A flexible adsorption-transfer system and placement method for reducing DIC anomalies in silicon wafers

Abstract

This invention discloses a flexible adsorption transfer system and placement method for reducing DIC (Displacement Injection) defects on silicon wafers, relating to the field of flexible adsorption transfer technology. The system includes a transfer system internally configured to clean the suction cups. The cleaning mechanism includes several sets of lifting and drying units, a cleaning unit, and several sets of liquid replenishment units. Each lifting and drying unit includes a mounting frame with a rotating shaft rotatably mounted inside. A rotating rod is fixedly mounted on the surface of the rotating shaft. Through the lifting and drying units, a micro-asynchronous motor drives the shaft and small bevel gears, causing the shaft column meshing with the large bevel gears and the cleaning cloth on the support plate to rotate. This rotary cleaning method can perform multi-angle, dead-loop wiping of the bottom of the suction cups, effectively removing particles, wax residue, and other contaminants adhering to the flexible adsorption pads, thereby reducing silicon wafer backside defects caused by suction cup contamination at the source and improving silicon wafer yield.

Description

Technical Field

[0001] This invention relates to the field of flexible adsorption transfer technology, specifically to a flexible adsorption transfer system and placement method for reducing DIC anomalies in silicon wafers. Background Technology

[0002] Silicon wafers are thin, round or square sheets made from high-purity polycrystalline silicon through a series of complex processes. They are key components in the manufacture of electronic devices such as integrated circuits and solar cells, providing the basic platform for the physical support and electrical connections of electronic components.

[0003] According to the patent titled "A Silicon Wafer Transfer Device and a Silicon Wafer Testing Device" (Patent Publication No.: CN109904103A, Patent Publication Date: 2019-06-18), the silicon wafer transfer device includes a main body, multiple robotic arms, and an adsorption element. Each of the multiple robotic arms is independently and rotatably connected to the main body. Each robotic arm includes a rod. The two ends of the rod are connected to the main body and the adsorption element, respectively. The adsorption element is configured to adsorb silicon wafers and allow selective desorption of the silicon wafers. This transfer device has multiple operating postures, thereby enabling the controlled silicon wafers to be switched between various postures as needed, in order to achieve operations such as sorting and testing of the silicon wafers with appropriate equipment.

[0004] Based on the aforementioned existing technologies, current flexible adsorption transfer systems and placement methods for reducing silicon wafer DIC anomalies still have the following problems: during the repeated adsorption of silicon wafers by traditional chucks, trace particles, wax residues, or previous process residues on the back of the silicon wafer gradually adhere to the flexible adsorption pad of the chuck. These contaminants can contaminate the back of subsequent silicon wafers, causing cross-contamination. Therefore, this invention provides a flexible adsorption transfer system and placement method for reducing silicon wafer DIC anomalies. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a flexible adsorption and transfer system and placement method for reducing DIC anomalies in silicon wafers. This solves the problem that during the repeated adsorption of silicon wafers by traditional chucks, trace particles, wax residues, or previous process residues on the back of the silicon wafer gradually adhere to the flexible adsorption pad of the chuck.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a flexible adsorption and transfer system and placement method for reducing DIC abnormalities in silicon wafers, comprising a transfer system, wherein the transfer system has an internal transfer mechanism for cleaning the suction cup, and the cleaning mechanism includes: Several sets of lifting and drying units include a mounting frame. A rotating shaft is rotatably mounted inside the mounting frame. A rotating rod is fixedly mounted on the surface of the rotating shaft. The rotating shaft and the rotating rod are driven to rotate by a rotating assembly. A fixing plate is fixedly mounted at the bottom end of the rotating rod. A shaft column is rotatably mounted inside the fixing plate. A large conical tooth is fixedly mounted on the bottom surface of the shaft column. A micro asynchronous motor is fixedly mounted at the bottom of the fixing plate. A shaft is fixedly mounted at the output end of the micro asynchronous motor. A small conical tooth is fixedly mounted at one end of the shaft. The small conical tooth meshes with the large conical tooth. The micro asynchronous motor drives the small conical tooth and the large conical tooth through the shaft to rotate the wiping assembly. The cleaning cloth on the wiping assembly rotates and cleans the bottom of the suction cup. The wiping assembly also includes a support plate fixedly installed on the top of the shaft column, and an mounting plate fixedly installed on one side of the support plate. A first locking post and a second locking post are rotatably installed on the inner side of the mounting plate, and a second micro motor is fixedly installed on the outer side of the mounting plate. The output end of the second micro motor passes through the mounting plate and is fixedly connected to the second locking post. A material unwinding wheel is clamped on the first locking post, and a winding wheel is clamped on the second locking post. The cleaning cotton cloth on the material unwinding wheel passes through the top of the support plate and is wound around the winding wheel. The second locking post and the winding wheel are driven to rotate by the second micro motor, so that the cleaning cotton cloth is moved and conveyed on the support plate to realize automatic replacement of cleaning cotton. The cleaning unit is located above the lifting and drying unit and is used to lift and lower the lifting and drying unit and the liquid replenishment unit, and to dry the cleaned suction cups. Several sets of liquid replenishment units are located above the lifting and drying unit and are used to replenish the cleaning cotton cloth with liquid.

