Display panel and display device

Abstract

This application relates to a display panel and a display device, including a substrate and a fixing layer. The side surface of the substrate has multiple wiring structures; a first surface of the substrate has multiple light-emitting elements, multiple first pads, and multiple signal lines connecting the light-emitting elements and the pads, with the first pads connected to one end of the wiring structures; a second surface of the substrate has multiple second pads, multiple third pads, and multiple fan-out wirings connecting the second and third pads, with the second pads used to connect to a circuit board, and the third pads connected to the other end of the wiring structures; display signals are transmitted sequentially to the light-emitting elements via the second pads, third pads, wiring structures, first pads, and signal lines; the fixing layer covers at least one of the portions of the second pads away from the substrate, the portions of the third pads away from the substrate, and the portions of the fan-out wirings away from the substrate, and extends to the exposed second surface of the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and a display device. Background Technology

[0002] In the field of display technology, "infinite splicing" is considered an important industrialization goal.

[0003] Side wiring is a key technology for achieving "wireless splicing." However, the side wiring process is complex, involving the installation of metal traces on the front, sides, and back. Conventional display panels suffer from problems such as dense fan-out traces connected to the side wiring and large cross-area areas, making the traces prone to detachment and reducing wiring yield. Summary of the Invention

[0004] This application provides a display panel and display device that can improve the above-mentioned problems.

[0005] In a first aspect, this application provides a display panel, comprising:

[0006] A substrate having a first surface and a second surface disposed opposite to each other, and a side surface connected between the first surface and the second surface;

[0007] The side surface is provided with multiple wiring structures;

[0008] The first surface is provided with a plurality of light-emitting elements, a plurality of first pads, and a plurality of signal traces for connecting the light-emitting elements and the pads, wherein the plurality of first pads are correspondingly connected to the first ends of the plurality of trace structures.

[0009] The second surface is provided with a plurality of second pads, a plurality of third pads, and a plurality of fan-out traces for connecting the second pads and the third pads. The plurality of second pads are used to connect the circuit board, and the plurality of third pads are correspondingly connected to the second ends of the plurality of trace structures.

[0010] A fixing layer covers at least one of the following: a portion of the second pad away from the substrate, a portion of the third pad away from the substrate, and a portion of the fan-out trace away from the substrate, and extends to the second surface of the substrate exposed.

[0011] Beneficial effects: The display panel is provided with a fixing layer that can cover at least one of the partial surfaces of the second pad away from the substrate, the partial surfaces of the third pad away from the substrate, and the partial surfaces of the fan-out trace away from the substrate, and extend to the second surface of the substrate exposed, thereby reducing the risk of the corresponding pads and fan-out traces falling off and improving the structural stability of the display panel.

[0012] In one embodiment, it further includes:

[0013] The first gold layer is disposed on at least one of the following surfaces: the second pad on the side away from the substrate that is not covered by the fixing layer, the third pad on the side away from the substrate that is not covered by the fixing layer, and the fan-out trace on the side that is not covered by the fixing layer.

[0014] Beneficial effects: The first gold layer is disposed on at least one of the surfaces of the second pad away from the substrate that are not covered by the fixing layer, the third pad away from the substrate that are not covered by the fixing layer, and the fan-out trace that are not covered by the fixing layer. The chemical properties of the material in the first gold layer are more stable than the chemical properties of the material of at least one of the second pad, the third pad, and the fan-out trace, thereby protecting the exposed surfaces of at least one of the second pad, the third pad, and the fan-out trace and reducing the risk of oxidation and corrosion of at least one of the exposed surfaces of the second pad, the third pad, and the fan-out trace.

[0015] In one embodiment, it further includes:

[0016] The first black matrix layer covers the surface of the first gold-plated layer on the side of the fan-out trace away from the fan-out trace, and the sidewall of the fan-out trace in the width direction, and extends to a portion of the surface of the fixing layer on the side away from the substrate.

[0017] Beneficial effects: The first black matrix layer covers the surface of the first gold layer on the side away from the fan-out trace, as well as the sidewall of the fan-out trace in the width direction, and extends to a portion of the surface of the fixing layer on the side away from the substrate. This not only shields the display panel from light, but also protects and fixes the fan-out trace, improving the firmness between the fan-out trace and the substrate and reducing the risk of the fan-out trace falling off.

[0018] In one embodiment,

[0019] The first black matrix layer also covers a portion of the surface of the target gold layer facing away from the second surface; the target gold layer includes at least one of the gold layers disposed on the second pad and the third pad facing away from the second surface.

[0020] Beneficial effects: The first black matrix layer can also cover a portion of the surface of the target gold layer facing away from the second surface; the target gold layer includes at least one of the gold layers disposed on the second pad and the third pad facing away from the second surface, increasing the coverage area of ​​the first black matrix layer. On the one hand, this increases the light-shielding area of ​​the second surface of the display panel, improving the display effect. On the other hand, it improves the fixing strength of the gold layer, fan-out traces, and fixing layers, enhancing the stability of the display panel structure.

[0021] In one embodiment, it further includes:

[0022] The second black matrix layer extends from the edge of the second surface away from the third pad to the sidewall of the fixing layer near the second pad and a portion of the surface away from the second surface.

[0023] Beneficial effects: The display panel also includes a second black matrix layer, which extends from the edge away from the third pad to the sidewall of the fixing layer near the second pad and a portion of the surface away from the second surface. Together with the first black matrix layer, it almost covers the entire second surface, which can improve the light-shielding effect of the display panel, thereby improving the display effect of the display panel.

[0024] Secondly, this application also provides a display panel, comprising:

[0025] A substrate having a first surface and a second surface disposed opposite to each other, and a side surface connected between the first surface and the second surface;

[0026] The side surface is provided with multiple wiring structures;

[0027] The first surface is provided with a plurality of light-emitting elements, a plurality of first pads, and a plurality of signal traces for connecting the light-emitting elements and the pads, wherein the plurality of first pads are correspondingly connected to the plurality of trace structures.

[0028] The second surface is provided with a plurality of second pads, a plurality of third pads, and a plurality of fan-out traces for connecting the second pads and the third pads. The plurality of second pads are used to connect the circuit board, and the plurality of third pads are correspondingly connected to the plurality of trace structures.

[0029] The third black matrix layer covers the surface of the fan-out trace away from the second surface and extends through the sidewall of the fan-out trace to a portion of the second surface.

[0030] Beneficial effects: The third black matrix layer directly covers the surface of the fan-out trace away from the second surface and extends to a portion of the second surface through the sidewall of the fan-out trace. This can fix the fan-out trace to the second surface of the substrate, reducing the risk of the fan-out trace falling off, and thus reducing the risk of the second and / or third pads falling off due to the fan-out trace falling off.

[0031] In one embodiment,

[0032] The third black matrix layer also covers at least one of the second pad and a portion of the surface of the third pad facing away from the second surface.

[0033] Beneficial effects: The third black matrix layer can also cover at least one of the second and third pads on the side facing away from the second surface, increasing the coverage area of ​​the third black matrix layer. On the one hand, this increases the light-shielding area of ​​the second surface of the display panel, improving the display effect. On the other hand, it can improve the fixing strength of the fan-out traces and the second and / or third pads, improving the stability of the display panel structure.

[0034] In one embodiment, it further includes:

[0035] The second gold layer is disposed on the surface of the second pad away from the substrate that is not covered by the third black matrix layer and / or on the surface of the third pad away from the substrate that is not covered by the third black matrix layer, and extends to the second surface.

