Electrolytic tank bipolar plate electroplating device with pre-cleaning function

Abstract

The invention discloses an electrolytic bath bipolar plate electroplating device with a pre-cleaning function, and relates to the technical field of bipolar plate electroplating. The device comprises an electrolytic bath, wherein an electroplating mechanism is arranged in the electrolytic bath; a cleaning mechanism is arranged on one side of the electrolytic cell, the cleaning mechanism comprises a cleaning tank fixedly mounted on one side of the electrolytic cell, the bipolar plate can be soaked in the cleaning tank through the arranged cleaning mechanism, and pollutants can be separated from the surfaces of the bipolar plate and the outer frame bracket. When the pollutants are separated, the pollutants can float to the liquid level of the cleaning liquid to facilitate follow-up pollution discharge and cleaning, when the pollutants float, the cleaning plate moves upwards to push the cleaning agent, and the pollutants are discharged through the pollution discharge pipe, so that the pollutants are ensured to be removed in time and prevented from being re-deposited in the tank; and meanwhile, a rotating plate is arranged, so that a worker can adjust the hole diameter of a gushing hole according to the gathering degree of pollutants, and the flowing intensity of the cleaning agent is adjusted.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of bipolar plate electroplating equipment, in particular to an electrolytic cell bipolar plate electroplating device with pre-cleaning function. BACKGROUND

[0002] At present, hydrogen energy as a green and environmentally friendly energy has been included in the national energy law. In recent years, the domestic industry of producing hydrogen by electrolyzing water has developed rapidly. The electrolytic cell bipolar plate as the core component of the hydrogen production equipment by electrolyzing water, its surface electroplating process is particularly critical. Electrolytic plating of nickel on the surface can realize good electrical conductivity of the electrolytic cell bipolar plate in the process of producing hydrogen by electrolyzing water, and in the environment of alkaline hydrogen production electrolyte (KOH aqueous solution), it has good corrosion resistance, which meets the use requirements of hydrogen production equipment. The electroplating layer of the electrolytic cell bipolar plate directly affects the hydrogen production effect and service life of the electrolytic cell bipolar plate.

[0003] In the patent (application number: CN202311601120.2), a bipolar plate, an electrolytic cell and an electrolytic cell are disclosed, which relates to the technical field of water electrolysis hydrogen production. Among them, the bipolar plate includes a plate body; part of the plate body is arched to the side away from itself to form a convex structure; the convex structure is multiple and uniformly distributed; the convex structures near the water outlet position or the water inlet position on the plate body form a buffer zone with a sawtooth-shaped profile. Without adding multiple layers of sintered titanium mesh, the design effectively reduces the process assembly difficulty and cost, and can reduce the water / gas inlet resistance, water / gas outlet resistance, while ensuring the effective contact area on the plate body, reducing the layer resistance and working voltage, and improving the hydrogen production efficiency.

[0004] The patent and the prior art have the following technical problems in actual use: The existing electroplating tank, when electroplating the bipolar plate, due to the long-time placement of the bipolar plate and the outer frame bracket in the external environment, dust, oil stains, impurities in the air and other pollutants are easily accumulated on the surface of the bipolar plate and the outer frame bracket. These pollutants will adhere to the metal surface, affecting the adhesion quality of the subsequent electroplating layer. SUMMARY

[0005] The purpose of the present application is to solve the above problems, and the present application provides an electrolytic cell bipolar plate electroplating device with pre-cleaning function.

[0006] In order to achieve the above purpose, the present application specifically adopts the following technical scheme: An electrolytic cell bipolar plate electroplating device with pre-cleaning function, comprising an electrolytic cell, an electroplating mechanism is arranged in the electrolytic cell; One side of the electrolytic tank is provided with a cleaning mechanism, the cleaning mechanism comprises a cleaning tank fixedly installed on one side of the electrolytic tank, a cleaning plate is slidably installed in the cleaning tank, a plurality of groups of protruding holes are formed on the surface of the cleaning plate, an adjusting mechanism is arranged in the cleaning plate and located at the position of the protruding holes, and a blowdown pipe is fixedly communicated with one side of the cleaning tank; The adjusting mechanism comprises a rotating plate arranged in the cleaning plate, the rotating plate is rotatably connected with the inner bottom of the cleaning plate, a sliding groove is formed on the surface of the rotating plate, a plurality of groups of sliding grooves are annularly arranged, a sealing plate is slidably installed on the rotating plate through the sliding groove, a limiting plate is arranged above the rotating plate, a limiting groove for the sliding of the sealing plate is formed on the surface of the limiting plate, the rotating plate can rotate in the cleaning plate, and a temperature detector is fixedly installed on the top of the cleaning tank.

