Auxiliary device for testing bonding performance of micro-fluidic chip

Abstract

The invention relates to an auxiliary device for testing the bonding performance of a micro-fluidic chip, belongs to the technical field of chip testing, and solves the problem that the bonding performance of the micro-fluidic chip is difficult to test in the prior art. The auxiliary device comprises an air pressure generation module, an air pressure branching and control module, a chip interface module and an air pressure detection module. The air pressure branching and control module can divide the air pressure generated by the air pressure generation module into multiple paths, and meanwhile pressure control is conducted on multiple paths of air pressure branches. The chip interface module is communicated with the air pressure branch and control module and the air pressure detection module through a plurality of air pressure inlets and a plurality of air pressure outlets, and an internal flow channel of the micro-fluidic chip is connected between the air pressure inlet and the air pressure outlet of the chip interface module. The bonding performance of the micro-fluidic chip can be judged by detecting the pressure before and after the gas flows through the micro-fluidic chip.

Description

Technical Field

[0001] This invention relates to the field of technology, and more particularly to an auxiliary device for testing the bonding performance of microfluidic chips. Background Technology

[0002] Microfluidic chips are rapid analytical platforms that integrate basic operations such as sample preparation, reaction, separation, and detection involved in biological, chemical, and medical analysis. Recent advancements in microfluidic technology have enabled applications related to lab-on-a-chip or micro total analysis systems. They allow for the control of small amounts of liquid within microfabricated channels and, in some cases, the efficient automation of analytical steps on the microchip, including sample pretreatment, reaction, separation, and detection. Based on their small size, low reagent consumption, and high integration, they have immense application potential in biology, chemistry, and medicine, and have gradually developed into a highly interdisciplinary research field encompassing biochemistry, fluid mechanics, microelectronics, materials science, and mechanics. In the field of medical diagnostics, microfluidic chips are an important platform for point-of-care testing (POCT) diagnostic devices and have proven to have significant potential in various biological applications, including cell sorting, enzyme analysis, immunohybridization, nucleic acid analysis, and nucleic acid sequencing.

[0003] As can be seen, the typical structural feature of microfluidic chips is the presence of fluid channels. The number, structure, and size of these channels and chambers vary depending on the application scenario to facilitate steps such as liquid distribution, extraction, mixing, and separation in general biochemical reactions (e.g., cell sorting, nucleic acid analysis, or other sample processing reactions). Generally, microfluidic chips contain at least a channel layer and an encapsulation layer. More complex microfluidic chips contain more layers, and bonding processes between layers typically employ double-sided adhesive bonding, laser bonding, or ultrasonic bonding. The reliability and sealing of these bonds directly affect the yield rate of chip production and the success and reliability of subsequent biochemical reaction results. However, microfluidic chips are disposable consumables. Using methods such as fluid permeation or immersion in liquid for aeration to verify chip bonding performance increases chip wear and makes it impossible to accurately locate bonding failures.

[0004] Based on this, the purpose of the present invention is to provide an auxiliary device for testing the bonding performance of microfluidic chips, which is suitable for quality inspection of bonded microfluidic chips during the bonding process of microfluidic chip production, so as to improve the speed of bonding performance evaluation and the accuracy of fault point location. Summary of the Invention

[0005] Based on the above analysis, the present invention aims to provide an auxiliary device for testing the bonding performance of microfluidic chips, in order to solve the problem that the bonding performance of existing microfluidic chips is difficult to test.

[0006] The objective of this invention is mainly achieved through the following technical solutions:

[0007] An auxiliary device for testing the bonding performance of microfluidic chips includes: a pressure generation module, a pressure shunt and control module, the chip interface module, and a pressure detection module.

[0008] The pressure generation module provides a pressure source to the pressure branching and control module; the pressure branching and control module divides the pressure source into multiple pressure branches and controls the pressure of these branches; multiple pressure inlets on the chip interface module are interconnected with these multiple pressure branches; the pressure detection module is connected to multiple pressure outlets of the chip interface module and can detect the pressure values ​​of the gas flowing out through these outlets; the internal flow channel of the microfluidic chip is connected between the pressure inlets and outlets of the chip interface module, and the bonding performance of the microfluidic chip can be determined by comparing the pressure before and after the gas flows through it.

