Magnetic sensing device

Abstract

Apparatuses, systems, and methods are provided for a magnetic sensing device including one or more linear magnetic sensors, such as Hall sensors. In some embodiments, the magnetic sensing device includes a housing, a substantially cylindrical shield mechanically coupled to the housing, a magnet disposed within a cavity defined by the substantially cylindrical shield, wherein the magnet defines a countersunk cavity, and / or a printed circuit board assembly (PCBA) disposed proximate a first end of the magnet opposite a second end of the magnet proximate an end of the housing proximate a measured medium.

Description

Technical Field

[0001] The embodiments disclosed herein generally relate to magnetic sensing devices, and in particular to sensing devices including Hall sensors. Background Technology

[0002] In some examples, some sensing devices rely on passive magnets to sense and / or attract other materials. For example, some slag plugs include multiple stacked passive magnets configured to accumulate debris along the length of the slag plug. The applicant has recognized the many technical challenges and difficulties associated with such passive sensors. Through effort, ingenuity, and innovation, many of these identification problems have been addressed by developed solutions, including those described in the embodiments of this disclosure, many examples of which are detailed herein. Summary of the Invention

[0003] The various example implementations described herein relate to sensing devices, particularly sensing devices that include Hall sensors.

[0004] According to various embodiments of the present disclosure, an apparatus is provided comprising: (i) a housing; (ii) a substantially cylindrical shield mechanically coupled to the housing; (iii) a magnet disposed within a cavity defined by the substantially cylindrical shield, wherein the magnet defines a countersunk cavity; and (iv) a printed circuit board assembly (PCBA) disposed near a first end of the magnet, the first end being opposite a second end of the magnet, wherein the second end of the magnet is near an end of the housing that is close to the medium being measured.

[0005] In some implementations, the PCBA includes a Hall sensor protruding from the surface of the PCBA, wherein the protruding Hall sensor is disposed within a countersunk cavity defined by a magnet.

[0006] In some implementations, the substantially cylindrical shield is configured to allow changes in magnetic flux sensed by the Hall sensor to be sensed substantially uniformly by the Hall sensor.

[0007] In some implementations, the magnet is axially magnetized relative to the countersunk hole, and the Hall sensor is positioned at an angle to the magnetization axis of the magnet.

[0008] In some implementations, the magnet is configured to generate a region with a magnetic field strength close to zero, and a Hall sensor is placed in this region.

[0009] In some implementations, regions with magnetic field strength close to zero are configured to allow substantially linear operation of the Hall sensor.

[0010] In some embodiments, the device is configured to detect rapid changes in Hall voltage caused by rapid changes in the presence of debris on at least one surface of the housing.

[0011] According to various embodiments of the present disclosure, a system is provided comprising: (1) a fluid container; and (2) a magnetic sensing device for sensing debris in a fluid within the fluid container, the magnetic sensing device comprising: (i) a housing; (ii) a substantially cylindrical shield mechanically coupled to the housing; (iii) a magnet disposed within a cavity defined by the substantially cylindrical shield, wherein the magnet defines a countersunk cavity; and (iv) a printed circuit board assembly (PCBA) disposed adjacent to a first end of the magnet, the first end being opposite a second end of the magnet, wherein the second end of the magnet is adjacent to an end of the housing adjacent to the medium being measured.

[0012] In some implementations, the PCBA includes a Hall sensor protruding from the surface of the PCBA, wherein the protruding Hall sensor is disposed within a countersunk cavity defined by a magnet.

[0013] In some implementations, the substantially cylindrical shield is configured to allow changes in magnetic flux sensed by the Hall sensor to be sensed substantially uniformly by the Hall sensor.

[0014] In some implementations, the magnet is axially magnetized relative to the countersunk hole, and the Hall sensor is positioned at an angle to the magnetization axis of the magnet.

[0015] In some implementations, the magnet is configured to generate a region with a magnetic field strength close to zero, and a Hall sensor is placed in this region.

[0016] In some implementations, regions with magnetic field strength close to zero are configured to allow substantially linear operation of the Hall sensor.

[0017] In some implementations, the sensing device is configured to detect rapid changes in Hall voltage caused by rapid changes in the presence of debris on at least one surface of the housing.