[0007] Preferably, a support frame is fixedly installed at the bottom of the fixed plate, and the shaft rotates in the through hole inside the support frame. The shaft is supported by the support frame. A turntable is fixedly installed on the surface of the shaft, and an arc groove is opened on one side of the turntable. A fixed seat is fixedly installed on the inner side of the support frame, and a sliding column is fixedly installed on one side of the fixed seat. One end of the sliding column slides inside the arc groove. The rotation limit of the turntable is achieved by the sliding column inside the arc groove.

[0008] Preferably, a protective cover is fixedly installed on the bottom of the fixing plate, and the structure at the bottom of the fixing plate is located inside the protective cover to protect the structure at the bottom of the fixing plate. A heat dissipation hole is provided on one side of the protective cover to dissipate heat from the inside of the fixing plate.

[0009] Preferably, two support rods are fixedly installed between the support plate and the shaft column to support the support plate. The front ends of the first and second locking posts are both provided with threaded grooves. The front end of the first locking post is screwed with a second threaded button through the threaded groove, and the front end of the second locking post is screwed with a first threaded button through the threaded groove. The second threaded button limits the position of the unwinding material wheel, and the first threaded button limits the position of the winding wheel. The unwinding material wheel and the winding wheel can be replaced by rotating the second threaded button and the first threaded button, thereby replacing the cleaning cloth. Two limiting blocks are fixedly installed on both sides of the support plate to limit the movement of the cleaning cloth.

[0010] Preferably, a first housing is fixedly mounted on one side of the fastener frame by bolts, and a second housing is fixedly mounted on one side of the first housing by bolts. A worm gear is fixedly mounted on the surface of the rotating shaft. A worm is vertically rotatably mounted inside the first housing, and a first micro motor is fixedly mounted on the top of the first housing. The output end of the first micro motor passes through the first housing and is fixedly connected to the worm. The first micro motor drives the worm to rotate, causing the worm gear to drive the rotating shaft and the rotating rod to rotate, realizing the rotation and folding of the rotating rod. This allows the lifting and drying unit to present two modes: working state and non-working state. A limit stop is fixedly mounted on the inner side of the fastener frame to limit the rotation angle of the rotating rod.

[0011] Preferably, the cleaning unit includes a fixed frame, and a lifting cylinder is fixedly installed on the top of the fixed frame. The output end of the lifting cylinder passes through the fixed frame and is fixedly installed on a straight plate through a connecting block. A fastener frame is fixedly installed on the bottom of the straight plate. The lifting cylinder drives the straight plate to realize the overall lifting and lowering of the lifting and drying unit.

[0012] Preferably, two sleeves are fixedly installed on the top of the straight plate, a hot air blower is fixedly installed on the top of the fixing frame, and a connecting pipe is fixedly installed at the output end of the hot air blower. The connecting pipe is fixedly connected to the air distribution pipe. Several air spray pipes are fixedly installed on one side of the air distribution pipe, and the output end of the fixing frame faces the bottom of the suction cup. Hot air is generated by the operation of the hot air blower, and the hot air is delivered into the air distribution pipe through the connecting pipe and sprayed out through the air spray pipes to dry the bottom of the suction cup.

[0013] Preferably, the replenishment unit includes a top frame fixedly installed on top of the mounting bracket, and a liquid storage tank is fixedly installed on the top of the top frame. A liquid level sensor is fixedly installed on the top of the liquid storage tank, and its detection rod is inserted into the liquid storage tank. A suction tube is installed through the top of the liquid storage tank, and a small water pump is fixedly installed at one end of the suction tube. A delivery pipe is fixedly installed at the output end of the small water pump. One end of the delivery pipe passes through the top frame and is fixedly installed with a diversion pipe. Several droppers are fixedly installed at the bottom of the diversion pipe. By operating the small water pump, the cleaning alcohol inside the liquid storage tank is introduced into the diversion pipe through the suction tube and the delivery pipe, and then flows out through the droppers, causing the cleaning liquid to drip onto the cleaning cloth.

[0014] Preferably, the transfer system includes a frame, a second linear module is mounted on the top of the frame via a first linear module and a moving track, and a movable frame is fixedly mounted on the top of the second linear module. An air pump is fixedly mounted on the top of the movable frame, and a cylinder is fixedly mounted on the bottom of the movable frame. The air pump and the cylinder are connected by a pipe. A vacuum negative pressure machine is fixedly mounted on the front side of the movable frame. A mounting frame is fixedly mounted on the bottom end of the output shaft of the cylinder. The fixed frame is fixedly mounted on the front side of the mounting frame, and several suction cup modules are fixedly mounted inside the mounting frame. The vacuum negative pressure machine and the suction cup modules are connected by a flexible hose. A conveying module and a processing module are provided on the base plate of the transfer system.

[0015] This invention also discloses a flexible adsorption-transfer placement method for reducing DIC anomalies in silicon wafers, comprising the following steps: S1: After the silicon wafer is adsorbed and transferred from the conveying position to the processing position by the transfer system, the liquid replenishment unit is activated to drip the cleaning liquid onto the cleaning cloth; the cleaning unit is controlled to drive the lifting and drying unit to descend so that the cleaning cloth and the dropper are facing the adsorption part of the transfer system. S2: Control the rotating component to drive the rotating rod and the fixed plate to rotate, so that the wiping component moves to the working position; start the micro asynchronous motor, and drive the cleaning cloth on the shaft column and support plate to rotate through the shaft, small bevel teeth and large bevel teeth to wipe and clean the adsorption area; S3: After cleaning is completed, the micro asynchronous motor stops; the control rotation component drives the rotating rod to rotate in the opposite direction, so that the wiping component returns to the non-working position; the second micro motor is started, driving the second locking pin and the winding wheel to rotate, winding up the used cleaning cloth, and at the same time pulling out a new cleaning cloth from the unwinding material wheel to the support plate.

