product, a plurality of terminals 2 distributed in an array are arranged on the insulating base 1, and the number and position of the terminals 2 correspond to the contacts of the CPU chip one by one.

[0021] The anti-warping CPU socket based on stress buffering fluorine-containing silicone rubber layer comprises an insulating base 1 for assembling with a PCB 4 and a plurality of terminals 2 mounted on the insulating base 1 and used for connecting the PCB 4 and a CPU chip 5, that is, in specific use, the insulating base 1 is mounted on the PCB 4, the terminals 2 in the insulating base 1 are connected with the PCB 4, then the CPU chip 5 is mounted on the insulating base 1, and the terminals 2 are connected with the CPU chip 5, so as to realize the connection between the CPU chip 5 and the PCB 4, which is the conventional CPU socket structure and use mode.

[0022] In order to improve the anti-warping ability of the CPU socket, the following improvements are made: the bottom surface of the insulating base 1 is further fixed with a fluorine-containing silicone rubber layer 3, the insulating base 1 is in contact with the PCB 4 through the fluorine-containing silicone rubber layer 3, and after the insulating base 1 is fixedly connected with the PCB 4, the fluorine-containing silicone rubber layer 3 is deformed by extrusion to form a gapless contact with the PCB 4.

[0023] That is, the fluorine-containing silicone rubber layer 3 is additionally arranged on the bottom surface of the insulating base 1, the fluorine-containing silicone rubber layer 3 has good elastic ability, when the CPU socket is assembled with the PCB 4, the fluorine-containing silicone rubber layer 3 is mounted in contact with the PCB 4, and after the insulating base 1 is fixed on the PCB 4, the fluorine-containing silicone rubber layer 3 is deformed by extrusion to form a gapless contact with the PCB 4, so that the contact between the bottom surface of the CPU socket and the PCB 4 is more flat, and the phenomenon of virtual welding or poor contact between the terminals in the CPU socket and the PCB does not occur, the conduction quality is ensured, and after welding, the phenomenon that the CPU socket is separated from the PCB due to the warping of the CPU socket in the later period does not occur, or the phenomenon that the terminals in the CPU socket are separated from the PCB due to the elastic contact between the terminals in the CPU socket and the PCB after the warping of the CPU socket in the later period is limited, and the product quality is ensured.

[0024] The fluorine-containing silicone rubber layer 3 is fixedly connected with the fluorine-containing silicone rubber layer 3 by a hot-pressing process or an ultrasonic process or a secondary bonding process or a double-color injection molding process or a secondary injection molding process.

[0025] In the embodiment, the fluorosilicone rubber layer 3 is fixed and formed at the lower end of the insulating base 1 by a secondary injection molding process. Specifically, the insulating base 1 is integrally formed by using LCP material, and the fluorosilicone rubber layer 3 is fixed and formed at the lower end of the insulating base 1 by a secondary injection molding process to form an inseparable whole, which has good bonding force, stable structure and is not easy to crack and separate.

[0026] In the embodiment, the bottom surface of the already formed insulating base 1 is subjected to instant plasma treatment (treatment time less than 1 second) to increase the surface energy and the chemical bonding ability of the insulating base 1 and the fluorosilicone rubber, so as to improve the structural stability of the two and form an inseparable whole which is not easy to crack and separate.

[0027] In the embodiment, the fluorosilicone rubber layer 3 is formed by using a mold for secondary injection molding. The mold containing the insulating base 1 is subjected to local precise cooling, so that the temperature of the area of the mold in contact with the insulating base 1 is maintained at 120-140℃, and the temperature of the cavity area in contact with the fluorosilicone rubber material is raised to 150-185℃, so as to form the fluorosilicone rubber layer 3 on the bottom surface of the insulating base 1. The temperature field design ensures that the fluorosilicone rubber material can be fully vulcanized, while avoiding the change of crystallinity or deformation of the insulating base 1 made of LCP material due to excessive heating, thereby ensuring the dimensional accuracy and reliability of the product.

[0028] The fluorosilicone rubber material further contains a silane coupling agent. The silane coupling agent is a key factor for determining the success or failure of the composite material. If the silane coupling agent is not added, the bonding ability of the LCP material and the fluorosilicone rubber is poor, and the two are easy to separate. After the silane coupling agent is added to the fluorosilicone rubber material, one end of the molecule can be combined with the fluorosilicone rubber, and the other end can form physical and chemical adsorption with the solder resist layer of the PCB board, moderately improve the interfacial adhesion, prevent micro-slippage in thermal cycling, but at the same time maintain the vertical direction buffer capacity.