[0018] According to various embodiments of the present disclosure, a method is provided, comprising: (i) mechanically coupling a substantially cylindrical shield to a housing; (ii) disposing a magnet within a cavity defined by the substantially cylindrical shield, wherein the magnet defines a countersunk cavity; and (iii) disposing a printed circuit board assembly (PCBA) adjacent to a first end of the magnet, the first end being opposite a second end of the magnet, wherein the second end of the magnet is adjacent to an end of the housing near the medium being measured.

[0019] In some implementations, the PCBA includes a Hall sensor protruding from the surface of the PCBA, wherein the protruding Hall sensor is disposed within a countersunk cavity defined by a magnet.

[0020] In some implementations, the method further includes axially magnetizing the magnet relative to the countersunk hole, such that the Hall sensor is positioned at an angle to the magnetization axis of the magnet.

[0021] In some implementations, the method further includes configuring the magnet to generate a region with a magnetic field strength close to zero, in which a Hall sensor is positioned.

[0022] In some implementations, the method also includes configuring a region with a magnetic field strength close to zero to allow substantially linear operation of the Hall sensor.

[0023] In some embodiments, the method further includes configuring the means of implementing the method to identify rapid changes in Hall voltage caused by rapid changes in the presence of debris on at least one surface of the housing. Attached Figure Description

[0024] The description of the exemplary embodiments can be read in conjunction with the accompanying drawings. It should be understood that, for simplicity and clarity of illustration, the elements illustrated in the figures are not necessarily drawn to scale unless otherwise described. For example, unless otherwise described, the dimensions of some elements may be exaggerated relative to others. Embodiments incorporating the teachings of this disclosure are shown and described with reference to the accompanying drawings, in which:

[0025] Figure 1 This is a cross-sectional view of an example magnetic sensing device including a Hall sensor;

[0026] Figure 2A yes Figure 1 A top view of at least a portion of the magnetic sensing device;

[0027] Figure 2B yes Figure 1 A cross-sectional view of at least a portion of the magnetic sensing device; and

[0028] Figure 3 This is a flowchart illustrating an exemplary method for constructing a magnetic sensing device including a Hall sensor according to some embodiments of the present disclosure. Detailed Implementation

[0029] introduce

[0030] Some embodiments of this disclosure will be described more fully below with reference to the accompanying drawings, which illustrate some, but not all, embodiments of this disclosure. In fact, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will meet applicable legal requirements. Similar reference numerals always refer to similar elements.

[0031] As used herein, terms such as “front,” “rear,” “top,” “bottom,” “left,” “right,” etc., in the examples provided below, are used for illustrative purposes to describe the relative positions of certain parts or portions of parts. Furthermore, as will be apparent to those skilled in the art based on this disclosure, the terms “substantially” and “approximately” indicate that the referenced element or associated description is accurate within applicable engineering tolerances.

[0032] As used herein, the term “comprising” means including but not limited to, and should be interpreted in the manner in which it is typically used in the patent context. The use of broader terms such as “comprising,” “including,” and “having” should be understood to provide support for narrower terms such as “consisting of,” “substantially composed of,” and “substantially constituted by.”

[0033] The phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally mean that the specific feature, structure, or characteristic following the phrase may be included in at least one embodiment of this disclosure, and may be included in more than one embodiment of this disclosure (importantly, such phrases do not necessarily refer to the same embodiment).

[0034] The phrases “in one example,” “according to one example,” “in some examples,” etc. generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one example of this disclosure, and may be included in more than one example of this disclosure (importantly, such phrases do not necessarily refer to the same example).

[0035] If the specification states that a component or feature "may," "can," "should," "will," "preferably," "possibly," "usually," "optionally," "for example," "as an example," "in some examples," "often," or "may" (or other such language) be included or have that characteristic, then the specific component or feature is not required to be included or have that characteristic. Such a component or feature may be optionally included in some examples or excluded.

[0036] The terms “example” or “exemplary” as used herein mean “used as an example, instance, or illustration.” Any specific implementation described herein as an “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other specific implementations.

[0037] The terms “electrically connected,” “electrically connected,” “electrically linked,” “electrically connected,” “communication with,” or “electronic communication with” in this disclosure refer to two or more elements or components connected by wired and / or wireless components such that signals, voltages / currents, data, and / or information can be transmitted to and / or received from these elements or components.

