Optimization of nitrogen diffuser for reducing dross in wave solder machine

Abstract

A wave solder machine performs a wave solder operation on an electronic substrate. The wave solder machine includes a wave solder station having a solder tank with a reservoir of solder, a flow conduit disposed in the reservoir of the solder tank, and a wave solder nozzle assembly coupled to the flow conduit. The nozzle assembly is configured to generate a solder wave. The wave solder machine further includes a conveyor configured to transport the electronic substrate to the wave solder station, at least one first gas diffuser configured to supply a gas to flow over the solder wave on each side of the solder wave and provide a layer of the gas above the solder wave, and at least one second gas diffuser configured to supply a gas under the solder wave on each side of the solder wave and provide a layer of the gas under the solder wave.

Description

Background of the Invention 1. Technical Field This disclosure generally relates to apparatus and methods for manufacturing printed circuit boards and for assisting in the process of soldering metal to integrated circuit boards, and more specifically, to a wave soldering machine and related methods having a wave soldering nozzle assembly including a nitrogen diffuser strategically arranged within the wave soldering station to generate a more complete inert atmosphere during the wave soldering process. 2. Background Technology In the manufacture of printed circuit boards (PCBs), electronic components are mounted onto the PCBs using a process known as "wave soldering." In a typical wave soldering machine, the PCB (sometimes called a "PCB") moves along an inclined path via a conveyor, passing through a flux handling station, a preheating station, and finally the wave soldering station. At the wave soldering station, a wave of solder is propelled (by a pump) through the wave soldering nozzles upwards and contacts the portions of the PCB to be soldered.

[0002] Printed wiring boards, circuit boards, and other components are preferably soldered in a gaseous atmosphere with at least partially reduced oxygen content. The benefits of soldering in an atmosphere with reduced oxygen content are known. The use of nitrogen diffusers is known. Figure 1 shows a wave soldering station 2 configured to generate solder waves. The wave soldering station 2 includes three nitrogen diffusers 4, 6, and 8 located at known positions within the wave soldering station 2. In this known system, the nitrogen diffusers 4, 6, and 8 are positioned above the solder waves generated by the wave soldering station 2. Therefore, an inert atmosphere is generated only in the space above the solder waves. Summary of the Invention

[0003] One aspect of this disclosure relates to a wave soldering machine for performing wave soldering operations on an electronic substrate. In one embodiment, the wave soldering machine includes a wave soldering station comprising a solder tank having a solder reservoir, a flow conduit disposed in the reservoir of the solder tank, and a wave soldering nozzle assembly coupled to the flow conduit. The nozzle assembly is configured to generate a solder wave. The wave soldering machine further includes: a conveyor configured to transport an electronic substrate to the wave soldering station; at least one first gas diffuser configured to supply gas such that the gas flows over the solder wave on each side and provides a gas layer over the solder wave; and at least one second gas diffuser configured to supply gas below the solder wave on each side and provide a gas layer below the solder wave.

[0004] Embodiments of the wave soldering machine may further include: configuring at least one first gas diffuser to include two gas diffusers disposed above the solder wave. One of the at least one first gas diffusers may be disposed on the loading side of the solder wave, and the other of the at least one first gas diffuser may be disposed on the unloading side of the solder wave. At least one second gas diffuser may include two gas diffusers disposed below the nozzle assembly and below the solder wave. One of the at least one second gas diffuser may be disposed below the nozzle assembly on the loading side of the solder wave, and the other of the at least one second gas diffuser may be disposed below the nozzle assembly on the unloading side of the solder wave. At least one second gas diffuser may include two gas diffusers disposed below the nozzle assembly and below the solder wave. One of the at least one second gas diffuser may be disposed below the nozzle assembly on the loading side of the solder wave, and the other of the at least one second gas diffuser may be disposed below the nozzle assembly on the unloading side of the solder wave. Each of at least one first gas diffuser and at least one second gas diffuser is coupled to a gas supply source configured to deliver inert gas to the gas diffuser in the at least one first gas diffuser and at least one second gas diffuser. The nozzle assembly may further include a core frame supported by a flow conduit and configured to support a solder dispensing baffle.

