Backlight module with DBR reflection structure

Abstract

The utility model relates to the technical field of backlight modules, in particular to a backlight module with a distributed bragg reflector (DBR) reflection structure, which comprises a substrate structure, an optical film, a light guide packaging structure and an assembly component, and the assembly component comprises an assembly frame, a baffle, two locking pieces, a flexible pad, two abutting pieces and a heat conduction structure. The substrate structure is located at the bottom of the assembly frame, the two abutting pieces are operated to abut against the two sides of the light guide packaging structure so that the optical module can be fixed in the assembly frame, then the baffle is operated to be buckled with the notch of the assembly frame, the locking piece is operated for assembly, overall assembly of the backlight module is completed, and the heat productivity of the overall backlight module is reduced in cooperation with the heat conduction structure. The problems that in the long-time use process of an existing backlight module with a DBR reflection structure, a large amount of heat can be generated by the backlight module, adhesion of all structures in the backlight module is likely to be loosened, and follow-up normal use is affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of backlight modules, in particular to a backlight module with a DBR reflection structure. Background Art

[0002] The backlight module refers to the module that realizes backlight illumination. Since the existing backlight module has a small angle when emitting light, and the illuminated area has dark areas and spots, poor uniformity, low reflectivity, and insufficient brightness, a backlight module with a DBR reflective structure will be used.

[0003] The prior art (CN213118676U) discloses a backlight module with a DBR reflective structure. The backlight module includes a light guide packaging structure, an optical film and a substrate structure. Each structure is assembled by stacking and gluing. A plurality of light-emitting chips arranged in a matrix are arranged on the surface of the substrate structure. An ITO layer circuit is arranged in the substrate structure. Grooves are arranged between adjacent light-emitting chips. A DBR reflective structure is arranged in the groove. The DBR reflective structure can increase the reflectivity of light to more than 99%, thereby reducing the occurrence of dark areas and light spots in the illumination area.

[0004] However, when the above method is used, a large amount of heat will be generated by the backlight module during long-term use, which may cause the adhesion of various structures inside the backlight module to loosen, affecting subsequent normal use. Utility Model Content

[0005] The purpose of the utility model is to provide a backlight module with a DBR reflective structure, aiming to solve the problem that the existing backlight module with a DBR reflective structure generates a large amount of heat during long-term use, which may cause the adhesion of various structures inside the backlight module to loosen, affecting subsequent normal use.

[0006] To achieve the above object, the utility model provides a backlight module with a DBR reflective structure, including a substrate structure, an optical film, a light guide packaging structure and an assembly component, wherein the optical film is located on one side of the substrate structure; the light guide packaging structure is located on one side of the optical film,

[0007] The assembly assembly comprises an assembly frame, a baffle, two locking members, a flexible pad, two abutting members and a heat conducting structure;

[0008] The assembly frame is located on one side of the substrate structure; the baffle is located on one side of the assembly frame; the two locking members are respectively arranged on both sides of the baffle; the flexible pad is fixedly connected to the assembly frame and is located on one side of the assembly frame; the two abutment members are respectively arranged on both sides of the assembly frame; the heat conducting structure is arranged on one side of the assembly frame.

[0009] Wherein, the locking member includes a locking screw and a bolt, the locking screw is rotatably connected to the baffle and is threadedly connected to the assembly frame and is located on one side of the baffle; the bolt is fixedly connected to the locking screw and is located on one side of the locking screw.

[0010] Wherein, the resistance member includes a locking screw, a hidden nut, a telescopic rod, a resistance block, a guide cylinder and a guide rod, the locking screw is rotatably connected to the assembly frame and is located on one side of the assembly frame; the hidden nut is fixedly connected to the locking screw, rotatably connected to the assembly frame, and is located on one side of the locking screw; the telescopic rod is threadedly connected to the locking screw and is located on one side of the locking screw; the resistance block is fixedly connected to the telescopic rod and is located on one side of the telescopic rod; the guide cylinder is fixedly connected to the assembly frame and is located on one side of the assembly frame; the guide rod is slidably connected to the guide cylinder, fixedly connected to the resistance block, and is located on one side of the guide cylinder.

[0011] Wherein, the heat-conducting structure includes a heat-conducting copper plate and heat-dissipating fins. The heat-conducting copper plate is fixedly connected to the assembly frame and is located on one side of the substrate structure; the heat-dissipating fins are fixedly connected to the heat-conducting copper plate and are located on one side of the heat-conducting copper plate.

[0012] Wherein, the abutment member further comprises a protective attachment, and the protective attachment is arranged on one side of the abutment block.