[0009] Furthermore, the chip interface module includes: a pressing structure, a chip support structure, and a positioning guide shaft; the pressing structure is arranged parallel above the chip support structure; at least two positioning guide shafts are vertically arranged on the chip support structure, and the pressing structure is slidably mounted on the positioning guide shafts; the microfluidic chip is disposed between the pressing structure and the chip support structure.

[0010] Furthermore, the pressure-down structure is provided with multiple sets of vertically penetrating air pressure inlets and outlets; the multiple sets of air pressure inlets and outlets are respectively connected to multiple sets of microchannel inlets and microchannel outlets on the microfluidic chip under test.

[0011] Furthermore, the upper surface of the chip support structure is provided with a recessed chip placement groove, and the microfluidic chip is disposed in the chip placement groove.

[0012] Furthermore, an elastic support pad is provided on the bottom surface of the chip placement slot.

[0013] Furthermore, an elastic sealing gasket is provided on the lower surface of the pressing structure. When the microfluidic chip is clamped between the pressing structure and the chip support structure, the elastic sealing gasket adheres to and seals the upper surface of the microfluidic chip.

[0014] Furthermore, the lower surface of the elastic sealing gasket is provided with a chip mating structure, which can mate with the upper surface of the microfluidic chip.

[0015] Furthermore, it also includes a pressure reading and recording module connected to the pressure detection module; the pressure reading and recording module includes a display screen and a memory, the display screen is used to display the pressure before and after flowing through the microfluidic chip; the memory is used to record the pressure data detected by the pressure detection module.

[0016] Furthermore, the pressure splitting and control module includes: a flow distributor and a pressure control unit; the flow distributor is used to split a single airflow into multiple airflows, and the pressure control unit can regulate the pressure values ​​of the multiple airflows.

[0017] A method for testing the bonding performance of microfluidic chips, wherein the auxiliary device for testing the bonding performance of microfluidic chips is used to test the bonding performance of microfluidic chips.

[0018] The technical solution of this invention can achieve at least one of the following effects:

[0019] 1. The auxiliary device for bonding performance testing of microfluidic chips of the present invention is used to perform quality inspection on microfluidic chips after bonding during microfluidic chip production. By introducing gas into the microfluidic chip and detecting changes in gas pressure, the bonding performance of the microfluidic chip is evaluated, thereby reducing the wear and tear on the microfluidic chip during the quality inspection process, improving the speed of bonding performance evaluation and the accuracy of fault location, and providing a reliable solution for improving the quality inspection efficiency of chips.

[0020] 2. The auxiliary device for testing the bonding performance of microfluidic chips of the present invention connects the microfluidic chip to a chip interface module, and connects the multi-channel microfluidic channel inside the microfluidic chip to the multi-channel gas path provided by the gas pressure generation module and the gas pressure distribution and control module through the gas pressure inlet and gas pressure outlet set on the chip interface module. By comparing the pressure change of the gas before and after flowing through the chip interface module, the bonding effect of the microfluidic chip is indirectly displayed; the more consistent the pressure value of the gas before and after flowing through the chip interface module, the better the bonding effect of the microfluidic chip.

[0021] 3. The auxiliary device for testing the bonding performance of microfluidic chips of the present invention, by setting elastic sealing pads and elastic support pads on the pressing structure and the chip support structure respectively, enables the microfluidic chip to reliably seal with the air pressure inlet and air pressure outlet on the pressing structure when it is clamped between the pressing structure and the chip support structure, thereby ensuring the accuracy of the test results.

[0022] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained from what is particularly pointed out in the description and drawings. Attached Figure Description

[0023] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0024] Figure 1 This is a schematic diagram of the bonding sealing performance testing auxiliary device according to Embodiment 1 of the present invention;

[0025] Figure 2 This is a schematic diagram of the chip interface module in Example 1;

[0026] Figure 3 This is a schematic diagram of the structure of the chip under test;

[0027] Figure 4 This is a schematic diagram of the structure of the chip interface module pressure-down auxiliary tooling according to Embodiment 2 of the present invention;

[0028] Figure 5 This is a schematic diagram of the pressure plate of the pressure auxiliary tooling in Example 2;

[0029] Figure 6 This is a schematic diagram of the chip interface module in Embodiment 2 of the present invention.