[0005] Another aspect of this disclosure relates to a method for providing an inert gas layer for a solder wave. In one embodiment, the method includes: generating a solder wave within a wave soldering station of a wave soldering machine; conveying an electronic substrate above the solder wave; supplying an inert gas above the solder wave on each side of the solder wave via at least one first gas diffuser, and providing a gas layer above the solder wave; and supplying the inert gas via at least one second gas diffuser, the at least one second gas diffuser being configured to supply gas below the solder wave on each side of the solder wave, and providing a gas layer below the solder wave.

[0006] Embodiments of the method may further include: transporting an electronic substrate above a solder wave by moving the electronic substrate on a conveyor. The method may further include: arranging two gas diffusers from at least one first gas diffuser above the solder wave. One of the gas diffusers in the at least one first gas diffuser may be positioned on the loading side of the solder wave, and the other gas diffuser in the at least one first gas diffuser may be positioned on the unloading side of the solder wave. The method may further include: arranging two gas diffusers from at least one second gas diffuser below a nozzle assembly and below the solder wave. One of the gas diffusers in the at least one second gas diffuser may be positioned below the nozzle assembly on the loading side of the solder wave, and the other gas diffuser in the at least one second gas diffuser may be positioned below the nozzle assembly on the unloading side of the solder wave. The method may further include: arranging two gas diffusers from at least one second gas diffuser below a nozzle assembly and below the solder wave. One of the gas diffusers in the at least one second gas diffuser may be positioned below the nozzle assembly on the loading side of the solder wave, and the other gas diffuser in the at least one second gas diffuser may be positioned below the nozzle assembly on the unloading side of the solder wave. Supplying inert gas via at least one first gas diffuser and supplying inert gas via at least one second gas diffuser may include: connecting each of the at least one first gas diffuser and the at least one second gas diffuser to a gas supply source configured to deliver inert gas to the gas diffuser in the at least one first gas diffuser and the at least one second gas diffuser.

[0007] Another aspect of this disclosure relates to a wave soldering station of a wave soldering machine configured to perform wave soldering operations on an electronic substrate. In one embodiment, the wave soldering station includes: a solder tank having a solder reservoir; a flow conduit disposed in the reservoir of the solder tank; a wave soldering nozzle assembly coupled to the flow conduit, the nozzle assembly being configured to generate a solder wave; at least one first gas diffuser configured to supply gas such that the gas flows over the solder wave on each side and provides a gas layer over the solder wave; and at least one second gas diffuser configured to supply gas below the solder wave on each side and provide a gas layer below the solder wave.

[0008] Embodiments of the wave soldering station may further include: configuring at least one first gas diffuser such that two gas diffusers are arranged above the solder wave, one of the at least one first gas diffuser being positioned on the loading side of the solder wave, and the other of the at least one first gas diffuser being positioned on the unloading side of the solder wave. At least one second gas diffuser may include two gas diffusers arranged below the nozzle assembly and below the solder wave, one of the at least one second gas diffuser being positioned below the nozzle assembly on the loading side of the solder wave, and the other of the at least one second gas diffuser being positioned below the nozzle assembly on the unloading side of the solder wave. Attached Figure Description

[0009] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in different figures is indicated by the same reference numerals. For clarity, not every component may be labeled in each figure. In the drawings: Figure 1 is a cross-sectional view of a wave soldering station with a nitrogen diffuser located at a known position within the station. Figure 2 It is a 3D view of a wave soldering machine; Figure 3 This is a side elevation view of a wave soldering machine, with the outer packaging removed to expose the internal components of the wave soldering machine; Figure 4 This is a perspective view of a wave soldering station having nitrogen diffusers located at various positions in embodiments of this disclosure; Figure 5 This is an exploded 3D view of a wave soldering station; Figure 6 This is a cross-sectional view of the wave soldering station; Figure 7 This is an enlarged cross-sectional view of the wave soldering station; Figure 8 This is an exploded perspective view of the nitrogen diffuser before it is installed in the wave soldering nozzle assembly; and Figure 9 This is another exploded perspective view of the nitrogen diffuser before it is installed in the wave soldering nozzle assembly. Detailed Implementation

[0010] This disclosure is not limited to the details of the construction and arrangement of the components set forth in the following description or shown in the accompanying drawings. This disclosure is capable of having other embodiments and can be practiced or implemented in various ways. Similarly, the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of “comprising,” “including,” “having,” “containing,” “involving,” and variations thereof throughout this document is intended to cover the items listed thereafter and their equivalents, as well as other items.