[0036] Beneficial effects: The second gold layer is disposed on the surface of the second pad away from the substrate that is not covered by the third black matrix layer and / or the surface of the third pad away from the substrate that is not covered by the third black matrix layer. The chemical properties of the material in the second gold layer are more stable than the chemical properties of the materials of the second pad and / or the third pad, thereby protecting the exposed surfaces of the second pad and / or the third pad and reducing the risk of oxidation and corrosion of the exposed surfaces of the second pad and / or the third pad.

[0037] In one embodiment,

[0038] The thickness of the second gold layer is greater than the thickness of the third black matrix layer.

[0039] Beneficial effects: The thickness of the second gold layer is greater than that of the third black matrix layer, which can ensure that the second gold layer can completely cover the second pad and / or the third pad, improve the protection effect of the second pad and / or the third pad, reduce the risk of oxidation and corrosion of the second pad and / or the third pad, and improve the stability of signal transmission of the second pad and / or the third pad.

[0040] In one embodiment, it further includes:

[0041] The fourth black matrix layer covers the area on the second surface where the second gold layer, the second pad, the third pad, and the third black matrix layer are not disposed, and extends from the edge of the second surface away from the third pad toward the second pad, and is spaced apart from the second pad.

[0042] Beneficial effects: The display panel also includes a fourth black matrix layer, which covers the area of ​​the second surface where the second gold layer, second pad, third pad and third black matrix layer are not provided, and extends from the edge of the second surface away from the third pad toward the second pad, and is spaced apart from the second pad. Together with the third black matrix layer, it almost covers the entire second surface, which can improve the light-shielding effect of the display panel, thereby improving the display effect of the display panel. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This is one of the structural schematic diagrams of a display panel in some embodiments of this application;

[0045] Figure 2 This is a second schematic diagram of the structure of the display panel in some embodiments of this application;

[0046] Figure 3(a) is one of the structural schematic diagrams of the fixed layer in some embodiments of this application;

[0047] Figure 3(b) is a second schematic diagram of the structure of the fixed layer in some embodiments of this application;

[0048] Figure 3(c) is a third schematic diagram of the structure of the fixed layer in some embodiments of this application;

[0049] Figure 3(d) is a fourth schematic diagram of the structure of the fixed layer in some embodiments of this application;

[0050] Figure 3(e) is a fifth of the structural schematic diagrams of the fixed layer in some embodiments of this application;

[0051] Figure 3(f) is a schematic diagram of the structure of the fixed layer in some embodiments of this application;

[0052] Figure 4 This is a schematic diagram of the structure of the first gold-plated layer in some embodiments of this application;

[0053] Figure 5 This is one of the structural schematic diagrams of the first black matrix layer in some embodiments of this application;

[0054] Figure 6 This is the second schematic diagram of the structure of the first black matrix layer in some embodiments of this application;

[0055] Figure 7This is a schematic diagram of the structure of the second black matrix layer in some embodiments of this application;

[0056] Figure 8 This is the third schematic diagram of the display panel structure in some embodiments of this application;

[0057] Figure 9 This is the fourth schematic diagram of the display panel structure in some embodiments of this application;

[0058] Figure 10 This is a schematic diagram of the structure of the second gold-plated layer in some embodiments of this application;

[0059] Figure 11 This is a schematic diagram of the structure of the fourth black matrix layer in some embodiments of this application.

[0060] Explanation of reference numerals in the attached figures:

[0061] 110: Substrate; 112: First surface; 1121: First pad; 1122: Light-emitting element; 111: Second surface; 1111: Second pad; 1112: Third pad; 1113: Fan-out trace; 120: Fixing layer; 130: First gold plating layer; 140: First black matrix layer; 150: Second black matrix layer; 160: Third black matrix layer; 170: Second gold plating layer; 180: Fourth black matrix layer. Detailed Implementation

[0062] The embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described below do not represent all embodiments consistent with this application. They are merely examples of systems and methods consistent with some aspects of this application as detailed in the claims.

[0063] It should be noted that the brief descriptions of terms in this application are only for the convenience of understanding the embodiments described below, and are not intended to limit the embodiments of this application. Unless otherwise stated, these terms should be understood in their ordinary and common meaning.

[0064] The terms "first," "second," "third," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar or related objects or entities, and do not necessarily imply a specific order or sequence, unless otherwise specified. It should be understood that such terms are interchangeable where appropriate.

[0065] The terms “comprising” and “having”, and any variations thereof, are intended to cover but not exclude inclusion, for example, a product or device that includes a range of components is not necessarily limited to all of the components that are clearly listed, but may include other components that are not clearly listed or that are inherent to such product or device.

[0066] The term "module" refers to any known or subsequently developed hardware, software, firmware, artificial intelligence, fuzzy logic, or combination of hardware and / or software code that is capable of performing the functions associated with that element.

[0067] The application scenarios described in this application are for the purpose of more clearly illustrating the technical solutions of this application, and do not constitute a limitation on the technical solutions provided in this application. As those skilled in the art will know, with the emergence of new application scenarios, the technical solutions provided in this application are also applicable to similar technical problems.

[0068] In one embodiment, this application provides a display panel. The display panel in this embodiment may include a substrate 110.

[0069] The substrate 110 can be a glass substrate, a PCB (Printed Circuit Board) substrate, etc. Glass substrates possess excellent optical properties, providing high light transmittance, low dispersion, and low absorption, resulting in superior display effects, such as higher brightness and more realistic color reproduction. PCB substrates have higher yield rates and lower costs, meeting the needs of applications with less stringent display precision requirements. In practical applications, the type of substrate 110 can be flexibly selected according to actual needs, and is not limited to the examples described above. This application embodiment does not impose specific limitations on the type of substrate 110.

[0070] In this embodiment, the substrate 110 may have a first surface 112 and a second surface 111 disposed opposite to each other, and a side surface connected between the first surface 112 and the second surface 111.

[0071] The side surface can have multiple wiring structures.

[0072] The first surface 112 may be provided with a plurality of light-emitting elements 1122, a plurality of first pads 1121, and a plurality of signal traces for connecting the light-emitting elements 1122 and the pads, wherein the plurality of first pads 1121 are correspondingly connected to the first ends of the plurality of trace structures.

[0073] The light-emitting element 1122 can also be referred to as a light-emitting chip. For example, in the embodiments of this application, the light-emitting element 1122 can be a Micro LED chip miniaturized to the micrometer level. Micro LED chips are extremely small in size, which can achieve higher resolution and smaller pixel pitch, and can meet the requirements of higher definition display.

[0074] Multiple light-emitting elements 1122 can be arranged in an array according to preset display requirements. For example, light-emitting elements 1122 that emit different light beams can be grouped into a light-emitting unit, and multiple groups of light-emitting units can be arranged in an array. For example, light-emitting elements 1122 that emit red light, blue light, and green light can be grouped into a light-emitting unit, but this is not limited to this.

[0075] The first pad 1121 may be a metal area capable of electrical connection and / or providing mechanical support for electronic components. Exemplarily, the first pad 1121 is electrically connected to signal traces disposed on the first surface 112, enabling display signals to be transmitted to the light-emitting element 1122 correspondingly connected to the signal traces, thereby achieving light emission control of the light-emitting element 1122. In another exemplary embodiment, the first pad 1121 may also be electrically connected to a trace structure disposed on the side surface of the substrate 110 to receive electrical signals, such as display signals, transmitted by the trace structure. Further, the first pad 1121 transmits display signals to the correspondingly connected light-emitting element 1122 via the signal traces on the first surface 112.