[0038] The term "component" can refer to an article of writing, device, or apparatus that may include one or more surfaces, portions, layers, and / or elements. For example, an example component may include one or more substrates that may provide one or more underlying layers for the component, and may include one or more elements that may form a portion on top of the substrate and / or one or more elements that may be disposed on top of the substrate. In this disclosure, the term "element" can refer to an article of writing, device, or apparatus that can provide one or more functions.

[0039] The term “sensor” or “sensing device” refers to a component or device capable of detecting, measuring and / or identifying any one or more properties or characteristics of a media environment (including, but not limited to, the presence of other media, the proximity of other media and / or objects).

[0040] Overview

[0041] In some examples, sensing devices (such as magnetic sensing devices) may be configured to monitor the presence of debris (e.g., metallic or magnetic debris) in fluids of various types of systems (e.g., engines, transmissions, gearboxes, radiators, cooling systems, and / or other systems) that may originate from various components of the system (e.g., bearings, gears, etc.). In some examples, such sensing devices may be oil debris plugs configured to collect, for example, metallic debris present in the oil of a vehicle. In some examples, an oil debris plug may comprise a plurality of stacked passive magnets configured to collect debris along the length of the oil debris plug. However, such configurations may not allow for “face sensing,” a term referring to sensing performed at the end and / or surface (e.g., a face) of the sensing device.

[0042] In some examples, embodiments of this disclosure provide a magnetic sensing device. In some examples, exemplary embodiments of this disclosure may include a magnetic sensing device configured to measure the presence and / or proximity at a first end or surface of the magnetic sensing device. Such a magnetic sensing device may include any type of linear magnetic sensor, such as a Hall sensor, anisotropic magnetoresistive (AMR) sensor, giant magnetoresistive (GMR) sensor, tunneling magnetoresistive (TMR) sensor, etc. The magnetic sensing device may include one or more Hall sensors. For example, the magnetic sensing device may include a housing, such as a housing configured to at least partially surround one or more components of the magnetic sensing device. The magnetic sensing device may also include a substantially cylindrical shield, such as a shield mechanically coupled to the housing via adhesive and / or snap-fit. The magnetic sensing device may also include a magnet disposed within a cavity defined by the substantially cylindrical shield. For example, the magnet may define a cavity, such as a countersunk cavity. The cavity defined by the magnet may be substantially cylindrical and / or composed of another geometry. The magnetic sensing device may also include a printed circuit board assembly (PCBA) positioned near a first end of a magnet, which is opposite a second end of the magnet, wherein the second end of the magnet is near the end of the housing that is close to the medium being measured.

[0043] In some examples, embodiments of this disclosure allow the sensing device to perform facial sensing. In some examples, facial sensing also includes sensing one or more properties of the medium and / or its environment via the end and / or surface of the housing near the measured medium. For example, a magnetic sensing device may be configured to sense the proximity of one or more objects to an end of the magnetic sensing device and / or the amount (or quantity) of debris at the end of the magnetic sensing device via one or more Hall sensors included in the magnetic sensing device, while allowing at least one magnet included in the magnetic sensing device to accumulate debris along the side of the housing. The magnet may define a substantially cylindrical cavity generally at its center and may be at least partially (e.g., completely) surrounded by a substantially cylindrical shield. The magnet may generate a magnetic field that defines a “zero zone” within the substantially cylindrical cavity where the magnetic field strength is close to zero. A PCBA including a Hall sensor may be positioned near a first end of the magnet such that the Hall sensor protrudes into the substantially cylindrical cavity and thus into the zero zone. Positioning the Hall sensor within the zero zone allows for linear operation of the Hall sensor. The second end of the magnet can be positioned close to the end of the housing near the medium being sensed, thereby increasing the magnetic field strength at the “head” of the magnetic sensing device (e.g., the end close to and / or protruding into the medium being measured).

[0044] As described herein, in some examples, embodiments of this disclosure provide apparatus, systems, and / or methods for sensing devices, such as sensing devices including Hall sensors.

[0045] To address the challenges and limitations associated with sensing devices, various examples of this disclosure are provided. For example, various examples of this disclosure provide example apparatus, systems, and / or methods for magnetic sensing devices, such as sensing devices including one or more Hall sensors.

