Production process of ceramic smart card and ceramic smart card

Abstract

The application discloses a production process of a ceramic smart card and the ceramic smart card. According to the production process of the ceramic smart card, the antenna unit can be first installed on a first ceramic base body, the coil part is arranged in a first accommodating groove, and the connecting part is arranged in a mounting hole. After the first ceramic base body and a second ceramic base body are pressed together, the second ceramic base body is connected to one side of the first ceramic base body which is provided with the first accommodating groove, the second ceramic base body can cover the first accommodating groove, the connecting part leaks out of the mounting hole, and subsequently, a user can select a required chip and connect the chip with the connecting part according to requirements, and embed the chip into the mounting hole, so that the installation of the chip is completed, and the flexibility of the ceramic smart card is improved.

Description

Technical Field

[0001] This application relates to the field of smart card technology, and in particular to a manufacturing process for a ceramic smart card and a ceramic smart card. Background Technology

[0002] With the development of smart card technology, ceramic smart cards have been widely used in finance, identity authentication, and other fields due to their advantages such as high structural strength, high temperature resistance, and long service life. Currently, most ceramic smart cards employ a lamination packaging process, which typically requires pre-connecting the antenna unit and chip electrically and then laminating and encapsulating them between two substrates before composite molding. This process necessitates chip assembly and fixation before substrate lamination. Once the substrates are laminated, the chip model cannot be changed, and because the antenna is encased inside the substrate, its tip cannot be exposed. Therefore, users cannot select the required chip after the smart card is packaged according to their actual needs, resulting in poor flexibility. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a manufacturing process for ceramic smart cards, which enables the first bonding of a first ceramic substrate and a second ceramic substrate, followed by selective installation of the required chip, thereby improving flexibility.

[0004] This application also proposes a ceramic smart card produced using the aforementioned ceramic smart card manufacturing process.

[0005] The manufacturing process of the ceramic smart card according to the first aspect of this application includes the following steps: A first receiving groove and a mounting hole are formed on a first ceramic substrate, wherein the first receiving groove and the mounting hole are connected, the first receiving groove is formed on one side of the first ceramic substrate, and the mounting hole extends through both sides of the first ceramic substrate along the thickness direction. The antenna unit is connected to the first ceramic substrate, wherein the antenna unit includes a coil part and a connecting part, the end of the coil part is connected to the connecting part, the coil part is disposed in the first receiving groove, and the connecting part is disposed in the mounting hole; The second ceramic substrate and the first ceramic substrate are pressed together, the second ceramic substrate is connected to the side of the first ceramic substrate that forms the first receiving groove, and the second ceramic substrate covers the first receiving groove; Connect the chip and the connecting part; The chip is installed in the mounting hole.

[0006] The manufacturing process of the ceramic smart card according to the first aspect of this application has at least the following advantages: the antenna unit can be installed on the first ceramic substrate, the coil part is placed in the first receiving groove, and the connecting part is placed in the mounting hole. After the first ceramic substrate and the second ceramic substrate are pressed together, the second ceramic substrate is joined with the side of the first ceramic substrate where the first receiving groove is formed. The second ceramic substrate can cover the first receiving groove, and the connecting part is exposed through the mounting hole. Subsequently, the user can select the chip required by the user and connect it to the connecting part according to the user's needs, and embed the chip into the mounting hole to complete the chip installation, thereby improving the flexibility of the ceramic smart card of this application.

[0007] According to some embodiments of this application, a curved section is formed on the connecting portion.

[0008] According to some embodiments of this application, connecting the chip and the connection portion includes the following steps: Pull the connecting part out of the mounting hole; The end of the connector that is pulled out of the mounting hole is connected to the chip.

[0009] According to some embodiments of this application, the following steps are also included: A second receiving groove is formed on the side of the second ceramic substrate close to the first ceramic substrate, and the mounting hole corresponds to the second receiving groove; The back of the chip installed in the mounting hole is located in the second receiving groove.

[0010] According to some embodiments of this application, the following steps are also included: A slotted piece with a through hole is installed in the second receiving groove, and one side of the slotted piece is connected to the bottom of the second receiving groove. The chip placed in the mounting hole is connected to the other side of the slot, and the back of the chip is located in the through hole.

[0011] According to some embodiments of this application, connecting the chip and the connection portion includes the following steps: The connecting part enters the through hole from one end near the second ceramic substrate and exits from the other end away from the second ceramic substrate. The end of the connecting part that exits from the through hole is connected to the chip.