[0007] Further, a driving tooth is fixedly installed on the surface of the rotating plate, a plurality of groups of driving teeth are annularly arranged, a driving gear is rotatably installed in the cleaning plate, two groups of driving gears are symmetrically arranged, and the driving gears are meshingly connected with the driving teeth.

[0008] Further, a driving box is fixedly installed on the top of the cleaning plate, a driving motor is fixedly installed in the driving box, and the output end of the driving motor is fixedly connected with the driving gear.

[0009] Further, an electric telescopic rod is fixedly installed at the bottom of the cleaning tank, and the output end of the electric telescopic rod is fixedly connected with the bottom of the cleaning plate.

[0010] Further, a liquid discharge pipe is fixedly communicated with the bottom of the cleaning tank, and an electromagnetic valve is arranged in the liquid discharge pipe.

[0011] Further, the electroplating mechanism comprises an outer frame bracket arranged in the electrolytic tank, an annular baffle is arranged in the outer frame bracket, and a bipolar plate is arranged in the annular baffle.

[0012] Further, the annular baffle is provided with a conductive mechanism, the conductive mechanism comprises a conductive copper block arranged on one side of the annular baffle, a polytetrafluoroethylene insulating rod is fixedly installed on one side of the conductive copper block, an installation seat is fixedly installed on one side of the outer frame bracket, an installation rod is threadedly installed on one side of the installation seat, the installation rod is opposite to the polytetrafluoroethylene insulating rod, and two groups of conductive mechanisms are symmetrically arranged.

[0013] Further, the outer diameter of the annular baffle is 60mm larger than the outer diameter of the bipolar plate, and the inner diameter of the annular baffle is 110mm smaller than the outer diameter, so that the bipolar plate in the electrolytic tank can be fully shielded.

[0014] Further, the inside of the ring-shaped baffle is provided as a hollow structure, and a plurality of balance holes are formed in the surface of the ring-shaped baffle, and the ratio of the balance holes to the ring-shaped baffle is 20-40%.

[0015] The beneficial effects of the present application are as follows: 1、The cleaning mechanism arranged in the application can immerse the bipolar plate into the cleaning tank, and the pollutants can be separated from the surface of the bipolar plate and the outer frame bracket. When the pollutants are separated, they will float to the liquid level of the cleaning liquid, which is convenient for subsequent pollution discharge and cleaning. When the pollutants float, the cleaning agent is pushed upward by the cleaning plate, and the pollutants are discharged through the pollution discharge pipe, which ensures that the pollutants are removed in time and avoids their re-deposition in the tank. At the same time, the rotating plate is arranged, so that the staff can adjust the aperture of the rising hole according to the aggregation degree of the pollutants, so as to adjust the flow intensity of the cleaning agent. When the aperture increases, the disturbance intensity of the cleaning agent increases, which is helpful to remove stubborn pollutants; when the aperture decreases, the pollutants in the area can be cleaned more carefully.

[0016] 2、The ring-shaped baffle can shield the edge part of the bipolar plate, so that the current density of the edge part in the electroplating process can be reduced, so that the edge effect of electroplating can be eliminated. The current density of the bipolar plate in the entire electrolytic tank is in a balanced state in the electroplating process, which can eliminate the edge effect and also ensure that there is enough plating thickness at the edge part of the baffle. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is the overall schematic diagram of the present application; Figure 2 is the overall internal schematic diagram of the present application; Figure 3 is the overall internal schematic diagram of the present application; Figure 4 is the internal schematic diagram of the cleaning plate of the present application; Figure 5 is the schematic diagram of the rotating plate of the present application; Figure 6 is the schematic diagram of the sealing plate of the present application; Figure 7 is the schematic diagram of the outer frame bracket of the present application; Figure 8 is the schematic diagram of the outer frame bracket of the present application; Figure 7 is the schematic diagram of the outer frame bracket of the present application;

