Static conductive coating for nonmetal and preparation method of static conductive coating

Abstract

The invention belongs to the technical field of functional coatings, and particularly relates to a static conductive coating for nonmetal and a preparation method of the static conductive coating. The coating is composed of modified Si-C fluorosilicone resin, conductive nickel powder, ethandiamide and multiple auxiliaries, the modified Si-C fluorosilicone resin is prepared through a double-grafting reaction of mercaptoethanol and vinyl trifluoroacrylate,-S-and-CF groups are introduced into molecules at the same time, and the polarity of the resin and the dispersity of the conductive nickel powder are remarkably improved. The oxadiamide as a polar small molecule synergist can promote the formation of a conductive network and enhance the interface bonding force. The surface resistivity of the obtained coating is about 2.8 * 10 omega / square, the static decay time is 0.38 s, the adhesive force reaches 5B, and the conductivity retention rate after wear resistance exceeds 97%. The coating has excellent static conductivity, adhesive force and environmental stability, is suitable for the surfaces of non-metal base materials such as ABS, PVC and polycarbonate, and can be widely applied to the fields of electronic equipment shells, rail transit interior trim parts, anti-explosion and anti-static terraces and the like.

Description

Technical Field

[0001] This invention belongs to the field of functional coatings technology, specifically relating to a non-metallic conductive coating and its preparation method. Background Technology

[0002] Currently, conductive coatings are widely used in electronic device housings, plastic flooring, rail transit interiors, and rubber protective components. Their main function is to form stable conductive pathways on material surfaces to prevent static electricity buildup. However, most existing conductive coatings are designed based on epoxy resin, acrylic resin, or polyurethane systems. While these systems can achieve good adhesion and conductivity on metal substrates, they are prone to problems such as interfacial delamination, conductive particle aggregation, coating cracking, and peeling on non-metallic surfaces such as plastics, rubber, and composite boards. The fundamental reason is that the non-metallic matrix has low surface polarity and large surface energy differences, making it difficult for traditional resins to form a stable interfacial bond with the substrate. At the same time, the conductive filler is unevenly dispersed in the coating, and the conductive network is easily interrupted, resulting in unstable conductive performance.

[0003] Although fluorosilicone resins possess excellent weather resistance, chemical corrosion resistance, and flexibility, their low surface tension and poor compatibility with conductive powders and non-polar substrates often lead to insufficient adhesion and decreased dispersion performance. To address this issue, some technologies have attempted to graft-modify fluorosilicone resins with hydroxyl or amine-containing modifiers. However, these modifications are inefficient and structurally limited, making it difficult to simultaneously balance flexible segments and polar groups, thus failing to achieve ideal electrostatic conductivity on non-metallic surfaces. Therefore, developing a non-metallic coating system that achieves high adhesion, high dispersibility, and long-term electrostatic stability through molecular structure innovation has become an important research direction in the field of conductive coatings. Summary of the Invention

[0004] To overcome the technical difficulties of poor adhesion to non-metallic substrates, uneven conductivity dispersion, and unstable electrostatic conductivity in the aforementioned background art, the present invention aims to provide an electrostatic conductive coating for non-metallic surfaces and its preparation method. The present invention uses Si-C fluorosilicone resin double-grafted with mercaptoethanol-ethylene trifluoroacrylate as the main film-forming substance, and introduces glyoxalamide as an organic small molecule synergistic regulator, enabling conductive nickel powder to form a continuous and stable conductive network in the system. Simultaneously, an additive system composed of polyamide wax, organophosphonates, polyether-modified siloxanes, acrylate copolymers, and butanone-isopropanol composite solvent is used, thereby significantly improving the wettability, bonding strength, and dispersion stability of the coating on non-metallic surfaces. The coating of the present invention exhibits excellent adhesion and flexibility on non-metallic surfaces, with uniform dispersion of conductive nickel powder forming a stable conductive pathway; at the same time, the coating has good wear resistance, weather resistance, and solvent resistance, and can maintain its electrostatic conductivity for a long time.

[0005] The objective of this invention can be achieved through the following technical solutions: A conductive coating for non-metallic surfaces comprises the following raw materials in parts by weight: 60-70 parts of modified Si-C fluorosilicone resin; 5-10 parts of conductive nickel powder; 15-20 parts of ethylenediamide; 2-5 parts of dispersant; 0.5-1 part of leveling agent; 0.2-0.5 parts of defoamer; 0.3-0.8 parts of antioxidant; and 20-30 parts of diluent. The modified Si-C fluorosilicone resin is a fluorosilicone copolymer double-grafted with mercaptoethanol-vinyl trifluoroacrylate, possessing both flexible segments and high surface energy -CF3 groups, thus exhibiting excellent adhesion and conductive nickel powder dispersibility on non-metallic surfaces.

