A jig for improving the yield of components in a wave soldering process

Abstract

The application discloses a jig for improving the skew and floating of components in a wave-soldering process, which comprises a PCB, a carrier plate, elastic elements, electronic components, a gland, a clamping mechanism and a limiting mechanism; the PCB is provided with positioning holes; the carrier plate is provided with positioning grooves matched with the PCB; the elastic elements are inserted into the PCB through the pins at the bottom ends of the elastic elements; the electronic components are also inserted into the PCB through the pins at the bottom ends of the electronic components; the gland is located directly above the carrier plate; the clamping mechanism is used for detachably connecting the gland and the carrier plate together; the elastic elements are pressed by the pressing strips installed on the lower surface of the gland, and the electronic components are pressed by the bottom ends of the pressing rods, so that the elastic elements and the electronic components will not be skewed or floated during the wave-soldering process; and thus the jig solves the problems of the skew and floating of the elastic elements and the electronic components in the wave-soldering process.

Description

Technical Field

[0001] This invention relates to the field of DIP packaging fixture technology, specifically a fixture for improving component misalignment and floating in wave soldering processes. Background Technology

[0002] DIP (Dual In-line Package) is a common type of electronic component packaging used for integrated circuits (ICs) and other electronic devices. DIP devices have a rectangular plastic or ceramic housing with multiple pins on the bottom. These pins are designed to insert into holes on a printed circuit board (PCB) and are secured by soldering, thus providing an electrical connection between the device and the circuitry.

[0003] Wave soldering is a commonly used soldering technology in the electronics manufacturing industry. It uses the wave peaks formed by molten solder to achieve mechanical and electrical connections between components and circuit boards. The process involves key steps such as component insertion, preheating (temperature controlled at 90-100℃), soldering (temperature maintained at 220-240℃), and cooling. The core material is solder bar, and it is particularly suitable for the manufacturing process of DIP-type electronic products.

[0004] However, during DIP wave soldering, molten solder may overflow from the holes on the PCB and potentially lift the components; simultaneously, jig vibration during transport can cause components to float or become misaligned on the PCB. Furthermore, to assemble wave-soldered PCB components with other devices—for example, assembling PCB components with a glass cover to form a touchscreen—it is necessary to simultaneously wave solder corresponding elastic components to achieve a flexible connection between the PCB components and the glass cover. However, current technology lacks a jig specifically designed to prevent misalignment and floating of elastic components during wave soldering. Therefore, we propose an improved jig to address the issues of component misalignment and floating in the wave soldering process, particularly resolving the problems of misalignment and floating of elastic components. Summary of the Invention

[0005] The purpose of this invention is to improve and innovate upon the shortcomings and problems existing in the prior art, and to provide a fixture that improves the misalignment and floating of components in the wave soldering process.

[0006] A fixture for improving component misalignment and float in wave soldering process, comprising:

[0007] PCB board; positioning holes are provided on the PCB board;

[0008] The carrier board has a positioning groove adapted to the PCB board.

[0009] An elastic element, which is inserted onto a PCB board via pins at its bottom end;

[0010] Electronic components, which are also inserted onto the PCB board via pins at their bottom ends;

[0011] A pressure cap, which is located directly above the carrier plate;

[0012] A locking mechanism for detachably connecting the gland and the carrier plate together;

[0013] A limiting mechanism is used to fix the elastic element and electronic components after the pressure cap is installed on the carrier plate by the locking mechanism.

[0014] A further embodiment is that the limiting mechanism includes a pressure bar, and a first spring is sleeved on the outer surface of the pressure bar; when the bottom end of the pressure bar abuts against the electronic component, the first spring is in a compressed state.

[0015] A further embodiment is that the limiting mechanism includes a pressure strip installed on the lower surface of the pressure cap, the lower surface of which is used to press down the elastic element.

[0016] A further embodiment is that the pressure bar is hollow inside; at least two connecting rods are symmetrically slidably fitted on the pressure bar, the connecting rods are in the shape of an "I", and clamping blocks and fixing plates are fixedly connected to both ends of the connecting rods respectively. A second spring is provided between the fixing plate and the outer surface of the pressure bar; a screw is threaded to the upper end of the pressure bar, and an extrusion head is fixedly connected to the bottom end of the screw. An inclined surface that cooperates with the extrusion head is provided at the top end of the connecting rod. When the extrusion head presses down on the connecting rod, the clamping block abuts against the inner side of the elastic element.

