Cathode module and semiconductor device

Abstract

The application discloses a cathode module and a semiconductor device, and relates to the technical field of semiconductor devices. The cathode module comprises a shell, a first liquid distributor and a target material. The shell is provided with a containing cavity. The first liquid distributor is located in the containing cavity. The target material is fixed to the bottom of the shell. The shell is provided with a liquid inlet for introducing a cooling medium. The first liquid distributor is provided with at least one liquid inlet channel, a plurality of shunt channels and a plurality of liquid outlet channels. Each liquid inlet channel is in communication with the liquid inlet. The inlet of each shunt channel is in communication with the liquid inlet channel corresponding to the shunt channel. The plurality of shunt channels are used for distributing the cooling medium to different areas of the first liquid distributor. The outlet of each shunt channel is in communication with the inlet of at least one liquid outlet channel. The outlet of the liquid outlet channel is arranged towards a cooling area, so that the cooling effect of the cathode module can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a cathode module and semiconductor equipment. Background Technology

[0002] As semiconductor thin film deposition processes evolve towards higher uniformity and lower defects, semiconductor equipment places higher demands on the stability of target temperature control. During sputtering, the target continuously endures particle bombardment and generates heat. Uneven heat dissipation can easily lead to localized high-temperature areas, reducing the reliability of the target backplane bonding layer and potentially causing target warping and deformation. This, in turn, affects the relative positional relationship between the target surface and the magnetron, resulting in drift in the magnetic field distribution and sputtering uniformity.

[0003] In related technologies, cooling channels are typically set on the back side of the target material, allowing the cooling medium to flow through the target material to remove heat. The cooling medium also needs to cool other components such as the magnetron or backplate. However, after entering the cooling channel, the cooling medium tends to flow sequentially along a pre-defined path, easily concentrating its effect on localized areas. This makes it difficult to distribute the cooling medium fully and evenly within the cooling area, resulting in a relatively large maximum temperature of the components being cooled and a significant temperature difference between different areas, thus limiting the cooling effect of the cathode module. Summary of the Invention

[0004] This application discloses a cathode module and semiconductor device for reducing the maximum temperature of the component to be cooled, reducing the temperature difference between different areas of the component to be cooled, and improving the cooling effect of the cathode module.

[0005] In a first aspect, this application provides a cathode module, including a housing, a first liquid distribution component, and a target material. The housing has a receiving cavity, the first liquid distribution component is located in the receiving cavity, the target material is fixed to the bottom of the housing, and the housing has a liquid inlet for introducing cooling medium. The first liquid distribution component is provided with at least one liquid inlet channel, multiple diversion channels, and multiple liquid outlet channels; Each inlet channel is connected to the inlet port, and the inlet of each branch channel is connected to the corresponding inlet channel. Multiple branch channels are used to distribute the cooling medium to different areas of the first distribution element. The outlet of each diversion channel is connected to the inlet of at least one liquid outlet channel; The outlet of the liquid outlet channel is oriented towards the area to be cooled.

[0006] In this embodiment, since the cathode module includes a housing, a first liquid distribution component, and a target material, and the housing has a receiving cavity, the first liquid distribution component is located inside the receiving cavity, and the target material is fixed to the bottom of the housing, the first liquid distribution component can be integrated inside the cathode module, resulting in a more compact structure. This allows for cooling of the target material and other components to be cooled during the operation of the cathode module. Because the first liquid distribution component has an inlet channel, multiple diversion channels, and multiple outlet channels, and the inlet of each diversion channel is connected to the corresponding inlet channel, and the outlet of each diversion channel is connected to the inlet of at least one outlet channel, the cooling medium, after entering the inlet channel of the first liquid distribution component through the inlet, can first be distributed to different areas of the first liquid distribution component through multiple diversion channels, and then flow out from the side of the first liquid distribution component away from the inlet through multiple outlet channels, allowing the cooling medium to be more fully distributed within the area to be cooled. Meanwhile, at least some of the liquid outlet channels are oriented towards the area to be cooled, so that different liquid outlet channels can deliver the cooling medium to the corresponding area to be cooled for directional cooling, reduce local insufficient cooling and heat accumulation, thereby reducing the maximum temperature of the component to be cooled, reducing the temperature difference between different areas of the component to be cooled, and improving the cooling effect of the cathode module.

[0007] In one possible implementation, the outlet of each liquid outlet channel is located on the side of the first liquid distribution element away from the liquid inlet. The target material includes a first heating zone and a second heating zone. The heat generation of the first heating zone is greater than that of the second heating zone. The area to be cooled is the first heating zone of the target material.

[0008] In this embodiment, because the outlet of each liquid outlet channel is located on the side of the first liquid distribution component away from the liquid inlet, the cooling medium can be more fully distributed in the cooling area on the back side of the target. Since the target includes a first heating zone and a second heating zone, and the heat output of the first heating zone is greater than that of the second heating zone, and the area to be cooled is the first heating zone of the target, the liquid outlet channel of the first liquid distribution component can directionally deliver the cooling medium to the area with greater heat output in the target. This matches the cooling capacity of the cooling medium with the heat distribution of the target, avoiding excessive liquid supply to the second heating zone with lower heat output while the first heating zone is insufficiently cooled. This enhances heat exchange in the first heating zone, reduces heat accumulation in the first heating zone, lowers the local maximum temperature of the target, and reduces the temperature difference between the first and second heating zones. This improves the temperature control adaptability and cooling effect of the cathode module to the non-uniform heat dissipation distribution of the target.

