Carrier for processing a sheet-shaped wafer

Abstract

The application discloses a carrier for wafer processing, and belongs to the technical field of wafer processing, which comprises a frame body, a chassis, a support and a slow-release structure, the chassis is installed at the bottom of the frame body, supports are installed on three sides of the frame body, the slow-release structure is installed outside the support, a sliding rail structure is installed at the top of the chassis, a rotating shaft is installed at the rear end of the bottom of the frame body, and the sliding seat of the sliding rail structure is connected with the rotating shaft of the frame body. The positioning frame is continuously subjected to a slight tension force by the small elastic coefficient of the guide spring, is tightly attached to the back plate in the whole falling process, and is accurately clamped into the accommodating groove of the back plate. By constructing the buffer path and the navigation path driven by springs with different elastic coefficients, the problem of lacking falling buffer and attitude guidance of the existing vertical wafer loading mode is solved, the elastic speed reduction and trajectory constraint of the wafer falling process are realized, and the wafer loading damage probability is effectively reduced.

Description

Technical Field

[0001] This invention belongs to the field of wafer processing technology, and in particular to a carrier for processing wafer-shaped wafers. Background Technology

[0002] As a core material in semiconductor manufacturing, wafers require frequent handling and placement between carriers, processing equipment, and warehouse shelves during processing, inspection, and transportation. Due to the extremely thin thickness, brittle and hard material, and extremely high surface cleanliness requirements of wafers, the structural design of the carrier directly affects the wafer yield and transportation efficiency.

[0003] In existing wafer handling processes, wafers are often placed vertically with the opening facing upwards to accommodate automated robotic arms. However, traditional carriers are mostly fixed structures, typically operating only in a single, fixed orientation. Traditional wafer transfer containers feature a top-opening design, with the robotic arm using suction or clamping to place the wafer into slots within the container from top to bottom. While this method accommodates vertical robotic arm operations, it doesn't address the impact protection issue when the wafer hits the bottom of the slot during vertical descent. When the robotic arm releases the wafer, even slight deviations in stroke control or minor vibrations can cause the wafer's bottom edge to collide hard with the rigid slot bottom, leading to edge damage or particulate contamination. Existing technologies include wafer containers with cushioning structures and spring plates at the bottom. However, these structures typically occupy significant space at the bottom and lack precise lateral navigation of the wafer's orientation during cushioning. Furthermore, the springs can resonate, potentially causing the wafer to deviate and scrape the sidewalls during descent.

[0004] On the other hand, when storing or manually inspecting wafers on warehouse shelves, operators tend to position the wafer rack with the opening facing forward to allow for horizontal removal or placement of wafers one by one. However, in existing technologies, switching between vertical mounting and horizontal storage positions is often extremely inconvenient, typically requiring an external flipping mechanism or manual handling of the entire rack for flipping and adjustment. Alternatively, wafer racks with inclined support surfaces can stably store wafers, but these fixed racks struggle to switch flexibly between opening-up and opening-forward positions. This fails to meet the need for convenient position switching in complex scenarios that require both automated vertical hoisting and manual horizontal handling.

[0005] In summary, existing wafer carrier technologies face the following main contradictions: if a vertical mounting method with the opening facing upwards is adopted, there is a lack of a structure that can take into account both drop buffering and precise attitude guidance, and it is difficult to directly convert it into a horizontal orientation suitable for manual handling; if the precision control of the robotic arm itself is relied upon to avoid collisions, it will increase the equipment debugging cost and have a low fault tolerance rate.

