Bonding clamp for vacuum low-temperature bonding

Abstract

The utility model discloses a bonding clamp for vacuum low-temperature bonding, which belongs to the technical field of bonding clamps, can ensure that an upper clamp can stably cover the top of a lower clamp, can ensure that the upper clamp is stably covered together during working, and can ensure that the lower clamp and the upper clamp can be stably tensioned after the lower clamp and the upper clamp are covered. And the subsequent bonding work can be smoothly carried out. The bonding clamp for vacuum low-temperature bonding comprises a mounting frame, a vertical plate is vertically fixed to one end of the top of the mounting frame, a clamp body is mounted at the top of the mounting frame and comprises a lower clamp, a containing cavity is formed in the lower clamp, and a supporting disc is slidably arranged in the containing cavity; an upper clamp is hinged to the end, close to the vertical plate, of the lower clamp through a hinge, a lifting cavity is vertically formed in the side edge, facing the upper clamp, of the vertical plate, and a supporting assembly is installed in the lifting cavity; the supporting assembly comprises a lead screw, the lead screw is sleeved with a sliding block, and a supporting rod is hinged between the sliding block and the upper clamp.

Description

Technical Field

[0001] The utility model belongs to the technical field of bonding clamps, and in particular relates to a bonding clamp for vacuum low-temperature bonding. Background Art

[0002] Bonding temperature is the most important indicator of wafer bonding technology. High-temperature bonding technology is not suitable for bonding devices containing temperature-sensitive materials. Therefore, it is of great significance to reduce the bonding temperature to achieve low-temperature wafer bonding. Surface plasma activation technology can generate dangling bonds on the wafer surface, achieve surface activity, and then achieve low-temperature wafer bonding. Wafer bonding technology is one of the basic technologies for microsystem packaging and has become an important tool in the field of micro-electromechanical systems. Wafer bonding technology has a wide range of applications in wafer-level packaging, three-dimensional chip stacking, and silicon-on-insulator technology. As bonding technology develops towards low cost, high performance, high integration, small size, and low power consumption, it has entered the era of three-dimensional stacking from the original two-dimensional packaging. The high integration of devices and circuits has put forward higher requirements for wafer bonding technology. During the low-temperature bonding process, the activation of the wafer surface bond and the bonding must be completed in the same vacuum environment.

[0003] The existing vacuum low-temperature bonding fixture cannot ensure that the fixture can be stably clamped together during the bonding operation. When gaps appear at the fixture connection during operation, it is easy to cause the bonding to fail to effectively alleviate the demand. Therefore, a vacuum low-temperature bonding fixture is needed to assist in solving this problem. Utility Model Content

[0004] (1) Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a bonding fixture for vacuum and low-temperature bonding, which can ensure that the upper fixture can stably cover the top of the lower fixture, can ensure that the upper fixture is stably covered together during work, and can ensure that the lower fixture and the upper fixture can be stably tightened after the lower fixture and the upper fixture are covered, thereby ensuring that subsequent bonding work proceeds smoothly.

[0006] (2) Technical solution

[0007] In order to solve the above technical problems, the utility model provides a bonding fixture for vacuum low-temperature bonding, which comprises a mounting frame, a vertical plate is vertically fixed at one end of the top of the mounting frame, a fixture body is installed at the top of the mounting frame, the fixture body comprises a lower fixture fixed at the top of the mounting frame, a receiving cavity is arranged inside the lower fixture, a support plate is slidably arranged in the receiving cavity, an upper fixture is hingedly installed at one end of the lower fixture close to the vertical plate through a hinge, a lifting cavity is vertically opened on one side of the vertical plate facing the upper fixture, and a support assembly is installed in the lifting cavity;

[0008] The support assembly includes a screw rod that is vertically rotated and arranged in a lifting chamber, a sliding block is mounted on the screw rod, the sliding block and the screw rod are threadedly matched, a support rod is hingedly installed between the sliding block and the upper clamp, and a support motor that assists the rotation of the screw rod is installed at the top of the vertical plate.

[0009] Furthermore, a fixing assembly for auxiliary tightening is installed at the middle section of the outer side edge of the lower clamp, and a fixing block for tightening in cooperation with the fixing assembly is installed at the middle section of the outer side edge of the support plate.

[0010] Furthermore, the fixing assembly includes an articulated seat fixed on the lower clamp, a hinged plate is hingedly installed on the articulated seat, a pull ring is hingedly installed at the top of the articulated plate, and the fixing block and the pull ring are engaged with each other.