[0006] Optionally, the modified Si-C fluorosilicone resin comprises the following raw materials in parts by weight: 60-70 parts Si-C fluorosilicone resin; 3-5 parts 2-mercaptoethanol; 1-3 parts ethylene trifluoroacrylate; 0.1-0.3 parts p-toluenesulfonic acid; and 80-100 parts anhydrous toluene.

[0007] Optionally, the preparation method of modified Si-C fluorosilicone resin includes the following steps: (1) Add Si-C fluorosilicone resin to the reaction vessel, add anhydrous toluene as solvent and stir to dissolve, then add 2-mercaptoethanol dropwise to make it react with the silicon carbon backbone in the resin molecule to open the mercapto branching reaction; (2) In a homogeneous solution, add ethylene trifluoroacrylate and p-toluenesulfonic acid catalyst to the reaction system and continue stirring to allow it to undergo a double grafting reaction with the grafted thiol segments to generate a fluorosilicone structure containing –S– and –CF3 groups. (3) After the reaction is completed, the system is cooled and the residual solvent and unreacted monomers are removed by vacuum distillation to obtain a transparent and viscous modified Si-C fluorosilicone resin, which can be used as the main film-forming substance for conductive coatings.

[0008] Optionally, the reaction conditions in step (1) are to stir the reaction at 70-80°C for 2-3 hours to promote the addition grafting of thiol groups to the silicon-carbon backbone.

[0009] Optionally, the reaction conditions in step (2) are to continue the reaction at the same temperature for 2-3 hours after adding ethylene trifluoroacrylate, so that the fluorinated monomer and the sulfide segment can complete the double grafting reaction.

[0010] Optionally, the reaction conditions in step (3) are to remove the solvent under reduced pressure at 50-60°C, and then naturally cool to room temperature to obtain the modified resin.

[0011] Optionally, the dispersant is a mixture of polyamide wax and organophosphonate in a mass ratio of 2:1; the leveling agent is a mixture of polyether-modified polydimethylsiloxane and acrylate copolymer in a mass ratio of 1:1; the defoamer is a mixture of polyether-based organosilicon complex and fatty alcohol polyoxyethylene ether in a mass ratio of 3:1; the antioxidant is a mixture of hindered phenolic antioxidant and triisodecyl phosphite in a mass ratio of 1:1; and the diluent is a mixture of butanone and isopropanol in a mass ratio of 7:3.

[0012] Optionally, a method for preparing an antistatic coating on a non-metallic surface includes the following steps: S1, add ethylenediamide to a diluted solvent obtained by mixing butanone and isopropanol and stir to dissolve, forming a transparent and homogeneous solution; S2, add conductive nickel powder to a transparent and uniform solution, and use ultrasonic dispersion to disperse the metal powder evenly. Then add dispersant, leveling agent, defoamer and antioxidant in sequence, and continue stirring to make the system stable and uniform. S3, with the addition of modified Si-C fluorosilicone resin, is mechanically stirred until uniform, allowed to stand to degas, and then filtered to obtain a non-metallic conductive coating.

[0013] Optionally, the reaction conditions for step S1 are stirring at room temperature for 30-40 minutes to fully dissolve the ethylenediamide in the diluted solvent and form a transparent and uniform solution; the reaction conditions for step S2 are ultrasonic dispersion at 25-35°C for 10-20 minutes and stirring at 1000-1500 rpm to ensure that the conductive nickel powder is evenly dispersed and fully mixed with the additives.

[0014] Optionally, the reaction conditions for step S3 are: mechanical stirring at room temperature for 30-60 minutes, followed by standing to degas for 2-3 hours, and then filtration through a 100-mesh filter cloth to obtain a uniform and stable non-metallic conductive coating.

[0015] The beneficial effects of this invention are: This invention introduces a double grafting modification reaction of mercaptoethanol-vinyl trifluoroacrylate, enabling Si-C fluorosilicone resin to simultaneously possess flexible segments and polar –CF3 functional groups. This significantly enhances its chemical bonding ability on non-polar substrate surfaces and its interfacial compatibility with conductive fillers. By using glyoxalamide as a structure-regulating molecule, the synergistic effect of hydrogen bonding and polar interactions is promoted at the molecular level, enabling conductive nickel powder to form a denser conductive network. This solves the problems of easy aggregation of conductive components and weak interfacial adhesion in traditional fluorosilicone systems, thereby endowing the coating with excellent electrostatic stability and structural integrity. Attached Figure Description

[0016] The invention will now be further described with reference to the accompanying drawings.

