Semiconductor process equipment

Abstract

The utility model discloses semiconductor process equipment which comprises a cavity, a gas uniformizing part, a rotating motor, a transmission assembly and a plurality of lifting assemblies, the lifting assemblies are distributed in the circumferential direction of the cavity at intervals, the lifting assemblies are connected with the gas uniformizing part, and the gas uniformizing part is connected with the rotating motor. And each lifting assembly is in transmission connection with the rotating motor through the transmission assembly, so that the rotating motor drives each lifting assembly through the transmission assembly to drive the gas uniformizing piece to do lifting motion relative to the cavity. According to the semiconductor process equipment, the problem that the gas uniformizing piece in the current semiconductor process equipment is easy to incline in the lifting process, so that the normal process is unfavorably influenced can be solved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a semiconductor process equipment. Background Art

[0002] In the semiconductor processing, atomic layer deposition is a commonly used processing technology. Due to the relatively slow deposition rate of this process, the development speed of multi-chip chambers is relatively fast in order to increase production capacity. The volume of the multi-chip chamber is relatively large, and the number of wafers that can be processed simultaneously is relatively large. Accordingly, in order to ensure that the air intake volume and air intake efficiency meet the requirements, the size and weight of the gas uniformity parts equipped in the multi-chip chamber are also relatively large, which requires the use of corresponding drive equipment when maintaining the chamber.

[0003] At present, multiple linear motors are usually arranged around the gas leveler, and a push rod is used to connect the motor and the gas leveler, so that when the gas leveler needs to be opened, the multiple linear motors work together to lift the gas leveler to the corresponding position above the cavity. However, since the multiple linear motors are independent of each other, it is impossible to accurately ensure the synchronous operation of the multiple linear motors during the control process, which can easily cause the gas leveler to tilt during the lifting process, resulting in damage to the structure of the gas leveler, thereby adversely affecting the normal progress of the process. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a semiconductor process equipment to solve the problem that the gas leveling parts in the current semiconductor process equipment are prone to tilting during the lifting process, thereby causing adverse effects on the normal progress of the process.

[0005] The embodiment of the present application discloses a semiconductor process equipment, which includes a chamber, a gas homogenizing member, a rotating motor, a transmission assembly and a lifting assembly, wherein:

[0006] There are multiple lifting assemblies, and the multiple lifting assemblies are distributed at intervals along the circumference of the cavity. Each lifting assembly is connected to the gas uniformizing member, and each lifting assembly is connected to the rotating motor through the transmission assembly, so that the rotating motor drives each lifting assembly through the transmission assembly to drive the gas uniformizing member to perform lifting and lowering movements relative to the cavity.

[0007] The embodiment of the present application discloses a semiconductor process equipment, wherein a plurality of lifting components are connected to a rotating motor through a transmission component, and the transmission component can transmit the driving action of the rotating motor to the lifting component, so that the lifting component can perform linear motion when the rotating motor is working. At the same time, each lifting component is connected to a uniform gas piece, so that a plurality of lifting components can synchronously drive the entire uniform gas piece to perform lifting motion relative to the cavity under the drive of the same rotating motor, which can ensure that the action consistency of each lifting component is relatively high, and prevent the uniform gas piece from tilting when moving relative to the cavity, thereby preventing the structure of the uniform gas piece from being damaged, and ensuring that the process can proceed normally. In addition, a plurality of lifting components are distributed at intervals along the circumference of the cavity, which can improve the driving stability and uniformity of the uniform gas piece, thereby further improving the straightness of the uniform gas piece when being driven. In addition, in the semiconductor process equipment disclosed in the embodiment of the present application, the rotary motion of the rotating motor can be converted into linear motion by using a transmission component and / or a lifting component, so that the driven accuracy and stability of the uniform gas piece are relatively high, which can further improve the action stability of the uniform gas piece and maximize the prevention of tilting of the uniform gas piece during the lifting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0009] Figure 1 A schematic diagram of a state of a semiconductor process equipment disclosed in an embodiment of the present application;

[0010] Figure 2 A schematic diagram of another state of the semiconductor process equipment disclosed in the embodiment of the present application;

[0011] Figure 3 It is a schematic diagram of the assembly between the rotating motor and the lifting assembly in the semiconductor process equipment disclosed in the embodiment of the present application;

[0012] Figure 4 It is a schematic diagram of the assembly between the transmission component and the lifting component in the semiconductor process equipment disclosed in the embodiment of the present application;

[0013] Figure 5 This is a schematic diagram of the structure of a nut in a semiconductor process equipment disclosed in an embodiment of the present application;

[0014] Figure 6 A cross-sectional schematic diagram of a lifting assembly in a semiconductor process equipment disclosed in an embodiment of the present application;

[0015] Figure 7-Figure 9 It is an enlarged schematic diagram of the lifting assembly and the gas uniforming member in the semiconductor process equipment disclosed in the embodiment of the present application in different states.