[0011] Furthermore, an adsorption chamber is provided at the top of the upper clamp, a vacuum hole is provided on one side of the adsorption chamber, adsorption plates are installed in the adsorption chamber and at the top of the support plate, a conduit is connected to the bottom of the adsorption plate, and adsorption pumps for assisting the adsorption plate in adsorption are installed in the lower clamp and the upper clamp.

[0012] Furthermore, a limiting block is symmetrically fixed on the outer side of the support plate, and a limiting groove is vertically provided in the accommodating cavity of the lower clamp, and the limiting groove is plugged in with the limiting block.

[0013] Furthermore, a hydraulic rod is installed at the center of the bottom of the lower clamp to assist the support plate to lift up, a fixed rod is vertically fixed at the bottom of the lower clamp, a sliding cavity is opened on the support plate for the fixed rod to slide, and a support spring is installed in the sliding cavity to assist the fixed rod to push.

[0014] Furthermore, a sealing gasket is embedded and installed on one side edge adjacent to the lower clamp and the upper clamp, and an inclined rod is obliquely fixed between the mounting frame and the vertical plate.

[0015] (3) Beneficial effects

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The utility model cooperates between the lower clamp and the upper clamp and the support assembly by hinge-hinged installation, starts the support motor, and the support motor drives the screw rod to rotate as a whole. The screw rod cooperates with the sliding block, so that the sliding block moves downward as a whole. In the process of the sliding block moving downward, the support rod moves downward as a whole, so that the upper clamp is assisted to push the upper clamp through the support rod to ensure that the upper clamp can stably cover the top of the lower clamp, and the pull ring is clamped and installed on the fixing block, and the hinge plate is pressed downward. The hinge plate drives the pull ring to pull, so that the pull ring pulls the fixing block to ensure that the upper clamp can stably cover the top of the lower clamp. It can ensure that the upper clamp is stably covered together during work, and the cooperation between the fixing assembly and the fixing block can ensure that the lower clamp and the upper clamp can be stably tightened after the lower clamp and the upper clamp are covered, so as to ensure that the subsequent bonding work can be carried out smoothly.

[0018] The utility model can ensure that the upper wafer plate and the lower wafer plate will not move after installation through the coordination between the adsorption plate, the conduit and the adsorption pump, and the like, and ensure that the upper wafer plate and the lower wafer plate can be stably bonded subsequently. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is a longitudinal sectional view of the lower clamp of the utility model;

[0022] Figure 3 For this utility model Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0023] Figure 4 For this utility model Figure 1 Schematic diagram of the enlarged structure at point B in the middle.

[0024] The markings in the attached drawings are: 1. mounting frame; 2. vertical plate; 3. oblique rod; 4. clamp body; 5. lower clamp; 51. limit groove; 52. sealing gasket; 6. support plate; 61. limit block; 62. hydraulic rod; 63. fixing rod; 64. supporting spring; 7. upper clamp; 8. adsorption plate; 81. conduit; 82. adsorption pump; 9. vacuum hole; 10. fixing assembly; 101. fixing block; 11. hinge seat; 12. hinge plate; 13. pull ring; 14. supporting assembly; 15. supporting motor; 16. sliding block; 17. screw rod; 18. support rod. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] This specific embodiment is a bonding fixture for vacuum low temperature bonding, such as Figure 1 As shown, the bonding fixture for vacuum low-temperature bonding includes a mounting frame 1, a vertical plate 2 is vertically fixed at one end of the top of the mounting frame 1, and an inclined rod 3 is obliquely fixed between the mounting frame 1 and the vertical plate 2. By setting the inclined rod 3, the overall strength of the vertical plate 2 can be improved and bending of the vertical plate 2 can be avoided as much as possible.

[0027] Reference Figure 1 and Figure 2 As shown, a clamp body 4 is installed at the top of the mounting frame 1, and the clamp body 4 includes a lower clamp 5 fixed at the top of the mounting frame 1, a accommodating cavity is arranged inside the lower clamp 5, a support plate 6 is slidably arranged in the accommodating cavity, an upper clamp 7 is hingedly installed at one end of the lower clamp 5 close to the vertical plate 2 through a hinge, an adsorption cavity is opened at the top of the upper clamp 7, a vacuum hole 9 is opened on one side of the adsorption cavity, and the vacuum hole 9 can be connected to the vacuum pump through a pipeline, an adsorption plate 8 is installed in the adsorption cavity and at the top of the support plate 6, and a conduit 81 is connected to the bottom of the adsorption plate 8, and an adsorption pump 82 for assisting the adsorption plate 8 in adsorption is installed in the lower clamp 5 and the upper clamp 7.