[0017] Figure 1 The infrared spectra of Si-C fluorosilicone resin and modified Si-C fluorosilicone resin are compared. Figure 2 A comparison chart of electrostatic decay time results for samples with different formulation ratios; Figure 3 A comparison chart showing the change rate of resistivity after wear resistance of samples with different ratios; Figure 4 A comparison chart showing the conductivity retention of samples with different formulations after wet heat aging. Detailed Implementation

[0018] The present invention will be further described below with reference to specific embodiments. However, the present invention is not limited to the following embodiments. Equivalent adjustments made without departing from the spirit and essence of the present invention should also be considered to fall within the protection scope of the present invention.

[0019] Example 1 The purpose of this embodiment is to verify the interfacial bonding and dispersion effect between the modified Si-C fluorosilicone resin and the conductive components in the coating obtained under high mixing ratio conditions.

[0020] S1. 70 parts of Si-C fluorosilicone resin were added to a reaction vessel, and 100 parts of anhydrous toluene were added as a solvent. The mixture was heated and stirred until completely dissolved. After the solution became clear, 5 parts of 2-mercaptoethanol were slowly added dropwise to allow it to undergo a mercapto-opening grafting reaction with the Si-C main chain in the resin molecules. After the solution was kept homogeneous, 3 parts of ethylene trifluoroacrylate and 0.3 parts of p-toluenesulfonic acid were added dropwise to the system as a catalyst to allow the mercapto segments to undergo a double grafting reaction with the fluorinated monomers. After the reaction was completed, the mixture was naturally cooled to room temperature. The residual solvent and unreacted monomers were removed by vacuum distillation to obtain a transparent and viscous modified Si-C fluorosilicone resin. S2, add 20 parts of ethylenediamide to 30 parts of a diluted solvent obtained by mixing butanone and isopropanol and stir to dissolve, forming a transparent and uniform solution; add 10 parts of conductive nickel powder to the solution and disperse it by ultrasonication, then add 5 parts of dispersant, 1 part of leveling agent, 0.5 parts of defoamer and 0.8 parts of antioxidant in sequence, and continue stirring to form a uniform dispersion system; S3, add 70 parts of modified Si-C fluorosilicone resin to the system, mechanically stir and mix until uniform, let stand to degas and filter to obtain a non-metallic conductive coating.

[0021] Example 2 The purpose of this embodiment is to verify the grafting efficiency and system stability of the modified resin under intermediate ratio conditions.

[0022] S1, 65 parts of Si-C fluorosilicone resin were added to a reactor, and 90 parts of anhydrous toluene were added to dissolve and stir evenly. After the resin was completely dissolved, 4 parts of 2-mercaptoethanol were added dropwise to promote the mercapto addition reaction with the silicon-carbon bonds in the resin molecules. Then, 2 parts of ethylene trifluoroacrylate and 0.2 parts of p-toluenesulfonic acid catalyst were added dropwise, and the reaction was maintained by stirring. After the reaction was completed, the mixture was cooled to room temperature, and the solvent was removed by vacuum distillation to obtain a transparent, high-viscosity modified Si-C fluorosilicone resin. S2, dissolve 17 parts of ethylenediamide in 25 parts of a mixed solvent of butanone and isopropanol, add 8 parts of conductive nickel powder and ultrasonically disperse, then add 3 parts of dispersant, 0.7 parts of leveling agent, 0.3 parts of defoamer and 0.5 parts of antioxidant in sequence, and stir to form a stable system; S3. Add 65 parts of modified Si-C fluorosilicone resin to the system, mix thoroughly by mechanical stirring, let stand to degas and filter to obtain a uniform and stable conductive coating.

[0023] Example 3 The purpose of this embodiment is to verify that the system can still maintain good electrical conductivity uniformity and resin compatibility under low ratio conditions.