[0076] To achieve different electrical connection purposes, the shape of the first pad 1121 can be circular, rectangular, elliptical, etc. In practical applications, it can be flexibly set according to the requirements and is not limited to this.

[0077] The wiring structure on the side surface of the substrate 110 can also be used to realize electrical connections. For example, the wiring structure on the side surface can be electrically connected to the electrical transmission lines on the second surface 111 of the substrate 110, thereby receiving electrical signals from the second surface 111 of the substrate 110.

[0078] For example, the second surface 111 may be provided with a plurality of second pads 1111, a plurality of third pads 1112, and a plurality of fan-out traces 1113 for connecting the second pads 1111 and the third pads 1112. The plurality of second pads 1111 are used to connect the circuit board, and the plurality of third pads 1112 are correspondingly connected to the second ends of the plurality of trace structures. The display signal from the circuit board is transmitted to the light-emitting element 1122 in sequence through the second pads 1111, the third pads 1112, the trace structure, the first pad 1121, and the signal traces.

[0079] The second pad 1111 and the third pad 1112 can be understood as technical areas capable of electrical transmission. The shapes of the second pad 1111 and the third pad 1112 can be set according to actual needs, such as circular, rectangular, elliptical, etc. The second pad 1111 is connected to the circuit board and is also connected to the fan-out trace 1113 provided on the second surface 111. The fan-out trace 1113 on the second surface 111 can also be connected to the third pad 1112. The third pad 1112 is electrically connected to the trace structure on the side surface of the substrate 110, thereby forming an electrical signal transmission path from the circuit board to the light-emitting element 1122.

[0080] In this embodiment, the circuit board can be a flexible printed circuit (FPC). The circuit board in this embodiment can integrate circuitry or a chip capable of providing display signals for driving the light-emitting element 1122 to emit light. Exemplarily, the display signals may include gate drive signals, data signals, control signals, power signals, etc., but are not limited thereto.

[0081] Multiple fan-out lines 1113 can be arranged in a preset area on the second side, which can be called the fan-out region.

[0082] The first pad 1121, the second pad 1111, and the third pad 1112 can be made of metals with good electrical and thermal conductivity. For example, the first pad 1121, the second pad 1111, and the third pad 1112 can all be made of copper. To prevent oxidation of the copper pads and improve solderability, tin plating, gold plating, nickel plating, or other treatments can also be applied to the copper surface.

[0083] The display panel in this embodiment may also include a fixing layer 120.

[0084] The fixing layer 120 can be made of a material that can withstand high temperatures, such as a material that can withstand 230°C-250°C. In other embodiments, in order to ensure the high temperatures of the back-end processes in the display panel manufacturing process, the material can also be selected that can withstand the corresponding temperatures, and is not limited to the examples above.

[0085] For example, the material of the fixing layer 120 may include a resin. For example, PI (Polyimide) resin, epoxy resin, acrylic resin, etc., and is not limited thereto.

[0086] In this embodiment, the fixing layer 120 can cover at least one of the partial surface of the second pad 1111 away from the substrate 110, the partial surface of the third pad 1112 away from the substrate 110, and the partial surface of the fan-out trace 1113 away from the substrate 110, and extend to the second surface 111 exposed on the substrate 110.

[0087] The exposed second surface 111 of the substrate 110 may refer to the area of ​​the second surface 111 where the second pad 1111, the third pad 1112, and the fan-out trace 1113 are not provided.

[0088] For example, referring to Figure 3(a), the fixing layer 120 can cover a portion of the surface of the second pad 1111 away from the substrate 110 and extend to the exposed second surface 111 of the substrate 110, thereby more firmly fixing the second pad 1111 to the second surface 111 and reducing the risk of the second pad 1111 falling off. Furthermore, the second pad 1111 is also connected to the fan-out trace 1113, which is also connected to the third pad 1112. The fixing layer 120 improves the structural stability of the second pad 1111 and the substrate 110, reducing the risk of the fan-out trace 1113 and the third pad 1112 falling off due to the second pad 1111 falling off.

[0089] In another exemplary embodiment, referring to Figure 3(b), the fixing layer 120 may also cover a portion of the surface of the third pad 1112 away from the substrate 110 and extend to the exposed second surface 111 of the substrate 110 to fix the third pad 1112 to the second surface 111, reducing the risk of the third pad 1112 detaching. This also reduces the risk of the fan-out trace 1113 and the second pad 1111 detaching due to the detachment of the third pad 1112.

[0090] Another example is shown in the appendix. Figure 1 The fixing layer 120 can also cover at least a portion of the surface of the fan-out trace 1113 away from the substrate 110 and extend to the exposed second surface 111 of the substrate 110 to fix the fan-out trace 1113 to the second surface 111, thereby reducing the risk of the fan-out trace 1113 falling off and reducing the risk of the second pad 1111 and the third pad 1112 falling off due to the fan-out trace 1113 falling off.

[0091] Understandably, see appendix. Figure 1In order to enhance the structural stability of the fan-out trace 1113 and the second surface 111 of the substrate 110 and further reduce the risk of the fan-out trace 1113 falling off, the fixing layer 120 can cover the part of the surface of all fan-out traces 1113 away from the substrate 110 and extend to the second surface 111 of the substrate 110 respectively, thereby fixing each fan-out trace 1113 to the substrate 110 and improving the stability of the fan-out trace 1113 and the second surface 111 of the substrate 110.

[0092] In another exemplary embodiment, referring to FIG3(c), the fixing layer 120 may also cover the surface of the second pad 1111 away from the substrate 110 and extend to the second surface 111 exposed on the substrate 110, and cover the surface of the third pad 1112 away from the substrate 110 and extend to the second surface 111 included on the substrate 110.

[0093] In another exemplary embodiment, referring to Figure 3(d), the fixing layer 120 may also cover the surface of the second pad 1111 away from the substrate 110 and extend to the second surface 111 exposed on the substrate 110, and cover at least a portion of the fan-out trace 1113 away from the substrate 110 and correspondingly extend to the second surface 111 exposed on the substrate 110.

[0094] In another exemplary embodiment, referring to Figure 3(e), the fixing layer 120 may also cover the surface of the third pad 1112 away from the substrate 110 and extend to the second surface 111 exposed on the substrate 110, and cover at least a portion of the fan-out trace 1113 away from the substrate 110 and correspondingly extend to the second surface 111 exposed on the substrate 110.

[0095] In another exemplary embodiment, referring to Figure 3(f), the fixing layer 120 may also cover the surface of the second pad 1111 away from the substrate 110 and extend to the second surface 111 exposed on the substrate 110, cover the surface of the third pad 1112 away from the substrate 110 and extend to the substrate 110, and cover at least a portion of the fan-out trace 1113 away from the substrate 110 and correspondingly extend to the second surface 111 exposed on the substrate 110.

[0096] In this embodiment, the display panel is provided with a fixing layer 120. The fixing layer 120 can cover at least one of the partial surface of the second pad 1111 away from the substrate 110, the partial surface of the third pad 1112 away from the substrate 110, and the partial surface of the fan-out trace 1113 away from the substrate 110, and extends to the second surface 111 exposed on the substrate 110, thereby reducing the risk of the corresponding pads and fan-out traces 1113 falling off and improving the structural stability of the display panel.