[0016] This invention provides a flexible adsorption-transfer system and placement method for reducing DIC anomalies in silicon wafers. Compared with existing technologies, it has the following advantages: 1. This flexible adsorption transfer system and placement method for reducing DIC anomalies in silicon wafers utilizes a lifting and drying unit. A micro-asynchronous motor drives a shaft and small conical teeth, which in turn rotate a cleaning cloth on a support plate and a shaft that meshes with large conical teeth. This rotary cleaning method allows for multi-angle, dead-loop-free wiping of the suction cup bottom, effectively removing particles, wax residue, and other contaminants adhering to the flexible adsorption pad. This fundamentally reduces silicon wafer backside defects caused by suction cup contamination, thereby improving silicon wafer yield.

[0017] 2. This flexible adsorption and transfer system and placement method for reducing DIC anomalies in silicon wafers utilizes a cleaning unit. A lifting cylinder drives a straight plate and a fixed lifting and drying unit to move up and down, allowing the cleaning cloth to precisely contact or leave the bottom of the suction cup. Simultaneously, an integrated hot air blower sprays hot air onto the cleaned suction cup bottom through connecting pipes, air distribution pipes, and spray pipes for rapid drying. This design avoids residual cleaning alcohol, ensuring the suction cup is dry and clean before subsequent adsorption operations, preventing silicon wafer slippage or water stains caused by liquid residue. 3. This flexible adsorption-transfer system and placement method for reducing DIC anomalies in silicon wafers features a replenishment unit. A small water pump pumps cleaning alcohol from the storage tank into a distribution pipe via a suction pipe and a delivery pipe, ultimately dripping it evenly onto the cleaning cloth through a dropper. A liquid level sensor monitors the liquid level in the storage tank in real time. This automatic replenishment mechanism ensures that the cleaning cloth receives an appropriate amount of fresh cleaning solution each time it is cleaned, maintaining stable and efficient cleaning capabilities and avoiding incomplete cleaning due to insufficient cleaning solution. This achieves automation and consistency in the cleaning process. Attached Figure Description

[0018] Figure 1 This is a frontal perspective view of the three-dimensional structure of the present invention; Figure 2 This is a three-dimensional structural diagram of the cleaning mechanism of the present invention; Figure 3 This is a partial right-side perspective view of the cleaning mechanism of the present invention. Figure 4 This is a partial cross-sectional perspective view of the cleaning unit of the present invention; Figure 5 This is a three-dimensional structural view of the rotating component of the present invention from the right rear view. Figure 6 This is a partial three-dimensional structural diagram of the rotating component of the present invention; Figure 7 This is a right-side perspective view of the wiping assembly of the present invention; Figure 8 This is a left-side perspective view of the wiping assembly of the present invention; Figure 9 This is a three-dimensional structural diagram of the cleaning mechanism of the present invention in its non-working state; Figure 10 This is a partial cross-sectional perspective view of the cleaning mechanism of the present invention in its non-working state.