[0017] A further embodiment is that a retaining ring is snapped onto the outer surface of the pressure bar; the two ends of the first spring are respectively connected to the retaining ring and the inner wall of the pressure bar.

[0018] A further embodiment is that the locking mechanism includes an upper fixing block installed on the lower surface of the pressure cap and a lower fixing block installed on the upper surface of the carrier plate. A rotating locking block is rotatably connected to the upper fixing block, and a locking groove is provided on the lower fixing block to cooperate with the bottom end of the rotating locking block.

[0019] A further embodiment is that a torsion spring is sleeved on the rotating shaft corresponding to the rotating block, a first inclined surface is provided on the lower surface of the bottom end of the rotating block, and a second inclined surface is provided on the upper surface of the lower fixing block to cooperate with the first inclined surface.

[0020] A further embodiment is that a positioning mechanism is provided between the pressure cap and the carrier plate. The positioning mechanism includes a positioning post installed on the pressure cap and a positioning block installed on the carrier plate. The upper surface of the positioning block is provided with a groove that matches the bottom end of the positioning post.

[0021] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention presses the elastic element by installing a pressure strip on the lower surface of the pressure cover and presses the electronic component by pressing the bottom end of the pressure bar, so that the elastic element and the electronic component will not float or become misaligned due to the solder overflowing from the positioning hole on the PCB board or the jig shaking during the wave soldering process; thus, the jig of this application solves the problem of misalignment and floating of the elastic element and the electronic component in the wave soldering process;

[0022] (2) The present invention uses a pressure bar to press down on the electronic components, so that the electronic components will not float or become misaligned during wave soldering. At the same time, after turning the adjustment knob, the extrusion head is driven to move down and the extrusion head acts on the inclined surface at the top of the connecting rod, so that the clamping block moves outward and fits tightly against the inner wall of the elastic element, thus clamping the elastic element. This can also effectively avoid the problem of misalignment and floating of the elastic element. In addition, the elastic element is not compressed during the whole process, so when the solder overflows from the positioning hole on the PCB board during wave soldering, it is not easy to stick the spring rings at different heights at the bottom of the elastic element together, thus not affecting the normal use of the elastic element. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural schematic diagram of a fixture for improving component misalignment and float in wave soldering process according to the first embodiment of the present invention;

[0024] Figure 2 Provided by the first embodiment of the present invention Figure 1 A magnified view of the structure at point A in the middle;

[0025] Figure 3 This is a cross-sectional structural schematic diagram of a fixture for improving component misalignment and float in wave soldering process according to the first embodiment of the present invention;

[0026] Figure 4 Provided by the first embodiment of the present invention Figure 3 A magnified schematic diagram of the structure at point B in the middle;

[0027] Figure 5 Provided by the first embodiment of the present invention Figure 3 A magnified schematic diagram of the structure at point C in the middle;

[0028] Figure 6 This is a three-dimensional structural schematic diagram of a fixture for improving component misalignment and float in wave soldering process according to the second embodiment of the present invention;

[0029] Figure 7 This is a cross-sectional structural schematic diagram of a fixture for improving component misalignment and floating height in wave soldering process according to the second embodiment of the present invention;

[0030] Figure 8 Provided for the second embodiment of the present invention Figure 7 A magnified schematic diagram of the structure at point D.

[0031] Reference numerals: 1. PCB board; 2. Elastic element; 3. Electronic component; 4. Carrier board; 5. Pressure bar; 6. Pressure cap; 7. Positioning mechanism; 701. Positioning block; 702. Positioning post; 8. Locking mechanism; 801. Upper fixing block; 802. Lower fixing block; 803. Rotating locking block; 804. Locking groove; 805. First inclined surface; 806. Second inclined surface; 9. Limiting mechanism; 901. Pressure bar; 902. Locking ring; 903. First spring; 904. Clamping block; 905. Connecting rod; 906. Screw; 907. Extrusion head; 908. Second spring; 909. Fixing plate; 10. Solder block. Detailed Implementation

[0032] To make the objectives, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0034] Example 1

[0035] Please see Figure 1-5 This invention provides a fixture for improving component misalignment and floating in wave soldering processes. It includes a carrier board 4 and a PCB board 1. The carrier board 4 has several positioning slots adapted to the PCB board 1. The PCB board 1 is placed in the positioning slots, which serve to position the PCB board 1. The PCB board 1 also has several positioning holes for inserting the pins of DIP connectors. The carrier board 4 may also have several through slots to allow molten solder to overflow from the positioning holes on the PCB board 1 during wave soldering.