[0018] Reference numerals: 1. Electrolytic cell; 2. Electroplating mechanism; 201. Outer frame bracket; 202. Annular baffle; 203. Bipolar plate; 204. Mounting base; 205. Mounting rod; 3. Cleaning mechanism; 301. Cleaning tank; 302. Cleaning plate; 303. Rising hole; 304. Drain pipe; 4. Adjusting mechanism; 41. Rotating plate; 42. Sliding groove; 43. Sealing plate; 44. Limiting plate; 45. Limiting groove; 46. Temperature detector; 5. Drive gear; 6. Drive gear; 7. Drive box; 8. Drive motor; 9. Electric telescopic rod; 10. Drain pipe; 11. Conductive mechanism; 111. Conductive copper block; 112. Polytetrafluoroethylene insulating rod. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0020] An electrolytic cell bipolar plate electroplating apparatus with a pre-cleaning function according to a preferred embodiment of the present invention will be described in detail below.

[0021] Example 1, as Figures 1-8 As shown, it includes an electrolytic cell 1, and an electroplating mechanism 2 is provided inside the electrolytic cell 1; A cleaning mechanism 3 is provided on one side of the electrolytic cell 1. The cleaning mechanism 3 includes a cleaning tank 301 fixedly installed on one side of the electrolytic cell 1. A cleaning plate 302 is slidably installed inside the cleaning tank 301. A surge hole 303 is opened on the surface of the cleaning plate 302. Several sets of surge holes 303 are provided. An adjustment mechanism 4 is provided inside the cleaning plate 302 and at the position of the surge hole 303. A drain pipe 304 is fixedly connected to one side of the cleaning tank 301. The adjustment mechanism 4 includes a rotating plate 41 disposed inside the cleaning plate 302. The rotating plate 41 is rotatably connected to the inner bottom of the cleaning plate 302. A sliding groove 42 is provided on the surface of the rotating plate 41. Several sets of sliding grooves 42 are arranged in a ring. A sealing plate 43 is slidably installed on the rotating plate 41 through the sliding grooves 42. A limiting plate 44 is provided above the rotating plate 41. A limiting groove 45 is provided on the surface of the limiting plate 44 for the sealing plate 43 to slide. The rotating plate 41 can rotate inside the cleaning plate 302. A temperature detector 46 is fixedly installed on the top of the cleaning tank 301. First, the staff fills the cleaning tank 301 with cleaning agent. Then, using the outer frame bracket 201, they place the bipolar plate 203 into the cleaning tank 301 for soaking and cleaning. During soaking, contaminants on the surface of the bipolar plate 203 and the outer frame bracket 201 separate from their surfaces. Simultaneously, the staff activates the temperature detector 46 to monitor the temperature of the cleaning agent in the cleaning tank 301. As the contaminants are separated, they rise to the surface of the cleaning agent. After the bipolar plate 203 is cleaned, the staff moves the cleaning plate 302 upwards from the bottom of the cleaning tank 301. This upward movement of the cleaning plate 302 causes the entire cleaning agent in the cleaning tank 301 to rise, allowing the contaminants that have risen to the surface to be discharged through the drain pipe 304. If contaminants accumulate in a certain area of ​​the cleaning agent within the cleaning tank 301, their presence can alter the overall thermal conductivity of the cleaning agent, leading to temperature changes in certain areas. Materials with low thermal conductivity, such as grease, can cause uneven heat conduction, creating localized temperature gradients. At this point, the temperature detector... After the device 46 detects the area, it immediately controls the rotating plate 41 inside the cleaning plate 302 in that area to rotate. When the rotating plate 41 rotates, it will drive one side of the sealing plate 43 to rotate inside the sliding groove 42. Under the action of the limiting groove 45, the sealing plate 43 can only move along the direction of the limiting groove 45, thereby opening the surge hole 303. Then, the operator can control the cleaning plate 302 to move downward. During the downward movement, the cleaning agent at the bottom of the cleaning plate 302 will flow out from the surge hole 303. The cleaning agent in the area is agitated, causing contaminants that have accumulated in a certain place to float to the surface of the cleaning liquid for discharge. At the same time, the staff can control the rotation angle of the rotating plate 41 according to the degree of contaminant accumulation, thereby adjusting the orifice diameter of the surge hole 303. When a stronger agitation is needed, the staff can control the rotating plate 41 to rotate to the maximum angle to increase the orifice diameter of the surge hole 303, while when a finer flow is needed, the orifice diameter of the surge hole 303 can be reduced, thus adapting to the needs. The cleaning mechanism 3 allows the bipolar plate 203 to be immersed in the cleaning tank 301, separating contaminants from the surfaces of the bipolar plate 203 and the outer frame bracket 201. After separation, the contaminants float to the surface of the cleaning solution, facilitating subsequent drainage and cleaning. As the contaminants rise, the cleaning plate 302 pushes the cleaning agent upwards, and the contaminants are discharged through the drain pipe 304, ensuring timely removal and preventing redeposition in the tank. Simultaneously, the rotating plate 41 allows operators to adjust the orifice diameter of the agitator 303 according to the degree of contaminant accumulation, thereby regulating the flow intensity of the cleaning agent. A larger orifice diameter increases the agitation of the cleaning agent, helping to remove more stubborn contaminants; a smaller orifice diameter allows for more thorough cleaning of contaminants within the area.