[0016] Reference numerals:

[0017] 110- cavity, 120- support plate, 130- stand, 140- bracket,

[0018] 210-gas equalizing part, 220-air inlet part, 230-support seat,

[0019] 310-rotating motor, 320-dual-axis output device,

[0020] 400-transmission assembly, 410-worm gear, 420-worm, 430-universal coupling, 440-transmission shaft,

[0021] 500-lifting assembly, 510-screw, 520-nut, 521-step surface, 530-lifting rod,

[0022] 610-photoelectric sensor, 620-shielding member, 630-first detection unit, 640-second detection unit,

[0023] 700-heater,

[0024] 800 - Linear bearings. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0026] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0027] like Figure 1-Figure 9As shown, an embodiment of the present application discloses a semiconductor process equipment, which includes a chamber 110, a gas uniforming member 210, a rotating motor 310, a transmission assembly 400 and a lifting assembly 500. Of course, the semiconductor process equipment may also include other components such as an air inlet member 220 and a heater 700. Considering the simplicity of the text, they will not be introduced in detail here.

[0028] Among them, the cavity 110 is the main structure of the semiconductor process equipment, which is usually formed of a material with relatively high structural strength such as metal, and the top of the cavity 110 is usually provided with an opening, which is used to cooperate with the structure such as the gas leveling member 210, so that the cavity 110 and the gas leveling member 210 can enclose a process chamber, and the process chamber can provide a process environment for the semiconductor workpiece to be processed. The above-mentioned heater 700 can be provided in the cavity 110, and the semiconductor workpiece to be processed can be carried on the heater 700 and heated by the heater 700; accordingly, the air inlet 220 can be connected with the gas leveling member 210, so that the process gas can be transported to the gas leveling member 210 through the air inlet 220, and through the uniform flow effect of the gas leveling member 210, the process gas can be relatively evenly transported to various areas in the process chamber and act on the semiconductor workpiece to be processed. During the deposition process of the semiconductor process equipment, the gas leveling member 210 is supported on the top of the cavity 110, and a sealed connection is formed between the two; when the semiconductor process equipment needs to be maintained, the gas leveling member 210 needs to be lifted above the top of the cavity 110 to expose the internal space of the cavity 110. In the embodiment of the present application, the rotating motor 310, the transmission assembly 400 and the lifting assembly 500 can enable the gas leveling member 210 to move up and down relative to the cavity 110.

[0029] Among them, the rotating motor 310, as the driving source of the gas leveling member 210, can be connected to the cavity 110. For example, the rotating motor 310 can be installed in the cavity 110. In other embodiments of the present application, in order to prevent the rotating motor 310 from interfering with the process environment in the cavity 110, the rotating motor 310 can be installed outside the cavity 110. Specifically, the rotating motor 310 can be connected to the cavity 110 by connecting members such as bolts to form a reliable assembly relationship with the cavity 110, so as to ensure that the power provided by the rotating motor 310 can act on the gas leveling member 210, so that the gas leveling member 210 moves relative to the cavity 110. In addition, in the embodiment of the present application, by equipping the rotating motor 310 with a transmission assembly 400, the rotational driving action of the rotating motor 310 can be transmitted and act on the lifting assembly 500, so as to drive the gas leveling member 210 to perform a linear lifting movement relative to the cavity 110.

[0030] In order to ensure that the lifting stability of the gas leveling member 210 is relatively good, in the embodiment of the present application, the number of lifting components 500 is multiple, specifically two, three or more, and by making the multiple lifting components 500 distributed at intervals along the circumference of the cavity 110, it can be ensured that the connection positions of each lifting component 500 and the gas leveling member 210 are relatively dispersed, so that the overall driven effect of the gas leveling member 210 is relatively good. More specifically, the multiple lifting components 500 can be evenly distributed along the circumference of the cavity 110, that is, the angles between any two adjacent lifting components 500 in the axial direction around the cavity 110 are equal, thereby further improving the driven stability of the gas leveling member 210.