[0030] Figure label:

[0031] 1-Pressure generation module; 2-Pressure branching and control module; 3-Chip interface module; 4-Pressure detection module; 5-Pressure reading and recording module; 6-Pressure-down auxiliary fixture;

[0032] 31-Pressing structure; 32-Chip support structure; 33-Positioning guide shaft; 34-Reset spring;

[0033] 311-Air pressure inlet; 312-Air pressure outlet; 313-Elastic sealing gasket; 314-Chip mating structure; 315-Annular track groove;

[0034] 321 - Chip placement slot; 322 - Elastic support pad;

[0035] 51 - Microfluidic channel inlet; 52 - Microfluidic channel outlet; 53 - Microfluidic internal flow channel;

[0036] 601-Upper support plate; 602-Side support column; 603-Lower support plate; 604-Rotating handle; 605-Rotating rod; 606-Rotating gear; 607-Rotating screw; 608-Threaded sleeve; 609-Gear post; 610-Pressure plate; 611-Ball bearing. Detailed Implementation

[0037] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which constitute a part of the present invention and are used together with the embodiments of the present invention to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention.

[0038] Example 1

[0039] One specific embodiment of the present invention discloses an auxiliary device for testing the bonding performance of microfluidic chips, such as... Figure 1 As shown, it includes: a pressure generation module 1, a pressure distribution and control module 2, a chip interface module 3, and a pressure detection module 4; the pressure generation module 1 provides a pressure source to the pressure distribution and control module 2; the pressure distribution and control module 2 divides the pressure source into multiple pressure branches and controls the pressure of these branches; multiple pressure inlets 311 on the chip interface module 3 are interconnected with the multiple pressure branches; the pressure detection module 4 is connected to multiple pressure outlets 312 of the chip interface module 3 and can detect the pressure values ​​of the gas flowing out of the multiple pressure outlets 312; the internal flow channel of the microfluidic chip is connected between the pressure inlets 311 and the pressure outlets 312 of the chip interface module 3, and the bonding performance of the microfluidic chip can be determined by comparing the pressure before and after the gas flows through the microfluidic chip.

[0040] like Figure 3 As shown, a four-channel microfluidic chip structure is used as the chip under test. The microfluidic chip includes four microchannel inlets 51, four microchannel outlets 52, and four microfluidic internal channels 53. After the bonding of the upper and lower surfaces of the microfluidic chip is completed, the bonding condition of the chip under test needs to be inspected.

[0041] Specifically, the pressure generating module 1 is used to provide pressurized airflow; the pressure generating module 1 includes a gas generator, a pressure pump and connecting pipes; the connecting pipes are respectively connected to the gas generator and the pressure distribution and control module 2, and can provide a stable gas pressure source (airflow with a certain pressure) to the pressure distribution and control module 2.

[0042] In one specific embodiment of this example, the air pressure splitting and control module 2 includes: a flow distributor and an air pressure control unit; the flow distributor is used to split a single airflow into multiple airflows, and the air pressure control unit can regulate the pressure values ​​of the multiple airflows.

[0043] Specifically, the flow distributor splits multiple airflow paths, and the pressure control unit controls the pressure of these multiple airflow paths, thereby providing multiple controllable air pressures for the microfluidic chip under test. For example, the flow distributor can be a multi-channel air connector, a multi-channel air source distributor, or a multi-channel air outlet. After the flow distributor splits the air source path into multiple pressure branches, each pressure branch is equipped with a pressure control unit, thereby achieving pressure control of the multiple pressure branches. Preferably, the pressure control unit is a pressure transmitter with pressure display function or a digital display pressure controller.

[0044] Specifically, the air pressure detection module 4 uses an air pressure detector, which can detect the air pressure output from each pipeline in real time; and further display it on the display of the air pressure reading and recording module 5 connected to the air pressure detection module 4.

[0045] Furthermore, a gas storage device is connected to the end of the multiple gas pressure branches connected to the gas pressure detection module 4; preferably, the gas storage device is a pressure bladder with good extensibility, which can store the gas generated by the gas pressure generating module 1 on the one hand, and prevent the gas at the end of the gas line from leaking too quickly, causing the gas pressure detection module 4 to misdetect the pressure.