[0009] In one possible implementation, at least a portion of the liquid outlet channel is oriented towards the thickness direction of the first liquid distribution element; Alternatively, at least part of the liquid outlet channel is oriented toward the center of the first dispensing element; Alternatively, a portion of the liquid outlet channels are oriented towards the thickness direction of the first liquid distribution component, and another portion of the liquid outlet channels are oriented towards the first rotation direction, with the number of liquid outlet channels oriented towards the first rotation direction being the same as the number of liquid outlet channels oriented towards the thickness direction. Alternatively, some of the liquid outlet channels face the first rotation direction, while others face the second rotation direction. The first and second rotation directions are different, and the number of liquid outlet channels facing the first rotation direction is the same as the number of liquid outlet channels facing the second rotation direction.

[0010] In this embodiment, because at least a portion of the liquid outlet channels can be oriented towards the thickness direction of the first liquid distributor, the center of the first liquid distributor, the first rotation direction, or the second rotation direction, the corresponding liquid outlet mode can be selected according to the heating location and cooling requirements of the target material's cooling area: when the liquid outlet channels are oriented towards the thickness direction of the first liquid distributor, the cooling medium can flow to the back side of the target material via a shorter path, improving the direct flushing and heat exchange effect on the area to be cooled; when the liquid outlet channels are oriented towards the center of the first liquid distributor, the cooling medium can converge towards the central area to enhance the cooling of the central heating area of ​​the target material; when a portion of the liquid outlet channels are oriented towards the thickness direction and another portion of the liquid outlet channels are oriented towards the thickness direction, the cooling medium can flow towards the center of the target material's cooling area. When the number of liquid outlet channels facing the first rotation direction is the same as the number of liquid outlet channels facing the thickness direction, the cooling medium can directly act on the area to be cooled and form a flow with a circumferential component, thus taking into account both direct cooling and rotational disturbance diffusion. When some liquid outlet channels face the first rotation direction and others face different second rotation directions, and the number of liquid outlet channels facing the first rotation direction is the same as the number of liquid outlet channels facing the second rotation direction, the cooling medium can form a relatively balanced flow distribution in different rotation directions, reducing the cooling bias caused by a single rotation direction. Therefore, this first liquid distribution component can improve the adaptability of the cooling medium to different heat-generating areas, enhance the coverage and disturbance effect of the cooling medium on the back side of the target, reduce local stagnation and heat accumulation, thereby reducing the local maximum temperature of the target and reducing the temperature difference between different areas of the target.

[0011] In one possible implementation, at least part of the diversion channel includes a main diversion channel and a plurality of first diversion branches connected to the outlet of the main diversion channel. The inlet of the main diversion channel is connected to the liquid inlet channel corresponding to the main diversion channel, and the outlet of each first diversion branch is connected to the liquid outlet channel corresponding to the first diversion branch.

[0012] In this embodiment, since the diversion channel includes a main diversion channel connected to the liquid inlet and a first diversion branch channel connected to the outlet of the main diversion channel, the cooling medium enters from the liquid inlet and is first guided by the main diversion channel before being distributed to each of the first diversion branches, thereby realizing the step-by-step diversion of the cooling medium and distributing the cooling medium more evenly to a larger area with a smaller pressure drop loss.

[0013] In one possible implementation, at least part of the diversion channel further includes a plurality of second diversion branches, the inlet of the second diversion branch being connected to the outlet of the corresponding first diversion branch, the outlet of the plurality of second diversion branches being connected to the inlet of a plurality of liquid outlet channels in a one-to-one correspondence, and at least one of the main diversion channel, the first diversion branch and the second diversion branch extending in a circumferential direction around the central axis of the first liquid distribution element.

[0014] In this embodiment, because the diversion channel further includes a second diversion branch connected to the first diversion branch, and the second diversion branch is connected to each outlet channel in a one-to-one correspondence, the cooling medium is further subdivided before entering each outlet channel. This reduces the risk of excessive flow or insufficient liquid supply in some channels, ensuring a more stable and balanced supply of cooling medium to each outlet channel, thereby improving the overall cooling uniformity of the area to be cooled. At least one of the main diversion channel, the first diversion branch, and the second diversion branch extends circumferentially around the central axis of the first liquid distribution component. Therefore, the diversion channel can adapt to circular / annular components to be cooled, transporting and distributing the cooling medium circumferentially within the diversion channel. This improves the coverage of the cooling medium over the area to be cooled in the circular / annular component, reduces circumferential cooling blank areas, and helps improve the circumferential temperature uniformity of the component to be cooled.

[0015] In one possible implementation, the plurality of liquid outlet channels include a plurality of first liquid outlet channels evenly distributed along a first circumferential region of the first liquid distributor, and a plurality of second liquid outlet channels evenly distributed along a second circumferential region of the first liquid distributor that is different from the first circumferential region.

[0016] In this embodiment, since the multiple liquid outlet channels include multiple first liquid outlet channels evenly distributed along the first circumferential region of the first liquid distributor, and multiple second liquid outlet channels evenly distributed along the second circumferential region of the first liquid distributor which is different from the first circumferential region, the cooling medium can be transported radially to annular regions of different radii and evenly distributed circumferentially. This improves the uniformity of the cooling medium's coverage of the area to be cooled in both radial and circumferential directions, reduces local insufficient cooling areas, and lowers the maximum temperature and regional temperature difference.

[0017] In one possible implementation, the plurality of diversion channels include a first diversion channel and a second diversion channel, the first diversion channel and the second diversion channel being located in the first circumferential region and the second circumferential region of the first liquid distribution element, respectively. The first diversion channel is connected to the liquid inlet channel and a plurality of first liquid outlet channels, and the second diversion channel is connected to the liquid inlet channel and a plurality of second liquid outlet channels. The first diversion channel and the second diversion channel are respectively used to distribute cooling medium to the first circumferential region and the second circumferential region of the first liquid distribution element.