[0012] According to some embodiments of this application, connecting the antenna element to the first ceramic substrate includes the following steps: The coil portion and the connecting portion are wound and adhered to the second substrate layer; A second adhesive layer is arranged on the side of the second substrate layer opposite to the coil portion; The second adhesive layer is adhered to the side of the second substrate layer that is opposite to the first receiving groove.

[0013] According to some embodiments of this application, the following steps are also included: An identification structure is provided on the side of the second ceramic substrate that is opposite to the first ceramic substrate; The step of setting the marking structure on the side of the second ceramic substrate opposite to the first ceramic substrate includes the following steps: The label layer is applied to the first substrate layer by hot stamping, printing, or pasting. A first adhesive layer is disposed on the side of the first substrate layer opposite to the marking layer; The first adhesive layer is adhered to the second ceramic substrate on the side opposite to the first substrate layer.

[0014] According to some embodiments of this application, the following steps are also included: Fill the first receiving groove with glue.

[0015] The ceramic smart card according to the second aspect of this application is manufactured using the manufacturing process of the ceramic smart card according to the first aspect of this application.

[0016] The ceramic smart card according to the second aspect embodiment of this application has at least the following beneficial effects: including all the beneficial effects of the manufacturing process of the ceramic smart card according to the first aspect embodiment, which will not be repeated here.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is an exploded view of a ceramic smart card according to a second aspect embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the structure of the first ceramic matrix on the side opposite to the second ceramic matrix; Figure 3 for Figure 1 A schematic diagram of the structure of the first ceramic matrix near the second ceramic matrix; Figure 4 for Figure 1 A schematic diagram of the structure of the second ceramic matrix on the side opposite to the first ceramic matrix; Figure 5 for Figure 1 A schematic diagram of the structure of the second ceramic matrix near the first ceramic matrix; Figure 6This is a top view of the ceramic smart card according to an embodiment of this application; Figure 7 for Figure 1 Schematic diagram of the structure of the antenna unit; Figure 8 for Figure 4 A schematic diagram of the structure of the Chinese identifier; Figure 9 This is a schematic diagram of one of the winding methods of the antenna element relative to the first ceramic substrate; Figure 10 This is a schematic diagram of another winding method for the antenna element relative to the first ceramic substrate.

[0019] Figure label: First ceramic substrate 100; first receiving groove 110; surrounding section 111; extension section 112; connecting section 113; mounting hole 120; Second ceramic substrate 200; second receiving groove 210; marking structure 220; marking layer 221; first substrate layer 222; first adhesive layer 223; Antenna element 300; coil portion 310; connecting portion 320; bending section 321; second substrate layer 330; second adhesive layer 340; 400 groove; 410 through hole; Chip 500. Detailed Implementation

[0020] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0024] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] Reference Figure 1 , Figure 2 and Figure 3 The manufacturing process of the ceramic smart card according to the first aspect of this application includes the following steps: S100. A first receiving groove 110 and a mounting hole 120 are formed on the first ceramic substrate 100, wherein the first receiving groove 110 and the mounting hole 120 are connected, the first receiving groove 110 is formed on one side of the first ceramic substrate 100, and the mounting hole 120 extends through both sides of the first ceramic substrate 100 along the thickness direction. S200, Connect the antenna unit 300 to the first ceramic substrate 100, wherein the antenna unit 300 includes a coil part 310 and a connecting part 320, the end of the coil part 310 is connected to the connecting part 320, the coil part 310 is disposed in the first receiving groove 110, and the connecting part 320 is disposed in the mounting hole 120. S300, pressing the second ceramic substrate 200 and the first ceramic substrate 100 together, the second ceramic substrate 200 is connected to the side of the first ceramic substrate 100 where the first receiving groove 110 is formed, and the second ceramic substrate 200 covers the first receiving groove 110. S400, connector chip 500 and connector 320; S500, install chip 500 into mounting hole 120.

[0026] It is understood that the antenna unit 300 can be installed on the first ceramic substrate 100, the coil part 310 can be placed in the first receiving groove 110, and the connecting part 320 can be placed in the mounting hole 120. After the first ceramic substrate 100 and the second ceramic substrate 200 are pressed together, the second ceramic substrate 200 is joined to the side of the first ceramic substrate 100 where the first receiving groove 110 is formed. The second ceramic substrate 200 can cover the first receiving groove 110, and the connecting part 320 protrudes through the mounting hole 120. Subsequently, the user can select the chip 500 required by the user and connect it to the connecting part 320, and fit the chip 500 into the mounting hole 120 to complete the installation of the chip 500, thereby improving the flexibility of the ceramic smart card of this application.