[0031] During the process of assembling the lifting components 500, each lifting component 500 can be fixedly connected to the gas leveling member 210, or at least a portion of each lifting component 500 can be supported below the gas leveling member 210, so that when each lifting component 500 is driven by the rotating motor 310 to perform a lifting action relative to the cavity 110, it is ensured that each lifting component 500 can support the gas leveling member 210 and drive the gas leveling member 210 to perform a lifting motion relative to the cavity 110. Accordingly, each lifting component 500 also needs to be connected to the rotating motor 310 through the transmission component 400, so as to utilize the transmission capacity of the transmission component 400, so that the rotation of the rotating motor 310 can be used as a power source to drive the lifting component 500 to perform a linear motion, and then the rotating motor 310 can drive each lifting component 500 through the transmission component 400 to drive the gas leveling member 210 to perform a lifting motion relative to the cavity 110.

[0032] Among them, one of the transmission assembly 400 and the lifting assembly 500 may include a mechanism for converting a rotational motion into a linear motion. For example, in a specific embodiment of the present application, the transmission assembly 400 may include the aforementioned mechanism, and the lifting assembly 500 may not include a mechanism for converting a rotational motion into a linear motion. Specifically, the transmission assembly 400 may include a gear and a rack that mesh with each other. By connecting the gear to the rotating motor 310, the rotating motor 310 can drive the gear to rotate and drive the rack to move linearly. Accordingly, by designing the layout position of the rotating motor 310, or by adding a bevel gear set, etc., it is ensured that the rack can extend along the axial direction of the cavity 110 regardless of whether the axial direction of the rotating shaft of the rotating motor 310 is parallel, vertical or relatively inclined to the axial direction of the cavity 110, and then by forming a corresponding assembly relationship between the rack and the lifting assembly 500, it is ensured that the rotating motor 310 can drive the lifting assembly 500 to move up and down through the transmission assembly 400. It should be noted that the direction of the aforementioned lifting movement is the axial direction of the cavity 110.

[0033] In this case, the lifting assembly 500 may only include rod-type structural components, and the rod-type structural components may be formed of materials with relatively high structural strength such as metal, so that the rod-type structural components can be used as devices for directly lifting the air homogenizing member 210, thereby ensuring that the lifting assembly 500 has reliable structural stability.

[0034] The embodiment of the present application discloses a semiconductor process equipment, wherein a plurality of lifting assemblies 500 are all connected to the rotating motor 310 through the transmission assembly 400, and the transmission assembly 400 can transmit the driving action of the rotating motor 310 to the lifting assemblies 500, and then when the rotating motor 310 is working, the lifting assemblies 500 can move in a straight line. At the same time, each lifting assembly 500 is connected to the gas leveling member 210, so that the plurality of lifting assemblies 500 can synchronously drive the entire gas leveling member 210 to move relative to the cavity 110 under the drive of the same rotating motor 310. This can ensure that the movement consistency of each lifting assembly 500 is relatively high, and prevent the gas leveling member 210 from tilting when moving relative to the cavity 110, thereby preventing the structure of the gas leveling member 210 from being damaged, and ensuring that the process can proceed normally. In addition, the plurality of lifting assemblies 500 are distributed at intervals along the circumference of the cavity 110, which can improve the driving stability and uniformity of the gas leveling member 210, thereby further improving the straightness of the gas leveling member 210 when being driven. In addition, in the semiconductor process equipment disclosed in the embodiment of the present application, the rotational motion of the rotating motor 310 can be converted into linear motion by using the transmission assembly 400 and / or the lifting assembly 500, so that the driven accuracy and stability of the gas leveling member 210 are relatively high, which can further improve the movement stability of the gas leveling member 210 and maximize the prevention of tilting of the gas leveling member 210 during the lifting process.