[0013] Wherein, the protective accessory comprises a buffer layer and a protective pad, the buffer layer is fixedly connected to the abutment block and is located on one side of the abutment block; the protective pad is fixedly connected to the buffer layer and is located on one side of the buffer layer.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. By setting the assembly frame, the baffle, the two locking members, the flexible pad, the two abutting members and the heat-conducting structure, the assembled backlight module is placed into the assembly frame, the substrate structure is located at the bottom of the assembly frame, and then the two abutting members are operated to abut against the two sides of the substrate structure so that the substrate structure, the optical film and the light-conducting packaging structure are fixed in the assembly frame, and then the baffle is operated to buckle with the notch of the assembly frame, and the two locking members are operated to assemble with the assembly frame to complete the assembly of the entire backlight module. The assembly frame and the two abutting members are fixed, and the heat generation of the entire backlight module is reduced in cooperation with the heat-conducting structure, so as to solve the problem that the existing backlight module with a DBR reflective structure will generate a lot of heat during long-term use, which may cause the adhesion of various structures inside the backlight module to loosen, affecting the subsequent normal use.

[0016] 2. By setting the locking screw and the bolt, the baffle is buckled with the assembly frame when assembling the baffle, and then the bolt is twisted to make the locking screw and the assembly frame threadedly connected to complete the assembly of the baffle, thereby making it more convenient to install the baffle.

[0017] 3. By setting the locking screw, the hidden nut, the telescopic rod, the resistance block, the guide cylinder and the guide rod, when the substrate structure, the optical film and the light guide packaging structure are assembled into the assembly frame, a tool is used to twist the hidden nut to rotate the locking screw. The rotation of the locking screw drives the telescopic rod to cooperate with the limit of the guide rod, and drives the resistance block to resist the substrate structure to complete the reinforcement of the overall backlight module assembly.

[0018] 4. By providing the thermally conductive copper plate and the heat dissipation fins, the thermally conductive copper plate is used to absorb the heat generated on the substrate structure and cooperate with the heat dissipation fins to discharge the heat, thereby reducing the overall temperature of the backlight module.

[0019] 5. By setting the buffer layer and the protective pad, when the resistance block resists the side of the substrate structure, the buffer layer provides a buffering force which cooperates with the flexible tension of the protective pad to make the resistance block softer when resisting the substrate structure, thereby preventing damage to the light guide packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0021] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model.

[0022] Figure 2 It is an overall cross-sectional view of the first embodiment of the utility model.

[0023] Figure 3 It is a cross-sectional view of the baffle and the locking member of the first embodiment of the utility model.

[0024] Figure 4 It is an overall cross-sectional view of the second embodiment of the utility model.

[0025] 101-substrate structure, 102-optical film, 103-light guide packaging structure, 104-assembly frame, 105-baffle, 106-locking piece, 107-flexible pad, 108-resistance piece, 109-heat conductive structure, 110-locking screw, 111-bolt, 112-locking screw, 113-hidden nut, 114-telescopic rod, 115-resistance block, 116-guide tube, 117-guide rod, 118-heat conductive copper plate, 119-heat sink fin, 201-protective accessories, 202-buffer layer, 203-protective pad. DETAILED DESCRIPTION

[0026] The first embodiment of the present application is:

[0027] See also Figure 1-Figure 3 ,in, Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model. Figure 2 is a sectional view of the entire first embodiment of the utility model, Figure 3 It is a cross-sectional view of the baffle and the locking member of the first embodiment of the utility model.

[0028] The utility model provides a backlight module with a DBR reflective structure: comprising a substrate structure 101, an optical film 102, a light guide packaging structure 103 and an assembly component, wherein the assembly component comprises an assembly frame 104, a baffle 105, two locking members 106, a flexible pad 107, two resisting members 108 and a heat-conducting structure 109, wherein the locking member 106 comprises a locking screw 110 and a bolt 111, the resisting member 108 comprises a locking screw 112, a hidden nut 113, a telescopic rod 114, a resisting block 115, a guide cylinder 116 and a guide rod 117, and the heat-conducting structure 109 comprises a heat-conducting copper plate 118 and a heat dissipation fin 119. The above-mentioned solution solves the problem that the existing backlight module with a DBR reflective structure generates a large amount of heat during long-term use, which may cause the adhesion of various structures inside the backlight module to loosen, thereby affecting subsequent normal use.

[0029] For this specific embodiment, the light-guiding packaging structure 103, the optical film 102 and the substrate structure 101 are stacked and assembled in sequence to form a backlight module. The surface of the substrate structure 101 is provided with a plurality of light-emitting chips arranged in a matrix. An ITO layer circuit is provided in the substrate structure 101. Grooves are provided between adjacent light-emitting chips. A DBR reflective structure is provided in the groove. The DBR reflective structure is used to increase the reflectivity of light to more than 99%, thereby reducing the occurrence of dark areas and light spots in the illuminated area. For the specific structure, refer to the patent document with publication number CN213118676U.