[0027] Specifically, refer to Figure 3 A mounting hole 120 is disposed at one corner end of the first ceramic substrate 100. The first receiving groove 110 includes a surrounding section 111 and an extending section 112. The surrounding section 111 is disposed around the edge of the first ceramic substrate 100, and the mounting hole 120 is located within the surrounding section 111. The extending section 112 extends from the surrounding section 111 to communicate with the mounting hole 120. In some embodiments, refer to Figure 9 The main body of the coil portion 310 is located within the surrounding section 111 and is arranged around the surrounding section 111. Both ends of the coil portion 310 extend along the extension section 112 into the mounting hole 120, and both ends of the coil portion 310 are connected to a connecting portion 320. Further, refer to... Figure 3 The first receiving groove 110 also includes a connecting section 113, which connects the extended central portion and the surrounding section 111. Thus, in some other embodiments, referring to Figure 10 The main body of the coil portion 310 is located within the winding section 111 and is arranged around the winding section 111. One end of the coil portion 310 extends along the extension section 112 into the mounting hole 120, and the other end of the coil portion 310 extends along the connecting section 113 into another extension section 112, and then extends along another extension section 112 into the mounting hole 120. Both ends of the coil portion 310 are connected to a connecting portion 320. This allows for adaptation to different winding methods, improving versatility.

[0028] Specifically, the connecting part 320 and the coil part 310 are integrally formed.

[0029] Specifically, the connector 320 is connected to the chip 500 by welding, and then adhesive is applied to the mounting hole 120 to fix the chip 500 in the mounting hole 120.

[0030] Reference Figure 1 According to some embodiments of this application, a curved segment 321 is formed on the connecting portion 320.

[0031] It is understandable that the connection portion 320 forms a bent section 321, which can ensure the length of the connection portion 320, increase the connection area with the chip 500, improve the electrical connection stability between the chip 500 and the connection portion 320, and straighten the connection portion 320 and extend its length during the connection process between the chip 500 and the connection portion 320, so as to facilitate the connection between the connection portion 320 and the chip 500.

[0032] Reference Figure 1 According to some embodiments of this application, the connection of S400, the connection chip 500, and the connection part 320 includes the following steps: S410, Pull the connecting part 320 out of the mounting hole 120; S420, the end of the connector 320 that is pulled out of the mounting hole 120 is connected to the chip 500.

[0033] Understandably, the connector 320 has sufficient length so that during the connection process between the connector 320 and the chip 500, the connector 320 can be pulled out of the mounting hole 120, and one end of the connector 320 pulled out of the mounting hole 120 is connected to the chip 500, so as to facilitate the connection between the connector 320 and the chip 500.

[0034] Specifically, the length of the connecting part 320 is greater than the thickness of the mounting hole 120.

[0035] Reference Figure 5 According to some embodiments of this application, the following steps are also included: S600, a second receiving groove 210 is formed on the side of the second ceramic substrate 200 near the first ceramic substrate 100, and the mounting hole 120 corresponds to the second receiving groove 210. The back of the chip 500, which is installed in the mounting hole 120, is located in the second receiving groove 210.

[0036] It is understandable that the chip 500 has a backing surface on the side facing the second ceramic substrate 200, which gives the chip 500 a certain thickness. The overall thickness of the chip 500 is greater than the depth of the mounting hole 120. Therefore, before step S300 and pressing the second ceramic substrate 200 and the first ceramic substrate 100, a second receiving groove 210 is opened on the second ceramic substrate 200 to accommodate the backing surface of the chip 500, so that the chip 500 can be completely embedded in the mounting hole 120.

[0037] Reference Figure 1 and Figure 6 According to some embodiments of this application, the following steps are also included: S700, The slotted piece 400 with a through hole 410 is installed in the second receiving groove 210, and one side of the slotted piece 400 is connected to the bottom of the second receiving groove 210. The chip 500, which is placed in the mounting hole 120, is connected to the other side of the slot 400, and the back of the chip 500 is located in the through hole 410.