[0006] Therefore, the object of the present invention is to provide a wafer carrier for wafer processing, and a wafer carrier that can provide effective buffering and guidance during vertical wafer mounting. Summary of the Invention

[0007] The purpose of this invention is to provide a carrier for processing wafers to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: A carrier for processing wafers includes a frame, a base frame, a support frame, and a release structure. The base frame is installed at the bottom of the frame, and the support frame is installed on three sides of the frame. The release structure is installed on the outside of the support frame, and a slide rail structure is installed at the top of the base frame. A rotating shaft is installed at the rear end of the bottom of the frame. The slide block of the slide rail structure is connected to the rotating shaft of the frame, and the frame rotates upward by rotating the rotating shaft. The support frame includes two side plates and a back plate, and the two side plates and the back plate are provided with equidistant receiving slots. The two reset structures of the slow-release structure are installed on the outer walls of the two side plates. An elastic buffer rope is connected below the reset structure. The buffer rope is guided by the slow-release roller near the front of the reset structure and then fixed to the positioning frame by the slow-release roller behind the positioning frame. An elastic guide rope is also fixed to the rear end of the positioning frame. A guide roller is provided in the receiving groove of the back plate. The guide rope is connected to the corresponding reset structure under the guidance of the guide roller and another set of slow-release rollers. A guide spring is installed at the top inside the reset structure, and the end of the guide spring is connected to a guide rope. A release spring is installed at the bottom inside the reset structure, and the end of the release spring is connected to a buffer rope. The elastic coefficient of the guide spring is smaller than that of the release spring.

[0009] Furthermore, after the buffer rope is led out from the release spring, it first passes through the circumference of the release roller near the front of the reset structure for directional guidance, and then extends backward, passing around the release roller installed on the positioning frame behind the positioning frame, and is fixedly connected to the positioning frame.

[0010] Furthermore, after the guide rope is led out from the rear end of the positioning frame, it passes through the guide roller in the corresponding receiving groove on the back plate, and is then guided by another set of slow-release rollers set on the side plate, and extends upward into the reset structure, where it is fixedly connected to the end of the guide spring inside the reset structure.

[0011] Furthermore, the slide rail structure includes a slide block, a slide base, a slot, and a reset hook. The slide block is a T-shaped metal component. The slide block is slidably mounted on the slide base. Two sets of pulleys are installed inside the slide base to clamp the slide block. Slots are provided at the beginning and end of the slide block. The outer wall of the slide base is connected to a reset hook via a torsion spring.

[0012] Furthermore, the base has locking holes at the front and rear of the slide rail structure, the top of the rear end of the frame has a first locking block, and the front of the bottom end of the frame has a second locking block. The slide block drives the frame to move to the front end of the slide rail structure, and then the rotating shaft rotates to make the opening of the frame face upward. The first locking block engages and is fixed with the locking hole at the rear end, and then the limiting rod passes through the frame and the first locking block in sequence.

[0013] Furthermore, the slide block drives the frame to move to the rear end of the slide rail structure, and then the rotating shaft rotates to reset the opening of the frame. The second locking block engages and is fixed with the locking hole at the front end, and then the limiting rod passes through the frame and the second locking block in sequence.

[0014] Furthermore, semi-frame-shaped squares are installed on the outer walls of the two side panels for hoisting.

[0015] Furthermore, the positioning frame is a long strip-shaped component, horizontally placed between the two side plates to support the bottom end of the wafer. When the wafer is lowered vertically and pushes the positioning frame, the positioning frame stretches the buffer rope. The buffer rope, after being turned by the release roller, pulls the release spring to extend. Simultaneously, the positioning frame drags the guide rope. After multiple turns by the guide roller and the release roller, the guide rope pulls the guide spring to extend. The guide spring provides a continuous, slight tension force to the rear end of the positioning frame, keeping the positioning frame stable during descent.