[0030] The assembly frame 104 is located on one side of the substrate structure 101; the baffle 105 is located on one side of the assembly frame 104; the two locking members 106 are respectively arranged on both sides of the baffle 105; the flexible pad 107 is fixedly connected to the assembly frame 104 and is located on one side of the assembly frame 104; the two abutting members 108 are respectively arranged on both sides of the assembly frame 104; the heat conducting structure 109 is arranged on one side of the assembly frame 104, the assembled backlight module is placed into the assembly frame 104, the substrate structure 101 is located at the bottom of the assembly frame 104, and then the two abutting members 108 are operated to abut against both sides of the substrate structure 101 so that the substrate structure 101, the optical film 102 and the light-guiding packaging structure 103 are fixed in the assembly frame 104, and then the baffle 105 is operated to engage with the notch of the assembly frame 104, and then the two locking members 106 are operated to assemble with the assembly frame 104 to complete the assembly of the entire backlight module. The assembly frame 104 and the two abutment members 108 are fixed, and then the heat-conducting structure 109 is used to reduce the heat generation of the entire backlight module, so as to solve the problem that the existing backlight module with a DBR reflective structure will generate a lot of heat during long-term use, which may cause the adhesion of various structures inside the backlight module to loosen, affecting the subsequent normal use.

[0031] Secondly, the locking screw 110 is rotatably connected to the baffle 105 and is threadedly connected to the assembly frame 104 and is located on one side of the baffle 105; the bolt 111 is fixedly connected to the locking screw 110 and is located on one side of the locking screw 110. When assembling the baffle 105, the baffle 105 and the assembly frame 104 are buckled together, and then the bolt 111 is twisted to make the locking screw 110 and the assembly frame 104 threadedly connected to complete the assembly of the baffle 105, thereby making it more convenient to install the baffle 105.

[0032] At the same time, the locking screw 112 is rotatably connected to the assembly frame 104 and is located on one side of the assembly frame 104; the hidden nut 113 is fixedly connected to the locking screw 112, rotatably connected to the assembly frame 104, and is located on one side of the locking screw 112; the telescopic rod 114 is threadedly connected to the locking screw 112 and is located on one side of the locking screw 112; the abutment block 115 is fixedly connected to the telescopic rod 114 and is located on one side of the telescopic rod 114; the guide cylinder 116 is fixedly connected to the assembly frame 104 and is located on the assembly frame 104. One side; the guide rod 117 is slidably connected to the guide cylinder 116, and is fixedly connected to the resistance block 115, and is located on one side of the guide cylinder 116. When the substrate structure 101, the optical film 102 and the light guide packaging structure 103 are assembled into the assembly frame 104, the hidden nut 113 is twisted with a tool to rotate the locking screw 112. The rotation of the locking screw 112 drives the telescopic rod 114 to cooperate with the limit of the guide rod 117, and drives the resistance block 115 to resist the substrate structure 101 to complete the reinforcement of the overall backlight module assembly.

[0033] In addition, the thermally conductive copper plate 118 is fixedly connected to the assembly frame 104 and is located on one side of the substrate structure 101; the heat dissipation fins 119 are fixedly connected to the thermally conductive copper plate 118 and are located on one side of the thermally conductive copper plate 118. The thermally conductive copper plate 118 is used to absorb the heat generated on the substrate structure 101 and cooperate with the heat dissipation fins 119 to discharge the heat, thereby reducing the overall temperature of the backlight module.

[0034] In the use of a backlight module with a DBR reflective structure described in this embodiment, a plurality of light-emitting chips arranged in a matrix are arranged on the surface of the substrate structure 101, an ITO layer circuit is arranged in the substrate structure 101, grooves are arranged between adjacent light-emitting chips, and a DBR reflective structure is arranged in the groove. The DBR reflective structure increases the reflectivity of light to more than 99%, thereby reducing the occurrence of dark areas and light spots in the illumination area. The light guide packaging structure 103, the optical film 102 and the substrate structure 101 are stacked and assembled in sequence to form a backlight module. The assembled backlight module is placed in the assembly frame 104, and the substrate structure 101 is located at the bottom of the assembly frame 104. The hidden nut 113 is twisted with a tool to rotate the locking screw 112. The locking screw 112 rotates. The telescopic rod 114 is driven to cooperate with the limit of the guide rod 117, and the abutment block 115 is driven to abut against the substrate structure 101 to complete the reinforcement of the overall backlight module assembly, and then the baffle 105 is operated to engage with the notch of the assembly frame 104, and the bolts 111 on both sides are twisted to make the locking screws 110 and the assembly frame 104 threadedly connected to complete the assembly of the entire backlight module. The heat generated on the substrate structure 101 is absorbed by the thermal conductive copper plate 118 and the heat is discharged by the heat dissipation fins 119 to reduce the overall temperature of the backlight module, so as to solve the problem that the existing backlight module with a DBR reflective structure will generate a large amount of heat during long-term use, which may cause the adhesion of various structures inside the backlight module to loosen, affecting the subsequent normal use.