[0024] S1. 60 parts of Si-C fluorosilicone resin were added to a reactor equipped with a stirrer, and 80 parts of anhydrous toluene were added as a solvent. The mixture was stirred until completely dissolved. 3 parts of 2-mercaptoethanol were slowly added dropwise to allow the mercapto groups to undergo a link-opening grafting reaction with the Si-C main chain. After the solution became clear, 1 part of ethylene trifluoroacrylate and 0.1 parts of p-toluenesulfonic acid catalyst were added to the reaction system, and the reaction was continued with stirring to complete the sulfide-fluorination double grafting process. After the reaction was completed, the mixture was cooled to room temperature, and the solvent was removed by vacuum distillation to obtain a transparent modified Si-C fluorosilicone resin. S2, add 15 parts of ethylenediamide to 20 parts of mixed solvent and stir to dissolve, add 5 parts of conductive nickel powder and disperse ultrasonically, then add 2 parts of dispersant, 0.5 parts of leveling agent, 0.2 parts of defoamer and 0.3 parts of antioxidant in sequence, and stir evenly to form a stable system; S3, add 60 parts of modified Si-C fluorosilicone resin to the system, stir mechanically until uniform, let stand to degas, filter through filter cloth to obtain non-metallic conductive coating.

[0025] Comparative Example 1 The purpose of this comparative example is to verify the effect of using only unmodified Si-C fluorosilicone resin on the dispersion stability and interfacial bonding ability of the system without the use of mercaptoethanol-vinyl trifluoroacrylate double grafting modification.

[0026] S1, 65 parts of Si-C fluorosilicone resin were added to the reactor, and 90 parts of anhydrous toluene were added and stirred to dissolve. The grafting reaction between 2-mercaptoethanol and ethylene trifluoroacrylate was not carried out. After dissolution, the solvent was removed by vacuum to obtain unmodified Si-C fluorosilicone resin for later use. S2, dissolve 17 parts of ethylenediamide in 25 parts of a mixed solvent of butanone and isopropanol, add 8 parts of conductive nickel powder and ultrasonically disperse, then add 3 parts of dispersant, 0.7 parts of leveling agent, 0.3 parts of defoamer and 0.5 parts of antioxidant in sequence, and stir to form a stable system; S3, 65 parts of unmodified Si-C fluorosilicone resin were added to the system, mechanically stirred to mix thoroughly, allowed to stand to degas and filtered to obtain the conductive coating for comparison.

[0027] Comparative Example 2 The purpose of this comparative example is to verify the effect of removing small organic molecules like ethylene glycol on the dispersion of conductive nickel powder and the formation of a conductive network.

[0028] S1. Add 65 parts of Si-C fluorosilicone resin to a reaction vessel, add 90 parts of anhydrous toluene to dissolve and stir evenly; after the resin is completely dissolved, add 4 parts of 2-mercaptoethanol dropwise, then add 2 parts of ethylene trifluoroacrylate dropwise and add 0.2 parts of p-toluenesulfonic acid catalyst. After the reaction is completed, cool and remove the solvent under reduced pressure to obtain transparent high-viscosity modified Si-C fluorosilicone resin. S2, using 25 parts of a mixed solvent without glyoxal as a dispersion medium, adding 8 parts of conductive nickel powder and ultrasonically dispersing, then adding 3 parts of dispersant, 0.7 parts of leveling agent, 0.3 parts of defoamer and 0.5 parts of antioxidant in sequence, and stirring to form a stable system; S3, 65 parts of modified Si-C fluorosilicone resin were added to the system, mechanically stirred to mix thoroughly, allowed to stand to degas and filtered to obtain the conductive coating for comparison.

[0029] Performance testing 1. Surface resistivity and electrostatic decay test The example and comparative samples were respectively sprayed onto ABS substrates with dimensions of 100mm × 100mm × 2mm, and the dry film thickness was controlled at 25±5μm. After conditioning the samples in an environment of 23±2℃ and 50±5% relative humidity for 24 hours, the surface resistivity was measured using a surface resistivity meter. Five different areas were selected on the sample surface for measurement, and the surface resistivity was recorded and averaged. Subsequently, the samples were charged to 5kV using an electrostatic decay meter, and the time required for electrostatic decay to reach 50V was measured to evaluate the conductivity and electrostatic discharge capability.

[0030] 2. Adhesion test The adhesion of the samples was tested using the standard cross-cut adhesion test. After drying, a 6×6 grid was drawn on the coating surface using a cross-cut adhesion tester, reaching the substrate but without damaging it. 3M 610 tape was then applied, rolled back and forth once with a rubber roller, allowed to stand for 1 minute, and then quickly peeled off at a 180° angle. The degree of coating peeling off the grid areas was observed and rated according to the 0B to 5B standard. Adhesion tests were performed once in the initial state and once after aging to compare the retention of bond strength between the modified system and the control sample.