[0097] Micro LED is a next-generation display technology. Its advantages include high brightness, wide color gamut, and high reliability. It is also easy to achieve flexibility, transparency, free splicing, and sensor integration, and can be widely used in various fields, from micro-displays to consumer electronics and large-screen displays. Because Micro LED requires high current driving (in the microampere range), low-resistivity copper (Cu) is an ideal material for the traces. However, Cu is prone to oxidation and corrosion, which can compromise device reliability. Conventional techniques for corrosion protection of Cu traces typically involve layering an anti-corrosion layer on the Cu surface. However, conventional solutions often result in problems such as side trace detachment or exposed Cu edges, leading to poor corrosion protection efficiency or low yield of side trace structures.

[0098] In this embodiment, at least one of the first pad 1121, the second pad 1111, the third pad 1112, the fan-out trace 1113, and the signal trace disposed on the first surface 112 can be made of copper. To mitigate the problem of copper's susceptibility to oxidation and corrosion, a gold plating layer can be provided on the display panel. Exemplarily, in one embodiment, the display panel may further include a first gold plating layer 130.

[0099] In this embodiment, the first gold layer 130 may be disposed on at least one of the following surfaces: the second pad 1111 on the side away from the substrate 110 that is not covered by the fixing layer 120, the third pad 1112 on the side away from the substrate 110 that is not covered by the fixing layer 120, and the fan-out trace 1113 on the surface that is not covered by the fixing layer 120.

[0100] The first gold layer 130 refers to a dense protective layer formed by using a specific chemical solution to induce predetermined metal ions at a target location through a chemical oxidation-reduction reaction. The target location can be at least one of the following: the surface of the second pad 1111 away from the substrate 110 that is not covered by the fixing layer 120; the surface of the third pad 1112 away from the substrate 110 that is not covered by the fixing layer 120; and the surface of the fan-out trace 1113 that is not covered by the fixing layer 120.

[0101] The first gold-plating layer 130 can be prepared using a material capable of forming an alloy at low temperatures. Furthermore, it must be selected as a material that is not easily oxidized and does not affect the bonding effect with the chip. Exemplarily, the material of the first gold-plating layer 130 includes nickel-gold, tin, indium, etc., and is not limited thereto. A preset metal ion corresponds to the material of the second gold-plating layer 170. Exemplarily, the preset metal ion can be nickel-gold, tin, indium, etc., and is not limited thereto.

[0102] The process steps for forming the first gold layer 130 may include pretreatment, micro-etching, pre-dip, activation, chemical gold plating, and post-treatment. Pretreatment mainly removes oil and impurities from the target location surface; micro-etching roughens the metal surface of the target location to enhance the adhesion of subsequent plating layers; pre-dip and activation create conditions for the chemical gold plating reaction, allowing the preset metal ions to deposit smoothly; chemical gold plating is the core step, where a gold layer of appropriate thickness is obtained by controlling parameters such as the chemical composition, reaction time, and temperature; post-treatment mainly involves cleaning and drying the target location after gold plating to remove residual chemicals from the surface. For example, in this embodiment, the target location may be at least one of the following: the surface of the second pad 1111 away from the substrate 110 that is not covered by the fixing layer 120; the surface of the third pad 1112 away from the substrate 110 that is not covered by the fixing layer 120; and the surface of the fan-out trace 1113 that is not covered by the fixing layer 120.

[0103] The first gold layer 130 may be provided as needed on at least one of the surfaces of the second pad 1111, the third pad 1112, and the fan-out trace 1113 that are not covered by the fixing layer 120, in order to improve the phenomenon of easy oxidation.

[0104] For example, see Appendix Figure 4 , attached Figure 4 A schematic diagram of the first gold plating layer 130 is shown. The second pad 1111, the third pad 1112, and each fan-out trace 1113 are all made of copper. The first gold plating layer 130 can be disposed on the surface of the second pad 1111 away from the second surface 111 of the substrate 110 that is not covered by the fixing layer 120, on the surface of the third pad 1112 away from the second surface 111 of the substrate 110 that is not covered by the fixing layer 120, and on the surface of each fan-out trace 1113 away from the second surface 111 of the substrate 110 that is not covered by the fixing layer 120. This protects the second pad 1111, the third pad 1112, and the fan-out traces 1113 respectively, reducing the risk of oxidation and corrosion of the second pad 1111, the third pad 1112, and the fan-out traces 1113.

[0105] In another example, the second pad 1111 is made of other materials that are not easily oxidized. In this case, in order to reduce the manufacturing cost of the display panel and reduce the manufacturing process to improve efficiency, only the exposed surfaces of the third pad 1112 and the fan-out trace 1113 can be gold-plated to prepare the first gold-plated layer 130.

[0106] In another example, among the multiple fan-out traces 1113, only a portion of the fan-out traces 1113 are made of a material that is easily oxidized and corroded, while the other portion of the fan-out traces 1113 are made of a material that is not easily oxidized and corroded. The first gold layer 130 can be applied to the surface of the portion of the fan-out traces 1113 made of the easily oxidized and corroded material that is not covered by the fixing layer 120 on the side opposite to the first surface 112 of the substrate 110.

[0107] In this embodiment, the first gold layer 130 is disposed on at least one of the surfaces of the second pad 1111 away from the substrate 110 that are not covered by the fixing layer 120, the surface of the third pad 1112 away from the substrate 110 that are not covered by the fixing layer 120, and the surface of the fan-out trace 1113 that are not covered by the fixing layer 120. The chemical properties of the material in the first gold layer 130 are more stable than the chemical properties of the material of at least one of the second pad 1111, the third pad 1112, and the fan-out trace 1113, thereby protecting the exposed surfaces of at least one of the second pad 1111, the third pad 1112, and the fan-out trace 1113 and reducing the risk of oxidation and corrosion of at least one of the exposed surfaces of the second pad 1111, the third pad 1112, and the fan-out trace 1113.

[0108] In one embodiment, the display panel in this embodiment may further include a first black matrix layer 140 (BlackMatrix, BM).

[0109] See appendix Figure 5 , attached Figure 5 One of the structural schematic diagrams of the first black matrix layer 140 is shown. The first black matrix layer 140 can cover the surface of the first gold layer 130 on the side away from the fan-out trace 1113, the sidewall of the fan-out trace 1113 in the width direction, and extend to a portion of the surface of the fixing layer 120 on the side away from the substrate 110.

[0110] The materials of the black matrix layer in the embodiments of this application may include resin, black pigment, solvent, etc. The black pigment is usually carbon black, which is used to provide good light-blocking properties, while the resin forms a specific pattern in the black matrix during processes such as exposure and development.