[0011] Embodiments of this disclosure aim to reduce the amount of dross generated during the wave soldering process. In a particular embodiment, a nitrogen diffuser is arranged above and below the solder wave generated by the wave soldering station within the wave soldering station of the wave soldering machine.

[0012] For demonstration purposes, and for reference Figure 2 Embodiments of this disclosure will now be described with reference to a wave soldering machine, generally designated 10, used to perform solder coating on printed circuit boards 12. In some embodiments, the printed circuit board 12 may be referred to as an electronic substrate. The wave soldering machine 10 is one of several machines on a printed circuit board production / assembly line. As shown, the wave soldering machine 10 includes a housing or frame 14 adapted to house the components of the machine. This arrangement causes a conveyor 16 to transport the printed circuit boards to be processed by the wave soldering machine 10. Upon entering the wave soldering machine 10, each printed circuit board 12 travels along the conveyor 16 along an inclined path (e.g., at six degrees relative to the horizontal direction) through a channel 18 to adjust the printed circuit board for wave soldering. This channel includes a flux treatment station, generally designated 20, and a preheating station, generally designated 22. Once the adjustment treatment (i.e., heating) is complete, the printed circuit board 12 proceeds to a wave soldering station, generally designated 24, to have solder coated onto the printed circuit board. The controller 26 is configured to automate the operation of several stations of the wave soldering machine 10 (including, but not limited to, flux handling station 20, preheating station 22 and wave soldering station 24) in a well-known manner.

[0013] refer to Figure 3Flux treatment station 20 is configured to apply flux to the printed circuit board (PCB) as it travels on conveyor 16 through wave soldering machine 10. A preheating station includes several preheaters (e.g., preheaters 22a, 22b, and 22c) designed to progressively increase the temperature of the PCB as it travels along conveyor 16 through channel 18, preparing the PCB for the wave soldering process. As shown and described in more detail below, wave soldering station 24 includes a wave soldering nozzle assembly in fluid communication with a solder reservoir. A pump is disposed within the reservoir to deliver molten solder from the reservoir to the wave soldering nozzle assembly. Once soldering is complete, the PCB leaves wave soldering machine 10 via conveyor 16 to another station (e.g., a pick-and-place machine) on the production line.

[0014] In some embodiments, the wave soldering machine 10 may further include a flux management system, generally indicated by 28, for removing volatile contaminants from the channel 18 of the wave soldering machine. For example... Figure 3 As shown, the flux management system 28 is arranged below the preheating station 22. In one embodiment, the flux management system is supported by a housing 14 within the wave soldering machine and is in fluid communication with the channel 18. Figure 3 The diagram is shown schematically. The flux management system 28 is configured to receive contaminated gas from channel 18, process the gas, and return clean gas to the channel. The flux management system 28 is specifically configured to remove volatile contaminants from the gas, especially under an inert atmosphere.

[0015] refer to Figure 4 and Figure 5 In one embodiment, the wave soldering station 24 includes a solder tank 30 that defines a reservoir 32 configured to contain molten solder. In one embodiment, the solder tank 30 is a box-shaped structure supporting components of the wave soldering station 24, including a flow conduit 34 configured to deliver pressurized molten solder to an opening or nozzle of a wave soldering nozzle assembly, generally indicated by 36. As will be described in more detail below, the wave soldering nozzle assembly 36 is configured to guide molten solder to the bottom of the printed circuit board 12 and allow the solder to flow smoothly back into the reservoir 32. Specifically, the wave soldering nozzle assembly 36 is capable of adjusting the height and width of the solder wave during wave soldering operations.