[0035] As described above, the lifting assembly 500 may include a rod-like structure, and the rod-like structure directly drives the gas-leveling member 210 to perform lifting motion relative to the cavity 110 under the action of the transmission assembly 400. In another embodiment of the present application, each lifting assembly 500 includes a screw 510 and a nut 520 connected by a thread, and one of the screw 510 and the nut 520 is connected to the transmission assembly 400, and the other cooperates with the gas-leveling member 210, which can further improve the driving stability of the lifting assembly 500. Specifically, the screw 510 can form a rotational cooperation relationship with the gas-leveling member 210 through a bearing or other device. In this case, the nut 520 can be connected to the transmission assembly 400, so that when the rotating motor 310 is working, the rotating motor 310 can drive the nut 520 to rotate through the transmission assembly 400. Of course, in this embodiment, the transmission assembly 400 is specifically used to convert the rotational motion into a rotational motion. For this purpose, the transmission assembly 400 may include a gear set, or the transmission assembly 400 may also include a belt drive assembly or a chain drive assembly.

[0036] In order to reduce the difficulty of assembly between the lifting component 500 and the gas uniforming member 210, and further improve the driven stability of the gas uniforming member 210, in the present embodiment, each lifting component 500 may also include a lifting rod 530, and the lifting rod 530 and the nut 520 are relatively fixed in the axial direction of the cavity 110, and the lifting rod 530 can be sleeved outside the lead screw 510. By making the lifting rod 530 cooperate with the gas uniforming member 210, and making the lead screw 510 connected to the transmission component 400 for transmission, the lifting rod 530 can convert the rotational motion of the lead screw 510 into the linear motion of the lifting rod 530 under the action of the nut 520, which can also make the lifting stability of the lifting rod 530 relatively higher.

[0037] Specifically, the lifting rod 530 and the nut 520 can be fixedly connected by welding or the like, or the lifting rod 530 and the nut 520 can be relatively fixedly connected in the axial direction of the cavity 110 by a connecting piece. Figure 6 As shown, an external thread can be provided outside the nut 520, and an internal thread can be provided on the lifting rod 530, so that the nut 520 and the lifting rod 530 can form a fixed connection relationship through threaded connection, and ensure that the connection stability between the two is relatively high, thereby enabling the lifting rod 530 and the nut 520 to form a relatively stable fixed relationship in the above-mentioned axial direction.

[0038] When the lifting rod 530 and the nut 520 are connected to each other in the direction of threaded connection, in order to ensure that the verticality of the lifting rod 530 is relatively high, such as Figure 5 and Figure 6 As shown, the outer surface of the nut 520 is provided with a step surface 521, and in the above-mentioned axial direction, the lifting rod 530 is supported and limited on the step surface 521. In this case, by making the step surface 521 and the axial direction of the cavity 110 perpendicular to each other, it can be ensured that the axial direction of the lifting rod 530 is parallel to the axial direction of the cavity 110, thereby ensuring that the lifting rod 530 can provide a relatively collimated lifting driving action for the gas-leveling member 210. Specifically, the end face of the lifting rod 530 close to the nut 520 can be directly abutted and limited on the step surface 521, or a step surface corresponding to the step surface 521 on the nut 520 can be provided on the inner wall of the lifting rod 530, so that the step surface of the lifting rod 530 and the step surface 521 of the nut 520 are mutually connected, so as to further improve the limiting stability between the lifting rod 530 and the nut 520, and can improve the reliability of the fixed relationship between the two.

[0039] As described above, the lifting rod 530 cooperates with the gas leveling member 210. Optionally, the lifting rod 530 and the gas leveling member 210 are fixedly connected by welding or threaded connection, and the lifting rod 530 is fixedly connected to the bottom surface of the gas leveling member 210, that is, the side surface of the gas leveling member 210 facing the cavity 110, so that the lifting rod 530 can form a mutually coordinated relationship with the gas leveling member 210. In another embodiment of the present application, Figure 7-Figure 9 As shown, combined with Figure 1 and Figure 2 , the semiconductor process equipment also includes a support seat 230, and the gas leveling member 210 is provided with a through hole, the support seat 230 is fixedly installed on the side of the gas leveling member 210 away from the cavity 110, and the support seat 230 is arranged opposite to the through hole, so that the lifting rod 530 can pass through the through hole and be supported on the support seat 230, ensuring that the lifting rod 530 can provide a lifting effect for the gas leveling member 210 through the support seat 230. In the case of adopting the technical solution disclosed in the embodiment of the present application, it is convenient to modify the gas leveling member 210 in the current semiconductor process equipment so that the gas leveling member 210 can form a matching relationship with the lifting rod 530 in the semiconductor equipment disclosed in the embodiment of the present application. In addition, in the case of adopting the technical solution disclosed in the embodiment of the present application, the assembly flexibility between the gas leveling member 210 and the lifting rod 530 is relatively higher, so that the two can flexibly form a variety of assembly relationships such as fixed connection or active matching according to actual needs.