[0022] Example 2, as Figures 1-6 As shown, a drive gear 5 is fixedly installed on the surface of the rotating plate 41. Several sets of drive gear 5 are arranged in a ring. A drive gear 6 is rotatably installed inside the cleaning plate 302. Two sets of drive gear 6 are symmetrically arranged. The drive gear 6 meshes with the drive gear 5. A drive box 7 is fixedly installed on the top of the cleaning plate 302. A drive motor 8 is fixedly installed inside the drive box 7. The output end of the drive motor 8 is fixedly connected to the drive gear 6. When the operator starts the drive motor 8, the output of the drive motor 8 will drive the drive gear 6 to rotate. The drive gear 6 meshes with the drive teeth 5 on the surface of the rotating plate 41, thereby driving the rotating plate 41 to rotate through the drive teeth 5, thus enabling the rotation angle of the rotating plate 41 to be adjusted.

[0023] Example 3, as Figures 1-4 As shown, an electric telescopic rod 9 is fixedly installed at the bottom of the cleaning tank 301. The output end of the electric telescopic rod 9 is fixedly connected to the bottom of the cleaning plate 302. A drain pipe 10 is fixedly connected to the bottom of the cleaning tank 301. A solenoid valve is installed inside the drain pipe 10. The electric telescopic rod 9 can move the cleaning plate 302 up and down. At the same time, when the solenoid valve is opened, the drain pipe 10 can be controlled to discharge the cleaning liquid in the cleaning tank 301.

[0024] Example 4, as Figures 1-8 As shown, the electroplating mechanism 2 includes an outer frame bracket 201 disposed inside the electrolytic cell 1. An annular baffle 202 is disposed inside the outer frame bracket 201. A bipolar plate 203 is disposed inside the annular baffle 202. A conductive mechanism 11 is disposed on one side of the annular baffle 202. The conductive mechanism 11 includes a conductive copper block 111 disposed on one side of the annular baffle 202. A polytetrafluoroethylene insulating rod 112 is fixedly installed on one side of the conductive copper block 111. A mounting base 204 is fixedly installed on one side of the outer frame bracket 201. A mounting rod 205 is threadedly installed on one side of the mounting base 204. The mounting rod 205 is connected to the polytetrafluoroethylene insulating rod 112. Two sets of conductive mechanisms 11 are symmetrically arranged. After the bipolar plate 203 is cleaned, the staff installs the bipolar plate 203 into the inside of the annular baffle 202. Then, the outer frame bracket 201 is placed into the electrolytic cell 1 along with the annular baffle 202 and the bipolar plate 203 through the external hanging mechanism. At the same time, the electrolytic cell 1 is filled with electrolyte. Then, the conductive copper block 111 is controlled to conduct electricity to the bipolar plate 203. The annular baffle 202 is set to shield the edge of the bipolar plate 203 in the electrolytic cell 1, thereby reducing the current density at the edge during the electroplating process and eliminating the edge effect of electroplating. After the electroplating is completed, the outer frame bracket 201 can be removed from the electrolytic cell 1 through the external hanging mechanism. By using the annular baffle 202 to shield the edge of the bipolar plate 203, the current density at the edge during the electroplating process can be reduced, thereby eliminating the edge effect of electroplating. During the electroplating process, the current density of the bipolar plate 203 within the entire electrolytic cell 1 is kept in a balanced state, ensuring sufficient plating thickness at the edge of the baffle while eliminating the edge effect.