[0016] Compared with the prior art, the present invention has the following beneficial effects: (1) The present invention provides a reset structure on the outer wall of both side plates, and installs a guide spring on the upper part and a slow release spring on the lower part inside the reset structure. The elastic coefficient of the guide spring is smaller than that of the slow release spring. When the wafer is placed vertically, its bottom end first contacts the positioning frame placed horizontally between the two side plates. The positioning frame moves downward under the action of gravity. At this time, the motion is transmitted in two ways: First, the positioning frame stretches the buffer rope. After the buffer rope is turned by the slow release roller, it pulls the slow release spring to extend. The larger elastic coefficient of the slow release spring provides the main buffer resistance, and the rigid impact of the wafer falling is converted into slow motion. In the second path, the positioning frame simultaneously drags the guide rope. After the guide rope is turned by the back plate guide roller and another set of slow-release rollers, it pulls the guide spring to extend. Utilizing the small elastic coefficient of the guide spring, a slight tension force is continuously applied to the rear end of the positioning frame, so that the positioning frame is pressed tightly against the back plate and accurately locked into the receiving slot of the back plate throughout the descent. By constructing a buffer path and a navigation path driven by springs with different elastic coefficients, the problem of lack of descent buffer and attitude guidance in the existing vertical wafer loading method is solved. Elastic slowing and trajectory constraint are achieved during the wafer descent process, effectively reducing the probability of wafer damage.

[0017] (2) The base frame of the present invention is provided with a T-shaped sliding block on the top. The sliding block is clamped by two sets of upper and lower pulleys and can slide back and forth. The sliding block is connected to the rear end of the bottom of the frame through a rotating shaft. The sliding block is provided with slots at both ends. The outer wall of the sliding block is connected to a reset hook through a torsion spring. Under normal conditions, the sliding block is locked in the slot. The front and rear ends of the base frame are respectively provided with locking holes. The top of the rear end of the frame is provided with a first locking block and the front side of the bottom end is provided with a second locking block. When the sliding block moves to the front end and the frame is flipped so that the opening faces upward, the first locking block is locked into the rear locking hole and locked by the limit rod, thus completing the fixation of the vertical loading posture. When the sliding block moves to the rear end and the frame is flipped in the opposite direction so that the opening faces forward, the second locking block is locked into the front locking hole and locked by the limit rod, thus completing the fixation of the horizontal storage posture. By linking the back and forth movement of the sliding block along the sliding block with the rotation of the frame around the rotating shaft, and with the double locking of the front and rear locking blocks, locking holes and limit rods, the problems of the existing carrier in the vertical loading posture and horizontal storage posture are solved. The problem of relying on external flipping equipment for posture switching has been solved, enabling a single carrier to quickly and manually switch between two postures. All posture switching actions are integrated into the carrier's own structure. The operator only needs to manually complete three steps to complete the posture switch by pulling the reset hook to unlock, pushing the slide, and flipping the frame. No external auxiliary equipment is required. This allows the same carrier to directly connect to the vertical placement operation of the automated hoisting station with the opening facing upward, and then directly connect to the manual piece-by-piece picking of the warehouse shelf with the opening facing forward. This achieves seamless switching between the two process scenarios, reduces intermediate handling and posture adjustment links, and improves overall operation efficiency.

[0018] (3) In the slow-release structure of the present invention, one end of the buffer rope is connected to the slow-release spring, and the other end is fixed to the positioning frame via the slow-release roller and the slow-release wheel. One end of the guide rope is connected to the guide spring, and the other end is fixed to the positioning frame via the guide roller and the slow-release roller. This allows the positioning frame to have a vertically movable stroke constrained by the spring within the receiving groove. During operation, the external robot can release the wafer above the positioning frame in advance. The wafer pushes the positioning frame by its own gravity and falls naturally and slowly to the final fixed position under the constraint of the buffer rope and the slow-release spring. There is no need for the robot to move to the bottom of the groove with the wafer. By constructing a structure between the positioning frame and the reset structure, The flexible stroke with buffer margin solves the problems of low fault tolerance and high debugging cost caused by rigid matching between the robot and the carrier in the existing technology. It reduces the stringent requirements for the repeatability of the robot's positioning accuracy and avoids wafer extrusion damage caused by stroke error. The robot can release the wafer in advance after it is sent into the corresponding receiving slot. The subsequent descent of the wafer is completed by the slow release structure. This improves the system's tolerance to robot stroke deviation, reduces equipment downtime caused by frequent calibration, and avoids the risk of hard extrusion cracks between the wafer and the carrier caused by excessive pressure or improper positioning of the robot. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the frame structure in this invention; Figure 3 This is a side view of the frame structure in this invention; Figure 4 This is a schematic diagram of the sliding iron structure in this invention; Figure 5 This is a schematic diagram of the base frame structure in this invention; Figure 6 This is a schematic diagram of the slow-release structure in this invention; Figure 7 This is a top view of the slow-release structure in this invention; Figure 8 This is a schematic diagram of the reset structure in this invention; Figure 9 This is a schematic diagram of the positioning frame structure in this invention.

