High-precision automatic block ring line cutting device for silicon carbide wafer

By employing a double-sided symmetrical annular diamond wire and a synchronous feeding mechanism in a silicon carbide wafer cutting device, combined with a pressure sensor and a laser rangefinder, high-precision automatic block cutting of silicon carbide ingots was achieved, solving the problems of uneven cutting force and initial contact point positioning error, and improving cutting efficiency and stability.

CN122125819AActive Publication Date: 2026-06-02无锡连强智能装备有限公司
View PDF 8 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
无锡连强智能装备有限公司
Filing Date
2026-05-06
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing silicon carbide wafer dicing equipment suffers from uneven feeding mechanisms on both sides during the dicing process, resulting in uneven distribution of cutting force. This can easily lead to problems such as off-cutting, cracks, and wire saw overload. Furthermore, the initial contact point positioning error is large, resulting in low efficiency.

Method used

The system employs a double-sided symmetrical arrangement of annular diamond wires, combined with a synchronous feed mechanism driven by forward and reverse threaded screws. Pressure sensors and a PLC controller ensure synchronization of the feed frames on both sides. A laser rangefinder sensor enables precise monitoring of the cutting depth. A vacuum stage and a stepper motor are used to achieve stable rotation of the ingot and switching of the cutting mode. An electro-hydraulic rod is used to adjust the cutting height.

Benefits of technology

It effectively reduces the risk of cracking in silicon carbide ingots during the cutting process, improves cutting efficiency and precision, extends the service life of diamond wire, and ensures the stability and automation level of the cutting process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122125819A_ABST
    Figure CN122125819A_ABST
Patent Text Reader

Abstract

This invention discloses a high-precision automatic segmentation and ring wire cutting device for silicon carbide wafers, specifically relating to the field of ring wire cutting technology. The device includes a protective housing, on one side of which a PLC controller is fixedly installed. An operating frame is fixedly installed inside the protective housing, and two feed frames are arranged on the top surface of the operating frame. By symmetrically arranging annular diamond wires on both sides of the operating frame, the silicon carbide ingot is placed between the two annular diamond wires. Combined with a dual-sided synchronous feed mechanism driven by forward and reverse threaded screws, the feed frames on both sides maintain the same feed speed and displacement during cutting. When the annular diamond wires on both sides simultaneously cut into the ingot, the cutting forces are equal in magnitude and opposite in direction, canceling each other out inside the ingot and preventing additional bending moments. This structure effectively solves the problems of ingot bending and deformation due to uneven force during unilateral cutting, and the easy initiation of cracks in high-stress areas at the edges, reducing the cracking risk of ultra-hard and brittle silicon carbide materials during the cutting process.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Directional pressure bilateral stone-cutting method and equipment with rotating band saw

    CN101497219A

  • Bidirectional single-crystal silicon rod cutting device

    CN108724501A

  • Diamond fretsaw cutting tension control device

    CN112265167A

  • Wire saw diamond base line length, rope winding and performance detection device

    CN118478445A

  • Annular horizontal double-annular rotary cutting machine

    CN121268090A