[0016] The wave soldering station 24 further includes two pump impellers (each designated 38) arranged within the reservoir 32 of the solder tank 30, adjacent to an inlet disposed in the flow conduit 34. The pump impellers 38 pressurize the molten solder in the reservoir 32 to pump it vertically into the flow conduit 34, and then into the wave soldering nozzle assembly 36. In one embodiment, each pump impeller 38 is a centrifugal pump appropriately sized to pump molten solder into the nozzle of the wave soldering nozzle assembly 36. The wave soldering nozzle assembly 36 is configured to generate solder waves, provided in the manner described herein, for attaching components to the circuit board 12, and to optimize downtime during processing.

[0017] refer to Figure 6 The flow conduit 34 includes two chambers, each with an inlet connected to a corresponding pump impeller 38. The flow rate of molten solder to the solder distribution baffle 50 is controlled by controlling the pump impeller 38. The flow rate of molten solder through the chambers can be controlled independently by controlling the pump impeller 38. As a result, the solder wave can be controlled by operating the pump impeller 38. For example, the solder wave can be controlled such that by shutting off the pumping of one of the pump impellers 38, the solder wave extends through the solder distribution baffle 50 at the center of the baffle. With this arrangement, slag is also reduced due to the significantly reduced width of the solder wave.

[0018] For further reference Figure 7 The wave soldering nozzle assembly 36 includes a nozzle core holder 40 having two end walls 42, 44, a first longitudinal support element 46, and a second longitudinal support element 48 extending between the two end walls 42, 44. The nozzle core holder 40 may further include a plurality of lateral support elements extending between the first longitudinal support element 46 and the second longitudinal support element 48. The nozzle core holder 40 also guides solder flow through a nozzle throat defined between the first longitudinal support element 46 and the second longitudinal support element 48. The wave soldering nozzle assembly 36 further includes an elongated solder dispensing baffle 50 fixed to the first longitudinal support element 46 of the nozzle core holder 40. The solder dispensing baffle 50 is fixed to the first longitudinal support element 46 by screws, for example, through an opening located on the loading side of the solder dispensing baffle 50. In one embodiment, one side (i.e., the loading side) of the solder dispensing baffle 50 is fixed to or integrally formed with the first longitudinal support element 46, and the other side (i.e., the unloading side) of the solder dispensing baffle 50 is fixed to or integrally formed with the second longitudinal support element 48. In one embodiment, the solder dispensing baffle 50 includes a unique pattern of elongated openings to allow molten solder to flow through it.

[0019] In some embodiments, the wave soldering nozzle assembly 36 may further include a slag box fixed to the nozzle core holder 40 and configured to reduce turbulence as the solder travels back to the reservoir 32 of the solder bath 30, thereby reducing solder balls that may form within the reservoir 32.

[0020] Various aspects of this disclosure relate to a solder wave generated by the wave soldering nozzle assembly 36 (in... Figure 6 and Figure 7 A system that forms a nitrogen or inert gas layer above and below the solder bath (indicated by dashed line 52). In one embodiment, the system includes a plurality of gas diffusers (sometimes referred to as nitrogen pipes or diffusers) disposed within a reservoir 32 of the solder bath 30 of the wave soldering station 24 to provide an inert atmosphere for the wave soldering process. Figure 6 As shown, the system includes two gas diffusers 54 and 56, which are arranged below the cover plate 58 and above the solder wave 52 on both sides. The two gas diffusers 54 and 56 provide an inert gas layer above the solder wave 52. One gas diffuser 54 is located on the loading side of the solder wave 52, immediately below the cover plate 58. The other gas diffuser 54 is located on the unloading side of the solder wave 52, immediately below the cover plate 58.

[0021] The system further includes two auxiliary gas diffusers 60 and 62, which are arranged below the nozzle of the nozzle assembly 36 and on both sides below the solder wave 52 to provide an inert gas layer below the solder wave 52. One gas diffuser 60 is located on the loading side of the solder wave 52, immediately below the first longitudinal support element 46. The other gas diffuser 62 is located on the unloading side of the solder wave 52, immediately below the outlet wing 64 of the nozzle assembly 36. The placement of the gas diffusers 60 and 62 below the solder wave 52 ensures the presence of an inert atmosphere when the molten solder returns to the reservoir 32 of the solder bath 30.