[0018] In this embodiment, since the first diversion channel and the second diversion channel are located in the first circumferential region and the second circumferential region respectively, and are connected to multiple first liquid outlet channels and multiple second liquid outlet channels respectively, the first liquid outlet channel in the first circumferential region and the second liquid outlet channel in the second circumferential region are supplied with liquid independently by their respective corresponding diversion channels. This makes it easier for the inner and outer areas to be cooled to obtain a cooling medium supply that matches their heat generation, thereby improving the cooling adaptability of the cathode module to different circumferential heating areas.

[0019] In one possible implementation, the inlet of the liquid outlet channel is tangent to and connected to the sidewall of the corresponding diversion channel.

[0020] In this embodiment, because the inlet of the liquid outlet channel is tangential to and connected to the sidewall of the corresponding diversion channel, the cooling medium can smoothly transition from the diversion channel into the liquid outlet channel along the tangential direction, reducing abrupt changes in flow direction, turbulent impacts, and local backflow at the connection point, thereby reducing flow loss and improving the liquid inlet stability at the inlet of the liquid outlet channel.

[0021] In one possible implementation, the width of each main diversion channel in the radial direction of the first distribution element is 1.5 to 3 times the width of each first branch diversion channel in the radial direction of the first distribution element.

[0022] In this embodiment, since the width of each main channel in the radial direction of the first distribution element is 1.5 to 3 times the width of each branch channel in the radial direction of the first distribution element, the main channel can provide a larger flow space to increase the supply of cooling medium. When the cooling medium enters the branch channel from the main channel, the channel width decreases and a contraction guiding effect is formed, which increases the flow velocity of the cooling medium entering the branch channel. This enhances the flushing and heat exchange capacity of the cooling medium after it flows out through the branch channel and the corresponding outlet channel, thereby improving the cooling effect on the area to be cooled.

[0023] In one possible implementation, a second liquid distribution component is also included. The second liquid distribution component is located on the side of the first liquid distribution component facing the liquid inlet. The second liquid distribution component is provided with a main liquid delivery channel and multiple liquid delivery sub-channels connected to the main liquid delivery channel. There are multiple liquid inlet channels. The main liquid delivery channel is connected to the liquid inlet, and the multiple liquid delivery sub-channels are connected to the multiple liquid inlet channels one by one.

[0024] In this embodiment, because the cathode module also includes a second liquid distribution component located on the side of the first liquid distribution component facing the liquid inlet, and the liquid delivery channel of the second liquid distribution component is connected to the liquid inlet channel of the first liquid distribution component one by one, the cooling medium can be initially distributed through the main liquid delivery channel and the liquid delivery sub-channel of the second liquid distribution component, and then evenly delivered into each liquid inlet channel of the first liquid distribution component, thereby further improving the uniformity of the cooling medium supply.

[0025] Secondly, this application provides a semiconductor device, comprising: The cathode module provided in the above embodiments; The process chamber has a cathode module located at the top.

[0026] In this embodiment, since the semiconductor device includes the aforementioned cathode module and the cathode module is located at the top of the process chamber, the target material in the cathode module can be positioned facing the interior of the process chamber for sputtering deposition within the process chamber. Simultaneously, since the cathode module can distribute the cooling medium to different areas through the first liquid distribution component and directionally deliver the cooling medium to the corresponding area to be cooled through the liquid outlet channel, it can reduce the local maximum temperature of the component to be cooled and reduce the temperature difference between different areas of the component to be cooled during the operation of the semiconductor device. This reduces the deformation, positional displacement, or sputtering state fluctuations of the target material caused by uneven heating, thereby improving the stability of the deposition process within the process chamber and enhancing film uniformity and equipment operational reliability. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a cross-sectional schematic diagram of a semiconductor device provided in an embodiment of this application; Figure 2 This is a cross-sectional schematic diagram of the cathode module provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of the first liquid distribution component provided in the embodiments of this application; Figure 4 This is a schematic diagram of the structure of the first liquid dispensing component provided in an embodiment of this application from another perspective; Figure 5 This is a schematic diagram of the structure of the liquid outlet channel in the direct outlet enhanced mode provided in the embodiment of this application; Figure 6 This is a schematic diagram of the structure of the liquid outlet channel provided in the embodiment of this application, which is in a center-reinforced mode; Figure 7 This is a schematic diagram of the structure of the liquid outlet channel in the embodiment of this application, which is in a rotating convection enhancement mode; Figure 8 A schematic diagram of the combined enhanced mode of the liquid outlet channel provided in the embodiments of this application; Figure 9 This is a schematic diagram of the structure of the second liquid distribution component provided in the embodiments of this application; Figure 10 This is a schematic diagram of the second liquid distribution component provided in an embodiment of this application from another perspective. Figure 11 A perspective view of the combination of the first and second liquid dispensing components provided in the embodiments of this application.

[0029] Explanation of reference numerals in the attached figures: 1000 - Semiconductor equipment; 100 - Cathode module; 200 - Process chamber; 300 - Cover; 10-Shell; 101 - Receiving cavity; 102 - Liquid inlet; 103 - Liquid outlet; 20-Target material; 30 - First liquid distribution unit; 301 - Liquid Inlet Channel; 3021 - Main diversion channel; 3022 - First diversion branch channel; 3023 - Second diversion branch channel; 3024 - First diversion channel; 3025 - Second diversion channel; 3031 - First outlet channel; 3032 - Second outlet channel; 40 - Magnetron assembly; 401 - Magnetron; 402 - Mounting bracket; 403 - Fixture; 50-back panel; 60 - Second liquid separator; 601 - Main liquid delivery channel; 602 - Sub-liquid delivery channel. Detailed Implementation

[0030] The cathode module of this application is primarily used in the semiconductor equipment field, specifically in physical vapor deposition (PVD) equipment and other high-heat-generating process equipment requiring stable cooling of targets, magnetrons, or backplanes. For example, PVD equipment can be used for thin film deposition on blank masks, wafers, or other semiconductor substrates. The cathode module can be positioned at the top of the process chamber and cools the components to be cooled, thereby improving the temperature stability of the components during the deposition process.

