Method for manufacturing a board, board and printed circuit board

Abstract

The application discloses a manufacturing method of a plate, the plate and a printed circuit board. The manufacturing method of the plate comprises the following steps: preparing a base material; forming a groove on the base material; arranging an adhesive tape on at least one side of the base material; forming a perforation on the adhesive tape; arranging a copper base in the groove; stacking the base material, the copper base and an adhesive film in sequence; laminating the base material, the copper base and the adhesive film; and removing the adhesive tape to obtain the plate. The adhesive film is arranged when the copper base and the base material are laminated, so that adhesive in the adhesive film can fill the gap between the copper base and the base material during the lamination process. The structure of the produced plate is stable and reliable, and can meet the production and use requirements of the subsequent printed circuit board.

Description

Technical Field

[0001] This invention relates to the field of sheet metal manufacturing technology, and in particular to a method for manufacturing a sheet metal, the sheet metal itself, and a printed circuit board. Background Technology

[0002] In the current communications field, customer designs have increasingly higher demands for heat dissipation. Currently, the industry primarily uses metal substrate embedding for heat dissipation in wireless PCB products, and this technology is already mature and widely used. However, the embedding effect of the metal substrate on PCB products is not ideal, the connection is not reliable, and separation and detachment are prone to occur. This not only affects heat dissipation performance but also reduces overall performance. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of this invention is to provide a method for manufacturing a board material, wherein the method involves laminating a substrate, a copper base, and a film, so that the film can provide adhesive between the copper base and the substrate for bonding, making the placement of the copper base on the substrate more reliable, thereby improving the performance of the board material to meet the requirements of subsequent printed circuit board production.

[0004] Another object of the present invention is to provide a sheet material, including a method for manufacturing the sheet material as shown above.

[0005] Another object of the present invention is to provide a printed circuit board comprising the substrate shown above.

[0006] A method for manufacturing a sheet metal according to an embodiment of the present invention includes: Prepare the substrate; Grooves are formed on the substrate; Adhesive tape is provided on at least one side of the substrate; Perforations are formed in the tape; The copper base is placed inside the groove; The substrate, the copper substrate, and the film are stacked sequentially. The substrate, the copper base, and the film are laminated together; Remove the tape to obtain the sheet material.

[0007] According to the method for manufacturing the board material according to an embodiment of the present invention, by providing a film during the lamination of the copper base and the substrate, the adhesive in the film can fill the gap between the copper base and the substrate during the lamination process, so that the structure of the produced board material is more stable and reliable, and can meet the production and use requirements of subsequent printed circuit boards.

[0008] In some embodiments, the step of forming a groove on a substrate includes: forming the groove on the substrate by a milling process, wherein the groove is disposed opposite to the copper substrate.

[0009] In some embodiments, during the process of forming grooves on the substrate, a milling process can be used to form the required grooves at designated locations, so that the copper base can be arranged in the grooves according to the design in subsequent processes, thereby allowing the use of adhesives in subsequent processes to fix and connect the copper base and the substrate, improving the structural strength and performance of the board.

[0010] In some embodiments, the step of providing tape on at least one side of the substrate includes: when the substrate is a double-sided panel, preparing a substrate, providing tape on one side of the substrate, and providing the film on the side of the tape opposite to the substrate.

[0011] In some embodiments, the technical solution of this application is suitable for being arranged on a double-sided board. That is, when the substrate is a double-sided board, it is suitable to have an adhesive tape on at least one side of the substrate and a film on the back of the adhesive tape, so that the film can provide suitable adhesive to meet the needs of subsequent processes, thereby making the subsequent board production structure stronger. Of course, in some more specific embodiments, after the copper base is arranged in the groove, adhesive tape can also be provided on both sides of the substrate.

[0012] In some embodiments, the step of providing tape on at least one side of the substrate includes: when the substrate is a multi-panel substrate, preparing two substrates, the two substrates being disposed opposite each other and the tape being disposed on the side of the substrates facing away from each other, and the film being disposed on the side of the tape facing away from the substrates.

[0013] In some embodiments, and in some specific embodiments, it is suitable to arrange the technical solution of this application on a multi-panel. That is, when the substrate is a multi-panel, it is suitable to prepare at least two substrates, each of which has a corresponding groove to accommodate a copper base. An adhesive tape is provided on the side of the two substrates that is away from each other, and a film is provided on the side of the adhesive tape that is away from the substrate, so that the adhesive in the film can enter the substrate through both sides of the substrate to connect and fix the copper base and the substrate. This simplifies the adhesive replenishment process, improves production efficiency, and increases the yield of the produced boards.