[0036] In this embodiment, the DIP insert includes an elastic element 2 and an electronic component 3. The electronic component 3 is configured as an LED, and the elastic element 2 is configured as a spring; the elastic element 2 and the electronic component 3 correspond one-to-one; by setting the elastic element 2, a soft connection can be achieved between the glass cover and the PCB board 1 to assemble the touch screen. When the glass cover is placed on the elastic element 2, the elastic element 2 ensures that there is a small gap between the glass cover and the LED.

[0037] A solder baffle 10 is provided on the edge of the PCB board 1. The solder baffle 10 is fixed to the periphery of the PCB board 1 by positioning screws to block the flow of liquid solder during wave soldering.

[0038] The pressure cap 6 is located directly above the carrier plate 4. The pressure cap 6 is detachably mounted on the carrier plate 4 via a locking mechanism 8, and a positioning mechanism 7 is also provided between the pressure cap 6 and the carrier plate 4. The positioning mechanism 7 facilitates the quick and precise assembly of the pressure cap 6 and the carrier plate 4. The positioning mechanism 7 includes a positioning post 702 mounted on the pressure cap 6 and a positioning block 701 mounted on the carrier plate 4. The upper surface of the positioning block 701 has a groove that matches the bottom end of the positioning post 702. When the bottom end of the positioning post 702 is inserted into the groove on the positioning block 701, the pressure cap 6 is simultaneously detachably connected to the carrier plate 4 via the locking mechanism 8. The locking mechanism 8 prevents the pressure cap 6 from moving up and down relative to the carrier plate 4, while the positioning mechanism 7 prevents the pressure cap 6 from moving back and forth or left and right relative to the carrier plate 4. The positioning mechanism 7 also supports the pressure cap 6.

[0039] Specifically, the locking mechanism 8 includes an upper fixing block 801 mounted on the lower surface of the pressure cap 6 and a lower fixing block 802 mounted on the upper surface of the carrier plate 4. A rotating locking block 803 is rotatably connected to the upper fixing block 801, and a locking groove 804 that mates with the bottom end of the rotating locking block 803 is provided on the lower fixing block 802. A torsion spring is sleeved on the rotating shaft corresponding to the rotating locking block 803. A first inclined surface 805 is provided on the lower surface of the bottom end of the rotating locking block 803, and a second inclined surface 806 that mates with the first inclined surface 805 is provided in the middle of the upper surface of the lower fixing block 802. During the process of the bottom end of the positioning post 702 being inserted into the groove on the positioning block 701, the first inclined surface 805 at the bottom end of the rotating block 803 cooperates with the second inclined surface 806 on the lower fixed block 802, causing the rotating block 803 to rotate outward, allowing the rotating block 803 to continue to move downward until the rotating block 803 moves to correspond with the slot 804. At this time, under the reset action of the torsion spring, the bottom end of the rotating block 803 will automatically embed into the slot 804, thereby making the pressure cover 6 detachably connected to the carrier plate 4 through the locking mechanism 8.

[0040] The pressure cover 6 is also provided with a limiting mechanism 9, which is used to fix the elastic element 2 and the electronic component 3. In this embodiment, the limiting mechanism 9 includes a pressure strip 5 installed on the lower surface of the pressure cover 6, and the number of pressure strips 5 corresponds one-to-one with the number of PCB boards 1. The lower surface of the pressure strip 5 is used to press down on the elastic element 2, thereby fixing the elastic element 2 and preventing the elastic element 2 from tilting or floating during wave soldering; thus preventing problems such as floating or misalignment.

[0041] The limiting mechanism 9 also includes a pressure rod 901, which slides in conjunction with the pressure strip 5 and the pressure cover 6; a retaining ring 902 is engaged on the outer surface of the pressure rod 901. The two ends of the first spring 903 are connected to the retaining ring 902 and the inner wall of the pressure strip 5, respectively. The pressure rod 901 corresponds one-to-one with the electronic component 3. When the pressure strip 5 presses down on the elastic element 2, the bottom end of the pressure rod 901 abuts against the electronic component 3, and at this time, the first spring 903 is in a compressed state, thereby fixing the electronic component 3 and preventing it from floating or becoming misaligned during wave soldering.