[0031] In semiconductor equipment such as physical vapor deposition (PVD) equipment, target particles are sputtered and deposited onto a semiconductor substrate by bombarding the target surface with plasma. Since the target continuously heats up during sputtering due to particle bombardment, it needs to be cooled. Addressing the problem in related technologies where the cooling medium tends to concentrate in localized areas and fails to fully distribute on the back side of the target, resulting in high localized maximum temperatures and large temperature differences between different areas, this application discloses a cathode module and a semiconductor device. This cathode module incorporates a first liquid distribution component within the housing cavity, and within this component are inlet channels, multiple diversion channels, and multiple outlet channels. This allows the cooling medium, after entering the inlet channel of the first liquid distribution component, to be distributed to different areas of the component via multiple diversion channels, and then flow out towards the corresponding areas to be cooled via multiple outlet channels. This improves the distribution of the cooling medium, reduces insufficient localized cooling and heat accumulation, and lowers the maximum temperature of the component to be cooled and the temperature differences between areas.

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be understood that the terms "top", "bottom", "upper", "lower", "inner", "outer", "near", "far away", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship of the product during normal assembly and use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] This application provides a semiconductor device 1000. Please refer to... Figure 1 , Figure 1This is a cross-sectional schematic diagram of a semiconductor device provided in an embodiment of this application. The semiconductor device 1000 may include a process chamber 200 and a cathode module 100, with the cathode module 100 located on top of the process chamber 200. The process chamber 200 provides a reaction space, and the cathode module 100 provides the material to be deposited during the deposition process and cools the target 20. It is understood that the semiconductor device 1000 may also include a cover 300, located above the process chamber 200, for closing the top opening of the process chamber 200 and supporting the cathode module 100. The cathode module 100 may be one or more sets. When there are multiple sets of cathode modules 100, they may be installed inside the cover 300 or at the bottom of the cover 300; when there is one set of cathode modules 100, the cathode module 100 is directly installed on top of the process chamber 200 and opposite to the reaction space within the process chamber 200.

[0035] Further, please refer to Figure 2 , Figure 2 This is a cross-sectional schematic diagram of the cathode module provided in an embodiment of this application. The cathode module 100 may include a housing 10, a target 20, a first liquid distribution element 30, and a magnetron assembly 40. The housing 10 may have a receiving cavity 101, the first liquid distribution element 30 is located in the receiving cavity 101, and the target 20 is fixed to the bottom of the housing 10. The target 20 is used to provide the material to be deposited during the sputtering process. The side of the target 20 facing the process chamber 200 is the sputtering surface, and the side of the target 20 away from the sputtering surface is the back side. The magnetron assembly 40 is located in the receiving cavity 101 and may be disposed on the back side of the target 20. It is used to generate a magnetic field to enhance dissociation efficiency and sputtering efficiency, and to control the plasma distribution. The magnetron assembly 40 may include a magnetron 401, a mounting bracket 402, and a fixing bracket 403. The magnetron 401 may be fixed to the mounting bracket 402, the mounting bracket 402 may be fixed to the fixing bracket 403, and the fixing bracket 403 may be fixed to the cover 300 or the housing 10. The first dispensing element 30 may be disposed between the mounting bracket 402 and the target material 20 so that the cooling medium flowing out from the first dispensing element 30 can act on the back side of the target material 20 or the corresponding area to be cooled on the back side of the target material 20.

[0036] Please continue reading. Figure 2 And see Figure 3 , Figure 3This is a schematic diagram of the structure of the first liquid distribution component provided in this application embodiment. The housing 10 is provided with an inlet 102 for introducing cooling medium. The first liquid distribution component 30 is provided with at least one inlet channel 301, multiple diversion channels 3021, 3022, 3023, 3024, 3025, and multiple outlet channels 3031, 3032. Throughout the text, "multiple" means at least two. Exemplarily, the inlet channel 301 may include, but is not limited to, one or two. When there are two inlet channels 301, the two inlet channels 301 are symmetrically arranged about the central axis of the first liquid distribution component 30, allowing the cooling medium to simultaneously enter the diversion channels from multiple directions of the first liquid distribution component 30. This reduces the flow bias caused by unilateral liquid inlet, thereby improving the symmetry and balance of the cooling medium distribution within the first liquid distribution component 30, making the cooling of the area to be cooled more uniform. The central axis of the first liquid distribution component 30 is parallel to the thickness direction of the first liquid distribution component 30. The number of distribution channels includes, but is not limited to, two or four, and the number of outlet channels includes, but is not limited to, two, four, eight, or sixteen. The first distribution element 30 includes, but is not limited to, a disc-shaped or annular structure; the inlet channel 301 includes, but is not limited to, a circular or conical hole; the distribution channels include, but are not limited to, channels or arc-shaped channels; and the outlet channels include, but are not limited to, oblique or straight holes. Each inlet channel 301 is connected to the inlet 102, and the inlet of each distribution channel is connected to the corresponding inlet channel 301. Multiple distribution channels are used to distribute the cooling medium to different areas of the first distribution element 30. The outlet of each distribution channel is connected to the inlet of at least one outlet channel. For example, the outlet of one distribution channel is connected to the inlet of one outlet channel, and the outlet of another distribution channel is connected to the inlets of multiple outlet channels. The outlet direction of the outlet channels is oriented towards the area to be cooled, so as to deliver the cooling medium to the area to be cooled corresponding to the outlet channel. The component to be cooled can be the target material 20, the magnetron 401, or the back plate 50. The area to be cooled can be not only the back side of the target material 20, but also the side wall of the magnetron 401, the back plate 50 used to fix the target material 20, or the fixing bracket 403. The housing 10 is also provided with a liquid outlet 103, which is used to draw out the cooling medium in the receiving cavity 101.