[0035] The second embodiment of the present application is:

[0036] See also Figure 4 ,in, Figure 4 It is an overall cross-sectional view of the second embodiment of the utility model.

[0037] On the basis of the first embodiment, the utility model provides a backlight module with a DBR reflective structure, wherein the abutment 108 further includes a protective accessory 201 , and the protective accessory 201 includes a buffer layer 202 and a protective pad 203 .

[0038] The protection attachment 201 is disposed on one side of the abutment block 115 , and the protection attachment 201 is used to make the abutment block 115 more gentle when abutting against the substrate structure 101 , thereby preventing the light guide packaging structure 103 from being damaged.

[0039] Secondly, the buffer layer 202 is fixedly connected to the resistance block 115 and is located on one side of the resistance block 115; the protection pad 203 is fixedly connected to the buffer layer 202 and is located on one side of the buffer layer 202. When the resistance block 115 resists the side of the substrate structure 101, the buffer layer 202 provides a buffering force that cooperates with the flexible tension of the protection pad 203 to make the resistance block 115 softer when resisting the substrate structure 101, thereby preventing damage to the light-guiding packaging structure 103.

[0040] When using a backlight module with a DBR reflective structure described in this embodiment, when the resistance block 115 resists the side of the substrate structure 101, the buffer layer 202 provides a buffering force that cooperates with the flexible tension of the protection pad 203 to make the resistance block 115 softer when resisting the substrate structure 101, thereby preventing damage to the light guide packaging structure 103.

[0041] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A backlight module with a DBR reflective structure, comprising a substrate structure, an optical film and a light guide packaging structure, wherein the optical film is located on one side of the substrate structure; the light guide packaging structure is located on one side of the optical film; characterized in that: Also included are assembly components; The assembly assembly comprises an assembly frame, a baffle, two locking members, a flexible pad, two abutting members and a heat conducting structure; The assembly frame is located on one side of the substrate structure; the baffle is located on one side of the assembly frame; the two locking members are respectively arranged on both sides of the baffle; the flexible pad is fixedly connected to the assembly frame and is located on one side of the assembly frame; the two abutment members are respectively arranged on both sides of the assembly frame; the heat conducting structure is arranged on one side of the assembly frame.

2. A backlight module with a DBR reflective structure as claimed in claim 1, characterized in that: The locking member includes a locking screw and a bolt. The locking screw is rotatably connected to the baffle and is threadedly connected to the assembly frame and is located on one side of the baffle. The bolt is fixedly connected to the locking screw and is located on one side of the locking screw.

3. A backlight module with a DBR reflective structure as claimed in claim 2, characterized in that: The resistance member includes a locking screw, a hidden nut, a telescopic rod, a resistance block, a guide cylinder and a guide rod, wherein the locking screw is rotatably connected to the assembly frame and is located on one side of the assembly frame; the hidden nut is fixedly connected to the locking screw, rotatably connected to the assembly frame and is located on one side of the locking screw; the telescopic rod is threadedly connected to the locking screw and is located on one side of the locking screw; the resistance block is fixedly connected to the telescopic rod and is located on one side of the telescopic rod; the guide cylinder is fixedly connected to the assembly frame and is located on one side of the assembly frame; the guide rod is slidably connected to the guide cylinder, fixedly connected to the resistance block and is located on one side of the guide cylinder.

4. A backlight module with a DBR reflective structure as claimed in claim 3, characterized in that: The heat-conducting structure comprises a heat-conducting copper plate and heat-dissipating fins. The heat-conducting copper plate is fixedly connected to the assembly frame and is located on one side of the substrate structure; the heat-dissipating fins are fixedly connected to the heat-conducting copper plate and are located on one side of the heat-conducting copper plate.

5. A backlight module with a DBR reflective structure as claimed in claim 4, characterized in that: The abutment member further comprises a protective attachment, and the protective attachment is arranged on one side of the abutment block.

6. A backlight module with a DBR reflective structure as claimed in claim 5, characterized in that: The protective accessory comprises a buffer layer and a protective pad. The buffer layer is fixedly connected to the abutment block and is located at one side of the abutment block; the protective pad is fixedly connected to the buffer layer and is located at one side of the buffer layer.

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