[0046] In this embodiment, as Figure 2 As shown, the chip interface module 3 includes: a pressing structure 31, a chip support structure 32, and a positioning guide shaft 33; the pressing structure 31 is arranged parallel above the chip support structure 32; at least two positioning guide shafts 33 are vertically arranged on the chip support structure 32, and the pressing structure 31 is slidably mounted on the positioning guide shafts 33; the microfluidic chip is disposed between the pressing structure 31 and the chip support structure 32.

[0047] like Figure 3 As shown, the microfluidic chip under test has a microfluidic internal channel 53 and a microfluidic inlet 51 and a microfluidic outlet 52 connecting the microfluidic internal channel 53 to the upper surface of the microfluidic chip.

[0048] Furthermore, the pressure structure 31 is provided with multiple sets of vertically penetrating air pressure inlets 311 and air pressure outlets 312; the multiple sets of air pressure inlets 311 and air pressure outlets 312 are respectively connected to multiple sets of microchannel inlets 51 and microchannel outlets 52 on the microfluidic chip under test.

[0049] Furthermore, the multiple air pressure inlets 311 on the pressure-reducing structure 31 are connected to the gas output interfaces of the multiple air pressure branches of the air pressure branch and control module 2. The gas output interfaces can be standard threaded hard pipe connectors, and the gas output interfaces are rotatably connected to the air pressure inlets 311 and sealed. The air pressure outlet 312 is connected to the gas input interface of the air pressure detection module 4. The gas input interface can be standard threaded hard pipe connectors, and the gas input interface is rotatably connected to the air pressure outlet 312 and sealed.

[0050] like Figure 2 As shown, the upper surface of the chip support structure 32 is provided with a recessed chip placement groove 321; in use, the microfluidic chip is placed in the chip placement groove 321.

[0051] Furthermore, an elastic support pad 322 is provided on the bottom surface of the chip placement slot 321. By placing a silicone pad structure in the chip placement slot 321 of the chip support structure 32, it is made to fit and seal against the lower surface of the chip under test, thereby protecting the chip under test from scratches.

[0052] Correspondingly, an elastic sealing gasket 313 is provided on the lower surface of the pressing structure 31. When the microfluidic chip is clamped between the pressing structure 31 and the chip support structure 32, the elastic sealing gasket 313 adheres to and seals the upper surface of the microfluidic chip, thereby achieving airtight contact between the microchannel inlet 51 and microchannel outlet 52 of the microfluidic chip and the air pressure inlet 311 and air pressure outlet 312 of the pressing structure 31, respectively, while protecting the chip under test from scratches.

[0053] Preferably, both the elastic sealing gasket 313 and the elastic support gasket 322 are made of soft silicone.

[0054] Furthermore, the lower surface of the elastic sealing gasket 313 is provided with a chip mating structure 314, which can mate with the upper surface of the microfluidic chip. The chip mating structure 314 can seal or mate with the grooves or protrusions on the upper surface of the microfluidic chip.

[0055] The auxiliary device for testing the bonding performance of microfluidic chips in this embodiment also includes a pressure reading and recording module 5 connected to the pressure detection module 4; the pressure reading and recording module 5 includes a display screen and a memory, the display screen is used to display the pressure before and after flowing through the microfluidic chip; the memory is used to record the pressure data detected by the pressure detection module 4.

[0056] During implementation, the chip interface module 3 needs to be compatible with the microfluidic chip under test, placing the microfluidic chip between the pressing structure 31 and the chip support structure 32. By applying downward pressure to the pressing structure 31, the microfluidic chip is pressed firmly onto the chip support structure 32. Simultaneously, a pressure sensor is installed between the pressing structure 31 and the microfluidic chip, or between the microfluidic chip and the chip support structure 32, to monitor the pressure on the microfluidic chip, ensuring that the pressure applied by the pressing structure 31 is within a set range. This prevents insufficient pressure from failing to achieve the sealing function, while also preventing excessive pressure from damaging the chip under test. The air pressure generated by the air pressure generation module 1 is split into multiple paths by the air pressure branch and control module 2 and then introduced into the multiple microfluidic internal channels 53 of the microfluidic chip. The air pressure detection module 4 detects the pressure change before and after the air pressure flows through the microfluidic chip, indirectly detecting the bonding effect of the microfluidic chip.