[0022] Figure 8 and Figure 9Two gas diffusers 60, 62 are shown before being inserted into the nozzle core holder 40 of the nozzle assembly 36. Each gas diffuser can be made of porous stainless steel tubing. The porosity of the gas diffusers can be optimized to produce laminar gaseous nitrogen released from the gas diffusers. In one embodiment, the gas diffusers 60, 62 are suitably supported by the end wall 42 of the nozzle core holder 40 of the nozzle assembly 36. As shown, a gas supply source 66 is connected to the gas diffusers 60, 62 via lines 68, 70, respectively. In one embodiment, the gas supply source 66 can be an in-situ supply source. Nitrogen, carbon dioxide, and other inert gases can be supplied as protective gases. A field-based non-cryogenic nitrogen supply can be provided. Various different devices are known to produce nitrogen with an oxygen content of less than 10% (by volume). Gas diffusers 54, 56 positioned above the solder wave 52 can be similarly configured.

[0023] In one embodiment, see specific reference. Figure 9 Each gas diffuser 60, 62 is secured to the end wall 42 by a compression fitting, which rigidly secures the gas diffuser via a compression sleeve and / or ring. The compression fitting is threaded to a threaded fitting welded to the end wall 42 of the nozzle core 40 to secure the gas diffusers 60, 62 to the end wall 42 of the nozzle core 40. Gas diffusers 54, 56 are similarly secured to the cover plate 58.

[0024] In one embodiment, an inert gas (e.g., nitrogen) flows through two flow control valves, which in turn are connected to gas diffusers 54 and 56, respectively. Similarly, the inert gas flows through two additional flow control valves, which in turn are connected to gas diffusers 60 and 62, respectively. The flow rate of the inert gas from each set of gas diffusers can range from 200 cubic feet per hour to 600 cubic feet per hour. The gas supply to the diffusers can be varied by the flow control valves, which in turn controls the flow rate of gas exiting from the slots in the cover plate 58 on each side of the solder wave 52. In one embodiment, the nitrogen supply can be shut off unless the printed circuit board 12 is passing through the wave soldering station 24. This can be achieved by manipulating the flow control valves or shutting off the gas supply.

[0025] In some embodiments, the positions of gas diffusers 54 and 56 above the solder wave 52 can be varied to optimize the coverage of the inert gas layer above the solder wave 52. Similarly, the positions of gas diffusers 60 and 62 below the solder wave 52 can be varied to optimize the coverage of the inert gas layer below the solder wave 52. Furthermore, the number of gas diffusers disposed above and below the solder wave 52 can be varied to optimize the coverage of the inert gas layer above and below the solder wave 52.

[0026] In some embodiments, the gas supply source 66 comprises compressed air supplied through a filter and into the membrane apparatus. The membrane apparatus includes a membrane that divides the airflow into two portions, one of which is a nitrogen-enriched portion. In one embodiment, this portion continues along a conduit to gas diffusers 54, 56, and along another conduit to gas diffusers 60, 62. The other portion includes an oxygen-enriched portion that returns to the atmosphere through another conduit. In one embodiment, the membrane apparatus produces nitrogen gas with an oxygen content of less than 10% (by volume).

[0027] Embodiments of this disclosure are designed to minimize dross associated with molten solder. A more complete inert gas layer ensures that the molten solder is not oxidized before returning to the reservoir 32 of the solder bath 30. Different combinations of tin, lead, and other metals are used to produce lead-containing and lead-free solders. Dragging is a clump of solid impurities that floats on the surface of the molten solder or is dispersed within the molten solder. For solder, dross tends to form on the surface of tin-based molten metals, where oxidized impurities produce dross.

[0028] In another embodiment, a second-stage membrane system can be provided. The oxygen content of the nitrogen is reduced to less than 5% (by volume), and in another embodiment to less than 1,000 ppm. Systems utilizing membrane technology to provide nitrogen-rich airflow are known. If the demand for nitrogen is high, primarily depending on the welding conditions, the oxygen concentration is higher. However, if the demand is lower, the oxygen concentration is lower.

[0029] While nitrogen is considered the preferred embodiment of the protective gas, other inert gases can also be provided, carbon dioxide being one example. In all cases, it is preferred to keep the oxygen content less than about 10% (by volume).