[0111] For example, the fabrication process of the first black matrix layer 140 may include cleaning, coating material, exposure, development, and curing. In the cleaning process, chemical cleaning solutions and deionized water, combined with ultrasonic cleaning, can be used to remove dust, oil, and metallic impurities from the surfaces of the substrate 110, the first gold-plated layer 130, and the fixing layer 120, ensuring good adhesion between the subsequent coating and the substrate 110, the first gold-plated layer 130, and the fixing layer 120. A material containing black pigment, resin, and other components is uniformly coated using spin coating, slot coating, or other methods onto the cleaned surface of the first gold-plated layer 130 on the side of the fan-out trace 1113 facing away from the fan-out trace 1113, the sidewalls of the fan-out trace 1113 in the width direction, and a portion of the surface of the fixing layer 120 facing away from the substrate 110. During spin coating, the coating thickness can be adjusted by controlling the rotation speed and time. Slit coating utilizes a precision slit head to coat a material containing black pigment, resin, and other components at a specific flow rate and speed onto the surface of the first gold layer 130 on the side opposite to the fan-out trace 1113, the sidewalls of the fan-out trace 1113 in the width direction, and a portion of the surface of the fixing layer 120 on the side opposite to the substrate 110. The substrate 110 coated with the material containing black pigment, resin, and other components is placed in an exposure machine and irradiated with ultraviolet light through a mask corresponding to the pattern of the first black matrix layer 140. During exposure, the photosensitizer in the material containing black pigment, resin, and other components undergoes a photochemical reaction, causing the photosensitive resin in the exposed area to crosslink and solidify, while the photosensitive material in the unexposed area remains soluble in the developing solution. The exposed substrate 110 is then immersed in the developing solution, or sprayed with developing solution, to dissolve and remove the black photosensitive material in the unexposed area, while the solidified area remains, thereby forming a black matrix pattern on the substrate 110 that matches the mask pattern. After development, the substrate 110 is typically cleaned with deionized water to remove any residual developer. The developed substrate 110 is then subjected to heating or ultraviolet baking to further cure the photosensitive resin in the black matrix pattern, improving its hardness, abrasion resistance, and chemical corrosion resistance, while also enhancing its adhesion to the substrate 110. For example, it can be baked at a high temperature of approximately 200°C for several tens of minutes.

[0112] The above-described fabrication process steps for the first black matrix layer 140 are merely examples. In other embodiments, other fabrication methods may be used to fabricate the first black matrix layer 140 as needed. For example, the black matrix layer may be formed by photolithography and etching after evaporating a chromium metal layer. This is not limited to these methods.

[0113] The combined projection of the fan-out trace 1113 on the second surface 111 of the substrate 110, the first gold layer 130 on the second surface 111 of the substrate 110, and the fixing layer 120 on the second surface 111 of the substrate 110 at least partially overlaps with the projection of the first black matrix layer 140 on the second surface 111 of the substrate 110.

[0114] In this embodiment, the first black matrix layer 140 covers the surface of the first gold layer 130 on the side of the fan-out trace 1113 away from the fan-out trace 1113, and the sidewall of the fan-out trace 1113 in the width direction, and extends to a portion of the surface of the fixing layer 120 away from the substrate 110. This not only shields the display panel from light, but also protects and fixes the fan-out trace 1113, improving the firmness between the fan-out trace 1113 and the substrate 110 and reducing the risk of the fan-out trace 1113 falling off.

[0115] In some embodiments, the first black matrix layer 140 may also cover a portion of the surface of the target gold layer away from the second surface 111; the target gold layer includes at least one of the gold layers disposed on the second pad 1111 and the third pad 1112 away from the second surface 111.

[0116] For example, the first black matrix layer 140 may also cover a portion of the surface of the gold plating layer disposed on the side of the second pad 1111 away from the second surface 111 of the substrate 110 away from the second surface 111.

[0117] In another example, the first black matrix layer 140 may also cover a portion of the surface of the gold plating layer disposed on the side of the third pad 1112 away from the second surface 111 of the substrate 110 away from the second surface 111.

[0118] Another example is shown in the appendix. Figure 6 , attached Figure 6 The second schematic diagram of the structure of the first black matrix layer 140 is shown. The first black matrix layer 140 can also cover part of the surface of the gold plating layer on the side of the second pad 1111 and the third pad 1112 that is away from the second surface 111 of the substrate 110.

[0119] In this embodiment, the first black matrix layer 140 can also cover a portion of the target gold layer on the side facing away from the second surface 111. The target gold layer includes at least one of the gold layers disposed on the second pad 1111 and the third pad 1112 on the side facing away from the second surface 111, increasing the coverage area of ​​the first black matrix layer 140. On the one hand, this increases the light-shielding area of ​​the second surface 111 of the display panel, improving the display effect. On the other hand, it improves the fixing strength of the gold layer, the fan-out trace 1113, and the fixing layer 120, improving the stability of the display panel structure.

[0120] In one embodiment, see Appendix Figure 7 , attached Figure 7 A schematic diagram of the structure of the second black matrix layer 150 is shown. In this embodiment, the display panel may also include the second black matrix layer 150.

[0121] The second black matrix layer 150 can extend from the edge of the second surface 111 away from the third pad 1112 to the sidewall of the fixing layer 120 near the second pad 1111 and a portion of the surface away from the second surface 111.

[0122] The thickness of the second black matrix layer 150 may be different from or the same as the thickness of the first black matrix layer 140. For example, in this embodiment, the second surface 111 of the substrate 110 is divided into a first part and a second part. The second pad 1111, the third pad 1112, and the fan-out trace 1113 are all disposed in the first part. The first gold plating layer 130 is also disposed in the first part. The thickness of the film layer in the first part is higher than that in the second part due to the presence of the fixing layer 120, the fan-out trace 1113, the first gold plating layer 130, the second pad 1111, and the third pad 1112. The second black matrix layer 150 covers the second surface 111 of the second part. The thickness of the second black matrix layer 150 may be higher than that of the first black matrix layer 140 to reduce the height difference of the second surface 111.

[0123] In another example, the thickness of the second black matrix layer 150 may be equal to the thickness of the first black matrix layer 140 to ensure uniform light shading across the entire second surface 111.

[0124] In this embodiment, the display panel further includes a second black matrix layer 150. The second black matrix layer 150 extends from the edge away from the third pad 1112 to the sidewall of the fixing layer 120 near the second pad 1111 and a portion of the surface away from the second surface 111. Together with the first black matrix layer 140, it almost covers the entire second surface 111, which can improve the light-shielding effect of the display panel and thus improve the display effect of the display panel.

[0125] In one embodiment, the thickness of both the first black matrix layer 140 and the second black matrix layer 150 can be 1.5um-2.5um. Exemplarily, the thickness of the first black matrix layer 140 and the second black matrix layer 150 can be 1.5um, 1.6um, 1.7um, 1.8um, 1.9um, 2um, 2.1um, 2.2um, 2.3um, 2.4um, 2.5um, etc., respectively, and is not limited thereto.

[0126] In some embodiments, the thickness of the first black matrix layer 140 and the second black matrix layer 150 can be adjusted by adjusting coating parameters, controlling exposure and development conditions, and precisely controlling the curing process during the preparation of the first black matrix layer 140 and the second black matrix layer 150.

[0127] It is understood that, referring to the explanation of the previous embodiment, although the thickness of the first black matrix layer 140 and the second black matrix layer 150 in this embodiment can be within the same range, it does not mean that the thickness values ​​of the two are the same. In practical applications, the thickness of the first black matrix layer 140 and the second black matrix layer 150 can be flexibly and independently set as needed, and the thickness of the first black matrix layer 140 and the second black matrix layer 150 can be the same or different.

[0128] In this embodiment, if the thickness of the black matrix layer is insufficient, it may not be able to effectively block the light from the backlight, resulting in light leakage. This would make the display panel's color display less pure and reduce the display contrast. Furthermore, if the black matrix layer is too thick, it would cause the display panel size to be inappropriate, affecting the product's aesthetics and screen-to-body ratio. In this embodiment, the thickness of both the first black matrix layer 140 and the second black matrix layer 150 can be 1.5um-2.5um, which can ensure the light-blocking effect of the first black matrix layer 140 and the second black matrix layer 150, while not limiting the size design of the display panel.

[0129] In one embodiment, the first black matrix layer 140 and the fixing layer 120 may comprise the same material.

[0130] For example, the materials of both the first black matrix layer 140 and the fixing layer 120 may include resin. The resin may include, but is not limited to, PI resin, epoxy resin, acrylic resin, etc.