[0057] Example 2

[0058] A specific embodiment of the present invention is an improvement upon embodiment 1:

[0059] Considering that in order to ensure the accuracy of the microfluidic chip bonding performance test results, it is necessary to ensure that the pressure structure 31 has a certain pressure on the surface of the microfluidic chip; if the pressure is too small, the gas may overflow from the gap between the gas inlet 311 and the microfluidic inlet 51, resulting in inaccurate test results; if the pressure is too large, it may damage the microfluidic chip.

[0060] Based on this, in this embodiment, a pressing auxiliary tool 6 is designed to realize a stable and controllable pressing process of the pressing structure 31.

[0061] In this embodiment, as Figure 4 As shown, the pressing auxiliary tooling 6 includes: an upper support plate 601, a side support column 602, a lower support plate 603, and a rotating pressing assembly; the upper support plate 601 is parallel to the lower support plate 603, and the side support column 602 is fixedly installed between the upper support plate 601 and the lower support plate 603 to provide support and positioning for the upper support plate 601.

[0062] like Figure 4As shown, the rotary pressing assembly includes: a rotary handle 604, a rotary rod 605, a rotary gear 606, a rotary lead screw 607, a threaded sleeve 608, a gear post 609, and a pressure plate 610; specifically, the rotary rod 605 is rotatably mounted on the upper support plate 601 via bearings and is arranged perpendicular to the upper support plate 601; the rotary gear 606 is fixedly mounted on the lower end of the rotary rod 605 and rotates coaxially with the rotary rod 605; the threaded sleeve 608 is fixedly mounted below the upper support plate 601 and is arranged side by side with the rotary rod 605, that is, their axes are parallel to each other; The upper end of the rotating lead screw 607 is threadedly engaged with the threaded sleeve 608; a gear post 609 is fixedly mounted on the outside of the rotating lead screw 607, and the gear post 609 meshes with the rotating gear 606. When the rotating handle drives the rotating gear 606 to rotate, the gear post 609 drives the rotating lead screw 607 to rotate synchronously. When the rotating lead screw 607 rotates, it can move up and down relative to the threaded sleeve 608; a pressure plate 610 is mounted on the lower end of the rotating lead screw 607. When the rotating lead screw 607 moves down relative to the threaded sleeve 608, the pressure plate 610 gradually moves down synchronously.

[0063] Specifically, such as Figure 4 As shown, the axial length of the gear post 609 is greater than the axial length of the rotating gear 606; preferably, the length of the rotating lead screw 607 is greater than the length of the threaded sleeve 608; so that when the rotating lead screw 607 is within the maximum displacement stroke range, the gear post 609 and the rotating gear 606 do not disengage.

[0064] In use, the chip interface module 3 is placed between the pressure plate 610 and the lower support plate 603. When the rotating handle 604 is rotated, the rotating screw 607 drives the pressure plate 610 to move downward. The pressure plate 610 pushes the pressing structure 31 of the chip interface module 3 to move towards the chip support bearing structure 32, thereby realizing the pressing action of the pressing structure 31.

[0065] In one specific embodiment of the present invention, the rotating lead screw 607 and the pressure plate 610 are rotatably connected by a bearing; when the pressure plate 610 presses against the pressing structure 31 and the rotating lead screw 607 rotates and moves downward, it can push the pressure plate 610 to only move downward without rotating, thereby the pressure plate 610 can push the pressing structure 31 to move downward and press the microfluidic chip onto the chip support structure 32.

[0066] In another specific embodiment of the present invention, such as Figure 4 As shown, the rotating lead screw 607 is fixedly connected to the pressure plate 610, and multiple balls 611 are nested and installed on the lower surface of the pressure plate 610; the balls 611 can roll in the ball mounting groove at the bottom of the pressure plate 610. Correspondingly, as Figure 5As shown, the upper surface of the pressing structure 31 is provided with an annular track groove 315 that cooperates with the ball 611. When the rotating screw 607 drives the pressure plate 610 to rotate and move downward, the ball 611 can roll in the annular track groove 315, while pushing the pressing structure 31 downward and pressing the microfluidic chip.