[0040] Based on the above-mentioned embodiments of the present application, the lifting rod 530 and the support seat 230 can also be set separately, that is, when the gas uniforming member 210 is supported on other devices such as the cavity 110, the lifting rod 530 can continue to move downward relative to the gas uniforming member 210 and the cavity 110, which enables the lifting rod 530 and the gas uniforming member 210 to have the ability to separate from each other, thereby making the gas uniforming member 210 and the lifting rod 530 relatively independent devices. On the one hand, it is convenient for the processing work of the two, and on the other hand, it can also reduce the difficulty of assembling the lifting rod 530.

[0041] At the same time, when the above technical solution is adopted, the reliability of the semiconductor process equipment can be further improved by setting an idle stroke. Specifically, when the rotating motor 310 drives the gas leveling member 210 to descend relative to the cavity 110 via the lifting assembly 500, as the gas leveling member 210 continues to descend, when the gas leveling member 210 is just supported on the top of the cavity 110, the rotating motor 310 can continue to drive the lifting rod 530 to descend relative to the cavity 110. When the rotating motor 310 continues to work for a preset time, Figure 7 As shown, a certain distance H can be generated between the lifting rod 530 and the support seat 230. At this time, the top end of the lifting rod 530 and the top end of the support seat 230 are separated from each other.

[0042] If the lifting rod 530 cannot be separated from the gas leveling member 210, when the rotating motor 310 drives the gas leveling member 210 to descend relative to the cavity 110 through the lifting rod 530, when the gas leveling member 210 is already supported on the cavity 110, the lifting rod 530 may still be driven by the rotating motor 310, so that the lifting rod 530 may continue to drive the gas leveling member 210 to descend, causing the gas leveling member 210 to press the cavity 110 downward, which may cause damage to the gas leveling member 210 and the cavity 110. As described above, in the case of adopting the above embodiment, the present application enables the lifting rod 530 and the support seat 230 to have the ability to separate from each other, so that even if the gas leveling member 210 is already supported on the cavity 110, the lifting rod 530 itself still has the ability to move downward relative to the cavity 110, which can further improve the service life of the semiconductor process equipment.

[0043] In other words, in the embodiment of the present application, by making the height of the lifting rod 530 smaller than the distance between the bottom end of the thread in the screw 510 and the top end of the cavity 110, the rotating motor 310 can still drive the lifting rod 530 to move a preset distance away from the support seat 230 when the gas uniforming member 210 is supported on the cavity 110. Obviously, the aforementioned preset distance is the height difference between the distance between the bottom end of the thread in the screw 510 and the top end of the cavity 110 and the lifting rod 530, and the height difference is also roughly equivalent to the above-mentioned distance H.

[0044] Specifically, after the gas leveling member 210 is supported on the cavity 110, the rotary motor 310 can continue to drive the lifting assembly 500 to move downward by a distance of 3 to 15 mm. Figure 7 and Figure 8 As shown, in the process of using the lifting rod 530 to drive the support seat 230 and the gas-distributing member 210 to rise relative to the cavity 110, the lifting rod 530 also needs to be preliminarily raised for a distance, that is, the above-mentioned idle stroke H. Figure 8 As shown, the lifting rod 530 can form a supporting relationship with the support seat 230, and then, as shown in Fig. 9 As shown, the lifting rod 530 can drive the gas leveling member 210 to rise through the support seat 230 under the action of the rotating motor 310.