[0029] In the embodiment, the fluorosilicone rubber material contains 70%-85% fluorosilicone rubber, 3%-6% silane coupling agent and 10%-20% heat-conducting and insulating filler. Specifically, the fluorosilicone rubber material contains 80% fluorosilicone rubber, 5% silane coupling agent and 15% heat-conducting and insulating filler, wherein the heat-conducting and insulating filler is boron nitride or aluminum oxide, and the above percentages are mass percentages. That is, the fluorosilicone rubber layer 3 contains heat-conducting and insulating filler, so that the fluorosilicone rubber layer 3 also has the ability of insulation and heat conduction, that is, the fluorosilicone rubber layer 3 not only buffers stress and improves the anti-warping ability of CPU operation, but also builds an auxiliary channel for heat diffusion from the CPU socket to the PCB board, reduces local thermal gradient, and fundamentally reduces thermal stress leading to warping. The fluorosilicone rubber layer 3 added as a stress buffer layer in the application is also endowed with a synergistic heat management function, which solves two different problems (mechanical stress and thermal stress) in a "two-in-one" design, produces a synergistic effect, and achieves unexpected technical effects.

[0030] In structure, in order to improve the bonding ability of the fluorosilicone rubber layer 3 and the insulating base 1, and prevent the two from cracking and separating, the following improvements are made: the bottom surface of the insulating base 1 is also shaped with a plurality of blind holes 11, and the fluorosilicone rubber layer 3 is partially fused into the blind holes 11 and forms connecting columns 31 connected with the blind holes 11, the connecting columns 31 and the blind holes 11 form an interlocking structure, which greatly enhances the interfacial bonding force of the fluorosilicone rubber layer 3 and the insulating base 1, prevents interlayer peeling, and improves product quality and service life.

[0031] In addition, in some embodiments, the lower end surface of the fluorosilicone rubber layer 3 is a flat surface, which is integrally in contact with the PCB board 4; in other embodiments, the lower end surface of the fluorosilicone rubber layer 3 is simply a flat surface, which is non-uniformly patterned at the lower end surface of the fluorosilicone rubber layer 3. Specifically, the peripheral part of the lower end surface of the fluorosilicone rubber layer 3 is a stress concentration area (especially the diagonal part), and the area is shaped with a plurality of convexities 32 which are spaced apart and protrude downward. The convexities 32 are in contact with and are deformed by the PCB board 4. Since the area of the convexities 32 is small and easy to deform, even if a gap is formed between the lower end surface of the fluorosilicone rubber layer 3 and the surface of the PCB board 4, the convexities 32 will first contact and be deformed by the PCB board 4 after the CPU socket is fixed to the PCB board 4. Therefore, after the lower end surface of the fluorosilicone rubber layer 3 is in contact with the surface of the PCB board 4, it is easier to form a gapless contact. In addition, the design of the convexities 32 can better remove the air between the lower end surface of the fluorosilicone rubber layer 3 and the surface of the PCB board 4, avoiding the air remaining and causing the convexity to be easily warped.

[0032] The center of the lower end surface of the fluorosilicone rubber layer 3 is also shaped with a convexity, which can form a support, and after the lower end surface of the fluorosilicone rubber layer 3 is in contact with the surface of the PCB board 4, it is easier to form a gapless contact.

[0033] The other non-stress concentration areas of the lower end surface of the fluorosilicone rubber layer 3 are not shaped with convexities, which can reduce the difficulty of mold design and reduce the cost of mold opening.

[0034] Some of the convexities 32 are in orthographic projection relationship with the connecting columns 31, which can improve the support ability of the convexities 32.

[0035] In some embodiments, the terminals 2 are electrically connected to the CPU chip 5 and the PCB board 4 by elastic pressing.

[0036] Specifically, in combination with Figures 7-9As shown, the terminal 2 comprises a main body 21 fixedly inserted into the insulating base 1, first and second elastic arms 22 and 23 integrally formed on the upper end of the main body 21 and spacedly distributed in a curved shape, a first connecting arm 24 integrally connected with the upper ends of the first and second elastic arms 22 and 23, a first arc-shaped contact portion 25 bent and formed on the upper end of the first connecting arm 24 and upwardly protruding, third and fourth elastic arms 26 and 27 integrally formed on the lower end of the main body 21 and spacedly distributed in a curved shape, a second connecting arm 28 integrally connected with the lower ends of the third and fourth elastic arms 26 and 27, and a second arc-shaped contact portion 29 bent and formed on the upper end of the second connecting arm 28 and downwardly protruding. The first and second arc-shaped contact portions 25 and 29 respectively protrude out of the upper end surface of the insulating base 1 and the lower end surface of the fluorosilicone rubber layer 3 to respectively contact the contacts of the CPU chip 5 and the contacts of the PCB 4, so that the CPU chip 5 and the PCB 4 are in conduction. The lower end surface of the fluorosilicone rubber layer 3 is provided with a window for the second arc-shaped contact portion 29 to protrude out.