[0021] Explanation of reference numerals in the attached figures: In the picture: 1. Frame; 11. Square frame; 12. First locking block; 2. Base frame; 21. Slide rail structure; 211. Slide block; 212. Slide seat; 213. Slot; 214. Reset hook; 22. Locking hole; 23. Limiting rod; 24. Second locking block; 3. Bracket; 31. Back plate; 32. Guide roller; 33. Side plate; 4. Slow-release structure; 41. Reset structure; 411. Guide spring; 412. Slow-release spring; 413. Slow-release roller; 42. Guide rope; 43. Buffer rope; 44. Positioning frame; 45. Slow-release wheel. Detailed Implementation

[0022] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid obscuring the invention.

[0023] Unless otherwise defined, the directions mentioned herein, such as up, down, left, right, front, back, inside, and outside, are based on the directions shown in the figures of this invention, and are explained here together.

[0024] The connection method can be any existing method, such as bonding, welding, or bolting, depending on the actual needs.

[0025] Please see Figures 1 to 9 As shown, a carrier for wafer processing includes a frame 1, a base frame 2, a support 3, and a release structure 4. The frame 1 is a rectangular frame structure. The base frame 2 is fixedly installed at the bottom of the frame 1. The support 3 is installed on three sides of the frame 1, namely two side plates 33 on the left and right sides and a back plate 31 at the rear. The release structure 4 is installed on the outside of the support 3. A slide rail structure 21 is installed on the top plane of the base frame 2. A rotating shaft is installed at the rear bottom of the frame 1. The slide block 212 in the slide rail structure 21 is connected to the frame 1 through the rotating shaft, so that the frame 1 can rotate around the rotating shaft, realizing the attitude change of the frame opening direction from horizontal forward to vertical upward. Multiple receiving slots are equally spaced on the opposite surfaces of the two side plates 33 and the back plate 31 of the support 3. The width of the receiving slots is adapted to the thickness of the wafer, and is used to horizontally support the wafer one by one.

[0026] The release structure 4 has two reset structures 41, one of which is fixedly installed on the outer wall of each of the two side plates 33 of the frame 1. A release spring 412 is installed at the lower part of the interior of each reset structure 41. A buffer rope 43 with tensile elasticity is connected to the lower part of the reset structure 41, one end of which is fixedly connected to the end of the release spring 412 inside the reset structure 41. A release roller 413 is installed on the side plate 33 near the front of the reset structure 41. After the buffer rope 43 extends from the release spring 412, it first passes through the circumference of the release roller 413 for directional guidance, then extends backward, passes behind the positioning frame 44, around the release wheel 45 installed on the positioning frame 44, and is finally fixedly connected to the positioning frame 44. The positioning frame 44 is a long strip component, horizontally placed between the two side plates 33, used to support the bottom end of the wafer. A guide rope 42 is also fixedly connected to the rear end of the positioning frame 44. The guide rope 42 is also a rope with tensile elasticity. A guide roller 32 is provided on the inner side of each receiving slot of the back plate 31. After the guide rope 42 is led out from the rear end of the positioning frame 44, it passes through the guide roller 32 in the corresponding receiving slot on the back plate 31, and is then guided by another set of release rollers 413 provided on the side plate 33, and finally extends upward into the reset structure 41. A guide spring 411 is installed inside the reset structure 41. The elastic coefficient of the guide spring 411 is less than that of the release spring 412. The end of the guide spring 411 is fixedly connected to the end of the guide rope 42.