[0038] Understandably, the outer side of the back cover of chip 500 is curved, which causes chip 500 to tilt relative to the surface of the first ceramic substrate 100 when placed in the mounting hole 120, resulting in chip 500 partially protruding from the surface of the first ceramic substrate 100. Therefore, a slot plate 400 is provided in the second receiving groove 210. One side of the slot plate 400 is bonded to the bottom of the second receiving groove 210 with adhesive, and the other side of the slot plate 400 is bonded to the side of chip 500 with the back cover. The back cover is located in the through hole 410. With this arrangement, the slot plate 400 supports chip 500, and the through hole 410 accommodates the back cover of chip 500, thereby ensuring the flatness of chip 500 and making the surface of chip 500 flush with the surface of the first ceramic substrate 100.

[0039] Specifically, the surface of the first ceramic substrate 100 is the side of the first ceramic substrate 100 that is away from the second ceramic substrate 200, and the surface of the chip 500 is the side of the chip 500 that is away from the second mounting groove.

[0040] Specifically, the thickness of the groove 400 is less than the depth of the second receiving groove 210.

[0041] According to some embodiments of this application, step S400, the connection chip 500, and the connection part 320 include the following steps: S410, the connecting part 320 enters the through hole 410 from one end near the second ceramic substrate 200 and exits from the other end of the through hole 410 away from the second ceramic substrate 200, and the end of the connecting part 320 that exits from the through hole 410 is connected to the chip 500.

[0042] It is understandable that, after step S300, pressing the second ceramic substrate 200 and the first ceramic substrate 100, and before S400, connecting the chip 500 and the connecting part 320, if it is necessary to install the chip 500, the connecting part 320 can be pulled out of the mounting hole 120. The connecting part 320 passes through the through hole 410 from the end near the second ceramic substrate 200, and exits from the end away from the second ceramic substrate 200, so as to pass through the through hole 410 of the slot 400. Then the slot 400 is bonded to the second receiving groove 210, and then the chip is connected. The chip 500 is embedded in the mounting hole 120 by the connection part 320 and the chip 500. The slot plate 400 can press the end of the connection part 320 connected to the coil part 310 into the second receiving groove 210. The slot plate 400 cooperates with the second ceramic substrate 200 to clamp the end of the connection part 320 connected to the antenna unit 300, thereby improving the installation stability of the connection part 320. In addition, the welding position of the connection part 320 and the chip 500 corresponds to the through hole 410. Therefore, the connection position of the connection part 320 and the chip 500 does not affect the chip 500 being embedded in the mounting hole 120.

[0043] Reference Figure 7 According to some embodiments of this application, step S200, connecting the antenna element 300 to the first ceramic substrate 100, includes the following steps: S210, The coil portion 310 and the connecting portion 320 are wound and adhered to the second substrate layer 330; S220, A second adhesive layer 340 is arranged on the side of the second substrate layer 330 away from the coil portion 310; S230, the second adhesive layer 340 is pasted into the first receiving groove 110 on the side opposite to the second substrate layer 330.

[0044] It is understood that since the first ceramic substrate 100 is made of ceramic material, the coil part 310 and the connecting part 320 cannot be fixed to the first ceramic substrate 100 by means of adhesive. Therefore, the coil part 310 and the connecting part 320 are first bonded to the second substrate layer 330. The second substrate layer 330 is then bonded to the bottom of the first receiving groove 110 by the second adhesive layer 340, so as to fix the coil part 310 and the connecting part 320 to the first ceramic substrate 100.

[0045] Specifically, the height of the coil section 310 is lower than the depth of the first receiving groove 110.

[0046] Specifically, the connecting portion 320 is bonded to the second substrate layer 330 to ensure that its bent section 321 is positioned in a bent posture within the mounting hole 120 before the chip 500 is embedded, thereby protecting the connecting portion 320. It should be noted that the adhesive force between the connecting portion 320 and the second substrate layer 330 is relatively weak. When it is necessary to install the chip 500, the adhesive between the connecting portion 320 and the second substrate layer 330 can be released by prying up the connecting portion 320 with a tool, facilitating subsequent chip 500 installation.

[0047] Specifically, the second substrate layer 330 is made of PVC material.

[0048] Reference Figure 4 According to some embodiments of this application, the following steps are also included: S800, a marking structure 220 is provided on the side of the second ceramic substrate 200 away from the first ceramic substrate 100.