[0028] By setting the adsorption plate 8 and the coordination between the conduit 81 and the adsorption pump 82, it can be ensured that the upper wafer plate and the lower wafer plate will not move after installation, and the upper wafer plate and the lower wafer plate can be stably bonded subsequently.

[0029] A limiting block 61 is symmetrically fixed on the outer side of the support plate 6, and a limiting groove 51 is vertically provided in the accommodating cavity of the lower clamp 5. The limiting groove 51 and the limiting block 61 are plugged in and matched with each other. Through the cooperation between the setting of the limiting block 61 and the limiting groove 51, it can be ensured that the support plate 6 can move up and down stably during the working process, and it is avoided as much as possible that the support plate 6 is stuck and misaligned during the up and down movement.

[0030] A hydraulic rod 62 is installed at the bottom center of the lower clamp 5 to support the auxiliary support plate 6, and a fixing rod 63 is vertically fixed at the bottom of the lower clamp 5. A sliding cavity is opened on the support plate 6 for the fixing rod 63 to slide, and a supporting spring 64 is installed in the sliding cavity to be pushed by the auxiliary fixing rod 63. Through the cooperation between the set supporting spring 64 and the fixing rod 63, it can be ensured that the support plate 6 is uniformly stressed at various positions when it is propped up during operation, and the misalignment of the support plate 6 when it is raised can be avoided as much as possible.

[0031] Reference Figure 1 and Figure 3 As shown, a fixing assembly 10 for auxiliary tightening is installed at the middle section of the outer side edge of the lower clamp 5, and a fixing block 101 for tightening in cooperation with the fixing assembly 10 is installed at the middle section of the outer side edge of the support plate 6. The fixing assembly 10 includes a hinge seat 11 fixed on the lower clamp 5, a hinge plate 12 is hingedly installed on the hinge seat 11, a pull ring 13 is hingedly installed at the top of the hinge plate 12, and the fixing block 101 and the pull ring 13 are engaged and clamped.

[0032] By cooperating between the fixing assembly 10 and the fixing block 101, it can be ensured that the lower clamp 5 and the upper clamp 7 can be stably tightened after the lower clamp 5 and the upper clamp 7 are covered, thereby ensuring that the subsequent bonding work proceeds smoothly.

[0033] A sealing gasket 52 is embedded and installed on one side of the lower clamp 5 and the upper clamp 7. The sealing gasket 52 can ensure the overall sealing of the connection after the lower clamp 5 and the upper clamp 7 are stably tightened, ensuring mixing during subsequent work.

[0034] Reference Figure 1 and Figure 4 As shown, a lifting cavity is vertically opened on one side of the vertical plate 2 facing the upper clamp 7, and a support assembly 14 is installed in the lifting cavity. The support assembly 14 includes a screw rod 17 which is vertically rotated and arranged in the lifting cavity. A sliding block 16 is sleeved and installed on the screw rod 17. The sliding block 16 and the screw rod 17 are threadedly matched. A support rod 18 is hingedly installed between the sliding block 16 and the upper clamp 7. A support motor 15 for assisting the rotation of the screw rod 17 is installed at the top of the vertical plate 2.

[0035] By the cooperation between the lower clamp 5 and the upper clamp 7 and the support assembly 14 which are hingedly installed, the support motor 15 is started, and the support motor 15 drives the screw rod 17 to rotate as a whole. The screw rod 17 and the sliding block 16 are threadedly cooperated, so that the sliding block 16 moves downward as a whole. In the process of the sliding block 16 moving downward, the support rod 18 is driven to move downward as a whole, so that the upper clamp 7 is assisted in pushing by the support rod 18 to ensure that the upper clamp 7 can stably cover the top of the lower clamp 5.

[0036] Working principle:

[0037] During operation, the upper wafer disk is placed in the adsorption chamber of the upper clamp 7, and the adsorption pump 82 is started. The adsorption pump 82 drives the conduit 81 to evacuate the air as a whole, thereby performing auxiliary adsorption treatment on the upper wafer disk, and the lower wafer disk is placed on the top of the support plate 6 and adsorbed in the same way as above, and the support motor 15 is started. The support motor 15 drives the screw rod 17 to rotate as a whole, and the screw rod 17 and the sliding block 16 are threadedly matched, so that the sliding block 16 moves downward as a whole, and in the process of the sliding block 16 moving downward, the support rod 18 is driven to move downward as a whole, so that the upper clamp 7 is assisted to be pushed by the support rod 18 to ensure that the upper clamp 7 can stably cover the top of the lower clamp 5, and the pull ring 13 is clamped and installed on the fixed block 101, and the hinge plate 12 is pressed downward. The hinge plate 12 drives the pull ring 13 to pull, so that the pull ring 13 pulls the fixed block 101, and it is ensured that the upper clamp 7 can stably cover the top of the lower clamp 5.