[0027] When the wafer is lowered vertically and pushes the positioning frame 44, the motion transmission path is divided into two paths: First, the positioning frame 44 directly stretches the buffer rope 43. After the buffer rope 43 turns through the release roller 413, it pulls the release spring 412 to extend. The release spring 412 provides the main buffer resistance, slowing down the falling speed of the positioning frame 44 and the wafer. Second, the positioning frame 44 simultaneously drags the guide rope 42. After the guide rope 42 turns multiple times through the guide roller 32 and the release roller 413 of the back plate 31, it pulls the guide spring 411 in the upper part of the reset structure 41 to extend. Since the elastic coefficient of the guide spring 411 is small, its main function is not strong buffering, but to provide a continuous light tension force to the rear end of the positioning frame 44, so that the positioning frame 44 maintains a stable posture during the descent and accurately locks into the receiving groove of the back plate 31, playing the role of motion navigation and posture limitation.

[0028] When the slow-release structure 4 is used in conjunction with the robotic arm for transfer, its lowering stroke can leave a margin. That is, the robotic arm can release the wafer in advance, and then the wafer will fall and be fixed naturally under the influence of the slow-release structure 4. This avoids the wafer and carrier being squeezed and cracked when the robotic arm holds the wafer in an improper position or the lowering stroke error is large.

[0029] The slide rail structure 21 on the base frame 2 includes a slide block 211, a slide seat 212, a slot 213, and a reset hook 214. The slide block 211 is a long, T-shaped metal component, fixedly laid along the front-to-back direction of the top of the base frame 2. The slide seat 212 is slidably mounted on the slide block 211. Two sets of pulleys are installed inside the slide seat 212, clamping the upper and lower surfaces of the T-shaped head of the slide block 211 respectively, allowing the slide seat 212 to slide smoothly along the slide block 211 without coming off. A slot 213 is provided at each end of the slide block 211. A reset hook 214 is elastically hinged to the outer wall of the slide seat 212 via a torsion spring. The hook head of the reset hook 214 is normally embedded in the slot 213 under the action of the torsion spring, locking the position of the slide seat 212. The outer wall of the reset hook 214 is fixed with a handle. The operator holds the handle and pulls it outward to overcome the torsion spring force so that the hook head of the reset hook 214 disengages from the slot 213, thereby releasing the lock and pushing the slide 212 to move in position.

[0030] The base frame 2 has locking holes 22 at the front and rear ends corresponding to the slide rail structure 21. A first locking block 12 is fixedly installed at the top rear end of the frame 1, and a second locking block 24 is fixedly installed at the front bottom end of the frame 1. During vertical loading operations, the slide block 212 drives the frame 1 to move along the slide rail 211 to the front end of the slide rail structure 21. The reset hook 214 is operated so that its hook head is locked into the locking groove 213 at the front end to lock the slide block 212. Then, the frame 1 is rotated around the pivot, so that the opening of the frame 1 flips from horizontal forward to vertical upward. At this time, the first locking block 12 at the top rear end of the frame 1 falls down with the rotation and is locked into the locking hole 22 at the rear end of the base frame 2 to complete the locking and fixing. Then, the limiting rod 23 is passed horizontally through the reserved hole on the side of the frame 1 and the through hole on the first locking block 12 to complete the double locking and ensure that the frame 1 is stable and does not shake during the material receiving process.

[0031] When performing shelf storage and retrieval operations, first pull out the limit rod 23, rotate the shelf body 1 in the opposite direction to reset it to the state where the opening is horizontal and facing forward, and the first locking block 12 disengages from the rear locking hole 22; then operate the reset hook 214 to disengage from the front locking groove 213, push the slide block 212 to move the shelf body 1 along the slide iron 211 to the rear position of the slide rail structure 21, and the reset hook 214 engages with the rear locking groove 213 to lock; at this time, the second locking block 24 on the front side of the bottom end of the shelf body 1 engages with the locking hole 22 at the front end of the base frame 2 to achieve locking and fixation; finally, pass the limit rod 23 through the shelf body 1 and the second locking block 24 in sequence to complete the locking, so that the shelf body 1 can stably maintain the opening facing forward posture.