[0046] Exemplary apparatus, systems and methods

[0047] Now for reference Figure 1 A cross-sectional view of an example magnetic sensing device 100, including a Hall sensor, is provided. Figure 1 In the example, the magnetic sensing device 100 includes a housing 102, a shield 104, a magnet 106, a printed circuit board assembly (PCBA) 108, and a Hall sensor 110. Although... Figure 1 The example shows a housing, a shield, a magnet, a PCBA, and a Hall sensor, but any number of these components can be present in the magnetic sensing device 100.

[0048] The housing 102 may be made of plastic and / or other materials. A housing 102 made of plastic can offer several advantages, including, for example, not interfering with magnetic measurements performed by the magnetic sensing device 100. In some examples, the housing 102 is configured to at least partially surround one or more components of the magnetic sensing device 100. For example, the housing 102 may be configured to surround the shield 104, magnet 106, PCBA 108, and Hall sensor 110. The housing 102 may be further configured to protect one or more components of the magnetic sensing device 100 from contamination and / or debris originating from the material and / or medium being measured. For example, in an example where the magnetic sensing device 100 is an oil plug, the housing 102 may be configured to prevent oil from entering and / or damaging the internal portions of the magnetic sensing device 100.

[0049] The shield 104 may be made of metal and / or other materials. The shield 104 may be a substantially cylindrical housing. In some examples, the shield 104 may include a protruding feature projecting toward the center of the shield 104. This protruding feature may be configured to act as a mechanical stop, thereby maintaining the position of one or more components of the magnetic sensing device 100. The shield 104 may at least partially surround the magnet 106, PCBA 108, Hall sensor 110, and / or other components of the magnetic sensing device 100. The shield 104 may be configured to adjust the zero zone. For example, the shield 104 may be configured to extend the zero zone beyond the magnet 106. For example, the zero zone may be displaced toward one or more ends of the magnet 106 compared to a magnet without shielding. The shield 104 may be configured to allow the Hall sensor 110 to substantially experience, for example, the total magnetic field strength and / or magnetic flux generated by iron filings accumulated along the length of the magnetic sensing device 100 and / or at the head of the magnetic sensing device.

[0050] Magnet 106 may be a permanent magnet, an electromagnet, and / or another type of magnet. In some examples, magnet 106 is a permanent magnet. Magnet 106 may define a cavity approximately at its center, the cavity being configured to at least partially contain a zero region. The cavity of magnet 106 may be substantially cylindrical and / or composed of other geometries. In some examples, magnet 106 includes a cavity approximately hourglass-shaped.

[0051] PCBA 108 may include Hall sensor 110 and / or other electronic components. For example, Hall sensor 110 may consist of one or more portions, such as a first portion electrically connected to a “top” (e.g., first) surface of PCBA 108 and a second portion electrically connected to a “bottom” (e.g., second) surface of PCBA 108. The top surface of PCBA 108 may be opposite to the bottom surface of PCBA 108.

[0052] The Hall sensor 110 may consist of one or more components. For example, the Hall sensor 110 may consist of a first portion electrically connected to the PCBA 108 and / or a second portion connected to the opposite side of the PCBA 108. The Hall sensor 110 may be configured to convert received and / or measured magnetic field strength into, for example, an electrical signal, and the PCBA 108 may be configured to transmit the electrical signal to one or more devices and / or components thereof.

[0053] In some examples, the magnetic sensing device 100 is, for example, an oil-shaving plug configured to collect iron filings along the length of the magnetic sensing device 100. A magnet 106 may generate a zero zone at approximately the center of the cavity defined by the magnet 106. A shield 104 of the magnetic sensing device 100 may be configured to extend the zero zone beyond the magnet 106, such that the zero zone is at least partially located in a region at one or more ends of the magnet 106. For example, the shield 104 may be configured such that the magnetic field generated by the debris can be focused onto the sensing end of the magnetic sensing device 100. In some examples, the shield 104 may be configured to allow debris accumulated on the magnetic sensing device 100 to generate a change in magnetic flux that can be sensed by the Hall sensor 110.