[0019] In the diagram: 1. Transfer system; 11. Frame; 12. First linear module; 13. Moving track; 14. Second linear module; 15. Moving frame; 16. Air pump; 17. Vacuum negative pressure machine; 18. Suction cup module; 19. Cylinder; 110. Mounting frame; 111. Conveying module; 112. Processing module; 2. Cleaning mechanism; 21. Lifting and drying unit; 211. Fixture frame; 212. Rotating shaft; 2 13. Rotating rod; 214. Fixing plate; 215. Shaft column; 216. Large bevel gear; 217. Support frame; 218. Miniature asynchronous motor; 219. Small bevel gear; 2110. Turntable; 2111. Arc groove; 2112. Fixing seat; 2113. Sliding column; 2114. Protective cover; 2115. Shaft; 22. Cleaning unit; 221. Fixing frame; 222. Lifting cylinder; 223. Connecting block; 224. Straight plate; 225. Sleeve; 226. Air distribution duct; 227. Air jet duct; 228. Hot air blower; 229. Connecting pipe; 23. Liquid replenishment unit; 231. Liquid storage tank; 232. Liquid suction pipe; 233. Small water pump; 234. Delivery pipe; 235. Diverter pipe; 236. Dropper; 237. Top frame; 238. Liquid level sensor; 3. Rotating assembly; 31. First housing; 32. Second... 33. Housing; 34. Worm gear; 35. Worm; 36. First micro motor; 47. Limiting stop; 58. Wiping assembly; 49. Support plate; 40. Support rod; 41. Mounting plate; 42. Second micro motor; 43. First locking pin; 44. Second locking pin; 45. First threaded button; 46. Take-up roller; 47. Unwinding material roller; 48. Cleaning cloth; 49. Second threaded button; 40. Limiting block. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figures 1-10 The present invention provides a technical solution: A flexible adsorption transfer system and placement method for reducing DIC anomalies in silicon wafers includes a transfer system 1, which has a cleaning mechanism 2 for cleaning suction cups. Several sets of lifting and drying units 21 include a mounting frame 211. A rotating shaft 212 is rotatably mounted inside the mounting frame 211. A rotating rod 213 is fixedly mounted on the surface of the rotating shaft 212. The rotating shaft 212 and the rotating rod 213 are driven to rotate by a rotating assembly 3. A fixing plate 214 is fixedly mounted at the bottom end of the rotating rod 213. A shaft column 215 is rotatably mounted inside the fixing plate 214. A large bevel tooth 216 is fixedly mounted on the bottom surface of the shaft column 215. A micro asynchronous motor 218 is fixedly mounted at the bottom of the fixing plate 214. The micro asynchronous motor 218 is a 57BYG series two-phase hybrid stepper motor. The motor, in conjunction with the DM542 microstepping driver, achieves precise angle control and stable low-speed rotation. The output end of the micro asynchronous motor 218 is fixedly mounted with a shaft 2115. One end of the shaft 2115 is fixedly mounted with a small bevel gear 219, which meshes with a large bevel gear 216. The micro asynchronous motor 218 drives the small bevel gear 219 and the large bevel gear 216 through the shaft 2115 to rotate the wiping assembly 4. The cleaning cotton cloth 410 on the wiping assembly 4 rotates and cleans the bottom of the suction cup. The cleaning cotton cloth 410 is made of microfiber dust-free cloth, which has high liquid absorption and low lint characteristics. The wiping assembly 4 also includes a support plate 41 fixedly installed on the top of the shaft column 215, and an mounting plate 43 fixedly installed on one side of the support plate 41. A first locking post 45 and a second locking post 46 are rotatably installed on the inner side of the mounting plate 43, and a second micro motor 44 is fixedly installed on the outer side of the mounting plate 43. The second micro motor 44 is an N20 micro geared motor, which provides a stable winding torque. The output end of the second micro motor 44 passes through the mounting plate 43 and is fixedly connected to the second locking post 46. A material unwinding wheel 49 is clamped on the first locking post 45, and a winding wheel 48 is clamped on the second locking post 46. The cleaning cotton cloth 410 on the material unwinding wheel 49 passes through the top of the support plate 41 and is wound around the winding wheel 48. The second locking post 46 and the winding wheel 48 are driven to rotate by the second micro motor 44, so that the cleaning cotton cloth 410 is moved and conveyed on the support plate 41, thereby realizing automatic replacement of cleaning cotton. The cleaning unit 22 is located above the lifting and drying unit 21 and is used to lift and lower the lifting and drying unit 21 and the liquid replenishment unit 23, and to dry the cleaned suction cup. Several sets of liquid replenishment units 23 are arranged above the lifting and drying unit 21 and are used to replenish the cleaning cotton cloth 410.

[0022] In this embodiment, a support frame 217 is fixedly installed at the bottom of the fixed plate 214, and the shaft 2115 rotates in the through hole inside the support frame 217. The support frame 217 supports the shaft 2115. A turntable 2110 is fixedly installed on the surface of the shaft 2115, and an arc groove 2111 is opened on one side of the turntable 2110. A fixed seat 2112 is fixedly installed on the inner side of the support frame 217, and a sliding column 2113 is fixedly installed on one side of the fixed seat 2112. One end of the sliding column 2113 slides inside the arc groove 2111. The rotation limit of the turntable 2110 is achieved by the sliding column 2113 inside the arc groove 2111.

[0023] By sliding the slide column 2113 within the arc groove 2111, the rotation angle of the turntable 2110 and the shaft 2115 is mechanically limited, thereby precisely controlling the swing range of the small bevel tooth 219 driving the large bevel tooth 216, ensuring that the cleaning action of the wiping assembly 4 is stable within the preset angle. The length of the arc groove 2111 determines the swing angle of the shaft 2115 and the small bevel tooth 219, which is set to 270 degrees, thereby realizing the forward and reverse cleaning of the cleaning cloth 410 and the reset of the wiping assembly 4.

[0024] In this embodiment, a protective cover 2114 is fixedly installed on the bottom of the fixing plate 214, and the structure at the bottom of the fixing plate 214 is located inside the protective cover 2114 to protect the structure at the bottom of the fixing plate 214. A heat dissipation hole is provided on one side of the protective cover 2114 to dissipate heat inside the fixing plate 214.

[0025] The protective cover 2114 encapsulates and protects the precision transmission structure such as the miniature asynchronous motor 218 and bevel gear at the bottom of the fixing plate 214, effectively preventing dust, moisture or accidental contact from contaminating or damaging these structures. At the same time, the heat dissipation holes on the side promote internal air circulation, helping to dissipate the heat generated by the miniature asynchronous motor 218 and other components during operation, preventing overheating from causing a decrease in motor performance or a shortened lifespan, thereby ensuring the long-term stable operation of the core drive components of the lifting and drying unit 21.

[0026] In this embodiment, two support rods 42 are fixedly installed between the support plate 41 and the shaft column 215 to support the support plate 41. The front ends of the first locking post 45 and the second locking post 46 are both provided with threaded grooves. The front end of the first locking post 45 is screwed with a second threaded button 411 through the threaded groove, and the front end of the second locking post 46 is screwed with a first threaded button 47 through the threaded groove. The second threaded button 411 limits the position of the unwinding material wheel 49, and the first threaded button 47 limits the position of the winding wheel 48. The unwinding material wheel 49 and the winding wheel 48 can be replaced by rotating the second threaded button 411 and the first threaded button 47, so as to replace the cleaning cotton cloth 410. Two limiting blocks 412 are fixedly installed on both sides of the support plate 41 to limit the movement of the cleaning cotton cloth 410.