[0067] Specifically, multiple balls 611 are evenly spaced along the circumference of the pressure plate 610; for example... Figure 6 As shown, two sets of balls 611 are nested on the bottom surface of the pressure plate 610, with four balls 611 in each set. The four balls 611 are spaced 90° apart, and the four balls 611 in the same set are arranged in a ring. Figure 6 As shown, the two sets of balls 611 are located on two concentric rings of different diameters.

[0068] Furthermore, the upper surface of the pressing structure 31 is provided with two concentric annular track grooves 315 of unequal diameter; as shown Figure 6 As shown.

[0069] In use, the ball bearing 611 is inserted into the annular track groove 315. Rotating the rotating handle 604 drives the rotating rod 605 and the rotating gear 606 to rotate synchronously. The rotating gear 606 drives the rotating screw 607 and the pressure plate 610 to rotate synchronously through meshing. Since the rotating screw 607 and the threaded sleeve 608 are screwed together, the rotating screw 607 gradually unscrews the threaded sleeve 608 during rotation, thereby driving the pressure plate 610 to rotate and move downward. The ball bearing 611 rolls along the annular track groove 315, pushing the pressing structure 31 downward and pressing the microchannel chip at the same time.

[0070] Furthermore, in order to ensure the connection between the chip interface module 3 and the air pressure branch and control module 2 and the air pressure detection module 4, the annular track groove 315 is set in the area between the air pressure inlet 311 and the air pressure outlet 312, and when the ball bearing 611 cooperates with the annular track groove 315, the pressure plate 610 does not block the air pressure inlet 311 and the air pressure outlet 312.

[0071] Furthermore, in order to facilitate the self-resetting effect of the pressing structure 31, in this embodiment, a reset spring 34 is sleeved and installed on the outside of the positioning guide shaft 33; and the upper and lower ends of the reset spring 34 are respectively pressed against the lower surface of the pressing structure 31 and the upper surface of the chip support bearing structure 32.

[0072] In this embodiment, the position of the pressure plate 610 can be adjusted by operating the rotating handle 604, thereby enabling the pressure plate 610 to press or release the pressing structure 31 of the chip interface module 3, and thus enabling the pressing structure 31 to press down on the microfluidic chip, while ensuring that the pressing process is slightly adjustable and controllable.

[0073] In this embodiment, since the rotating lead screw 607 and the threaded sleeve 308 are screwed together, when the pressure gas is generated by the air pressure generating module 1 and introduced into the chip interface module 3 and the microfluidic chip, due to the stability of the screw engagement between the rotating lead screw 607 and the threaded sleeve 308, the pressing structure 31 will not relax its pressing effect on the microfluidic chip under the action of the air pressure lifting pressure, thereby maintaining the stability and continuous operation of the detection process.

[0074] Example 3

[0075] In one specific embodiment of the present invention, a bonding performance testing method for microfluidic chips is provided, employing the auxiliary device for bonding performance testing of microfluidic chips described in Embodiment 1 or Embodiment 2.

[0076] The bonding performance testing method for the microfluidic chip of the present invention includes the following steps:

[0077] Step S1: Place the microfluidic chip to be tested between the pressure structure 31 and the chip support structure 32 of the chip interface module 3, and align the microchannel inlet 51 of the microfluidic chip with the air pressure inlet 311, and align the microchannel outlet 52 with the air pressure outlet 312.

[0078] Specifically, in step S1, the cooperation between the microfluidic chip and the chip interface module 3 is as follows:

[0079] Step S101: Place the microfluidic chip to be tested in the chip placement slot 321 of the chip support structure 32.

[0080] Step S102: Press down the pressing structure 31 until the elastic sealing gasket 313 contacts the upper surface of the microfluidic chip, so that the multiple microchannel inlets 51 on the microfluidic chip are aligned with and connected to the multiple air pressure inlets 311 on the pressing structure 31, and at the same time, the multiple microchannel outlets 52 on the microfluidic chip are aligned with and connected to the multiple air pressure outlets 312 on the pressing structure 31.

