A multi-layer integrated winding method of printed circuit board leitz coil

By forming a narrow cut-out area at the edge of the printed circuit board, parallel conductors are evenly distributed in the multilayer PCB, solving the problems of limited current carrying capacity and large end area occupation in the prior art, and realizing higher power density and flexible multilayer coil design.

CN122552340APending Publication Date: 2026-08-11项张威
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Patent Information

Application Number
CN202610975188.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-07-01
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

In the existing technology, the winding method of Litz coils on printed circuit boards has problems such as limited current carrying capacity, large end area occupation, and insufficient flexibility, making it difficult to achieve uniform current distribution and simplified position exchange in multilayer PCBs.

Method used

By using a multilayer printed circuit board, and by forming narrow entry and exit line cut areas at the edges, parallel conductors are evenly distributed in the multilayer PCB. By rotating a specific angle around each layer, only one position exchange is required, thus achieving multilayer integrated winding.

Benefits of technology

It improves current carrying capacity, reduces end area, simplifies the number of position exchanges, is suitable for PCBs with any even number of layers, and achieves higher power density and more flexible coil design.

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Abstract

This invention discloses a multilayer integrated winding method for Litz coils on printed circuit boards, belonging to the field of power electronics technology. The invention includes: providing a PCB with at least four conductive layers; forming input / output cutout areas at the edge of the PCB; dividing multiple parallel conductors constituting one turn of the coil into multiple groups, each group starting from the same layer; each conductor sequentially traversing all conductive layers through vias in a predetermined order, extending circumferentially at a predetermined angle in each layer, so that the current paths of all conductors are uniformly distributed in a direction perpendicular to the coil plane; the input and output ends of all parallel conductors are led out from the cutout areas. This invention increases the number of PCB layers available for a single-turn coil to 4, 6, or more, significantly improving current carrying capacity; the input / output cutouts are concentrated in small-angle areas, reducing the end area occupied; each conductor only needs to undergo a minimum number of position exchanges within the cross-sectional area, reducing wiring complexity and making it suitable for the integrated design of magnetic components.
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