[0030] In operation, circuit board 12 is conveyed by conveyor 16 to wave soldering station 24. Circuit board 12 may have been pretreated with flux at flux treatment station 20 and heated at preheating station 22. As circuit board 12 travels through wave soldering station 24, gas diffusers 54, 56 and 60, 62 generate an inert gas curtain. Specifically, inert gas is supplied through gas diffusers 54, 56 below cover plate 58 and above solder wave 52 on each side of solder wave 52 to provide a gas layer above solder wave 52. Further, inert gas is supplied through gas diffusers 60, 62 below solder wave 52 on each side of solder wave 52 to provide a gas layer below solder wave 52. For each circuit board 12, the underside of circuit board 12 travels through solder wave 52 and is coated with solder in a conventional manner. Circuit board 12 leaves wave soldering station for further processing within the printed circuit board production line. By taking effective measures to keep air away from the solder in the reservoir 32, the formation of slag in the solder tank 30 can be minimized.

[0031] Various controllers can perform a variety of different operations discussed above. For example, as discussed above, a controller (such as controller 26) can control components of wave soldering machine 10 (including wave soldering station 24) and perform other operations. Using data stored in associated memory and / or storage devices, the controller can execute one or more instructions stored on one or more non-transitory computer-readable media, which may include and / or be coupled to said one or more non-transitory computer-readable media, which can generate manipulation data. In some examples, the controller may include one or more processors or other types of controllers. In one example, the controller is at least one processor or includes at least one processor. In another example, in addition to or instead of a general-purpose processor, the controller uses an application-specific integrated circuit (ASIC) to perform at least a portion of the operations discussed above, the ASIC being customized to perform the specific operations. As shown by these examples, examples of this disclosure can use many specific combinations of hardware and software to perform the operations described herein, and this disclosure is not limited to any specific combination of hardware and software components. Examples of this disclosure may include computer program products configured to perform the methods, processes, and / or operations discussed above. A computer program product may be one or more controllers and / or processors, or may include one or more controllers and / or processors configured to execute instructions to perform the methods, processes, and / or operations discussed above.

[0032] In each embodiment, the solder flow through the nozzle can be controlled to reduce or even prevent dross from recirculating through the nozzle. Dragging is reduced by decreasing the width of the solder wave. Each embodiment enables the reduction of the solder wave width.

[0033] In some embodiments, as mentioned above, the wave soldering nozzle assembly further includes a slag box fixed to the nozzle frame and configured to reduce turbulence as the solder travels back to the reservoir, thereby further reducing solder balls that may form within the reservoir.

[0034] Therefore, having described several aspects of at least one embodiment of this disclosure, it will be understood that various changes, modifications, and improvements will readily occur to those skilled in the art. Such changes, modifications, and improvements are intended to be part of this disclosure and are intended to fall within the spirit and scope of this disclosure. Therefore, the foregoing description and drawings are merely examples.

Claims

1. A wave soldering machine for performing wave soldering operations on electronic substrates, the wave soldering machine comprising: A wave soldering station, the wave soldering station including a solder tank having a solder reservoir, a flow conduit disposed in the reservoir of the solder tank, and a wave soldering nozzle assembly connected to the flow conduit, the nozzle assembly being configured to generate a solder wave; A conveyor configured to transport an electronic substrate to the wave soldering station; At least one first gas diffuser, the at least one first gas diffuser being configured to supply gas such that the gas flows over the solder wave on each side of the solder wave and provides a gas layer over the solder wave; as well as At least one second gas diffuser is configured to supply gas below the solder wave on each side of the solder wave and to provide a gas layer below the solder wave.

2. The wave soldering machine as described in claim 1, wherein, The at least one first gas diffuser includes two gas diffusers arranged above the solder wave.

3. The wave soldering machine as described in claim 2, wherein, One of the at least one first gas diffusers is disposed on the loading side of the solder wave, and the other of the at least one first gas diffusers is disposed on the unloading side of the solder wave.

4. The wave soldering machine as described in claim 2, wherein, The at least one second gas diffuser includes two gas diffusers arranged below the nozzle assembly and below the solder wave.