[0037] In this embodiment, the cathode module 100 includes a housing 10, a first liquid distribution component 30, and a target material 20. The housing 10 is provided with a receiving cavity 101, and the first liquid distribution component 30 is located in the receiving cavity 101. The target material 20 is fixed to the bottom of the housing 10, so the first liquid distribution component 30 can be integrated inside the cathode module 100, making the structure more compact. This allows the target material 20 and other components to be cooled to be cooled during the operation of the cathode module 100. Because the first liquid distribution component 30 is provided with an inlet channel 301, multiple diversion channels, and multiple outlet channels, and the inlet of each diversion channel is connected to the corresponding inlet channel 301, and the outlet of each diversion channel is connected to the inlet of at least one outlet channel, the cooling medium enters the inlet channel 301 of the first liquid distribution component 30 through the inlet 102, and can first be distributed to different areas of the first liquid distribution component 30 through multiple diversion channels, and then flow out through multiple outlet channels, so that the cooling medium can be more fully spread in the area to be cooled. Meanwhile, the outlet of the liquid outlet channel is set towards the area to be cooled, so that different liquid outlet channels can deliver the cooling medium to the corresponding area to be cooled for directional cooling, reduce local insufficient cooling and heat accumulation, thereby reducing the maximum temperature of the component to be cooled, reducing the temperature difference between different areas of the component to be cooled, and improving the cooling effect of the cathode module 100.

[0038] It is understandable that the inlet channel 301, multiple diversion channels, and multiple outlet channels of the first liquid distribution component 30 can jointly form a liquid distribution channel network. After the cooling medium enters the first liquid distribution component 30, it is dispersed step by step along each level of the channel by its own water pressure and flows to the area of ​​the target material 20 that needs temperature control through the outlet channel. Therefore, there is no need to add an additional rotating agitation mechanism in the cathode module 100, so that the cooling medium can be spread relatively evenly on the back side of the target material 20. Since the distribution and direction of the cooling medium are mainly determined by the channel structure of the first liquid distribution component 30, and do not depend on the rotation of the magnetron 401, the cathode module 100 can adapt to process scenarios with poor heat dissipation, such as high heat generation, non-uniform heat distribution, and non-rotation of the magnetron 401, and still achieve good maximum temperature control and temperature uniformity of the target material 20 under the above scenarios.

[0039] Please continue reading. Figure 2 and Figure 3Furthermore, the outlet of each liquid outlet channel is located on the side of the first liquid distribution component 30 opposite to the liquid inlet 102. The target material 20 includes a first heating zone and a second heating zone. The heat generation of the first heating zone is greater than that of the second heating zone. The area to be cooled is the first heating zone of the target material 20. The first heating zone is a high-heat area on the sputtering surface of the target material 20 where particle bombardment is more concentrated, and its heat generation is higher than that of the second heating zone. The liquid outlet channel of the first liquid distribution component 30 can directionally deliver the cooling medium to the area with higher heat generation in the target material 20, so that the cooling capacity of the cooling medium matches the heat generation distribution of the target material 20. This avoids over-supplying the second heating zone with lower heat generation while the first heating zone is under-cooled, thereby enhancing the heat exchange of the first heating zone, reducing heat accumulation in the first heating zone, lowering the local maximum temperature of the target material 20, and narrowing the temperature difference between the first and second heating zones. This improves the temperature control adaptability and cooling effect of the cathode module 100 to the non-uniform heat generation distribution of the target material 20. Meanwhile, the first liquid distribution component 30 can selectively suppress the temperature rise of the high-heat area by directionally delivering the cooling medium to the first heating zone, thereby reducing the risk of failure of the connection layer between the target material 20 and the back plate 50, as well as the risk of relative position and magnetic field distribution drift between the target surface and the magnetron 401.

[0040] Please continue reading. Figure 2 and Figure 3 And see Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 , Figure 4 This is a schematic diagram of the structure of the first liquid dispensing component provided in an embodiment of this application from another perspective; Figure 5 This is a schematic diagram of the structure of the liquid outlet channel in the direct outlet enhanced mode provided in the embodiment of this application; Figure 6 This is a schematic diagram of the structure of the liquid outlet channel provided in the embodiment of this application, which is in a center-reinforced mode; Figure 7 This is a schematic diagram of the structure of the liquid outlet channel in the embodiment of this application, which is in a rotating convection enhancement mode; Figure 8 This is a schematic diagram of the combined enhanced mode of the liquid outlet channel provided in the embodiment of this application.

[0041] When there are multiple liquid outlet channels, these channels are symmetrically arranged around the central axis of the first liquid distributor 30. At least some of the liquid outlet channels can be configured with different liquid outlet directions according to the heat distribution of the target material 20's cooling area. For example, at least some of the liquid outlet channels face the thickness direction of the first liquid distributor 30; or, at least some of the liquid outlet channels face the center of the first liquid distributor 30; or, some of the liquid outlet channels face the thickness direction of the first liquid distributor 30, and another portion faces the first rotation direction, with the number of liquid outlet channels facing the first rotation direction being the same as the number of liquid outlet channels facing the thickness direction; or, some of the liquid outlet channels face the first rotation direction, and another portion faces the second rotation direction, where the first and second rotation directions are different, and the number of liquid outlet channels facing the first rotation direction is the same as the number of liquid outlet channels facing the second rotation direction. Both the first and second rotation directions can be understood as the directions in which the liquid outlet direction of the liquid outlet channel has a circumferential component in a reference plane perpendicular to the central axis of the first liquid distributor 30. For example, the first rotation direction can be clockwise when viewed along the central axis of the first liquid dispensing component 30, and the second rotation direction can be counterclockwise when viewed along the central axis of the first liquid dispensing component 30.