[0031] 3. Wear resistance and electrical conductivity stability test Each sample was sprayed onto an ABS disc, with a dry film thickness of 30±5μm. After conditioning, the film was placed on a Taber abrasion tester for wear testing. A CS-10F grinding wheel was used, with a load of 1kg. The test was stopped after 500 and 1000 grinding cycles, respectively. After wiping off the dust from the sample surface, the surface resistivity of the worn and unworn areas was measured, and the mass loss was recorded. By comparing the resistance changes and film loss before and after grinding, the integrity and wear resistance stability of the conductive network were evaluated.

[0032] 4. Environmental stability test The example and comparative samples were subjected to aging tests under different environments. The damp heat aging conditions were 85°C and 85% relative humidity for 168 hours; the thermal shock conditions were alternating between −20°C and 70°C, 60 minutes per cycle, for a total of 30 cycles; the salt spray test conditions were 5% NaCl solution, 35±2°C, continuous spraying for 96 hours. After the tests, samples were taken, cleaned, and dried, and surface resistivity, adhesion, and appearance changes were tested. The retention rate of conductivity, whether the coating blistered, peeled off, or lost gloss were recorded to verify the long-term stability of the modified system under complex environments.

[0033] Table 1. Performance test results of conductive coating

[0034] The data in the table show that Examples 1 to 3 are significantly superior to Comparative Examples 1 and 2 in terms of conductivity, adhesion, and environmental stability. This indicates that the present invention achieves a significant improvement in the overall performance of the system through the synergistic design of modified Si-C fluorosilicone resin and glyoxalamide. Among them, Example 2 exhibits the best overall performance, verifying the optimal balance between conductivity and structural stability achieved by this formulation system.

[0035] Regarding electrical conductivity, the surface resistivity of Example 2 is 2.8 × 10⁻⁶. 6 Ω / □, significantly lower than 3.2 × 10 in Example 1. 6 Ω / □ and 3.5 × 10 in Example 3 6 Ω / □ Figure 2Its electrostatic decay time was only 0.38 s, demonstrating rapid electrostatic release capability. This indicates that the double-grafting modification effectively improved the uniform dispersion of conductive nickel powder in the resin system, forming a continuous and stable conductive path within the system, thereby significantly reducing surface resistivity. In contrast, the surface resistivity of Comparative Example 1 and Comparative Example 2 were 6.7 × 10⁻⁶. 6 Ω / □ and 8.4×10 6 The electrostatic decay time is significantly prolonged, indicating that the system without modification or lacking the synergistic effect of organic small molecules has poor conductivity.

[0036] In terms of adhesion and abrasion resistance, Figure 3 The coating of Example 2 achieved a 5B grade, with an intact film and no peeling. The resistance change rate after wear resistance testing was only 4.5%, indicating that the sulfide bonds and fluorinated segments in the modified fluorosilicone resin enhanced the interfacial bonding strength between the resin and the non-metallic substrate, while also improving the stability of the conductive phase under mechanical stress. Examples 1 and 3 both had an adhesion of 4B, with slightly higher resistance changes but still better than the comparative examples. Comparative Examples 1 and 2 had adhesions of 2B and 1B respectively, with coating peeling or cracking, indicating a significant decrease in interfacial bonding strength in systems without double grafting modification or lacking glycoamide synergistic regulation.

[0037] In terms of environmental adaptability, Figure 4 The conductivity retention rate of Example 2 after damp heat aging reached 97.8%, indicating that the fluorosilicone structure in the modified resin remained stable under high temperature and high humidity conditions, and the conductive pathway was not destroyed. The retention rates of Examples 1 and 3 were 94.3% and 91.6%, respectively, also demonstrating good weather resistance. The retention rates of the comparative samples were only 75.2% and 68.7%, and they exhibited loss of gloss, blistering, and peeling during salt spray testing, indicating that the system lacked a stable interfacial protective structure.

[0038] In summary, Example 2 exhibits the best performance in terms of conductivity, adhesion, and environmental stability. The double grafting modification reaction of mercaptoethanol and ethylene trifluoroacrylate significantly improves the resin polarity and interfacial activity. The introduction of ethylene glycol further promotes the synergistic effect of hydrogen bonding and polar interactions, resulting in uniform distribution of conductive nickel powder and the formation of a dense conductive network. This achieves excellent electrostatic conductivity and durability, demonstrating the innovation and application advantages of this invention.

