Image generation method and system applied to production of circuit board

By dividing the region, collecting detailed failure point data, and mining layout location correlation information, combined with anomaly correlation analysis and image generation rules, the accuracy and visualization issues of circuit board failure tracing were solved, enabling accurate reverse deduction from failure results to the source production process and restoration of intermediate states.

CN121861141BActive Publication Date: 2026-06-26GUIZHOU INST OF TECH +1
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Patent Information

Application Number
CN202610313801.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2026-03-16
Publication Date
2026-06-26
Estimated Expiration
2046-03-16

AI Technical Summary

Technical Problem

Existing technologies cannot accurately uncover the implicit correlation between circuit board failure characteristics and production anomalies, making it difficult to accurately trace back from the failure result to the source production process. Furthermore, image generation technology cannot reverse-engineer abnormal intermediate states in the production process, lacking intuitive and verifiable evidence for failure tracing.

Method used

By pre-defined failure location benchmark area division, failure point morphology detail collection and layout location correlation information mining, combined with anomaly correlation analysis and image generation rules, a full-link traceability technology link from failure result to production anomaly is constructed, realizing the directional identification of failure characteristics and global correlation logic mining, and generating a visualized intermediate state image.

Benefits of technology

It improves the accuracy and efficiency of circuit board failure tracing, provides traceable and verifiable visual evidence, breaks through the limitations of traditional failure analysis, and accurately locates the source production process that causes the failure.

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Abstract

Embodiments of the present application disclose an image generation method and system applied to circuit board production. The method responds to a failure circuit board traceability task request, positions a failure area based on a preset failure positioning benchmark, collects a failure point morphology detail image and determines its layout position association information, and obtains a failure feature through feature mining. According to the failure feature, an abnormal association analysis is performed on a production link chain to obtain an abnormal tendency analysis result containing an association degree value of each production link and the failure feature. A potential abnormal link is locked and abnormal variable data is extracted, and an image generation rule is determined in combination with the failure feature. Finally, based on the potential abnormal link scene label and the image generation rule, an intermediate state image of the failure circuit board in the potential abnormal link is reversely generated. The method can realize accurate traceability from a failure result to a production abnormality, and present an abnormal state in a production process in a visual image, thereby realizing efficient and intuitive circuit board failure traceability.
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