[0014] In some embodiments, a supplementary film is provided between the two substrates.

[0015] In some embodiments, when multiple panels are stacked and laminated, the adhesive material of the film may not be able to fully enter the groove, especially at the very center of the groove. Therefore, a supplementary film can be provided between the two substrates to provide more adhesive material during the lamination process to fix the copper base and the substrate, thereby improving the structural strength of the board and increasing the yield of the product.

[0016] In some embodiments, the step of forming a perforation on the tape includes: forming a perforation on the tape by a laser process, wherein the perforation is disposed opposite to the inner peripheral wall of the groove.

[0017] In some embodiments, using laser technology to form perforations on the tape not only simplifies the production process but also allows the perforations to be positioned opposite the grooves as designed, enabling the adhesive to be added between the copper base and the substrate to connect them, thereby giving the produced board higher structural strength.

[0018] In some embodiments, the perforation is at least one of circular and elliptical shapes, and a plurality of the perforations are circumferentially spaced.

[0019] In some embodiments, it is understood that the shape of the perforation can be adjusted according to the actual situation or actual production needs during the actual production process, as long as the adhesive can enter the groove through the perforation to connect the copper base and the substrate. This will not be elaborated here.

[0020] In some embodiments, the tape is a high-temperature resistant tape.

[0021] In some embodiments, during use, the tape is designed to restrict the entry of excess adhesive material. After the adhesive material has entered the groove as needed, the excess material tends to accumulate on the outside of the tape. Therefore, during tape removal, the tape carries away the excess material, preventing it from affecting the board material. To ensure the tape functions as designed, high-temperature resistant tape is suitable to avoid impacts on the tape during lamination, thereby improving the reliability of the subsequently produced boards.

[0022] According to an embodiment of the present invention, the sheet material is manufactured by the sheet material manufacturing method described above.

[0023] According to the embodiments of the present invention, the board material is provided with a film during the lamination of copper base and substrate during the production process, so that the adhesive in the film can fill the gap between copper base and substrate during the lamination process, making the structure of the produced board material more stable and reliable, and able to meet the production and use requirements of subsequent printed circuit boards.

[0024] A printed circuit board according to an embodiment of the present invention includes: a substrate as described above.

[0025] According to the embodiments of the present invention, in the production process of the printed circuit board, it is suitable to use a board material for printing. Since the structure of the board material is relatively reliable, the copper base can be well arranged on the board material according to the design. The printed circuit board produced subsequently can achieve better heat dissipation, thereby enabling the printed circuit board to have higher performance to meet the usage requirements.

[0026] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0027] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a flow chart of a method for manufacturing a sheet metal according to an embodiment of the present invention; Figure 2 This is a flow chart of a method for manufacturing a sheet metal according to an embodiment of the present invention; Figure 3 This is a flow chart of a method for manufacturing a sheet metal according to an embodiment of the present invention; Figure 4 This is a flow chart of a method for manufacturing a sheet metal according to an embodiment of the present invention; Figure 5 This is a flow chart of a method for manufacturing a sheet metal according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the plate material according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the plate material according to an embodiment of the present invention; Figure 8 This is a schematic flowchart of a method for manufacturing a sheet metal according to an embodiment of the present invention; Figure label: 10 pieces of board material Substrate 100, Double-sided panel 110, Multi-sided panel 120, Groove 101 Tape 200, perforation 201, Film 300, supplementary film 310, Galio Copper-based 400. Detailed Implementation

[0028] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0029] The following is for reference. Figures 1-8 A method for manufacturing the sheet metal 10 according to an embodiment of the present invention is described, comprising: Prepare 100g of substrate; A groove 101 is formed on the substrate 100; Adhesive tape 200 is provided on at least one side of the substrate 100; Perforations 201 are formed on the tape 200; The copper base 400 is placed in the groove 101; Substrate 100, copper-based 400 and film 300 are stacked in sequence; The substrate 100, copper-based 400, and film 300 are laminated; Remove tape 200 to obtain board 10.

[0030] It should be noted that in the current communications field, customer designs have increasingly higher requirements for heat dissipation. Currently, the industry primarily uses metal substrate embedding for heat dissipation in wireless communication PCB products, and this technology is already mature and widely used. However, the embedding effect of the metal substrate on PCB products using this technology is not ideal, the connection is not reliable, and separation and detachment are prone to occur. This not only affects heat dissipation performance but also reduces overall performance.

[0031] Therefore, the manufacturing method of the substrate 10 of this application can reliably place the metal substrate on the substrate 10, so as to facilitate the subsequent production of printed circuit boards and improve the performance.