[0037] The first arc-shaped contact portion 25 is elastically supported by two elastic arms (i.e. the first and second elastic arms 22 and 23), has a large elastic capacity, and is symmetrically distributed between the central line of the first connecting arm 24 and the main body 21, so as to provide stable and normal elastic support for the first arc-shaped contact portion 25, so that the first arc-shaped contact portion 25 is in stable and normal elastic conduction with the contacts of the CPU chip 5 in the later stage, and no folding or other undesirable phenomena occur. Similarly, the second arc-shaped contact portion 29 is elastically supported by two elastic arms (i.e. the third and fourth elastic arms 26 and 27), has a large elastic capacity, and is symmetrically distributed between the central line of the second connecting arm 28 and the main body 21, so as to provide stable and normal elastic support for the second arc-shaped contact portion 29, so that the second arc-shaped contact portion 29 is in stable and normal elastic conduction with the contacts of the PCB in the later stage, and no folding or other undesirable phenomena occur.

[0038] The upper and lower end faces of the PCB board 4 are fixedly installed with an upper support frame 61 and a lower support frame 62 by screws or rivets, wherein the upper and lower support frames 61 and 62 are in contact with the upper and lower end faces of the PCB board 4 through upper and lower gaskets 611 and 621 respectively; the insulating base 1 is installed in the installation position 612 of the upper support frame 61; the upper support frame 61 is provided with a plurality of support springs 63 and a plurality of guide rods 64, the heat sink 7 is sleeved on the guide rods 64 through the guide holes 71 thereof, the lower end face of the heat sink 7 is in contact with the upper end face of the CPU chip 5 in the middle part, the lower end face of the heat sink 7 is in contact with the support springs 63 in the peripheral part, the heat sink 7 is fastened with the upper support frame 61 through the adjusting screws 72, and the support springs 63 are compressed to form elastic support for the heat sink 7, so as to adjust the flatness of the lower end face of the heat sink 7 in contact with the CPU chip 5, and the CPU chip 5 is pressed downward by the heat sink 7 to form stable conduction with the terminal 2.

[0039] In some embodiments, the terminal 2 and the CPU chip 5 are electrically connected in an elastic pressing manner, and the terminal 2 and the PCB board 4 are electrically connected in a welding manner.

[0040] Specifically, in combination with Figures 12-13 As shown in the drawings, the terminal 2 comprises a main body 21 fixedly inserted into the insulating base 1, first and second elastic arms 22 and 23 integrally formed on the upper end of the main body 21 and spacedly distributed in a curved shape, a first connecting arm 24 integrally connected with the upper ends of the first and second elastic arms 22 and 23, a first arc-shaped contact part 25 bent and formed on the upper end of the first connecting arm 24 and upwardly protruding, a soldering leg 20 integrally formed on the lower end of the main body 21, and a tin ball 201 provided on the lower end of the soldering leg 20, the first arc-shaped contact part 25 extends into the installation groove 12 in the upper end face of the insulating base 1 and is in contact with the contact of the CPU chip 5 installed in the installation groove 12, and the tin ball 201 protrudes out of the lower end face of the fluorosilicone rubber layer 3 to be in contact with and welded with the pad of the PCB board 4, so as to make the CPU chip 5 and the PCB board 4 conductive. The lower end face of the fluorosilicone rubber layer 3 is provided with a window for the tin ball 201 to protrude out. The first arc-shaped contact part 25 is elastically supported by two elastic arms (i.e. the first and second elastic arms 22 and 23), has a large elastic capacity, and is symmetrically distributed between the central connecting line of the first connecting arm 24 and the main body 21, so as to provide stable and positive elastic support for the first arc-shaped contact part 25, so that the first arc-shaped contact part 25 and the contact of the CPU chip 5 form more stable and elastic conduction in the later stage, and no folding or other adverse phenomena occur.