[0131] In this embodiment, the first black matrix layer 140 and the fixed layer 120 may include the same material. In the process of preparing the display panel, the process of preparing the first black matrix layer 140 and the fixed layer 120 can be simplified, and the preparation efficiency of the display panel can be improved.

[0132] In one embodiment, the thickness of the first gold layer 130 is greater than the thickness of the fixing layer 120.

[0133] The thickness of the first gold layer 130 can be adjusted by controlling the deposition time, adjusting the chemical concentration, adjusting the temperature and pH value, and monitoring equipment parameters.

[0134] For example, under otherwise unchanged conditions, extending the chemical deposition time allows the preset metal ions more time to be reduced and deposited at the target site. The longer the chemical deposition time, the thicker the first gold layer 130 will be. However, excessive time may lead to defects such as roughness and porosity in the gold layer. Therefore, in the actual preparation process, the optimal deposition time can be determined through multiple experiments according to actual requirements to obtain a gold layer of suitable thickness.

[0135] In another example, the chemical gold deposit solution required to prepare the first gold-plated layer 130 contains gold salts, complexing agents, reducing agents, and other components. Increasing the gold salt concentration increases the number of preset metal ions available for reduction and deposition in the solution, thereby accelerating the deposition rate and increasing the thickness of the gold-plated layer. Conversely, decreasing the gold salt concentration will reduce the thickness of the gold-plated layer.

[0136] Another example is that the rate of chemical oxidation-reduction reaction can be accelerated by increasing the temperature, so that the preset metal ions can be reduced and deposited at the target location more quickly, thereby increasing the thickness of the first gold layer 130.

[0137] Furthermore, the chemical environment of the chemical gold immersion solution can be altered by adjusting the pH value, thereby affecting the activity of the preset metal ions and the reducing power of the reducing agent, and thus controlling the deposition rate and thickness of the first gold layer 130. This is not the only limitation.

[0138] In some embodiments, the thickness of the fixed layer 120 can be adjusted by adjusting the parameters of the coating process of the fixed layer 120, changing the viscosity of the material of the fixed layer 120, controlling the temperature of the substrate 110, and using a multilayer coating process.

[0139] For example, if the fixing layer 120 is coated using spin coating, the thickness of the fixing layer 120 can be controlled by the rotation speed and time. A faster rotation speed results in a greater centrifugal force and a thinner fixing layer 120; a longer rotation time results in more excess fixing layer 120 material being ejected, also leading to a thinner fixing layer 120. If the fixing layer 120 is coated using spray coating, the thickness of the fixing layer 120 can be controlled by adjusting the spray pressure, the distance between the nozzle and the substrate 110, and the spray time. A higher spray pressure and a closer distance result in more fixing layer 120 material deposited per unit time, leading to a thicker fixing layer 120; a longer spray time also results in a thicker fixing layer 120. If the fixing layer 120 is coated using a blade coating method, the resin coverage thickness can be adjusted by controlling the height, angle, and movement speed of the blade. The smaller the distance between the scraper and the substrate 110 and the larger the angle, the more material of the fixing layer 120 is scraped off, and the thinner the fixing layer 120 is. The slower the scraper moves, the longer the material of the fixing layer 120 stays on the substrate 110, and the thicker the fixing layer 120 is.

[0140] Another example is the use of resin as the material for the fixing layer 120. The thickness of the fixing layer 120 can be adjusted by changing the resin viscosity. Higher resin viscosity results in poorer resin flowability, making it less likely to spread and disperse during coating, thus forming a thicker cover layer, and consequently, a thicker fixing layer 120. Conversely, lower resin viscosity allows for easier resin flow, resulting in a thinner cover layer on the substrate 110, and consequently, a thinner fixing layer 120. Therefore, in some embodiments, the resin viscosity can be adjusted by adding a diluent or thickener, thereby controlling the thickness of the fixing layer 120.

[0141] In another exemplary embodiment, by increasing the temperature of the substrate 110, the surface tension between the material used to prepare the fixing layer 120 and the substrate 110 can be reduced, making it easier for the material used to prepare the fixing layer 120 (such as resin) to spread on the substrate 110, thereby obtaining a thinner fixing layer 120. A higher temperature also accelerates the evaporation rate of the solvent in the material used to prepare the fixing layer 120 (such as resin), which helps to quickly fix the coverage thickness of the material used to prepare the fixing layer 120 (such as resin). Conversely, decreasing the temperature of the substrate 110 reduces the fluidity of the material used to prepare the fixing layer 120 (such as resin), resulting in a thicker fixing layer 120.

[0142] As another example, the thickness of the fixed layer 120 can also be flexibly controlled by using a multi-layer coating method. For example, a small thickness can be controlled each time it is coated, and then the desired total thickness can be achieved through multiple coatings. Therefore, the uniformity and thickness of each fixed layer 120 can be controlled.

[0143] In this embodiment, the first gold plating layer 130 is disposed on at least one of the surfaces of the second pad 1111 away from the substrate 110 that are not covered by the fixing layer 120, the surface of the third pad 1112 away from the substrate 110 that are not covered by the fixing layer 120, and the surface of the fan-out trace 1113 that are not covered by the fixing layer 120. The fixing layer 120 covers at least one of the partial surfaces of the second pad 1111 away from the substrate 110, the partial surfaces of the third pad 1112 away from the substrate 110, and the partial surfaces of the fan-out trace 1113 away from the substrate 110, and extends to the second surface 111 exposed on the substrate 110. The thickness of the first gold plating layer 130 is greater than the thickness of the fixing layer 120, which can ensure that the corresponding second pad 1111 and / or the third pad 1112 and / or the fan-out trace 1113 are fully covered, thereby improving the protection effect on the corresponding second pad 1111 and / or the third pad 1112 and / or the fan-out trace 1113.

[0144] In one embodiment, the thickness of the first gold layer 130 can be 2.5µm-3.5µm.

[0145] For example, the thickness of the first gold layer 130 can be 2.5um, 2.6um, 2.7um, 2.8um, 2.9um, 3um, 3.1um, 3.2um, 3.3um, 3.4um, 3.5um, etc., and is not limited thereto.

[0146] If the first gold layer 130 is too thin, it is easily dissolved and consumed by other metals, leading to problems such as poor bonding at the interface of the first gold layer 130. On the one hand, the first gold layer 130 is prone to detachment, failing to effectively protect the corresponding pads and fan-out traces 1113. On the other hand, an excessively thin first gold layer 130 may cause increased local resistance, affecting normal signal transmission and causing signal interference and bit errors. If the first gold layer 130 is too thick, it will increase costs, and due to some of its own characteristics, such as the possibility of slow chemical changes under certain environments, it may adversely affect corrosion resistance. In addition, an excessively thick first gold layer 130 may also change the impedance characteristics of the circuit, similarly negatively impacting electrical performance. In this embodiment, the thickness of the first gold layer 130 can be 2.5um-3.5um, which ensures that the first gold layer 130 effectively protects the corresponding pads and fan-out traces 1113 while ensuring the stability of signal transmission of the corresponding pads and fan-out traces 1113.

[0147] In one embodiment, see Appendix Figure 2 and attached Figure 8 This application also provides a display panel. Unlike the previous embodiments, the display panel in this embodiment may not have a fixed layer 120. The limitations and explanations of the same or corresponding technical features as in the previous embodiments can be found above and will not be repeated here.

[0148] The display panel in this embodiment may include a substrate 110.