[0054] In some examples, the magnetic sensing device 100 is, for example, a proximity sensor configured to determine the proximity of one or more objects (e.g., composed of magnetic materials) to the magnetic sensing device 100. In the proximity sensor, the shield 104 may be configured to extend the sensing range of the proximity sensor by shifting the area defined by the zero zone.

[0055] Now for reference Figures 2A to 2B Top view and cross-sectional view of the magnetic sensing device 100 are provided respectively. Figure 2A In the example, the circular double-ended arrow indicates that the Hall sensor 110 can rotate about its axis so that it faces in any direction, because the Hall sensor 110 responds substantially linearly to the axial component of the applied magnetic field. The axis of rotation of the Hall sensor 110 can be substantially perpendicular to the plane of the magnet 106. Figure 2B In the example, reference numeral 110 indicates that the Hall sensor may protrude from either end of the PCBA 108. Furthermore, the Hall sensor 110 may be positioned in any one or more of the following regions: entirely within the zero region, partially within the zero region, and / or near the zero region. In some embodiments, the Hall sensor 110 may be positioned near the zero region such that the applied magnetic field is insufficient to saturate the Hall sensor 110.

[0056] In at least some techniques, a magnet configured to generate a first magnetic field strength can be relied upon to remove and / or attract debris from a medium (e.g., a fluid) into which the sensing device enters. To accommodate the first magnetic field strength, the linear output of the Hall sensor is in the range of approximately -300 mT to approximately 300 mT. The magnet, defining a cavity approximately at its center, can be configured to generate a zero region within the cavity. The Hall sensor can be coupled to a first surface of a PCBA, wherein one or more other electronic components can be coupled to a second surface of the PCBA, opposite the first surface. The PCBA can be positioned close to the magnet and enclosed by a shielding element such that the Hall sensor at least partially protrudes into the cavity of the magnet. In some examples, the geometry of the shielding element allows the Hall sensor to experience substantially uniform changes in magnetic flux caused by debris collected on the outer surface of the sensing device.

[0057] In some examples, the zero region can be adjusted based on the design of the shielding. For example, the Hall sensor can be positioned at least partially within the zero region, allowing for substantially linear operation dependent on the Hall sensor. In some examples, axisymmetry (relative to the sensing device) can be maintained, thereby allowing for adjustments to magnetic field strength, magnetic flux, and / or other characteristics caused by debris deposition.

[0058] In some examples, debris accumulating on the "face" of the sensing device can create a low magnetoresistance return path for magnetic flux, thereby increasing the magnetic field through the Hall sensor. Furthermore, due to its proximity to the Hall sensor, debris accumulating on the face can be detected with greater sensitivity.

[0059] In some examples, the magnet can be axially magnetized such that the magnetic field at the end of the sensing device is axisymmetric. The Hall sensor can then be positioned at any angle ranging from 0 to 360 degrees relative to the magnetization axis. Additionally or alternatively, the Hall sensor can be positioned close to any surface of the PCBA.

[0060] In some examples, some advantages of the implementation described herein include monitoring real-time debris deposition (e.g., to avoid catastrophic operational failures). Such monitoring can be achieved by configuring the response of a Hall sensor relative to at least one weight of debris (e.g., using a linearization algorithm, lookup table, etc.).

[0061] In some examples, the amount and / or quantity of deposited debris can range from about 3 grams to about 6 grams (e.g., 1 gram to 10 grams, preferably 3 grams to 6 grams). In such examples, the Hall sensor can be configured to respond to the deposition rate of the debris. For example, based on the rate of change of the Hall voltage, a surge in the amount of debris (e.g., caused by a failure of one or more components of the device and / or system including the sensing device) can be identified (e.g., via one or more predetermined algorithms).

[0062] In some examples, the output from the sensing device can be digital (e.g., SPI, SENT, I2C, etc.) or analog (e.g., voltage, current, PWM, etc.). Furthermore, the sensing device can be coupled (e.g., via electrical connection, etc.) to, for example, a microcontroller configured to output to the host system via digital (e.g., including CAN), analog, or wireless (BLE, Wi-Fi, etc.) communication.

[0063] In some examples, the amount and / or quantity of debris deposition can be varied by increasing or decreasing the number of magnets included in the sensing device. For example, by increasing one or more first gaps between magnets (e.g., by adjusting the thickness of the spacers between magnets), the debris deposition can be made more uniform. Additionally or alternatively, changing one or more second gaps between magnets and pole pieces can increase the uniformity of debris deposition. In some examples, the debris deposition area can be adjusted by adding spacers and / or adjusting the pole pieces and / or other components of the sensing device.