[0027] Support rod 42 enhances the rigidity of the connection between support plate 41 and shaft column 215; first threaded button 47 and second threaded button 411, through a simple threaded locking method, enable quick installation, fixing, and disassembly of take-up roller 48 and unwind material roller 49, facilitating operator replacement of cleaning cloth 410 rolls; limit blocks 412 on both sides constrain the path of cleaning cloth 410 as it moves on support plate 41, preventing it from deviating, wrinkling, or slipping, ensuring the accuracy of cleaning cloth 410 conveying and positioning, and thus guaranteeing uniform cleaning effect. Limit blocks 412 are made of polyoxymethylene low-friction coefficient material, reducing wear on cleaning cloth 410.

[0028] In this embodiment, a first housing 31 is fixedly installed on one side of the fastener frame 211 by bolts, and a second housing 32 is fixedly installed on one side of the first housing 31 by bolts. A worm gear 33 is fixedly installed on the surface of the rotating shaft 212. A worm 34 is vertically rotatably installed inside the first housing 31, and a first micro motor 35 is fixedly installed on the top of the first housing 31. The output end of the first micro motor 35 passes through the first housing 31 and is fixedly connected to the worm 34. The first micro motor 35 drives the worm 34 to rotate, so that the worm gear 33 drives the rotating shaft 212 and the rotating rod 213 to rotate, thereby realizing the rotation and folding of the rotating rod 213. This allows the lifting and drying unit 21 to present two modes: working state and non-working state. A limit stop bar 36 is fixedly installed on the inner side of the fastener frame 211 to limit the rotation angle of the rotating rod 213.

[0029] The first micro motor 35 is a 28BYJ-48 type five-wire four-phase geared stepper motor with a self-locking function. The first micro motor 35 drives the worm gear 34 to drive the worm wheel 33, thereby precisely controlling the rotation of the rotating shaft 212 and the rotating rod 213, realizing the switching between the working position and the non-working position of the lifting drying unit 21. The worm gear mechanism has the characteristics of smooth transmission and reverse self-locking, and can maintain the position lock in the power failure state. The limit stop bar 36 provides physical limit, which together ensures the accuracy of the rotation angle of the rotating rod 213 and the stability in the non-working state, optimizes the spatial layout of the equipment and improves safety.

[0030] In this embodiment, the cleaning unit 22 includes a fixed frame 221, and a lifting cylinder 222 is fixedly installed on the top of the fixed frame 221. The output end of the lifting cylinder 222 passes through the fixed frame 221 and a straight plate 224 is fixedly installed through the connecting block 223. The fastener frame 211 is fixedly installed on the bottom of the straight plate 224. The lifting cylinder 222 drives the straight plate 224 to realize the overall lifting and lowering of the drying unit 21.

[0031] The lifting cylinder 222 is an SC series thin cylinder. Its stroke is set according to the height difference between the suction cup 18 and the cleaning station. Through the linear movement of the lifting cylinder 222, the connecting block 223 drives the straight plate 224 and the entire lifting drying unit 21 and the liquid replenishment unit 23 installed at its bottom to perform vertical lifting and lowering movements. This allows the cleaning cloth 410 and the dropper 236 to be accurately raised and lowered to the position of contact or separation with the bottom of the suction cup 18, realizing the rapid docking and separation of the cleaning, liquid replenishment, and drying station with the working plane of the suction cup 18. It is a key action execution link to complete the automated cleaning process.

[0032] In this embodiment, two sleeves 225 are fixedly installed on the top of the straight plate 224, a hot air blower 228 is fixedly installed on the top of the fixing frame 221, and a connecting pipe 229 is fixedly installed at the output end of the hot air blower 228. The connecting pipe 229 is fixedly connected to the air distribution pipe 226. Several air spray pipes 227 are fixedly installed on one side of the air distribution pipe 226, and the output end of the fixing frame 221 faces the bottom of the suction cup. Hot air is generated by the operation of the hot air blower 228, and the hot air is delivered to the inside of the air distribution pipe 226 through the connecting pipe 229 and sprayed out through the air spray pipes 227 to dry the bottom of the suction cup.

[0033] The hot air blower 228 is a small centrifugal hot air blower, and the outlet of the air spray pipe 227 is designed as a flat slit to expand the drying area. The hot air generated by the hot air blower 228 at a controllable temperature is delivered to the air distribution pipe 226 through the connecting pipe 229, and finally blown evenly and centrally onto the bottom of the cleaned suction cup 18 through multiple air spray pipes 227. This design can quickly evaporate any cleaning alcohol or moisture that may remain after cleaning, ensuring the dryness of the suction surface of the suction cup 18 and avoiding poor adhesion of the silicon wafer, leaving marks or causing other contamination due to liquid residue.

[0034] In this embodiment, the replenishment unit 23 includes a top frame 237 fixedly installed on the top of the mounting frame 211, and a liquid storage tank 231 fixedly installed on the top of the top frame 237. A liquid level sensor 238 is fixedly installed on the top of the liquid storage tank 231, and its detection rod is inserted into the liquid storage tank 231. A suction pipe 232 is installed through the top of the liquid storage tank 231, and a small water pump 233 is fixedly installed at one end of the suction pipe 232. A delivery pipe 234 is fixedly installed at the output end of the small water pump 233. One end of the delivery pipe 234 passes through the top frame 237 and is fixedly installed with a diversion pipe 235. Several droppers 236 are fixedly installed at the bottom of the diversion pipe 235. When the small water pump 233 is running, the cleaning alcohol inside the liquid storage tank 231 is introduced into the diversion pipe 235 through the suction pipe 232 and the delivery pipe 234, and flows out through the droppers 236 so that the cleaning liquid drips onto the cleaning cotton cloth 410.

