High-conductivity copper paste cured in air atmosphere as well as preparation method and application of high-conductivity copper paste
By combining particle-free conductive copper ink with air-cured copper paste, and utilizing the in-situ reduction of copper ions to form nano-copper particles, the oxidation problem of conductive paste in an air atmosphere is solved, achieving high conductivity and stability while reducing costs.
CN122291133APending Publication Date: 2026-06-26WUXI JINGRUI OPTOELECTRONIC NEW MATERIALS CO LTD +1
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Patent Information
- Application Number
- CN202610468010.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-10
- Publication Date
- 2026-06-26
AI Technical Summary
Technical Problem
Existing conductive pastes suffer from copper powder oxidation in air, resulting in unstable conductivity and making them difficult to replace silver paste. Furthermore, traditional processes are complex and costly.
Method used
It combines particle-free conductive copper ink with air-curable copper paste, and reduces copper ions in situ to nano-copper particles to form a welded connection. Combined with multi-component synergistic anti-oxidation and infrared rapid curing, it ensures conductivity and stability.
Benefits of technology
It achieves a resistivity of less than 40 μΩ·cm in air atmosphere, has good oxidation resistance and high storage stability, reduces manufacturing costs and simplifies the process.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides high-conductivity copper paste cured in an air atmosphere and a preparation method and application thereof, and belongs to the technical field of conductive paste preparation. The high-conductivity copper paste comprises the following components: 60-80% of conductive copper powder; 3-10% of polymer resin; 1-3% of a curing agent; 3-10% of a first solvent; 1-5% of an auxiliary agent; 7.5-17% of particle-free conductive copper ink; a copper salt precursor in the particle-free conductive copper ink is dissolved in a mixed system of a complexing agent and a second solvent in a copper ion form; when the high-conductivity copper paste is heated and cured in an air atmosphere, copper ions in the particle-free type conductive copper ink are reduced into nano-copper particles in situ, and the nano-copper particles form welding type connection among conductive copper powder particles to form a conductive network jointly composed of micron-sized conductive copper powder and nano-copper welding points generated in situ. The high-conductivity copper paste disclosed by the invention is low in manufacturing cost, and has high conductivity and latent properties of room-temperature dormancy and heating trigger decomposition.
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