[0042] Preferably, the pressure bar 901 is made of metal material, and a rubber sleeve is provided at the bottom end of the pressure bar 901. The rubber sleeve can play a buffering role to prevent the metal pressure bar 901 from damaging the electronic components 3.

[0043] In summary, this embodiment, through the cooperation of the positioning block 701 and the positioning post 702, enables the quick and precise assembly of the pressure cap 6 and the carrier plate 4. After the pressure cap 6 and the carrier plate 4 are assembled, the pressure strip 5 installed on the lower surface of the pressure cap 6 can press down the elastic element 2, while the pressure rod 901 can press down the electronic component 3. This prevents the elastic element 2 and the electronic component 3 from floating or tilting during wave soldering due to solder overflowing from the positioning holes on the PCB board or jig vibration. Thus, the jig of this application solves the problems of misalignment and floating of the elastic element 2 and the electronic component 3 in the wave soldering process.

[0044] Example 2

[0045] Please see Figures 6-8 In this embodiment, the pressure bar 901 is hollow inside. A retaining ring 902 is snapped onto the outer surface of the pressure bar 901, and a first spring 903 is sleeved on the outer surface of the pressure bar 901. The two ends of the first spring 903 are respectively connected to the retaining ring 902 and the inner wall of the pressure bar 5. At least two connecting rods 905 are symmetrically slidably fitted on the pressure bar 901. The connecting rods 905 are in the shape of an "I". A clamping block 904 and a fixing plate 909 are respectively fixedly connected to the bottom and top ends of the connecting rods 905. A second spring 908 is provided between the fixing plate 909 and the outer surface of the pressure bar 901, and the second spring 908 is sleeved on one end of the connecting rod 905. A screw 906 is threadedly connected to the upper end of the inside of the pressure bar 901. A pressing head 907 is fixedly connected to the bottom end of the screw 906, and an adjusting knob is fixedly connected to the top end of the screw 906. The top end of the connecting rod 905 is provided with an inclined surface that cooperates with the extrusion head 907. When the extrusion head 907 moves down, it will extrude the connecting rod 905, thereby causing the clamping block 904 to abut against the inner side of the elastic element 2 and stretch the second spring 908.

[0046] Preferably, a rubber pad is provided on the outer surface of the clamping block 904 to increase the friction between the clamping block 904 and the elastic element 2.

[0047] The fixing plates 909 corresponding to different elastic elements 2 can be set at the same height position within the pressure strip 5, or they can be set at different height positions within the pressure strip 5. Those skilled in the art can determine this according to the actual situation, and this application does not make any specific limitations.

[0048] It should be noted that the rest of this embodiment is the same as that in Embodiment 1 above.

[0049] It should be further explained that after the pressure cap 6 and the carrier plate 4 are assembled together, the pressure bar 901 can still press down on the electronic component 3 and compress the first spring 903; this prevents the electronic component 3 from floating or becoming misaligned during wave soldering. At this time, the lower surface of the pressure bar 5 is still a certain distance from the elastic element 2, and the pressure bar 5 does not apply pressure to the elastic element 2; at the same time, the clamping block 904 is inside the elastic element 2. Then, by rotating the adjustment knob, the extrusion head 907 is moved down, and the extrusion head 907 acts on the inclined surface at the top of the connecting rod 905, causing the clamping block 904 to move outward and then fit tightly against the inner wall of the elastic element 2, clamping the elastic element 2; in this way, the problem of misalignment and floating of the elastic element 2 can also be avoided. After the wave soldering operation is completed, the adjustment knob can be rotated in the opposite direction so that the clamping block 904 no longer clamps the elastic element 2. It is understood that in this embodiment, since the elastic element 2 is not compressed, the pitch between the spring coils corresponding to the elastic element 2 is not shortened; therefore, during the wave soldering process, when the molten solder overflows from the positioning hole on the PCB board 1, it is not easy to stick the spring coils corresponding to different heights at the bottom of the elastic element 2 together, thereby ensuring the normal use of the elastic element 2 in the future.