[0064] In some examples, the sensing device is configured to distinguish the particle size of debris, thereby having the ability to identify specific materials that cause failure of the entire device and / or system, since different materials have different magnetic permeabilities (e.g., which are characteristics that affect the Hall voltage changes of the sensing device).

[0065] Further advantages of the implementation scheme described herein include: predicting failures and avoiding downtime by distinguishing between routine wear and / or system failures.

[0066] Now for reference Figure 3 A flowchart of an exemplary method 300 for constructing a sensing device including a Hall sensor is provided.

[0067] At step / operation 302, the substantially cylindrical shield can be attached to the housing.

[0068] At step / operation 304, the magnet may be disposed within a cavity defined by a substantially cylindrical shield, wherein the magnet defines a countersunk cavity.

[0069] At step / operation 306, the PCBA may be positioned near a first end of a substantially cylindrical shield, which is opposite a second end of the substantially cylindrical shield near the material being measured.

[0070] At step / operation 308, the Hall sensor may be configured such that it protrudes from one or more surfaces of the PCBA. The Hall sensor may be at least partially located in at least one of the following regions: the countersunk cavity defined by the magnet, the vicinity of the countersunk cavity defined by the magnet, and / or another region.

[0071] At step / operation 310, the magnet can be configured to generate a region with a magnetic field strength close to zero.

[0072] At step / operation 312, the substantially cylindrical shield can be configured to allow changes in magnetic flux sensed by the Hall sensor to be sensed substantially uniformly by the Hall sensor.

[0073] At step / operation 314, the region where the magnetic field strength is close to zero can be configured to allow substantially linear operation of the Hall sensor.

[0074] At step / operation 316, the apparatus implementing method 300 may be configured to identify rapid changes in Hall voltage caused by rapid changes in the presence of debris on at least one surface of the housing.

[0075] The operations and procedures described herein support combinations of components for performing specified functions and combinations of operations for performing specified functions. It should be understood that one or more operations, and combinations of operations, can be implemented by a computer system based on dedicated hardware or a combination of dedicated hardware and computer instructions to perform the specified functions.

[0076] In some example implementations, some of the operations described herein may be modified or further expanded as described below. Additionally, in some implementations, additional optional operations may be included. It should be understood that each of the modifications, optional additions, or expansions described herein may be included in the operations herein, either individually or in combination with any other feature described herein.

[0077] The foregoing description of methods and processes is provided as illustrative examples only and is not intended to require or imply that the steps of the various embodiments must be performed in the presented order. As those skilled in the art will understand, the order of steps in the above embodiments can be performed in any order. Words such as “after,” “then,” “next,” and similar terms are not intended to limit the order of steps; these words are merely used to guide the reader through the description of the method. Furthermore, any reference to singular claim elements, for example, using the articles “a,” “an,” or “the,” should not be construed as limiting the element to the singular and, in some cases, may be interpreted in the plural form.

[0078] in conclusion

[0079] Although various embodiments based on the principles disclosed herein have been shown and described above, modifications can be made by those skilled in the art without departing from the teachings of this disclosure. The embodiments described herein are representative only and not intended to be limiting. Many variations, combinations, and modifications are possible and are within the scope of this disclosure. Alternative embodiments resulting from the merging, integration, and / or omission of features of the embodiments are also within the scope of this disclosure. Therefore, the scope of protection is not limited by the description set forth above, but is defined by the following claims, which include all equivalents of the subject matter of the claims. Each claim is incorporated into the specification as further disclosure, and the claims are embodiments of this disclosure. Furthermore, any of the foregoing advantages and features may relate to specific embodiments, but the application of such published claims should not be limited to methods and structures that achieve any or all of the above advantages or have any or all of the above features.