[0032] A semi-frame-shaped square frame 11 is fixedly installed on the outer wall of each of the two side plates 33 on the left and right sides of the frame 1. The top crossbeam of the square frame 11 serves as the lifting force point and is used to connect with the hook or sling of the external lifting equipment to realize the overall lifting of the entire frame 1.

[0033] The specific operation process of the external hoisting equipment and warehouse racking is as follows: When the wafers need to be loaded and transferred after processing, the external hoisting equipment uses soft-contact wafer clamps to hold the wafers. The operator first moves the slide block 212 to the front end of the slide rail structure 21 and locks it through the reset hook 214, flips the frame 1 so that the opening faces upward, and the first locking block 12 is inserted into the rear locking hole 22 and fixed by the limiting rod 23. The external hoisting equipment uses its positioning module to align the wafer held by the wafer clamp with the receiving slot on the side plate 33 and places it vertically downward. The bottom edge of the wafer first contacts the upper surface of the positioning frame 44. Under the action of the wafer's own weight, the positioning frame 44 is pushed and moves downward synchronously. At this time, the buffer rope 43 is pulled and stretched by the positioning frame 44, which drives the slow release spring 412 to gradually extend. The elastic resistance of the slow release spring 412 is converted into a buffer force for the wafer's fall, avoiding the wafer from falling quickly and colliding hard with the bottom of the receiving slot. Simultaneously, the guide rope 42 is pulled as the positioning frame 44 descends, and the guide spring 411 is stretched accordingly. The slight pull of the guide spring 411 keeps the rear end of the positioning frame 44 always moving towards the back plate 31, guiding the positioning frame 44 to smoothly engage with the corresponding receiving slot on the back plate 31. The wafer is finally stably supported in the receiving slots of the side plate 33 and the back plate 31. The above operation is repeated to load wafers one by one until all the receiving slots of the frame 1 are full. Then, the lifting equipment of the external hoisting equipment can be connected to the two side frames 11 to lift the frame 1 as a whole for transportation.

[0034] When the opening is positioned above the surface, it effectively avoids situations where the wafer rubs or slips out due to jerking caused by the transport equipment during the transfer process.

[0035] When wafers need to be stored on warehouse shelves or retrieved individually from shelves, the rack 1, along with the base frame 2, is transferred to the corresponding shelf level. The operation reset hook 214 releases the front-end lock, pushes the slide block 212 to move the rack 1 to the rear of the slide rail structure 21 and locks it, then flips the rack 1 back to its opening facing forward. The second locking block 24 engages with the front locking hole 22 and is secured by the limiting rod 23. At this point, the opening of the rack 1 faces the operator, the back plate 31 is located inside, and all wafers in the receiving slots are horizontal. The operator can directly remove or place wafers one by one from the front of the rack 1 without significantly changing their operating posture or leaning out to retrieve them. This convenient operation reduces the risk of wafers scratching adjacent objects.