[0035] The liquid level sensor 238 is a capacitive liquid level sensor, the small water pump 233 is a 12V DC diaphragm pump, the drip tube 236 can be a silicone tube with a regulating valve at the end to control the drip rate, the storage tank 231 stores cleaning alcohol, the liquid level sensor 238 monitors the liquid volume, and the small water pump 233 serves as the power source to pump liquid as needed. The liquid is distributed through the delivery pipe 234 and the distribution pipe 235, and finally, multiple drip tubes 236 precisely and evenly drip the cleaning solution onto the cleaning cloth 410. This achieves automatic and quantitative replenishment of the cleaning solution, ensuring the effectiveness of each cleaning operation, reducing manual intervention, and improving the automation and consistency of the entire cleaning process.

[0036] In this embodiment, the transfer system 1 includes a frame 11. A second linear module 14 is mounted on the top of the frame 11 via a first linear module 12 and a moving track 13. A movable frame 15 is fixedly mounted on the top of the second linear module 14. An air pump 16 is fixedly mounted on the top of the movable frame 15. A cylinder 19 is fixedly mounted on the bottom of the movable frame 15. The air pump 16 and the cylinder 19 are connected by a pipe. A vacuum negative pressure machine 17 is fixedly mounted on the front side of the movable frame 15. A mounting frame 110 is fixedly mounted on the bottom end of the output shaft of the cylinder 19. A fixed frame 221 is fixedly mounted on the front side of the mounting frame 110. Several suction cup modules 18 are fixedly mounted inside the mounting frame 110. The vacuum negative pressure machine 17 and the suction cup modules 18 are connected by a flexible hose. A conveying module 111 and a processing module 112 are provided on the base plate of the transfer system 1.

[0037] The first linear module 12 is a ball screw type linear module responsible for Y-axis movement, and the second linear module 14 is a ball screw type linear module responsible for X-axis movement. The vacuum negative pressure machine 17 is an oil-free rotary vane vacuum pump that provides stable negative pressure for the suction cup module 18. Each suction cup module 18 includes a flexible silicone suction pad. The conveying module 111 uses a belt conveyor. The two linear modules enable precise and rapid movement of the mounting frame 110 and the suction cup module 18 in the X and Y directions in the horizontal plane. The cylinder 19 controls the vertical lifting and lowering of the suction cup module 18. The vacuum negative pressure machine 17 and the air pump 16 provide power for suction and cylinder respectively. Finally, they work together to realize the core transfer function of adsorbing, transporting and accurately placing the silicon wafer from the conveying module 111 onto the processing module 112, which is the basis for the movement and execution of the entire system.

[0038] A flexible adsorption-transfer placement method for reducing DIC anomalies in silicon wafers, characterized by the following steps: S1: This invention also discloses a flexible adsorption transfer placement method for reducing DIC anomalies in silicon wafers, comprising the following steps: S1: After the silicon wafer is adsorbed and transferred from the conveying position to the processing position by the transfer system 1, the liquid replenishment unit 23 is started to drip the cleaning liquid onto the cleaning cotton cloth 410; the cleaning unit 22 is controlled to drive the lifting and drying unit 21 to descend, so that the cleaning cotton cloth 410 and the dropper 236 are facing the adsorption part of the transfer system. S2: Control the rotating component 3 to drive the rotating rod 213 and the fixed plate 214 to rotate, so that the wiping component 4 moves to the working position; start the micro asynchronous motor 218, and drive the shaft column 215 and the cleaning cloth 410 on the support plate 41 to rotate through the shaft 2115, the small bevel gear 219 and the large bevel gear 216 to wipe and clean the adsorption part. S3: After cleaning is completed, the micro asynchronous motor 218 stops; the control rotation component 3 drives the rotating rod 213 to rotate in the opposite direction, so that the wiping component 4 is reset to the non-working position; the second micro motor 44 is started to drive the second locking post 46 and the winding wheel 48 to rotate, and the used cleaning cloth 410 is wound up, while a new cleaning cloth 410 is pulled out from the unwinding material wheel 49 onto the support plate 41.