[0042] When the high-heat location of the target material 20 changes with process conditions, the orientation of at least some of the liquid outlet channels can be adjusted accordingly to match the outlet direction of the cooling medium with the changed heat distribution. Specifically, when the outlet channel faces the thickness direction of the first liquid distributor 30, a direct outlet enhancement mode targeting a specific heat track can be formed; when the outlet channel faces the center of the first liquid distributor 30, a center enhancement mode can be formed; when the outlet channel faces the first rotation direction or the second rotation direction, a rotational convection enhancement mode can be formed; when the outlet channels facing the thickness direction are combined with the outlet channels facing the rotation direction, a combined inner and outer ring outlet enhancement mode can be formed. The outlets of multiple outlet channels can be distributed circumferentially around the central axis of the first liquid distributor 30; the outlet direction of each outlet channel can be changed by adjusting the machining angle of the corresponding channel so that the cooling medium points to one or more high-heat areas of the target material 20, thereby achieving directional temperature control adapted to the heat distribution of the target material 20 and reducing the overall temperature difference of the target material 20.

[0043] In this embodiment, because at least a portion of the liquid outlet channels can be oriented towards the thickness direction of the first liquid distributor 30, the center of the first liquid distributor 30, the first rotation direction, or the second rotation direction, the corresponding liquid outlet mode can be selected according to the heat dissipation location and cooling requirements of the target material 20 to be cooled: when the liquid outlet channels are oriented towards the thickness direction of the first liquid distributor 30, the cooling medium can flow to the back side of the target material 20 with a shorter path, improving the direct flushing and heat exchange effect of the area to be cooled; when the liquid outlet channels are oriented towards the center of the first liquid distributor 30, the cooling medium can converge towards the central area to enhance the cooling of the central heating area of ​​the target material 20; when a portion of the liquid outlet channels are oriented towards the thickness direction... When one portion of the liquid outlet channels faces the first rotation direction, and the number of liquid outlet channels facing the first rotation direction is the same as the number of liquid outlet channels facing the thickness direction, the cooling medium can directly act on the area to be cooled and form a flow with a circumferential component, thus taking into account both direct cooling and rotational disturbance diffusion. When one portion of the liquid outlet channels faces the first rotation direction and another portion faces different second rotation directions, and the number of liquid outlet channels facing the first rotation direction is the same as the number of liquid outlet channels facing the second rotation direction, the cooling medium can form a relatively balanced flow distribution in different rotation directions, reducing the cooling bias caused by a single rotation direction. Therefore, the first liquid distribution component 30 can improve the adaptability of the cooling medium to different heat-generating areas, enhance the coverage and disturbance effect of the cooling medium on the back side of the target 20, reduce local stagnation and heat accumulation, thereby reducing the local maximum temperature of the target 20 and reducing the temperature difference between different areas of the target 20.

[0044] Please continue reading. Figure 3 In one possible implementation, at least part of the diversion channel includes a main diversion channel 3021 and a plurality of first diversion branches 3022 connected to the outlet of the main diversion channel 3021. The inlet of the main diversion channel 3021 is connected to the liquid inlet channel 301 corresponding to the main diversion channel 3021, and the outlet of each first diversion branch 3022 is connected to the liquid outlet channel corresponding to the first diversion branch 3022. The main diversion channel 3021 can be an arc-shaped groove or an arc-shaped channel; the first diversion branches 3022 can be arc-shaped grooves or arc-shaped channels. After entering through the liquid inlet 102, the cooling medium is first guided through the main diversion channel 3021 and then distributed to each of the first diversion branches 3022, realizing the step-by-step diversion of the cooling medium, thereby distributing the cooling medium more evenly to a larger area with a smaller pressure drop loss.

[0045] The depth of the main diversion channel 3021 in the thickness direction of the first liquid distribution component 30 can be set to be the same as the depth of the first diversion branch channel 3022 in the thickness direction of the first liquid distribution component 30. The liquid inlet channel 301 can be a circular channel. The width of each main diversion channel 3021 in the radial direction of the first liquid distribution component 30 (as shown in the attached figure) Figure 3 L211 L 212 L 221 L 222 (As shown) can have the same diameter Φ2 as the inlet channel 301, and the width of each main diversion channel 3021 in the radial direction of the first diversion element 30 (as shown in the attached figure) can be the same as the diameter Φ2 of ... Figure 3 L 211 L 212 L 221 L 222 (As shown) The width of each first branch channel 3022 in the radial direction of the first distribution element 30 can be set to 1.5 to 3 times. The main branch channel 3021 can provide a larger flow space to increase the supply of cooling medium. When the cooling medium enters the first branch channel 3022 from the main branch channel 3021, the channel width decreases and a contraction guiding effect is formed, which increases the flow velocity of the cooling medium entering the first branch channel 3022. This enhances the flushing and heat exchange capacity of the cooling medium after flowing out of the first branch channel 3022 and the corresponding outlet channel, thereby improving the cooling effect on the area to be cooled. For example, the width of each main branch channel 3021 in the radial direction of the first distribution element 30 can be twice the width of each first branch channel 3022 in that radial direction.