[0149] The substrate 110 has a first surface 112 and a second surface 111 disposed opposite to each other, and a side surface connected between the first surface 112 and the second surface 111.

[0150] The side surface can have multiple wiring structures.

[0151] The first surface 112 may be provided with a plurality of light-emitting elements 1122, a plurality of first pads 1121, and a plurality of signal traces for connecting the light-emitting elements 1122 and the pads, with the plurality of first pads 1121 correspondingly connected to the plurality of trace structures.

[0152] The second surface 111 may be provided with a plurality of second pads 1111, a plurality of third pads 1112, and a plurality of fan-out traces 1113 for connecting the second pads 1111 and the third pads 1112. The plurality of second pads 1111 are used to connect the circuit board, and the plurality of third pads 1112 are correspondingly connected to the plurality of trace structures. The display signal from the circuit board is transmitted to the light-emitting element 1122 in sequence through the second pads 1111, the third pads 1112, the trace structures, the first pads 1121, and the signal traces.

[0153] The display panel may also include a third black matrix layer 160.

[0154] The third black matrix layer 160 can cover the surface of the fan-out trace 1113 away from the second surface 111, and extend through the sidewall of the fan-out trace 1113 to a portion of the surface of the second surface 111.

[0155] The fabrication process and materials of the third black matrix layer 160 can be the same as those of the first black matrix layer 140 in the previous embodiment.

[0156] In this embodiment, the third black matrix layer 160 directly covers the surface of the fan-out trace 1113 facing away from the second surface 111, and extends through the sidewall of the fan-out trace 1113 to a portion of the surface of the second surface 111. This can fix the fan-out trace 1113 to the second surface 111 of the substrate 110, reducing the risk of the fan-out trace 1113 falling off, and thus reducing the risk of the second pad 1111 and / or the third pad 1112 falling off due to the fan-out trace 1113 falling off.

[0157] In one embodiment, the third black matrix may also cover at least one of the portions of the second pad 1111 and the third pad 1112 that are away from the second surface 111.

[0158] For example, the third black matrix layer 160 may also cover a portion of the surface of the second pad 1111 facing away from the second surface 111 of the substrate 110.

[0159] In another exemplary embodiment, the third black matrix layer 160 may also cover a portion of the surface of the third pad 1112 facing away from the second surface 111 of the substrate 110.

[0160] Another example is shown in the appendix. Figure 9 The third black matrix layer 160 can also cover a portion of the surface of the second pad 1111 and the third pad 1112 on the side opposite to the second surface 111 of the substrate 110.

[0161] In this embodiment, the third black matrix layer 160 can also cover a portion of the surface of at least one of the second pads 1111 and the third pad 1112 that faces away from the second surface 111, increasing the coverage area of ​​the third black matrix layer 160. On the one hand, this increases the light-shielding area of ​​the second surface 111 of the display panel, improving the display effect. On the other hand, it increases the fixing strength of the fan-out traces 1113 and the second pads 1111 and / or the third pads 1112, improving the stability of the display panel structure.

[0162] In one embodiment, the display panel may further include a second gold layer 170.

[0163] The second gold layer 170 may be disposed on at least one of the surfaces of the second pad 1111 away from the substrate 110 that are not covered by the third black matrix layer 160, and the surfaces of the third pad 1112 away from the substrate 110 that are not covered by the third black matrix layer 160, and extend to the second surface 111.

[0164] The second gold plating layer 170 refers to a dense protective layer formed at a target location by a specific chemical solution through a chemical oxidation-reduction reaction, where predetermined metal ions are deposited. The target location can be at least one of the surfaces of the second pad 1111 (away from the substrate 110) not covered by the third black matrix layer 160, or the surface of the third pad 1112 (away from the substrate 110) not covered by the third black matrix layer 160. The predetermined metal ions correspond to the material of the second gold plating layer 170. Exemplarily, the predetermined metal ions can be nickel-gold, tin, indium, etc., but are not limited to these.

[0165] The second gold layer 170 can be provided as needed on at least one surface of the second pad 1111 and the third pad 1112 that is not covered by the third black matrix layer 160, in order to improve the phenomenon of easy oxidation.

[0166] For example, see Appendix Figure 10 , attached Figure 10 A schematic diagram of the second gold plating layer 170 is shown. Both the second pad 1111 and the third pad 1112 can be made of copper. The second gold plating layer 170 can be disposed on the surface of the second pad 1111 away from the second surface 111 of the substrate 110 that is not covered by the third black matrix layer 160, and also on the surface of the third pad 1112 away from the second surface 111 of the substrate 110 that is not covered by the third black matrix layer 160, thereby protecting the second pad 1111 and the third pad 1112 respectively and reducing the risk of oxidation and corrosion of the second pad 1111 and the third pad 1112.

[0167] In another example, the second pad 1111 is made of other materials that are not easily oxidized. In this case, in order to reduce the manufacturing cost of the display panel and reduce the manufacturing process to improve efficiency, the second gold layer 170 can be prepared only on the surface of the third pad 1112 that is not covered by the third black matrix layer.

[0168] In another example, the third pad 1112 is made of other materials that are not easily oxidized. In this case, in order to reduce the manufacturing cost of the display panel and reduce the manufacturing process to improve efficiency, the second gold layer 170 can be prepared only on the surface of the second pad 1111 that is not covered by the third black matrix layer.

[0169] In this embodiment, the second gold layer 170 is disposed on the surface of the second pad 1111 away from the substrate 110 that is not covered by the third black matrix layer 160 and / or the surface of the third pad 1112 away from the substrate 110 that is not covered by the third black matrix layer 160. The chemical properties of the material in the second gold layer 170 are more stable than the chemical properties of the materials of the second pad 1111 and / or the third pad 1112, thereby protecting the exposed surfaces of the second pad 1111 and / or the third pad 1112 and reducing the risk of oxidation and corrosion of the exposed surfaces of the second pad 1111 and / or the third pad 1112.

[0170] In one embodiment, the thickness of the second gold layer 170 is greater than the thickness of the third black matrix layer 160.

[0171] The thickness of the second gold-plated layer 170 can be adjusted in the same way as the thickness of the first gold-plated layer 130 in the above embodiment, and the thickness of the third black matrix layer 160 can also be adjusted in the same way as the thickness of the first black matrix layer 140 and the second black matrix layer 150 in the above embodiment.

[0172] In this embodiment, the thickness of the second gold plating layer 170 is greater than the thickness of the third black matrix layer 160, which ensures that the second gold plating layer 170 can completely cover the second pad 1111 and / or the third pad 1112, improve the protection effect of the second pad 1111 and / or the third pad 1112, reduce the risk of oxidation and corrosion of the second pad 1111 and / or the third pad 1112, and improve the stability of signal transmission of the second pad 1111 and / or the third pad 1112.

[0173] In one embodiment, see Appendix Figure 11 The display panel in this embodiment may further include a fourth black matrix layer 180.

[0174] The fourth black matrix layer 180 can cover the area of ​​the second surface 111 where the second gold layer 170, the second pad 1111, the third pad 1112 and the third black matrix layer 160 are not provided, and extends from the edge of the second surface 111 away from the third pad 1112 toward the second pad 1111, and is spaced apart from the second pad 1111.