[0041] Wherein, the solder leg 20 is further stamped to form a spherical groove (not shown in the figure), the lower end of the solder ball 201 is in contact with the edge of the opening of the spherical groove and fixedly connected, which is a circular ring contact, that is, the contact area is increased, so that the solder ball 201 is more stably installed on the solder leg 20; at this time, a gap is formed between the solder ball 201 and the spherical groove, and after the CPU socket contacts and is welded with the pad on the PCB, the solder ball 201 is partially melted into the spherical groove, so as to increase the welding area of the solder ball 201 and the solder leg 20, and make the solder leg 20 and the pad on the PCB form a more stable connection. In order to connect more stably, a groove can be arranged on the other plate surface of the solder leg 20 opposite to the spherical groove. Since the size of the solder ball 201 is larger than that of the solder leg 20, the solder ball 201 will cover the other plate surface of the solder leg 20 opposite to the spherical groove after melting, and enter the groove. When the solder ball 201 cools and solidifies, part of the solder will solidify in the groove to form a lock structure, so as to ensure that the solder leg 20 and the pad on the PCB are more stably connected.

[0042] The lower end of the insulating base 1 is further formed with a plurality of positioning columns 14, and the fluorosilicone rubber layer 3 further wraps the outer surface of the positioning columns to form a wrapped column layer (not shown in the figure), and the outer part of the wrapped column layer is further formed with a plurality of limiting convex ribs; the PCB 4 is provided with a positioning hole 41, and the positioning column and the wrapped column layer wrapped outside the positioning column are embedded in the positioning hole 41, so that the insulating base 1 is stably installed on the PCB 4, and convenient for later welding and fixing. Wherein, when the positioning column and the wrapped column layer wrapped outside the positioning column are embedded in the positioning hole 41, the wrapped column layer has good elastic ability, so that it can play a good tensioning effect, and the assembly structure is more stable.

[0043] In summary, the present application adds a layer of fluorosilicone rubber layer 3 to the bottom surface of the insulating base 1, which has good elastic ability. When the CPU socket is assembled with the PCB 4, the fluorosilicone rubber layer 3 is installed by adhering to the PCB 4, and after the insulating base 1 is fixed on the PCB 4, the fluorosilicone rubber layer 3 will be deformed by being pressed, so as to form a gapless contact with the PCB 4, so that the bottom surface of the CPU socket and the PCB 4 are more flatly adhered, and the phenomenon of virtual welding or poor contact between the terminals in the CPU socket and the PCB will not occur, ensuring the conduction quality, and after welding, the CPU socket will not be warped in the later period, and the phenomenon of the CPU socket and the PCB being separated will not occur, or the terminals in the CPU socket and the PCB will not be separated due to the warping of the CPU socket in the later period, ensuring the product quality.

[0044] Of course, the above merely illustrates the specific embodiments of the present application, and is not intended to limit the scope of the present application. Any equivalent changes or modifications made according to the structure, features and principles described in the present application should be included in the scope of the present application.

Claims

1. A stress-relief fluorosilicone rubber layer-based anti-warping CPU socket, comprising an insulating base (1) for mounting to a PCB board (4) and a plurality of terminals (2) mounted on the insulating base (1) for conducting the PCB board (4) and the CPU chip (5), characterized in that: The bottom surface of the insulating base (1) is also fixed with a layer of fluorosilicone rubber (3). The insulating base (1) contacts the PCB board (4) through the fluorosilicone rubber layer (3). After the insulating base (1) and the PCB board (4) are fixedly connected, the fluorosilicone rubber layer (3) is squeezed and deformed to form a close and gapless contact with the PCB board (4).

2. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to claim 1, characterized in that: The fluorosilicone rubber layer (3) is fixedly connected to the fluorosilicone rubber layer (3) by hot pressing, ultrasonic process, secondary bonding process, two-color injection molding process, or secondary injection molding process.

3. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to claim 2, characterized in that: The insulating base (1) is integrally formed using LCP material. The fluorosilicone rubber layer (3) is fixed to the lower end of the insulating base (1) through a secondary injection molding process to form an inseparable whole. The bottom surface of the already formed insulating base (1) is subjected to instantaneous plasma treatment to increase surface energy and improve the chemical bonding ability between the insulating base (1) and the fluorosilicone rubber.

4. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to claim 3, characterized in that: When using a mold for secondary injection molding of the fluorosilicone rubber layer (3), the mold containing the insulating base (1) is locally and precisely cooled so that the temperature of the area where the mold contacts the insulating base (1) is kept at 120-140°C, while the temperature of the cavity area in contact with the fluorosilicone rubber material is raised to 150-185°C so as to form the fluorosilicone rubber layer (3) on the bottom surface of the insulating base (1). The fluorosilicone rubber material also contains a silane coupling agent.

5. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to claim 1, characterized in that: The bottom surface of the insulating base (1) is also formed with a plurality of blind holes (11). The fluorosilicone rubber layer (3) is partially integrated into the blind holes (11) and forms a connecting post (31) connected to the blind holes (11). The connecting post (31) and the blind holes (11) are combined to form an interlocking structure.

6. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to claim 5, characterized in that: The lower end face of the fluorosilicone rubber layer (3) is a stress concentration area, and a plurality of convex bumps (32) are formed in this area. The convex bumps (32) are in contact with the PCB board (4) and are squeezed and deformed. Some of the convex bumps (32) are orthogonally projected to the connecting post (31).

7. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-6, characterized in that: The terminal (2) includes a main body (21) inserted and fixed in an insulating base (1), a first elastic arm (22) and a second elastic arm (23) integrally formed on the upper end of the main body (21) and spaced apart and curved, a first connecting arm (24) integrally connected to the upper ends of the first elastic arm (22) and the second elastic arm (23), a first arc-shaped contact portion (25) bent and formed on the upper end of the first connecting arm (24) and raised upward, and a third elastic arm (26) integrally formed on the lower end of the main body (21) and spaced apart and curved. The fourth elastic arm (27), the second connecting arm (28) integrally connected to the lower end of the third elastic arm (26) and the fourth elastic arm (27), and the second arc-shaped contact part (29) bent and formed on the upper end of the second connecting arm (28) and raised downward, the first arc-shaped contact part (25) and the second arc-shaped contact part (29) extend out of the upper end surface of the insulating base (1) and the lower end surface of the fluorosilicone rubber layer (3) respectively, so as to contact the contacts of the CPU chip (5) and the contacts of the PCB board (4) respectively, so that the CPU chip (5) and the PCB board (4) are connected.

8. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-6, characterized in that: The terminal (2) includes a main body (21) inserted and fixed in the insulating base (1), a first elastic arm (22) and a second elastic arm (23) integrally formed on the upper end of the main body (21) and spaced apart and curved, a first connecting arm (24) integrally connected to the upper end of the first elastic arm (22) and the second elastic arm (23), a first arc-shaped contact part (25) bent and formed on the upper end of the first connecting arm (24) and raised upward, a solder foot (20) integrally formed on the lower end of the main body (21), and a solder ball (201) disposed on the lower end of the solder foot (20). The first arc-shaped contact part (25) extends into the mounting groove (12) on the upper end surface of the insulating base (1) and contacts the contacts of the CPU chip (5) installed in the mounting groove (12). The solder ball (201) protrudes out of the lower end surface of the fluorosilicone rubber layer (3) to contact and weld to the pads of the PCB board (4), so that the CPU chip (5) and the PCB board (4) are connected.

9. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-6, characterized in that: The upper and lower support frames (61 and 62) are fixedly installed on the upper and lower end faces of the PCB board (4) by screws or rivets. The upper support frame (61) and the lower support frame (62) are in contact with the upper and lower end faces of the PCB board (4) by upper gaskets (611) and lower gaskets (621), respectively. The insulating base (1) is installed in the mounting position (612) of the upper support frame (61). The upper support frame (61) is provided with a number of support springs (63) and a number of guide rods (64). The heat sink (7) is sleeved on the guide rod through its guide hole (71). The heat sink (7) is placed on the rod (64), and the middle part of the lower end face of the heat sink (7) contacts the upper end face of the CPU chip (5). The outer periphery of the lower end face of the heat sink (7) contacts the support spring (63). The heat sink (7) is fastened to the upper support frame (61) by adjusting screws (72). The support spring (63) is compressed to form elastic support for the heat sink (7) to adjust the flatness of the middle part of the lower end face of the heat sink (7) in contact with the CPU chip (5). The CPU chip (5) is pressed down by the heat sink (7) to form a stable connection with the terminal (2).

10. The anti-warping CPU socket based on a stress-buffered fluorosilicone rubber layer according to any one of claims 1-6, characterized in that: The lower end of the insulating base (1) is also formed with a number of positioning posts (14), and the fluorosilicone rubber layer (3) also wraps the outer surface of the positioning posts to form a wrapping post layer. The wrapping post layer is also formed with a number of limiting ribs. The PCB board (4) is provided with a positioning hole (41), and the positioning post and the wrapping post layer wrapped around it are embedded in the positioning hole (41).

Images