[0046] Please continue reading. Figure 3 and Figure 4 Furthermore, at least part of the diversion channel also includes multiple second diversion branches 3023. Each second diversion branch 3023 can be an arc-shaped groove or an arc-shaped channel. The inlet of each second diversion branch 3023 is connected to the outlet of the corresponding first diversion branch 3022. The outlets of the multiple second diversion branches 3023 are connected one-to-one with the inlets of multiple liquid outlet channels. The cooling medium is progressively subdivided through the main diversion channel 3021, the first diversion branch 3022, and the second diversion branch 3023 before entering each liquid outlet channel. This reduces the risk of excessive flow or insufficient liquid supply in some channels, ensuring a more stable and balanced supply of cooling medium to each liquid outlet channel, thereby improving the overall cooling uniformity of the area to be cooled. The width and depth of all second diversion branches 3023 can be consistent with the width and depth of their corresponding first diversion branches 3022 to ensure a relatively stable and balanced supply of cooling medium to each liquid outlet channel. At least one of the main diversion channel 3021, the first diversion branch channel 3022, and the second diversion branch channel 3023 extends circumferentially around the central axis of the first liquid distribution component 30, so that the liquid distribution channel can be adapted to the circular or annular component to be cooled, and deliver and distribute the cooling medium in the circumferential direction within the diversion channel, thereby improving the coverage of the cooling medium on the cooling area in the circular / annular component to be cooled, reducing the circumferential cooling blank area, and helping to improve the circumferential temperature uniformity of the component to be cooled.

[0047] The multiple liquid outlet channels include multiple first liquid outlet channels 3031 evenly distributed along the first circumferential region of the first liquid distribution component 30, and multiple second liquid outlet channels 3032 evenly distributed along a second circumferential region of the first liquid distribution component 30, which is different from the first circumferential region. The multiple first liquid outlet channels 3031 and multiple second liquid outlet channels 3032 can respectively correspond to the outer ring and inner ring cooling areas of the target material 20. The number and outlet direction of the first liquid outlet channels 3031, as well as the number and outlet direction of the second liquid outlet channels 3032, can be individually set according to the heat distribution of the corresponding circumferential regions. The cooling medium can be transported radially to annular regions of different radii and evenly distributed circumferentially, thereby improving the uniformity of the cooling medium coverage of the cooling area in both radial and circumferential directions, reducing local insufficient cooling areas, and lowering the maximum temperature and regional temperature difference.

[0048] Please continue reading. Figure 3 and Figure 4 And see Figure 11 , Figure 11 This is a perspective view of the combined first and second liquid distribution components provided in an embodiment of this application. Accordingly, the plurality of distribution channels include a first distribution channel 3024 and a second distribution channel 3025. The first distribution channel 3024 and the second distribution channel 3025 are respectively located in the first circumferential region and the second circumferential region of the first liquid distribution component 30. The first distribution channel 3024 communicates with the inlet channel 301 and a plurality of first outlet channels 3031, and the second distribution channel 3025 communicates with the inlet channel 301 and a plurality of second outlet channels 3032. The first distribution channel 3024 and the second distribution channel 3025 are respectively used to distribute liquid to the first circumferential region and the second circumferential region of the first liquid distribution component 30. The cooling medium is distributed in the circumferential region, allowing the inner and outer ring cooling areas of the target material 20 to receive cooling medium flow rates matching their respective heat generation. Multiple first liquid outlet channels 3031 on the first circumferential region and multiple second liquid outlet channels 3032 on the second circumferential region are independently supplied with liquid by their respective corresponding first and second diversion channels 3024 and 3025. This facilitates ensuring that the inner and outer cooling areas receive cooling medium supplies matching their heat generation, thereby improving the cooling adaptability of the cathode module 100 to different circumferential heating areas. The liquid outlet channel can be circular, with its inlet tangentially connected to the sidewall of the corresponding diversion channel. This allows the cooling medium to smoothly transition tangentially along the sidewall of the diversion channel into the liquid outlet channel, reducing abrupt changes in flow direction, turbulent impacts, and local backflow at the connection point, thus reducing flow losses and improving the inlet stability of the liquid outlet channel.

[0049] Please continue reading. Figure 2 and Figure 11 And see Figure 9 and Figure 10, Figure 9 This is a schematic diagram of the structure of the second liquid distribution component provided in the embodiments of this application; Figure 10 This is a schematic diagram of the second liquid dispensing component provided in an embodiment of this application from another perspective.

[0050] In one possible implementation, the cathode module 100 further includes a second liquid distribution component 60, located on the side of the first liquid distribution component 30 facing the liquid inlet 102. The second liquid distribution component 60 has a main liquid delivery channel 601 and multiple liquid delivery sub-channels 602 communicating with the main liquid delivery channel 601. The number of liquid inlet channels 301 is multiple. The main liquid delivery channel 601 communicates with the liquid inlet 102, and the multiple liquid delivery sub-channels 602 are correspondingly connected to the multiple liquid inlet channels 301. The second liquid distribution component 60 may include, but is not limited to, a disc-shaped structure or a ring-shaped structure; the main liquid delivery channel 601 may include, but is not limited to, a circular hole or a conical hole; the liquid delivery sub-channels 602 may include, but is not limited to, channels or arc-shaped channels. The cooling medium can be initially distributed through the main liquid delivery channel 601 and the liquid delivery sub-channels 602 of the second liquid distribution component 60, and then uniformly delivered into each liquid inlet channel 301 of the first liquid distribution component 30, further improving the uniformity of the cooling medium supply.

[0051] The line connecting the center of the main liquid delivery channel 601 of the second liquid distribution component 60 to the center of the second liquid distribution component 60 can form a 90° angle with the line connecting the center of the outlet of each liquid delivery sub-channel 602 to the center of the second liquid distribution component 60. The main liquid delivery channel 601 can be a circular channel with its axis extending along the thickness direction of the second liquid distribution component 60. The diameter Φ1 of the main liquid delivery channel 601 of the second liquid distribution component 60 and the groove width of the liquid delivery sub-channels 602 (as shown in the attached figure) are also specified. Figure 9 L 11 L 12 The ratio of the depth of the main liquid delivery channel 601 to the depth of the liquid delivery sub-channel 602 can be 2:0.5:0.5-2:1.5:1.5. An arc transition can be used between the outlet of the main liquid delivery channel 601 and the inlet of the liquid delivery sub-channel 602. The ratio of the radius R1 of the arc transition to the diameter Φ1 of the main liquid delivery channel 601 can be set to 20:8-20:16 to distribute the cooling medium more evenly to the liquid delivery sub-channel 602 under a smaller pressure drop.