[0025] Example 5, such as Figures 1-8 As shown, the annular baffle 202 has an outer diameter 60 mm larger than the outer diameter of the bipolar plate 203, and an inner diameter 110 mm smaller than the outer diameter, in order to fully shield the bipolar plate 203 in the electrolytic cell 1. The interior of the annular baffle 202 is hollow, and a number of balance holes 206 are formed on the surface of the annular baffle 202. The duty cycle of the balance holes 206 to the annular baffle 202 is 20-40%. By setting several balance holes 206, the current density of the bipolar plates 203 in the entire electrolytic cell 1 can be kept in a balanced state during electroplating, which can eliminate the edge effect and ensure that there is sufficient coating thickness at the edge of the baffle.

[0026] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bipolar plate electroplating apparatus with a pre-cleaning function, comprising an electrolytic cell (1), characterized in that, An electroplating mechanism (2) is provided inside the electrolytic cell (1); A cleaning mechanism (3) is provided on one side of the electrolytic cell (1). The cleaning mechanism (3) includes a cleaning tank (301) fixedly installed on one side of the electrolytic cell (1). A cleaning plate (302) is slidably installed inside the cleaning tank (301). A surge hole (303) is opened on the surface of the cleaning plate (302). Several sets of surge holes (303) are provided. An adjustment mechanism (4) is provided inside the cleaning plate (302) and at the position of the surge hole (303). A drain pipe (304) is fixedly connected to one side of the cleaning tank (301). The adjustment mechanism (4) includes a rotating plate (41) disposed inside the cleaning plate (302). The rotating plate (41) is rotatably connected to the inner bottom of the cleaning plate (302). A sliding groove (42) is provided on the surface of the rotating plate (41). Several sets of sliding grooves (42) are arranged in a ring. A sealing plate (43) is slidably installed on the rotating plate (41) through the sliding groove (42). A limiting plate (44) is provided above the rotating plate (41). A limiting groove (45) for the sealing plate (43) to slide is provided on the surface of the limiting plate (44). The rotating plate (41) can rotate inside the cleaning plate (302). A temperature detector (46) is fixedly installed on the top of the cleaning groove (301).

2. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 1, characterized in that, The rotating plate (41) is fixedly mounted with drive teeth (5), and several sets of drive teeth (5) are arranged in a ring. The cleaning plate (302) is rotatably mounted with drive gears (6), and two sets of drive gears (6) are symmetrically arranged. The drive gears (6) are meshed with the drive teeth (5).

3. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 1, characterized in that, A drive box (7) is fixedly installed on the top of the cleaning plate (302), and a drive motor (8) is fixedly installed inside the drive box (7). The output end of the drive motor (8) is fixedly connected to the drive gear (6).

4. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 1, characterized in that, An electric telescopic rod (9) is fixedly installed at the bottom of the cleaning tank (301), and the output end of the electric telescopic rod (9) is fixedly connected to the bottom of the cleaning plate (302).

5. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 1, characterized in that, The bottom of the cleaning tank (301) is fixedly connected to a drain pipe (10), and a solenoid valve is installed inside the drain pipe (10).

6. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 1, characterized in that, The electroplating mechanism (2) includes an outer frame bracket (201) disposed inside the electrolytic cell (1), an annular baffle (202) disposed inside the outer frame bracket (201), and a bipolar plate (203) disposed inside the annular baffle (202).

7. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 6, characterized in that, A conductive mechanism (11) is provided on one side of the annular baffle (202). The conductive mechanism (11) includes a conductive copper block (111) provided on one side of the annular baffle (202). A polytetrafluoroethylene insulating rod (112) is fixedly installed on one side of the conductive copper block (111). A mounting seat (204) is fixedly installed on one side of the outer frame bracket (201). A mounting rod (205) is threaded on one side of the mounting seat (204). The mounting rod (205) is connected to the polytetrafluoroethylene insulating rod (112). Two sets of conductive mechanisms (11) are symmetrically arranged.

8. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 6, characterized in that, The outer diameter of the annular baffle (202) is 60 mm larger than the outer diameter of the bipolar plate (203), and the inner diameter of the annular baffle (202) is 110 mm smaller than the outer diameter, so as to fully shield the bipolar plate (203) in the electrolytic cell (1).

9. The bipolar plate electroplating apparatus for an electrolytic cell with pre-cleaning function according to claim 6, characterized in that, The interior of the annular baffle (202) is hollow, and a plurality of balance holes (206) are provided on the surface of the annular baffle (202). The duty cycle of the balance holes (206) to the annular baffle (202) is (20-40)%.

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