[0038] During operation, the inside of the clamp body 4 is evacuated through the vacuum hole 9, and the hydraulic rod 62 is started. The hydraulic rod 62 drives the support plate 6 to rise as a whole, and during the rising process of the support plate 6, the fixed rod 63 compresses the support spring 64, so that the lower wafer plate on the support plate 6 and the upper wafer plate on the upper clamp 7 are bonded, thereby completing the low-temperature bonding process.

[0039] All technical features in this embodiment can be freely combined according to actual needs.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A bonding fixture for vacuum low temperature bonding, the bonding fixture for vacuum low temperature bonding comprising a mounting frame (1), characterized in that: A vertical plate (2) is vertically fixed to one end of the top of the mounting frame (1), a fixture body (4) is installed at the top of the mounting frame (1), the fixture body (4) comprises a lower fixture (5) fixed to the top of the mounting frame (1), a receiving cavity is arranged inside the lower fixture (5), a support plate (6) is slidably arranged in the receiving cavity, an upper fixture (7) is hingedly mounted on one end of the lower fixture (5) close to the vertical plate (2) through a hinge, a lifting cavity is vertically opened on one side of the vertical plate (2) facing the upper fixture (7), a support assembly (14) is installed in the lifting cavity; The support assembly (14) comprises a screw rod (17) which is vertically rotatably arranged in the lifting chamber, a sliding block (16) is sleeved and mounted on the screw rod (17), the sliding block (16) and the screw rod (17) are threadedly matched, a support rod (18) is hingedly mounted between the sliding block (16) and the upper clamp (7), and a support motor (15) which assists the screw rod (17) in rotating is installed at the top of the vertical plate (2).

2. A vacuum low temperature bonding fixture according to claim 1, characterized in that: A fixing assembly (10) for auxiliary tightening is installed at the middle section of the outer side edge of the lower clamp (5), and a fixing block (101) for tightening in cooperation with the fixing assembly (10) is installed at the middle section of the outer side edge of the support plate (6).

3. A vacuum low temperature bonding bonding fixture according to claim 2, characterized in that: The fixing assembly (10) comprises an articulated seat (11) fixed on the lower clamp (5), a hinged plate (12) being hingedly mounted on the articulated seat (11), a pull ring (13) being hingedly mounted at the top of the articulated plate (12), and the fixing block (101) and the pull ring (13) being engaged and snap-fitted.

4. The bonding fixture for vacuum low temperature bonding according to claim 1, characterized in that: An adsorption chamber is provided at the top of the upper clamp (7), a vacuum hole (9) is provided on one side of the adsorption chamber, an adsorption plate (8) is installed in the adsorption chamber and at the top of the support plate (6), a conduit (81) is connected to the bottom of the adsorption plate (8), and an adsorption pump (82) for assisting the adsorption plate (8) in adsorption is installed in the lower clamp (5) and the upper clamp (7).

5. The bonding fixture for vacuum low temperature bonding according to claim 1, characterized in that: A limiting block (61) is symmetrically fixed on the outer side of the support plate (6), and a limiting groove (51) is vertically provided in the accommodating cavity of the lower clamp (5), and the limiting groove (51) is plugged in with the limiting block (61).

6. The bonding fixture for vacuum low temperature bonding according to claim 5, characterized in that: A hydraulic rod (62) is installed at the center of the bottom of the lower clamp (5) to support the auxiliary support plate (6), and a fixing rod (63) is vertically fixed at the bottom of the lower clamp (5). A sliding cavity for sliding the fixing rod (63) is opened on the support plate (6), and a supporting spring (64) is installed in the sliding cavity to be pushed by the auxiliary fixing rod (63).

7. The bonding fixture for vacuum low temperature bonding according to claim 1, characterized in that: A sealing pad (52) is embedded and installed on one side edge adjacent to the lower clamp (5) and the upper clamp (7), and an inclined rod (3) is obliquely fixed between the mounting frame (1) and the vertical plate (2).

Images