[0081] Step S103: The pressing structure 31 continues to press down until the pressure sensor value set on the surface of the microfluidic chip reaches the set pressure, and then stops pressing down.

[0082] In this invention, in step S1, the position of the chip interface module 3 is adjusted by using the pressure-down auxiliary tool 6.

[0083] Specifically, the adjustment method of the downward pressure auxiliary tooling 6 to the chip interface module 3 is as follows:

[0084] Step S111: Rotate the rotating handle 604, which drives the rotating gear 606 to rotate via the rotating rod 605;

[0085] Step S112: The rotating gear 606 meshes with the gear post 609 outside the rotating lead screw 607, causing the rotating lead screw 607 to rotate relative to the threaded sleeve 608, thereby enabling the rotating lead screw 607 to rotate downward relative to the threaded sleeve 608.

[0086] Step S113: The rotating lead screw 607 drives the pressure plate 610 fixedly connected to its end to rotate and move downward. The pressure plate 610 drives the ball bearings 611 on its lower surface to roll along the annular track groove 315 on the upper surface of the pressing structure 31. While the ball bearings 611 roll along the annular track groove 315, they press down on the pressing structure 31, so that the pressing structure 31 is pressed tightly against the upper surface of the microfluidic chip.

[0087] Step S2: Connect the air pressure branch and control module 2 between the air pressure generating module 1 and the chip interface module 3, and connect the multiple air pressure branches of the air pressure branch and control module 2 to the multiple air pressure inlets 311 of the chip interface module 3. At the same time, control the air pressure value entering the air pressure inlet 311 through the air pressure control unit of the air pressure branch and control module 2.

[0088] Preferably, the air pressure value entering the air pressure inlet 311 is set to 0.8-1.5 times the preset pressure value of the microfluidic chip under test.

[0089] Step S3: Connect the air pressure outlet 312 on the chip interface module 3 to the air pressure detection module 4.

[0090] Step S4: Open the pressure generation module 1, generate pressurized gas through the pressure generation module 1, and pass the pressurized gas into the pressure branch and control module 2 to split it into multiple pressure branches. Then, pass the multiple pressure branches into the microfluidic chip interface module 3 and its internal microfluidic chip. Detect the pressure of the gas before and after the microfluidic internal flow channel 53 flowing through the microfluidic chip, so as to determine the bonding effect of the microfluidic chip.

[0091] Specifically, in step S4, the pressurized gas is introduced into multiple pressurized inlets 311 through the pressurized branch, and the pressurized gas flows sequentially through the microfluidic inlet 51, the microfluidic inner channel 53, and the microfluidic outlet 52 before being discharged from the pressurized outlet 312; thus, the pressurized gas value after flowing through the microfluidic chip can be detected by the pressurized gas detection module 4.

[0092] Furthermore, in step S4, the pressure control module 2 controls the pressure of multiple pressure branches, enabling independent detection of multiple microfluidic internal channels 53 of the microfluidic chip; specifically, opening the pressure branch corresponding to the microfluidic internal channel 53 under test in the pressure branch and control module 2 enables bonding detection of the microfluidic internal channel 53 under test.

[0093] For example, the pneumatic branch corresponding to the first microfluidic internal channel 53 is opened, and then the pressurized gas flows through the corresponding pneumatic inlet 311 (first), microchannel inlet 51 (first), microfluidic internal channel 53 (first), and microchannel outlet 52 (first) before being discharged from the pneumatic outlet 312 (first). By observing the pressure change before and after the gas flows through the microfluidic internal channel 53, the bonding performance of the first microfluidic internal channel 53 can be tested. Similarly, the bonding test of other microfluidic internal channels 53 of the microfluidic chip can be completed in sequence.

[0094] Specifically, in step S4, the bonding performance of the microfluidic internal channel 53 of the microfluidic chip is judged as follows: if the input pressure and output pressure of the microfluidic internal channel 53 under test are the same or the error does not exceed 5%, and can be maintained stably, it indicates that the bonding of the microfluidic internal channel 53 is good. If the input pressure and output pressure of the microfluidic internal channel 53 under test are more than 5% different, it is considered that the channel has a bonding defect.