[0080] Furthermore, the chapter titles used in this article are intended to correspond with 37 CFR. The recommendations in 1.77 are consistent with or provide organizational clues. These headings should not limit or characterize the disclosure set forth in any of the claims published in this disclosure. For example, the description of the technology in “Background Art” should not be interpreted as an admission that a certain technology is prior art to any disclosure in this disclosure. Nor should “Summary of the Invention” be considered a limiting characterization of the disclosure set forth in the published claims. Furthermore, any reference in this disclosure to the singular forms “Disclosure” or “Simplification” should not be used to prove that there is only one novel point in this disclosure. Multiple embodiments of this disclosure may be set forth according to the limitations of the multiple claims published in this disclosure, and such claims accordingly define the disclosure protected by them and its equivalents. In all cases, the scope of these claims should be considered in accordance with the advantages of the claims themselves, and should not be limited by the headings set forth herein.

[0081] Furthermore, without departing from the scope of this disclosure, the systems, subsystems, apparatuses, techniques, and methods described and illustrated in various embodiments in a discrete or separate manner can be combined or integrated with other systems, modules, techniques, or methods. Other devices or components shown or discussed as being interconnected or communicating with each other can be indirectly interconnected through some intermediate devices or components, whether such interconnection is made electrically, mechanically, or otherwise. Other examples of variations, substitutions, and modifications that can be identified by those skilled in the art without departing from the scope of this disclosure are also provided.

[0082] Those skilled in the art to which these embodiments pertain will recognize numerous modifications and other embodiments of the disclosure set forth herein, which benefit from the teachings presented in the foregoing description and associated drawings. Although the drawings show only certain components of the apparatuses and systems described herein, various other components may be used in conjunction with the components and structures disclosed herein. Therefore, it should be understood that this disclosure is not limited to the specific embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. For example, various elements or components may be combined, rearranged, or integrated into another system, or certain features may be omitted or not implemented. Furthermore, the steps in any of the methods described above may not necessarily occur in the order depicted in the drawings, and in some cases, one or more of the depicted steps may occur substantially simultaneously, or additional steps may be involved. Although specific terms are used herein, they are used only in a general and descriptive sense and not for limiting purposes.

Claims

1. An apparatus, the apparatus comprising: case; A substantially cylindrical shielding element, which is mechanically connected to the housing; A magnet disposed within a cavity defined by the substantially cylindrical shielding member, wherein the magnet defines a countersunk cavity; and A printed circuit board assembly (PCBA) is positioned near a first end of a magnet, the first end being opposite a second end of the magnet, wherein the second end of the magnet is near the end of the housing that is close to the medium being measured.

2. The apparatus of claim 1, wherein the PCBA includes a Hall sensor protruding from the surface of the PCBA, and wherein the protruding Hall sensor is at least partially disposed in at least one of the following regions: The countersunk cavity defined by the magnet; or Near the countersunk cavity defined by the magnet.

3. The apparatus of claim 2, wherein the magnet is axially magnetized relative to the countersunk hole, and wherein the Hall sensor rotates about the magnetization axis of the magnet.

4. The apparatus of claim 2 or 3, wherein the magnet is configured to generate a region with a magnetic field strength close to zero.

5. The apparatus of claim 4, wherein the substantially cylindrical shield is configured to allow changes in magnetic flux sensed by the Hall sensor to be sensed substantially uniformly by the Hall sensor.

6. The apparatus of claim 5, wherein the region where the magnetic field strength is close to zero is configured to allow substantially linear operation of the Hall sensor.

7. The apparatus according to claims 2 to 6, wherein the apparatus is configured to detect rapid changes in Hall voltage caused by rapid changes in the presence of debris on at least one surface of the housing.

8. A method, the method comprising: The essentially cylindrical shielding is mechanically attached to the housing; The magnet is placed within a cavity defined by the generally cylindrical shield, wherein the magnet defines a countersunk cavity; as well as The printed circuit board assembly (PCBA) is positioned near a first end of the magnet, which is opposite a second end of the magnet, wherein the second end of the magnet is near the end of the housing that is close to the medium being measured.

9. The method of claim 8, wherein the PCBA includes a Hall sensor protruding from the surface of the PCBA, and wherein the protruding Hall sensor is at least partially disposed in at least one of the following regions: The countersunk cavity defined by the magnet; or Near the countersunk cavity defined by the magnet.

10. The method according to claim 9, further comprising: The apparatus for implementing the method is configured to identify rapid changes in Hall voltage caused by rapid changes in the presence of debris on at least one surface of the housing.

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