[0049] It is understood that by setting the identification structure 220, the ceramic smart card of this application can be applied to a variety of scenarios. For example, the identification structure 220 includes a magnetic stripe, an information stripe, and an anti-counterfeiting label, so that the ceramic smart card of this application can be used as a bank card, access card, and ID card.

[0050] Reference Figure 8 Step S800, setting an identification structure 220 on the side of the second ceramic substrate 200 opposite to the first ceramic substrate 100, includes the following steps: S810. The identification layer 221 is disposed on the first substrate layer 222 by hot stamping, printing or pasting. S820, A first adhesive layer 223 is arranged on the side of the first substrate layer 222 opposite to the marking layer 221; S830, the first adhesive layer 223 is attached to the second ceramic substrate 200 on the side opposite to the first substrate layer 222.

[0051] It is understood that since the second ceramic substrate 200 is made of ceramic material, the identification layer 221 cannot be fixed to the second ceramic substrate 200 by adhesive. Therefore, the identification layer 221 can be, for example, a magnetic strip, anti-counterfeiting label, signature strip, card number, QR code, barcode, anti-counterfeiting ink, barcode label, QR code label, or brand logo sticker. Among these, the magnetic strip, anti-counterfeiting label, and signature strip can be formed on the first substrate layer 222 by hot stamping; the card number, QR code, barcode, and anti-counterfeiting ink can be formed on the first substrate layer 222 by printing; and the barcode label, QR code label, and brand logo sticker can be formed on the first substrate layer 222 by adhesive. The first substrate layer 222 is bonded to the second ceramic substrate 200 by the first adhesive layer 223 to fix the identification layer 221 to the second ceramic substrate 200.

[0052] Specifically, the first substrate layer 222 is made of PVC material.

[0053] Specifically, a groove is provided on one side of the second ceramic substrate 200, and the marking structure 220 is disposed in the groove. The marking structure 220 is limited by the groove to facilitate its installation, and the marking structure 220 can be embedded in the second ceramic substrate 200 through the groove.

[0054] Specifically, the surface of the marking structure 220 is flush with the surface of the second ceramic substrate 200. It should be understood that the surface of the marking structure 220 is the side of the marking structure 220 that is away from the bottom of the groove, and the surface of the second ceramic substrate 200 is the side of the second ceramic substrate 200 that is away from the first ceramic substrate 100.

[0055] According to some embodiments of this application, the following steps are also included: S900, fill the first receiving groove 110 with glue.

[0056] It is understood that by filling the first receiving groove 110 with glue, after the first ceramic substrate 100 and the second ceramic substrate 200 are pressed together, there is no air in the first receiving groove 110, so that a crisp sound can be emitted when the ceramic smart card of this application is tapped or dropped.

[0057] The ceramic smart card according to the second aspect of this application is manufactured using the manufacturing process of the ceramic smart card according to the first aspect of this application.

[0058] The ceramic smart card according to the second aspect embodiment of this application has at least the following beneficial effects: including all the beneficial effects of the manufacturing process of the ceramic smart card according to the first aspect embodiment, which will not be repeated here.

[0059] It is understood that the ceramic smart card includes: a first ceramic substrate 100, a second ceramic substrate 200, an antenna unit 300, a slot 400, and a chip 500.

[0060] The first ceramic substrate 100 has a first receiving groove 110 and a mounting hole 120. The first receiving groove 110 is located on one side of the first ceramic substrate 100, and the mounting hole 120 extends along the thickness direction of the first ceramic substrate 100 and penetrates both sides of the first ceramic substrate 100. The mounting hole 120 is used to embed the chip 500, and the first receiving groove 110 and the mounting hole 120 are connected.

[0061] The second ceramic substrate 200 is disposed on one side of the first ceramic substrate 100 and can cover the first receiving groove 110. The second ceramic substrate 200 has a second receiving groove 210 on the side close to the first ceramic substrate 100, and the mounting hole 120 corresponds to the second receiving groove 210.

[0062] The antenna unit 300 includes a coil portion 310 and a connecting portion 320. The end of the coil portion 310 is connected to the connecting portion 320. The coil portion 310 is disposed in the first receiving groove 110, and the connecting portion 320 is disposed in the mounting hole 120. The connecting portion 320 forms a bent section 321, which is used to connect with the chip 500.

[0063] The slot 400 is disposed in the second receiving slot 210, one side of the slot 400 is connected to the bottom of the second receiving slot 210, and the slot 400 has a through hole 410 for accommodating the back cover of the chip 500.