[0175] The thickness of the fourth black matrix layer 180 may be different from or the same as the thickness of the third black matrix layer 160. For example, in this embodiment, the second surface 111 of the substrate 110 is divided into a first part and a second part. The second pad 1111, the third pad 1112, and the fan-out trace 1113 are all located in the first part. The thickness of the film layer in the first part is higher than that in the second part due to the presence of the fan-out trace 1113, the second pad 1111, and the third pad 1112. The fourth black matrix layer 180 covers the second surface 111 of the second part. The thickness of the fourth black matrix layer 180 may be higher than that of the third black matrix layer 160 to reduce the height difference of the second surface 111.

[0176] In another example, the thickness of the fourth black matrix layer 180 may be equal to the thickness of the third black matrix layer 160 to ensure uniform light shading across the entire second surface 111.

[0177] In this embodiment, the display panel further includes a fourth black matrix layer 180. The fourth black matrix layer 180 covers the area of ​​the second surface 111 where the second gold layer 170, the second pad 1111, the third pad 1112, and the third black matrix layer 160 are not disposed. It extends from the edge of the second surface 111 away from the third pad 1112 toward the second pad 1111 and is spaced apart from the second pad 1111. Together with the third black matrix layer 160, it almost covers the entire second surface 111, which can improve the light-shielding effect of the display panel, thereby improving the display effect of the display panel.

[0178] In some embodiments, the thickness range of the third black matrix layer 160 and the fourth black matrix layer 180 can be the same as the thickness range of the first black matrix layer 140 and the second black matrix layer 150. For example, the thickness of the third black matrix layer 160 and the fourth black matrix layer 180 can be 1.5µm-2.5µm. For example, the thickness of both the third black matrix layer 160 and the fourth black matrix layer 180 can be 1.5µm, 1.6µm, 1.7µm, 1.8µm, 1.9µm, 2µm, 2.1µm, 2.2µm, 2.3µm, 2.4µm, 2.5µm, etc., and is not limited thereto.

[0179] Although the thicknesses of the third black matrix layer 160 and the fourth black matrix layer 180 in this embodiment can be within the same range, it does not mean that their thickness values ​​are the same. In practical applications, the thicknesses of the third black matrix layer 160 and the fourth black matrix layer 180 can be flexibly and independently set as needed. The thicknesses of the third black matrix layer 160 and the fourth black matrix layer 180 can be the same or different.

[0180] In this embodiment, if the thickness of the black matrix layer is insufficient, it may not be able to effectively block the light from the backlight, resulting in light leakage. This would make the display panel's color display less pure and reduce the display contrast. Furthermore, if the black matrix layer is too thick, it would cause the display panel size to be inappropriate, affecting the product's aesthetics and screen-to-body ratio. In this embodiment, the thickness of both the third black matrix layer 160 and the fourth black matrix layer 180 can be 1.5um-2.5um, which can ensure the light-blocking effect of the third black matrix layer 160 and the fourth black matrix layer 180, while not limiting the size design of the display panel.

[0181] In one embodiment, a display device is also provided, the display device including the display panel of any of the above embodiments.

[0182] The display panel described in this application embodiment can be applied to a display device, which may include, but is not limited to, smartphones, televisions, smartwatches, etc.

[0183] In this embodiment, the display device includes the display panel of any of the above embodiments. In some embodiments, the display panel is provided with a fixing layer 120. The fixing layer 120 can cover at least one of the partial surface of the second pad 1111 away from the substrate 110, the partial surface of the third pad 1112 away from the substrate 110, and the partial surface of the fan-out trace 1113 away from the substrate 110, and extends to the second surface 111 exposed on the substrate 110, reducing the risk of the corresponding pads and fan-out traces 1113 falling off, and improving the structural stability of the display panel. In other embodiments, the display panel is provided with a third black matrix layer 160. The third black matrix layer 160 directly covers the surface of the fan-out trace 1113 away from the second surface 111, and extends through the sidewall of the fan-out trace 1113 to a portion of the surface of the second surface 111. This can fix the fan-out trace 1113 to the second surface 111 of the substrate 110, reduce the risk of the fan-out trace 1113 falling off, and thus reduce the risk of the second pad 1111 and / or the third pad 1112 falling off due to the fall of the fan-out trace 1113. It can also improve the structural stability of the display panel.

[0184] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0185] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: A substrate having a first surface and a second surface disposed opposite to each other, and a side surface connected between the first surface and the second surface; The side surface is provided with multiple wiring structures; The first surface is provided with a plurality of light-emitting elements, a plurality of first pads, and a plurality of signal traces for connecting the light-emitting elements and the pads, wherein the plurality of first pads are correspondingly connected to the first ends of the plurality of trace structures. The second surface is provided with a plurality of second pads, a plurality of third pads, and a plurality of fan-out traces for connecting the second pads and the third pads. The plurality of second pads are used to connect the circuit board, and the plurality of third pads are correspondingly connected to the second ends of the plurality of trace structures. A fixing layer covers at least one of the following: a portion of the second pad away from the substrate, a portion of the third pad away from the substrate, and a portion of the fan-out trace away from the substrate, and extends to the second surface of the substrate exposed.

2. The display panel according to claim 1, characterized in that, Also includes: The first gold layer is disposed on at least one of the following surfaces: the second pad on the side away from the substrate that is not covered by the fixing layer, the third pad on the side away from the substrate that is not covered by the fixing layer, and the fan-out trace on the side that is not covered by the fixing layer.

3. The display panel according to claim 2, characterized in that, Also includes: The first black matrix layer covers the surface of the first gold-plated layer on the side of the fan-out trace away from the fan-out trace, and the sidewall of the fan-out trace in the width direction, and extends to a portion of the surface of the fixing layer on the side away from the substrate.

4. The display panel according to claim 3, characterized in that, The first black matrix layer also covers a portion of the surface of the target gold layer facing away from the second surface; the target gold layer includes at least one of the gold layers disposed on the second pad and the third pad facing away from the second surface.

5. The display panel according to any one of claims 2 to 4, characterized in that, Also includes: The second black matrix layer extends from the edge of the second surface away from the third pad to the sidewall of the fixing layer near the second pad and a portion of the surface away from the second surface.

6. A display panel, characterized in that, include: A substrate having a first surface and a second surface disposed opposite to each other, and a side surface connected between the first surface and the second surface; The side surface is provided with multiple wiring structures; The first surface is provided with a plurality of light-emitting elements, a plurality of first pads, and a plurality of signal traces for connecting the light-emitting elements and the pads, wherein the plurality of first pads are correspondingly connected to the plurality of trace structures. The second surface is provided with a plurality of second pads, a plurality of third pads, and a plurality of fan-out traces for connecting the second pads and the third pads. The plurality of second pads are used to connect the circuit board, and the plurality of third pads are correspondingly connected to the plurality of trace structures. The third black matrix layer covers the surface of the fan-out trace away from the second surface and extends through the sidewall of the fan-out trace to a portion of the second surface.

7. The display panel according to claim 6, characterized in that, The third black matrix layer also covers at least one of the second pad and a portion of the surface of the third pad facing away from the second surface.

8. The display panel according to claim 6, characterized in that, Also includes: The second gold layer is disposed on the surface of the second pad away from the substrate that is not covered by the third black matrix layer and / or on the surface of the third pad away from the substrate that is not covered by the third black matrix layer, and extends to the second surface.

9. The display panel according to claim 8, characterized in that, The thickness of the second gold layer is greater than the thickness of the third black matrix layer.

10. The display panel according to claim 8, characterized in that, Also includes: The fourth black matrix layer covers the area on the second surface where the second gold layer, the second pad, the third pad, and the third black matrix layer are not disposed, and extends from the edge of the second surface away from the third pad toward the second pad, and is spaced apart from the second pad.

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