[0032] Specifically, this application proposes a manufacturing scheme for a sheet material 10, the production steps of which are suitable to include: preparing a substrate 100; forming a groove 101 on the substrate 100; providing an adhesive tape 200 on at least one side of the substrate 100; forming a perforation 201 on the adhesive tape 200; placing a copper base 400 in the groove 101; sequentially stacking the substrate 100, the copper base 400, and the adhesive film 300; laminating the substrate 100, the copper base 400, and the adhesive film 300; and removing the adhesive tape 200 to obtain the sheet material 10.

[0033] In other words, during the manufacturing process of board 10, a substrate 100 is prepared, and a groove 101 for accommodating the copper base 400 is formed on the substrate 100. One side of the substrate 100 is sealed with tape 200, and a film 300 is provided on the outside of the tape 200. During the lamination process, the adhesive 320 in the film 300 enters the groove 101 through the perforation 201 on the tape 200, so that the adhesive 320 can connect the inner peripheral wall of the groove 101 and the copper base 400. After removing the tape 200, the desired board 10 is obtained. The connection between the copper base 400 and the substrate 100 in the board 10 is relatively reliable, so that the copper base 400 can be reliably used for heat dissipation. In addition, the board 10 can meet the production requirements of printed circuit boards in the subsequent production process, so that the produced printed circuit boards can have higher performance to meet the needs of use.

[0034] According to the printing method of the board 10 of the present invention, by providing a film 300 when laminating the copper base 400 and the substrate 100, the adhesive 320 in the film 300 can fill the gap between the copper base 400 and the substrate 100 during the lamination process, so that the structure of the produced board 10 is more stable and reliable, and can meet the production and use requirements of subsequent printed circuit boards.

[0035] In some embodiments, the step of forming a groove 101 on the substrate 100 includes: forming the groove 101 on the substrate 100 by a milling process, wherein the groove 101 is disposed opposite to the copper base 400. It is understood that during the process of forming the groove 101 on the substrate 100, a milling process is suitable for forming the required groove 101 at a specified location, allowing the copper base 400 to be arranged within the groove 101 as designed in subsequent processes. This enables the use of adhesive 320 in subsequent steps to fix and connect the copper base 400 to the substrate 100, thereby improving the structural strength and performance of the board 10.

[0036] In some embodiments, the step of providing tape 200 on at least one side of substrate 100 includes: when substrate 100 is a double-sided panel 110, preparing a substrate 100, providing tape 200 on one side of substrate 100, and providing film 300 on the side of tape 200 away from substrate 100. It is understood that in some specific embodiments, it is suitable to arrange the technical solution of this application on double-sided panel 110. That is, when substrate 100 is a double-sided panel 110, it is suitable to construct tape 200 on at least one side of substrate 100, and provide film 300 on the back of tape 200, so that film 300 can provide suitable adhesive 320 to meet the usage requirements in subsequent processes, thereby making the subsequent production structure of board 10 stronger. Of course, in some more specific embodiments, tape 200 can also be provided on both sides of substrate 100 after copper base 400 is arranged in groove 101.

[0037] In some embodiments, the step of providing tape 200 on at least one side of substrate 100 includes: when substrate 100 is a multi-panel 120, preparing two substrates 100, the two substrates 100 being arranged opposite each other and tape 200 being provided on the side of substrate 100 away from each other, and providing film 300 on the side of tape 200 away from substrate 100. It is understood that in some specific embodiments, it is suitable to arrange the technical solution of this application on a multi-panel 120. That is, when the substrate 100 is a multi-panel 120, it is suitable to prepare at least two substrates 100. Each of the two substrates 100 is provided with a corresponding groove 101 to accommodate the copper base 400. An adhesive tape 200 is provided on the side of the two substrates 100 that is away from each other, and a film 300 is provided on the side of the adhesive tape 200 that is away from the substrate 100, so that the adhesive 320 in the film 300 can enter the substrate 100 through both sides of the substrate 100 to connect and fix the copper base 400 and the substrate 100. This simplifies the process of replenishing the adhesive 320, improves production efficiency, and makes the yield of the produced board 10 higher.

[0038] In some embodiments, a supplementary film 310 is provided between two substrates 100. Thus, when multiple panels 120 are stacked and laminated, the adhesive 320 of the film 300 may not be fully incorporated into the groove 101, especially at the very center of the groove 101. Therefore, a supplementary film 310 can be provided between the two substrates 100 to ensure that the supplementary film 310 provides more adhesive 320 during the lamination process to securely connect the copper base 400 and the substrate 100, thereby improving the structural strength of the board 10 and increasing the product yield.