[0095] The bonding performance testing method for microfluidic chips in this embodiment is applicable to the quality inspection of microfluidic chips after the bonding step during the microfluidic chip manufacturing process. It reduces the loss of microfluidic chips during quality inspection, improves the speed of evaluating the bonding performance of multi-channel microfluidic chips and the accuracy of fault location, providing an effective and reliable solution for improving chip quality inspection efficiency.

[0096] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. An auxiliary device for testing the bonding performance of microfluidic chips, characterized in that, include: The air pressure generation module (1), the air pressure distribution and control module (2), the chip interface module (3), and the air pressure detection module (4) are included. The air pressure generating module (1) is used to provide an air pressure source to the air pressure distribution and control module (2); The air pressure branch and control module (2) is used to divide the air pressure source into multiple air pressure branches and control the pressure of the multiple air pressure branches at the same time. The multiple air pressure inlets (311) on the chip interface module (3) are interconnected with the multiple air pressure branches respectively; the air pressure detection module (4) is connected to the multiple air pressure outlets (312) of the chip interface module (3) and can detect the gas pressure value flowing out through the multiple air pressure outlets (312); the internal flow channel of the microfluidic chip is connected between the air pressure inlets (311) and air pressure outlets (312) of the chip interface module (3), and the bonding performance of the microfluidic chip can be judged by comparing the pressure before and after the gas flows through the microfluidic chip.

2. The auxiliary device for testing the bonding performance of microfluidic chips according to claim 1, characterized in that, The chip interface module (3) includes: a pressing structure (31), a chip support structure (32), and a positioning guide shaft (33); the pressing structure (31) is arranged parallel above the chip support structure (32); at least two positioning guide shafts (33) are vertically arranged on the chip support structure (32), and the pressing structure (31) is slidably mounted on the positioning guide shafts (33); the microfluidic chip is disposed between the pressing structure (31) and the chip support structure (32).

3. The auxiliary device for testing the bonding performance of microfluidic chips according to claim 2, characterized in that, The pressure structure (31) is provided with multiple sets of vertically penetrating air pressure inlets (311) and air pressure outlets (312); the multiple sets of air pressure inlets (311) and air pressure outlets (312) are respectively connected to multiple sets of microchannel inlets (51) and microchannel outlets (52) on the microfluidic chip under test.

4. The auxiliary device for testing the bonding performance of microfluidic chips according to claim 3, characterized in that, The upper surface of the chip support structure (32) is provided with a recessed chip placement groove (321), and the microfluidic chip is disposed in the chip placement groove (321).

5. The auxiliary device for testing the bonding performance of microfluidic chips according to claim 4, characterized in that, An elastic support pad (322) is provided on the bottom surface of the chip placement slot (321).

6. The auxiliary device for testing the bonding performance of microfluidic chips according to claim 5, characterized in that, The lower surface of the pressing structure (31) is provided with an elastic sealing gasket (313). When the microfluidic chip is clamped between the pressing structure (31) and the chip support structure (32), the elastic sealing gasket (313) adheres to and seals the upper surface of the microfluidic chip.

7. The auxiliary device for testing the bonding performance of microfluidic chips according to claim 6, characterized in that, The lower surface of the elastic sealing gasket (313) is provided with a chip mating structure (314), which can mate with the upper surface of the microfluidic chip.

8. The auxiliary device for testing the bonding performance of microfluidic chips according to any one of claims 1-7, characterized in that, It also includes a pressure reading and recording module (5) connected to the pressure detection module (4); the pressure reading and recording module (5) includes a display screen and a memory, the display screen is used to display the pressure before and after flowing through the microfluidic chip; the memory is used to record the pressure data detected by the pressure detection module (4).

9. The auxiliary device for testing the bonding performance of microfluidic chips according to any one of claims 1-7, characterized in that, The pressure splitting and control module (2) includes: a flow distributor and a pressure control unit; the flow distributor is used to split a single airflow into multiple airflows, and the pressure control unit can regulate the pressure value of the multiple airflows.

10. A method for testing the bonding performance of microfluidic chips, characterized in that, The bonding performance of a microfluidic chip is tested using the auxiliary device for bonding performance testing of a microfluidic chip as described in any one of claims 1-9.

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