[0050] In summary, this embodiment enables the quick and precise assembly of the pressure cap 6 and the carrier plate 4 through the cooperation of the positioning block 701 and the positioning post 702. After the pressure cap 6 and the carrier plate 4 are assembled, the pressure bar 901 can still press down on the electronic component 3, preventing the electronic component 3 from floating or becoming misaligned during wave soldering. At the same time, the lower surface of the pressure bar 5 is still a certain distance from the elastic element 2, so the pressure bar 5 does not apply pressure to the elastic element 2 and does not shorten the pitch between the spring coils corresponding to the elastic element 2. Then, by rotating the adjustment knob, the extrusion head 907 is moved down. The extrusion head 907 acts on the inclined surface at the top of the connecting rod 905, causing the clamping block 904 to move outward and fit tightly against the inner wall of the elastic element 2, clamping the elastic element 2. This also prevents the elastic element 2 from becoming misaligned or floating. Since this embodiment does not compress the elastic element 2, when the molten solder overflows from the positioning hole on the PCB board 1 during wave soldering, it is not easy to stick the spring rings corresponding to different heights at the bottom of the elastic element 2 together, so as not to affect the normal use of the elastic element 2.

[0051] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0052] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0053] Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The reference to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily indicate the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A fixture for improving component misalignment and float in wave soldering process, characterized in that, include: PCB board (1); positioning holes are provided on PCB board (1); Carrier board (4), the carrier board (4) is provided with a positioning groove that is compatible with the PCB board (1); The elastic element (2) is inserted into the PCB board (1) through the pins at its bottom end; Electronic components (3) are also inserted into the PCB board (1) through their bottom pins; A pressure cap (6) is located directly above the carrier plate (4); A locking mechanism (8) is used to detachably connect the pressure cap (6) and the carrier plate (4) together; The limiting mechanism (9) is used to fix the elastic element (2) and the electronic component (3) after the pressure cap (6) is installed on the carrier plate (4) by the locking mechanism (8). The limiting mechanism (9) includes a pressure bar (901), and a first spring (903) is sleeved on the outer surface of the pressure bar (901); when the bottom end of the pressure bar (901) abuts against the electronic component (3), the first spring (903) is in a compressed state; The pressure bar (901) is hollow inside; at least two connecting rods (905) are symmetrically slidably fitted on the pressure bar (901). The connecting rods (905) are in the shape of [], and clamping blocks (904) and fixing plates (909) are fixedly connected to both ends of the connecting rods (905). A second spring (908) is provided between the fixing plate (909) and the outer surface of the pressure bar (901); a screw (906) is threaded to the upper end of the pressure bar (901), and an extrusion head (907) is fixedly connected to the bottom end of the screw (906). An inclined surface that cooperates with the extrusion head (907) is provided at the top end of the connecting rod (905). When the extrusion head (907) presses the connecting rod (905) downward, the clamping block (904) abuts against the inner side of the elastic element (2).

2. The fixture for improving component misalignment and floating in wave soldering process according to claim 1, characterized in that: The outer surface of the pressure bar (901) is fitted with a retaining ring (902); the two ends of the first spring (903) are respectively connected to the retaining ring (902) and the inner wall of the pressure bar (5).

3. The fixture for improving component misalignment and floating in wave soldering process according to claim 1, characterized in that: The locking mechanism (8) includes an upper fixing block (801) installed on the lower surface of the pressure cover (6) and a lower fixing block (802) installed on the upper surface of the carrier plate (4). A rotating locking block (803) is rotatably connected to the upper fixing block (801), and a locking groove (804) is provided on the lower fixing block (802) to cooperate with the bottom end of the rotating locking block (803).

4. A fixture for improving component misalignment and floating in wave soldering process according to claim 3, characterized in that: A torsion spring is sleeved on the rotating shaft corresponding to the rotating block (803). A first inclined surface (805) is provided on the lower surface of the bottom end of the rotating block (803), and a second inclined surface (806) that cooperates with the first inclined surface (805) is provided on the upper surface of the lower fixing block (802).

5. A fixture for improving component misalignment and floating in wave soldering process according to claim 1, characterized in that: A positioning mechanism (7) is provided between the pressure cap (6) and the carrier plate (4). The positioning mechanism (7) includes a positioning post (702) installed on the pressure cap (6) and a positioning block (701) installed on the carrier plate (4). The upper surface of the positioning block (701) is provided with a groove that matches the bottom end of the positioning post (702).

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