[0039] In some embodiments, the step of forming a perforation 201 on the tape 200 includes: forming the perforation 201 on the tape 200 using a laser process, wherein the perforation 201 is disposed opposite to the inner peripheral wall of the groove 101. It is understood that using a laser process to form the perforation 201 on the tape 200 not only simplifies the production process but also allows the perforation 201 to be disposed opposite to the groove 101 as designed, enabling the adhesive 320 to be supplied between the copper base 400 and the substrate 100 as designed for bonding, thereby resulting in a sheet material 10 with higher structural strength.

[0040] In some embodiments, the perforation 201 is at least one of circular and elliptical shapes, and multiple perforations 201 are arranged circumferentially at intervals. It is understood that in the actual production process, the shape of the perforation 201 can be adjusted according to the actual situation or actual production needs, as long as the adhesive 320 can enter the groove 101 through the perforation 201 to connect the copper base 400 and the substrate 100, which will not be elaborated here.

[0041] In some embodiments, the tape 200 is a high-temperature resistant tape 200. It is understood that during use, the tape 200 is designed to restrict the entry of excess adhesive 320. After the adhesive 320 has entered the groove 101 as required, the excess adhesive 320 tends to accumulate on the outside of the tape 200. Therefore, during tape removal, the tape 200 will carry away the excess adhesive 320, preventing it from affecting the board 10. To ensure that the tape 200 can be used effectively according to the design, a high-temperature resistant tape 200 is suitable to avoid its impact during lamination, thereby improving the reliability of the subsequently produced board 10.

[0042] According to an embodiment of the present invention, the board 10 is manufactured by the manufacturing method described above. Thus, because a film 300 is provided during the lamination of the copper base 400 and the substrate 100 in the production process, the adhesive 320 in the film 300 can fill the gap between the copper base 400 and the substrate 100 during lamination, resulting in a more stable and reliable structure for the manufactured board 10, which can meet the requirements of subsequent printed circuit board production and use.

[0043] According to an embodiment of the present invention, a printed circuit board includes a substrate 10 as described above. Therefore, during the production process of the printed circuit board, it is suitable to print on the substrate 10. Since the structure of the substrate 10 is relatively reliable, the copper base 400 can be well arranged on the substrate 10 according to the design, and the subsequently produced printed circuit board can achieve better heat dissipation, thereby giving the printed circuit board higher performance to meet usage requirements.

[0044] Other configurations and operations of the printed circuit boards according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0045] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0046] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A method for manufacturing a sheet material, characterized in that, include: Prepare the substrate; Grooves are formed on the substrate; Adhesive tape is provided on at least one side of the substrate; Perforations are formed in the tape; The copper base is placed in the groove; The substrate, the copper substrate, and the film are stacked sequentially. The substrate, the copper base, and the film are laminated together; Remove the tape to obtain the sheet material.

2. The method for manufacturing the sheet metal according to claim 1, characterized in that, The step of forming a groove on a substrate includes: forming the groove on the substrate by a milling process, wherein the groove is disposed opposite to the copper substrate.

3. The method for manufacturing the sheet metal according to claim 1, characterized in that, The step of providing tape on at least one side of the substrate includes: when the substrate is a double-sided panel, preparing a substrate, providing tape on one side of the substrate, and providing the film on the side of the tape away from the substrate.

4. The method for manufacturing the sheet metal according to claim 1, characterized in that, The step of providing tape on at least one side of the substrate includes: when the substrate is a multi-panel substrate, preparing two substrates, the two substrates being arranged opposite each other and the tape being provided on the side of the substrates that is away from each other, and the film being provided on the side of the tape that is away from the substrates.

5. The method for manufacturing the sheet metal according to claim 4, characterized in that, A supplementary film is provided between the two substrates.

6. The method for manufacturing the sheet metal according to claim 1, characterized in that, The step of forming a perforation on the tape includes: forming the perforation on the tape by a laser process, wherein the perforation is disposed opposite to the inner peripheral wall of the groove.

7. The method for manufacturing the sheet metal according to claim 1, characterized in that, The perforation is at least one of a circle or an ellipse, and the plurality of perforations are spaced apart circumferentially.

8. The method for manufacturing the sheet metal according to claim 1, characterized in that, The tape is a high-temperature resistant tape.

9. A type of board material, characterized in that, The sheet material is manufactured by the sheet material manufacturing method as described in any one of claims 1-8.

10. A printed circuit board, characterized in that, include: The sheet material as described in claim 9.

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