[0064] The chip 500 is installed in the mounting hole 120. The side of the chip 500 with the back cover is bonded to the side of the slot 400 away from the second ceramic substrate 200. The back cover is located in the through hole 410. The connecting part 320 passes through the through hole 410 and is connected to the chip 500.

[0065] Specifically, the first receiving groove 110 is filled with glue.

[0066] Specifically, the antenna unit 300 also includes a second substrate layer 330 and a second adhesive layer 340. The coil portion 310 is connected to the second substrate layer 330, and the second substrate layer 330 is attached to the bottom of the first receiving groove 110 through the second adhesive layer 340.

[0067] Specifically, a marking structure 220 is provided on the side of the second ceramic substrate 200 opposite to the first ceramic substrate 100. The marking structure 220 includes a marking layer 221, a first substrate layer 222, and a first adhesive layer 223 distributed along the thickness direction. The marking layer 221 is set on the first substrate layer 222 by hot stamping, printing, or pasting. The first substrate layer 222 is pasted to the second ceramic substrate 200 by the first adhesive layer 223.

[0068] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. The manufacturing process of ceramic smart cards, characterized in that, Includes the following steps: A first receiving groove and a mounting hole are formed on a first ceramic substrate, wherein the first receiving groove and the mounting hole are connected, the first receiving groove is formed on one side of the first ceramic substrate, and the mounting hole extends through both sides of the first ceramic substrate along the thickness direction. The antenna unit is connected to the first ceramic substrate, wherein the antenna unit includes a coil part and a connecting part, the end of the coil part is connected to the connecting part, the coil part is disposed in the first receiving groove, and the connecting part is disposed in the mounting hole; The second ceramic substrate and the first ceramic substrate are pressed together, the second ceramic substrate is connected to the side of the first ceramic substrate that forms the first receiving groove, and the second ceramic substrate covers the first receiving groove; Connect the chip and the connecting part; The chip is installed in the mounting hole.

2. The manufacturing process of the ceramic smart card according to claim 1, characterized in that, A curved section is formed on the connecting part.

3. The manufacturing process of the ceramic smart card according to claim 2, characterized in that, The connection between the chip and the connection part includes the following steps: Pull the connecting part out of the mounting hole; The end of the connector that is pulled out of the mounting hole is connected to the chip.

4. The manufacturing process of the ceramic smart card according to claim 3, characterized in that, It also includes the following steps: A second receiving groove is formed on the side of the second ceramic substrate close to the first ceramic substrate, and the mounting hole corresponds to the second receiving groove; The back of the chip installed in the mounting hole is located in the second receiving groove.

5. The manufacturing process of the ceramic smart card according to claim 4, characterized in that, It also includes the following steps: A slotted piece with a through hole is installed in the second receiving groove, and one side of the slotted piece is connected to the bottom of the second receiving groove. The chip placed in the mounting hole is connected to the other side of the slot, and the back of the chip is located in the through hole.

6. The manufacturing process of the ceramic smart card according to claim 5, characterized in that, The process of connecting the chip and the connection part includes the following steps: The connecting part enters the through hole from one end near the second ceramic substrate and exits from the other end away from the second ceramic substrate. The end of the connecting part that exits from the through hole is connected to the chip.

7. The manufacturing process of the ceramic smart card according to claim 1, characterized in that, The step of connecting the antenna element to the first ceramic substrate includes the following steps: The coil portion and the connecting portion are wound and adhered to the second substrate layer; A second adhesive layer is arranged on the side of the second substrate layer opposite to the coil portion; The second adhesive layer is adhered to the side of the second substrate layer that is opposite to the first receiving groove.

8. The manufacturing process of the ceramic smart card according to claim 1, characterized in that, It also includes the following steps: An identification structure is provided on the side of the second ceramic substrate that is opposite to the first ceramic substrate; The step of setting the marking structure on the side of the second ceramic substrate opposite to the first ceramic substrate includes the following steps: The label layer is applied to the first substrate layer by hot stamping, printing, or pasting. A first adhesive layer is disposed on the side of the first substrate layer opposite to the marking layer; The first adhesive layer is adhered to the second ceramic substrate on the side opposite to the first substrate layer.

9. The manufacturing process of the ceramic smart card according to claim 1, characterized in that, It also includes the following steps: Fill the first receiving groove with glue.

10. A ceramic smart card, characterized in that, The ceramic smart card is manufactured using the production process described in any one of claims 1 to 9.

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