[0039] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0040] During operation, firstly, the conveying module 111 transports the silicon wafer. The air pump 16 operates to inject gas into the cylinder 19 through the pipeline, causing the mounting frame 110, the cylinder 19, and the cleaning mechanism 2 to descend, so that the suction cup of the suction cup module 18 contacts the silicon wafer on the conveying module 111. After contact, the vacuum negative pressure machine 17 operates to generate negative pressure on the suction cup module 18 through the hose, and the silicon wafer is adsorbed on the suction cup module 18. The cylinder 19 operates to lift the mounting frame 110 and the cleaning mechanism 2, causing the silicon wafer to rise. Next, the first linear module 12 moves and drives the second linear module 14 to move back and forth, and the second linear module 14 moves and drives the moving frame 15 to move left and right, so that the suction cup module 18 carries the silicon wafer to the processing module 112. Then, the lifting cylinder 222 operates, driving the straight plate 224 to descend via the connecting block 223. The straight plate 224 drives the air distribution pipe 226 to move downward synchronously via the sleeve 225, so that the output end of the spray pipe 227 is directly facing the bottom of the suction cup on the suction cup module 18. The small water pump 233 operates to transport the cleaning alcohol inside the liquid storage tank 231 to the inside of the distribution pipe 235 through the liquid suction pipe 232 and the delivery pipe 234, and drips it onto the cleaning cotton cloth 410 through the dropper 236 to replenish the cleaning cotton cloth 410. The first micro motor 35 operates to drive the worm gear 34 to rotate. The worm gear 34 drives the worm wheel 33 to rotate. The worm wheel 33 drives the rotating shaft 212, the rotating rod 213 and the fixed plate 214 to rotate, driving the rotating rod 213, the fixed plate 214 and the wiping assembly 4 to rotate 180 degrees. Finally, the reciprocating rotation of the micro asynchronous motor 218 drives the shaft 2115 to rotate synchronously, which in turn drives the turntable 2110 to rotate synchronously, causing the sliding column 2113 to slide inside the arc groove 2111. The shaft 2115 drives the large bevel gear 216 to rotate via the small bevel gear 219, which in turn drives the shaft 215 to rotate. The shaft 215 then drives the support plate 41 and the cleaning cloth 410 to rotate, causing the cleaning cloth 410 to rotate and clean the dust on the suction cup at the bottom of the suction cup module 18. After the wiping component 4 finishes its work and resets, the rotating component 3 drives the rotating... Shaft 212, rotating rod 213 and fixed plate 214 rotate in opposite directions to make rotating rod 213 snap into the slot of fastener frame 211. After snapping in, the second linear module 14 runs and drives the take-up wheel 48 to rotate. The cleaning cloth 410 on the support plate 41 is wound up by the take-up wheel 48, and the new cleaning cloth on the unwinding material wheel 49 is moved to the top of the support plate 41. When the new cleaning cloth 410 moves, the liquid replenishment unit 23 runs and drips cleaning alcohol onto the cleaning cloth 410 that is about to move to the support plate 41 on the unwinding material wheel 49 to replenish the liquid.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flexible adsorptive transfer system for reducing silicon wafer DIC anomalies, comprising a transfer system, characterized in that: The transfer system has an internal transfer mechanism for cleaning the suction cup, and the cleaning mechanism includes: Several sets of lifting and drying units include a mounting frame. A rotating shaft is rotatably mounted inside the mounting frame. A rotating rod is fixedly mounted on the surface of the rotating shaft. The rotating shaft and the rotating rod are driven to rotate by a rotating assembly. A fixing plate is fixedly mounted at the bottom end of the rotating rod. A shaft column is rotatably mounted inside the fixing plate. A large conical tooth is fixedly mounted on the bottom surface of the shaft column. A micro asynchronous motor is fixedly mounted at the bottom of the fixing plate. A shaft is fixedly mounted at the output end of the micro asynchronous motor. A small conical tooth is fixedly mounted at one end of the shaft. The small conical tooth meshes with the large conical tooth. The micro asynchronous motor drives the small conical tooth and the large conical tooth through the shaft to rotate the wiping assembly. The cleaning cloth on the wiping assembly rotates and cleans the bottom of the suction cup. The wiping assembly also includes a support plate fixedly installed on the top of the shaft column, and an mounting plate fixedly installed on one side of the support plate. A first locking post and a second locking post are rotatably installed on the inner side of the mounting plate, and a second micro motor is fixedly installed on the outer side of the mounting plate. The output end of the second micro motor passes through the mounting plate and is fixedly connected to the second locking post. A material unwinding wheel is clamped on the first locking post, and a winding wheel is clamped on the second locking post. The cleaning cotton cloth on the material unwinding wheel passes through the top of the support plate and is wound around the winding wheel. The second locking post and the winding wheel are driven to rotate by the second micro motor, so that the cleaning cotton cloth is moved and conveyed on the support plate to realize automatic replacement of cleaning cotton. The cleaning unit is located above the lifting and drying unit and is used to lift and lower the lifting and drying unit and the liquid replenishment unit, and to dry the cleaned suction cups. Several sets of liquid replenishment units are located above the lifting and drying unit and are used to replenish the cleaning cotton cloth with liquid.

2. The flexible adsorption transfer system for reducing silicon wafer DIC abnormality according to claim 1, wherein: A support frame is fixedly installed at the bottom of the fixed plate, and the shaft rotates in the through hole inside the support frame. The shaft is supported by the support frame. A turntable is fixedly installed on the surface of the shaft, and an arc groove is opened on one side of the turntable. A fixed seat is fixedly installed on the inner side of the support frame, and a sliding column is fixedly installed on one side of the fixed seat. One end of the sliding column slides inside the arc groove. The rotation limit of the turntable is achieved by the sliding column inside the arc groove.

3. The flexible adsorption transfer system for reducing silicon wafer DIC abnormality according to claim 1, wherein: A protective cover is fixedly installed on the bottom of the fixing plate, and the structure at the bottom of the fixing plate is located inside the protective cover to protect the structure at the bottom of the fixing plate. A heat dissipation hole is provided on one side of the protective cover to dissipate heat from the inside of the fixing plate.