[0052] The first liquid distribution component 30 and the second liquid distribution component 60 can be combined in a splicing manner to reduce weight or accommodate the clearance requirements of the receiving cavity. During splicing, the first liquid distribution component 30 and the second liquid distribution component 60 can be joined as a single unit, and the joint can be achieved through a flat butt joint or a wedge-shaped snap-fit. The assembly and fixing methods between the first liquid distribution component 30 and the second liquid distribution component 60 can include screw fastening, cold-fit interference fitting, or welding. Using a splicing method reduces manufacturing difficulty and provides better spatial adaptability and weight reduction benefits.

[0053] The terminology used in the above embodiments is for the purpose of describing specific embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0054] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0055] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A cathode module, characterized in that, The device includes a housing, a first liquid distribution component, and a target material. The housing has a receiving cavity, the first liquid distribution component is located in the receiving cavity, the target material is fixed to the bottom of the housing, and the housing has an inlet for introducing cooling medium. The first liquid distribution component is provided with at least one liquid inlet channel, multiple diversion channels, and multiple liquid outlet channels; Each of the liquid inlet channels is connected to the liquid inlet, and the inlet of each of the diversion channels is connected to the liquid inlet channel corresponding to the diversion channel. The multiple diversion channels are used to distribute the cooling medium to different areas of the first liquid distribution component. The outlet of each of the diversion channels is connected to the inlet of at least one of the liquid outlet channels; The outlet of the liquid outlet channel is oriented towards the area to be cooled.

2. The cathode module according to claim 1, characterized in that, The outlet of each liquid outlet channel is located on the side of the first liquid distribution component away from the liquid inlet. The target material includes a first heating zone and a second heating zone. The heat generation of the first heating zone is greater than that of the second heating zone. The area to be cooled is the first heating zone of the target material.

3. The cathode module according to claim 1 or 2, characterized in that, At least a portion of the liquid outlet channel is oriented towards the thickness direction of the first liquid distribution element; Alternatively, at least a portion of the liquid outlet channel is oriented toward the center of the first liquid dispensing element; Alternatively, a portion of the liquid outlet channels are oriented towards the thickness direction of the first liquid distributor, and another portion of the liquid outlet channels are oriented towards the first rotation direction, wherein the number of liquid outlet channels oriented towards the first rotation direction is the same as the number of liquid outlet channels oriented towards the thickness direction; Alternatively, a portion of the liquid outlet channels faces a first rotation direction, while another portion faces a second rotation direction. The first and second rotation directions are different, and the number of liquid outlet channels facing the first rotation direction is the same as the number of liquid outlet channels facing the second rotation direction.

4. The cathode module according to any one of claims 1 to 3, characterized in that, At least a portion of the diversion channel includes a main diversion channel and a plurality of first diversion branches connected to the outlet of the main diversion channel. The inlet of the main diversion channel is connected to the liquid inlet channel corresponding to the main diversion channel, and the outlet of each first diversion branch is connected to the liquid outlet channel corresponding to the first diversion branch.

5. The cathode module according to claim 4, characterized in that, At least part of the diversion channel further includes a plurality of second diversion branches, the inlet of the second diversion branch being connected to the outlet of the first diversion branch corresponding to the second diversion branch, the outlet of the plurality of second diversion branches being connected to the inlet of the plurality of liquid outlet channels in a one-to-one correspondence, and at least one of the main diversion channel, the first diversion branch and the second diversion branch extending in a circumferential direction around the central axis of the first liquid distribution element.

6. The cathode module according to any one of claims 1 to 5, characterized in that, The plurality of liquid outlet channels include a plurality of first liquid outlet channels evenly distributed along a first circumferential region of the first liquid distributor, and a plurality of second liquid outlet channels evenly distributed along a second circumferential region of the first liquid distributor that is different from the first circumferential region.

7. The cathode module according to claim 6, characterized in that, The plurality of diversion channels include a first diversion channel and a second diversion channel. The first diversion channel and the second diversion channel are respectively located in the first circumferential region and the second circumferential region of the first liquid distribution component. The first diversion channel is connected to the liquid inlet channel and a plurality of first liquid outlet channels. The second diversion channel is connected to the liquid inlet channel and a plurality of second liquid outlet channels. The first diversion channel and the second diversion channel are respectively used to distribute the cooling medium to the first circumferential region and the second circumferential region of the first liquid distribution component.

8. The cathode module according to any one of claims 1 to 7, characterized in that, The inlet of the liquid outlet channel is tangent to and connected to the side wall of the corresponding diversion channel.

9. The cathode module according to claim 4, characterized in that, The width of each of the main diversion channels in the radial direction of the first diversion element is 1.5 to 3 times the width of each of the first diversion branches in the radial direction of the first diversion element.

10. The cathode module according to any one of claims 1 to 9, characterized in that, It also includes a second liquid distribution component, which is located on the side of the first liquid distribution component facing the liquid inlet. The second liquid distribution component is provided with a main liquid delivery channel and multiple liquid delivery sub-channels connected to the main liquid delivery channel. There are multiple liquid delivery channels. The main liquid delivery channel is connected to the liquid inlet, and the multiple liquid delivery sub-channels are connected to the multiple liquid delivery channels one by one.

11. A semiconductor device, characterized in that, include: The cathode module as described in any one of claims 1 to 10; The process chamber, with the cathode module located at the top of the process chamber.

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