[0036] It should be noted that, in this document, relational terms such as "one" and "two" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A carrier for processing wafers, comprising a frame (1), a base frame (2), a support frame (3), and a release structure (4), characterized in that: The frame (1) has a base frame (2) installed at the bottom, and supports (3) are installed on three sides of the frame (1). A slow-release structure (4) is installed on the outside of the supports (3). A slide rail structure (21) is installed on the top of the base frame (2). A rotating shaft is installed at the rear end of the bottom of the frame (1). The slide seat (212) of the slide rail structure (21) is connected to the rotating shaft of the frame (1). The frame (1) rotates through the rotating shaft to make the opening of the frame rotate upward. The support (3) includes two side plates (33) and a back plate (31). The two side plates (33) and the back plate (31) are provided with equidistant receiving slots. The two reset structures (41) of the release structure (4) are installed on the outer walls of the two side plates (33). The reset structure (41) is connected to the bottom of the elastic buffer rope (43). The buffer rope (43) is guided by the release roller (413) near the front of the reset structure (41) and is fixedly connected to the positioning frame (44) by the release roller (45) behind the positioning frame (44). The rear end of the positioning frame (44) is also fixed with an elastic guide rope (42). The back plate (31) is provided with a guide roller (32) in the receiving groove. The guide rope (42) is connected to the reset structure (41) under the guidance of the guide roller (32) and another set of release rollers (413). A guide spring (411) is installed at the top inside the reset structure (41), and the end of the guide spring (411) is connected to the guide rope (42). A release spring (412) is installed at the bottom inside the reset structure (41), and the end of the release spring (412) is connected to the buffer rope (43). The elastic coefficient of the guide spring (411) is smaller than that of the release spring (412).

2. The carrier for processing wafers according to claim 1, characterized in that: After the buffer rope (43) is led out from the release spring (412), it first passes through the circumference of the release roller (413) near the front of the reset structure (41) for directional guidance, and extends backward, passing around the release roller (45) installed on the positioning frame (44) behind the positioning frame (44), and is fixedly connected to the positioning frame (44).

3. The carrier for processing wafers according to claim 1, characterized in that: The guide rope (42) is led out from the rear end of the positioning frame (44), passes through the guide roller (32) in the corresponding receiving groove on the back plate (31), and is then guided by another set of slow-release rollers (413) set on the side plate (33), and extends upward into the reset structure (41), where it is fixedly connected to the end of the guide spring (411) inside the reset structure (41).

4. The carrier for processing wafers according to claim 1, characterized in that: The slide rail structure (21) includes a slide block (211), a slide seat (212), a slot (213), and a reset hook (214). The slide block (211) is a T-shaped metal component. The slide block (211) is slidably mounted on the slide seat (212). Two sets of pulleys are installed inside the slide seat (212) to clamp the slide block (211). Slots (213) are provided at the beginning and end of the slide block (211). The outer wall of the slide seat (212) is connected to the reset hook (214) by a torsion spring.

5. The carrier for processing wafers according to claim 4, characterized in that: The base has a locking hole (22) at the front and rear of the slide rail structure (21). The top of the rear end of the frame (1) has a first locking block (12). The front side of the bottom end of the frame (1) has a second locking block (24). The slide (212) drives the frame (1) to move to the front end of the slide rail structure (21). Then the rotating shaft rotates so that the opening of the frame (1) faces upward. The first locking block (12) engages and is fixed with the locking hole (22) at the rear end. Then the limiting rod (23) passes through the frame (1) and the first locking block (12) in sequence.

6. The carrier for wafer processing according to claim 5, characterized in that: The slide block (212) drives the frame (1) to move to the rear end of the slide rail structure (21), and then the rotating shaft rotates to reset the opening of the frame (1). The second locking block (24) engages and fixes the corresponding locking hole (22) at the front end, and then the limiting rod (23) passes through the frame (1) and the second locking block (24) in sequence.

7. The carrier for processing wafers according to claim 1, characterized in that: The outer walls of the two side panels (33) are fitted with semi-frame-shaped square frames (11) for hoisting.

8. The carrier for processing wafers according to claim 1, characterized in that: The positioning frame (44) is a long strip-shaped component, which is placed horizontally between the two side plates (33) to support the bottom end of the wafer. When the wafer is lowered vertically and the positioning frame (44) is pushed, the positioning frame (44) stretches the buffer rope (43). The buffer rope (43) turns through the release roller (413) and pulls the release spring (412) to extend. At the same time, the positioning frame (44) drags the guide rope (42). After the guide rope (42) turns through the guide roller (32) and the release roller (413) multiple times, it pulls the guide spring (411) to extend. The guide spring (411) provides a continuous light tension force to the rear end of the positioning frame (44) so ​​that the positioning frame (44) maintains a stable posture during the descent.

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