4. The flexible adsorption transfer system for reducing silicon wafer DIC abnormality according to claim 1, wherein: Two support rods are fixedly installed between the support plate and the shaft column to support the support plate. The front ends of the first and second locking pins are both provided with threaded grooves. The front end of the first locking pin is screwed with a second threaded button through the threaded groove, and the front end of the second locking pin is screwed with a first threaded button through the threaded groove. The second threaded button limits the position of the unwinding material wheel, and the first threaded button limits the position of the winding wheel. The unwinding material wheel and the winding wheel can be replaced by rotating the second threaded button and the first threaded button, so as to replace the cleaning cloth. Two limiting blocks are fixedly installed on both sides of the support plate to limit the movement of the cleaning cloth.

5. The flexible adsorption transfer system for reducing silicon wafer DIC abnormality according to claim 1, wherein: A first housing is bolted to one side of the fastener frame, and a second housing is bolted to one side of the first housing. A worm gear is fixedly mounted on the surface of the rotating shaft. A worm is vertically rotatably mounted inside the first housing, and a first micro motor is fixedly mounted on the top of the first housing. The output end of the first micro motor passes through the first housing and is fixedly connected to the worm. The first micro motor drives the worm to rotate, causing the worm gear to drive the rotating shaft and the rotating rod to rotate, realizing the rotation and folding of the rotating rod. This allows the lifting and drying unit to present two modes: working state and non-working state. A limit stop is fixedly mounted on the inner side of the fastener frame to limit the rotation angle of the rotating rod.

6. The flexible adsorption transfer system for reducing silicon wafer DIC abnormality according to claim 1, wherein: The cleaning unit includes a fixed frame, and a lifting cylinder is fixedly installed on the top of the fixed frame. The output end of the lifting cylinder passes through the fixed frame and is fixedly installed on a straight plate through a connecting block. A fastener frame is fixedly installed on the bottom of the straight plate. The lifting cylinder drives the straight plate to achieve the overall lifting and lowering of the drying unit.

7. The flexible adsorption transfer system for reducing silicon wafer DIC abnormality according to claim 6, wherein: Two sleeves are fixedly installed on the top of the straight plate. A hot air blower is fixedly installed on the top of the fixing frame. A connecting pipe is fixedly installed at the output end of the hot air blower and is fixedly connected to the air distribution pipe. Several air spray pipes are fixedly installed on one side of the air distribution pipe. The output end of the fixing frame faces the bottom of the suction cup. Hot air is generated by the operation of the hot air blower and is transported into the air distribution pipe through the connecting pipe. The hot air is then sprayed out through the air spray pipes to dry the bottom of the suction cup.

8. The flexible adsorption-transfer system for reducing DIC anomalies in silicon wafers according to claim 1, characterized in that: The replenishment unit includes a top frame fixedly installed on top of the mounting bracket, and a liquid storage tank fixedly installed on the top of the top frame. A liquid level sensor is fixedly installed on the top of the liquid storage tank, and its detection rod is inserted into the liquid storage tank. A suction tube is installed through the top of the liquid storage tank, and a small water pump is fixedly installed at one end of the suction tube. A delivery pipe is fixedly installed at the output end of the small water pump. One end of the delivery pipe passes through the top frame and is fixedly installed with a diversion pipe. Several droppers are fixedly installed at the bottom of the diversion pipe. When the small water pump is running, the cleaning alcohol inside the liquid storage tank is introduced into the diversion pipe through the suction tube and the delivery pipe, and then flows out through the droppers, causing the cleaning solution to drip onto the cleaning cloth.

9. A flexible adsorption-transfer system for reducing DIC anomalies in silicon wafers according to claim 6, characterized in that: The transfer system includes a frame. A second linear module is mounted on the top of the frame via a first linear module and a moving track. A movable frame is fixedly mounted on the top of the second linear module. An air pump is fixedly mounted on the top of the movable frame, and a cylinder is fixedly mounted on the bottom of the movable frame. The air pump and the cylinder are connected by a pipe. A vacuum negative pressure machine is fixedly mounted on the front side of the movable frame. A mounting frame is fixedly mounted on the bottom end of the output shaft of the cylinder. The fixed frame is fixedly mounted on the front side of the mounting frame, and several suction cup modules are fixedly mounted inside the mounting frame. The vacuum negative pressure machine and the suction cup modules are connected by a flexible hose. A conveying module and a processing module are provided on the base plate of the transfer system.

10. A flexible adsorption-transfer system for reducing DIC anomalies in silicon wafers, employing the flexible adsorption-transfer placement method for reducing DIC anomalies in silicon wafers as described in any one of claims 1-9, characterized in that: Includes the following steps: S1: After the silicon wafer is adsorbed and transferred from the conveying position to the processing position by the transfer system, the liquid replenishment unit is activated to drip the cleaning liquid onto the cleaning cloth; the cleaning unit is controlled to drive the lifting and drying unit to descend so that the cleaning cloth and the dropper are facing the adsorption part of the transfer system. S2: Control the rotation component to drive the rotating rod and the fixed plate to rotate, so that the wiping component moves to the working position; Start the micro asynchronous motor, which drives the shaft column and the cleaning cloth on the support plate to rotate through the shaft, small bevel teeth and large bevel teeth, and wipes and cleans the adsorption area; S3: After cleaning is completed, the micro asynchronous motor stops; the control rotation component drives the rotating rod to rotate in the opposite direction, so that the wiping component returns to the non-working position; the second micro motor is started, driving the second locking pin and the winding wheel to rotate, winding up the used cleaning cloth, and at the same time pulling out a new cleaning cloth from the unwinding material wheel to the support plate.

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