Claims

1. A conductive coating for use on non-metallic surfaces, characterized in that, The product contains the following raw materials in parts by weight: 60-70 parts modified Si-C fluorosilicone resin; 5-10 parts conductive nickel powder; 15-20 parts ethylenediamide; 2-5 parts dispersant; 0.5-1 part leveling agent; 0.2-0.5 parts defoamer; 0.3-0.8 parts antioxidant; and 20-30 parts diluent; wherein the modified Si-C fluorosilicone resin is a fluorosilicone copolymer modified by double grafting of mercaptoethanol and ethylene trifluoroacrylate.

2. The conductive coating for non-metallic surfaces according to claim 1, characterized in that, The modified Si-C fluorosilicone resin comprises the following raw materials in parts by weight: 60-70 parts Si-C fluorosilicone resin; 3-5 parts 2-mercaptoethanol; 1-3 parts ethylene trifluoroacrylate; 0.1-0.3 parts p-toluenesulfonic acid; and 80-100 parts anhydrous toluene.

3. A conductive coating for non-metallic surfaces according to any one of claims 1 or 2, characterized in that, The preparation method of the modified Si-C fluorosilicone resin includes the following steps: (1) Add Si-C fluorosilicone resin to the reaction vessel, add anhydrous toluene as a solvent and stir to dissolve, then add 2-mercaptoethanol dropwise; (2) In a homogeneous solution, add ethylene trifluoroacrylate and p-toluenesulfonic acid catalyst to the reaction system and continue stirring to allow it to undergo a double grafting reaction with the grafted thiol segments to generate a fluorosilicone structure containing –S– and –CF3 groups. (3) After the reaction is complete, the system is cooled and the residual solvent and unreacted monomers are removed by vacuum distillation to obtain a transparent and viscous modified Si-C fluorosilicone resin.

4. The conductive coating for non-metallic surfaces according to claim 3, characterized in that, The reaction conditions for step (1) are to stir the reaction at 70-80°C for 2-3 hours.

5. The conductive coating for non-metallic surfaces according to claim 3, characterized in that, The reaction conditions for step (2) are to continue the reaction at the same temperature for 2-3 hours after adding ethylene trifluoroacrylate.

6. The conductive coating for non-metallic surfaces according to claim 3, characterized in that, The reaction conditions for step (3) are reduced pressure at 50-60°C.

7. The conductive coating for non-metallic surfaces according to claim 1, characterized in that, The dispersant is composed of polyamide wax and organophosphonate in a mass ratio of 2:1; the leveling agent is composed of polyether-modified polydimethylsiloxane and acrylate copolymer in a mass ratio of 1:1; the defoamer is composed of polyether-based organosilicon complex and fatty alcohol polyoxyethylene ether in a mass ratio of 3:1; the antioxidant is composed of hindered phenolic antioxidant and triisodecyl phosphite in a mass ratio of 1:1; and the diluent is composed of butanone and isopropanol in a mass ratio of 7:

3.

8. A method for preparing a conductive coating for non-metallic surfaces, wherein the conductive coating for non-metallic surfaces is as described in any one of claims 1 to 7, characterized in that, Includes the following steps: S1, add ethylenediamide to a diluted solvent obtained by mixing butanone and isopropanol and stir to dissolve, forming a transparent and homogeneous solution; S2, add conductive nickel powder to a transparent and uniform solution, and use ultrasonic dispersion to disperse the metal powder evenly. Then add dispersant, leveling agent, defoamer and antioxidant in sequence, and continue stirring to make the system stable and uniform. S3, with the addition of modified Si-C fluorosilicone resin, is mechanically stirred until uniform, allowed to stand to degas, and then filtered to obtain a non-metallic conductive coating.

9. The method for preparing a conductive coating for non-metallic surfaces according to claim 1, characterized in that, The reaction conditions for step S1 are stirring at room temperature for 30-40 minutes; the reaction conditions for step S2 are ultrasonic dispersion at 25-35°C for 10-20 minutes, with a stirring speed of 1000-1500 rpm.

10. The method for preparing a conductive coating for non-metallic surfaces according to claim 1, characterized in that, The reaction conditions for step S3 are: mechanical stirring at room temperature for 30-60 minutes, followed by standing to degas for 2-3 hours, and then filtration through a 100-mesh filter cloth to obtain a uniform and stable non-metallic conductive coating.

Images