5. The wave soldering machine as described in claim 4, wherein, One of the at least two second gas diffusers is disposed below the nozzle assembly on the loading side of the solder wave, and the other of the at least two second gas diffusers is disposed below the nozzle assembly on the unloading side of the solder wave.

6. The wave soldering machine as described in claim 1, wherein, The at least one second gas diffuser includes two gas diffusers arranged below the nozzle assembly and below the solder wave.

7. The wave soldering machine as described in claim 6, wherein, One of the at least two second gas diffusers is disposed below the nozzle assembly on the loading side of the solder wave, and the other of the at least two second gas diffusers is disposed below the nozzle assembly on the unloading side of the solder wave.

8. The wave soldering machine as described in claim 1, wherein, Each of the at least one first gas diffuser and the at least one second gas diffuser is coupled to a gas supply source configured to deliver inert gas to the gas diffuser in the at least one first gas diffuser and the at least one second gas diffuser.

9. The wave soldering machine as described in claim 1, wherein, The nozzle assembly further includes a core frame supported by the flow conduit and configured to support a solder dispensing baffle.

10. A method for providing an inert gas layer for solder waves, the method comprising: The solder wave is generated within the wave soldering station of the wave soldering machine; An electronic substrate is transported above the solder wave; An inert gas is supplied above the solder wave through at least one first gas diffuser on each side of the solder wave, and a gas layer is provided above the solder wave. as well as Inert gas is supplied through at least one second gas diffuser, the at least one second gas diffuser being configured to supply gas below the solder wave on each side of the solder wave and to provide a gas layer below the solder wave.

11. The method of claim 10, wherein, Transporting the electronic substrate above the solder wave includes moving the electronic substrate on a conveyor.

12. The method of claim 10, further comprising arranging two of the at least one first gas diffuser above the solder wave.

13. The method of claim 12, wherein, One of the at least one first gas diffusers is disposed on the loading side of the solder wave, and the other of the at least one first gas diffusers is disposed on the unloading side of the solder wave.

14. The method of claim 12, further comprising arranging two of the at least one second gas diffuser below the nozzle assembly and below the solder wave.

15. The method of claim 14, wherein, One of the at least two second gas diffusers is disposed below the nozzle assembly on the loading side of the solder wave, and the other of the at least two second gas diffusers is disposed below the nozzle assembly on the unloading side of the solder wave.

16. The method of claim 10, further comprising arranging two of the at least one second gas diffuser below the nozzle assembly and below the solder wave.

17. The method of claim 16, wherein, One of the at least two second gas diffusers is disposed below the nozzle assembly on the loading side of the solder wave, and the other of the at least two second gas diffusers is disposed below the nozzle assembly on the unloading side of the solder wave.

18. The method of claim 10, wherein, Supplying the inert gas through the at least one first gas diffuser and supplying the inert gas through the at least one second gas diffuser comprises: connecting each of the at least one first gas diffuser and the at least one second gas diffuser to a gas supply source configured to deliver the inert gas to the gas diffuser in the at least one first gas diffuser and the at least one second gas diffuser.

19. A wave soldering station of a wave soldering machine configured to perform wave soldering operations on an electronic substrate, the wave soldering station comprising: A solder bath, the solder bath having a solder reservoir; A flow conduit is arranged in the reservoir of the solder bath; A wave soldering nozzle assembly connected to the flow conduit, the nozzle assembly being configured to generate solder waves; At least one first gas diffuser, the at least one first gas diffuser being configured to supply gas such that the gas flows over the solder wave on each side of the solder wave and provides a gas layer over the solder wave; as well as At least one second gas diffuser is configured to supply gas below the solder wave on each side of the solder wave and to provide a gas layer below the solder wave.

20. The wave soldering station as described in claim 19, wherein, The at least one first gas diffuser includes two gas diffusers disposed above the solder wave, one of the at least one first gas diffusers being disposed on the loading side of the solder wave, and the other of the at least one first gas diffuser being disposed on the unloading side of the solder wave, and wherein the at least one second gas diffuser includes two gas diffusers disposed below the nozzle assembly and below the solder wave, one of the at least one second gas diffuser being disposed below the nozzle assembly on the loading side of the solder wave, and the other of the at least one second gas diffuser being disposed below the nozzle assembly on the unloading side of the solder wave.

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