[0045] The support seat 230 may be a cover-shaped structure, the top of which is used to support the lifting rod 530, and the side of which is used to form a fixed connection with the gas leveling member 210. Of course, since the support seat 230 basically only needs to form a fixed connection with the gas leveling member 210, the support seat 230 and the gas leveling member 210 may be connected to each other by welding or the like. In another embodiment of the present application, Figure 7As shown, in order to facilitate the processing of the gas leveling member 210, the support seat 230 can be fixed to the gas leveling member 210 by bolts and other connecting parts. In addition, in order to ensure that the process chamber formed by the gas leveling member 210 and the cavity 110 still has a good sealing effect, a linear bearing 800 can be provided at the through hole of the gas leveling member 210, so that the lifting rod 530 can form a movable matching relationship with the gas leveling member 210 through the linear bearing 800, and the air tightness between the lifting rod 530 and the gas leveling member 210 can be relatively high.

[0046] As described above, if there is a corresponding demand, the rotating motor 310 can be installed in the cavity 110. In order to prevent the rotating motor 310 from interfering with the process environment in the process chamber as much as possible, in another embodiment of the present application, the rotating motor 310 can be arranged outside the cavity 110, for example, the rotating motor 310 can be located outside the cavity bottom of the cavity 110, that is, the rotating motor 310 is located below the cavity 110. On the outside, in this case, it is also necessary to set a through hole at the position corresponding to the through hole on the cavity 110, and let the lifting rod 530 pass through the aforementioned through hole to cooperate with the support seat 230. Accordingly, in order to ensure that the process chamber has good airtightness, a linear bearing 800 can also be correspondingly provided at the aforementioned through hole, so as to ensure that the lifting rod 530 and the cavity 110 can form a reliable sealing cooperation relationship while forming an active cooperation relationship. In addition, when the linear bearing 800 is provided, the verticality of the lifting rod 530 and the gas leveling member 210 can be further improved, thereby further improving the lifting accuracy and stability of the gas leveling member 210.

[0047] In the case where the rotary motor 310 is located outside the cavity 110, more specifically, as Figure 1 As shown, the cavity 110 can also be connected to a support plate 120 and a stand 130. The support plate 120 can be installed on a load-bearing surface such as the ground, and the cavity 110 is supported on the support plate 120 through the stand 130. The rotating motor 310 can be specifically installed on the support plate 120. Of course, if there is a corresponding demand, a part of the transmission assembly 400 and the lifting assembly can also be installed on the support plate 120.

[0048] As described above, the lead screw 510 is connected to the transmission assembly 400 in transmission. Specifically, in the embodiment of the present application, the transmission assembly 400 may include multiple gears to form a gear set, so that the drive shaft of the rotating motor 310 is connected to the lead screw 510 through the gear set, and then when the rotating motor 310 is working, the lead screw 510 is rotated, and then the lifting rod 530 is driven by the nut 520 to move relative to the cavity 110 along the axial direction of the cavity 110, and the gas uniforming member 210 is driven to move up and down relative to the cavity 110.

[0049] In order to further improve the transmission stability between the lead screw 510 and the rotating motor 310, in another embodiment of the present application, the transmission assembly 400 may include a worm wheel 410 and a worm 420 that are transmission-connected, wherein the worm wheel 410 is transmission-connected to the lead screw 510, and the worm 420 is transmission-connected to the output shaft of the rotating motor 310, so that when the output shaft of the rotating motor 310 rotates, the worm 420 can be driven to rotate, and under the rotation of the worm 420, the worm wheel 410 can be driven to rotate, thereby driving the lead screw 510 to rotate, thereby driving the nut 520 and the lifting rod 530 to perform lifting motion relative to the cavity 110. When the transmission assembly 400 adopts the worm wheel 410 and the worm 420, the position between the rotating motor 310 and the lifting assembly 500 can be set more flexibly, and the installation space occupied by the worm wheel 410 and the worm 420 is relatively small.

[0050] Specifically, the worm 420 can be directly connected to the output shaft of the rotating motor 310. In order to reduce the difficulty of connection between the two, the worm 420 can be connected to the rotating motor 310 by means of a coupling. As described above, the number of lifting assemblies 500 can be multiple. In this case, the length of the worm 420 can be relatively large, and the multiple worm wheels 410 can be connected to the same worm 420 in transmission, so that the multiple worm wheels 410 are fixedly connected to the lead screws 510 of the multiple lifting assemblies 500 in a one-to-one correspondence, so that the rotating motor 310 can simultaneously drive the multiple worm wheels 410 to rotate through the same worm 420, so that the multiple lifting assemblies 500 can be driven by the same rotating motor 310. Of course, when the above technical solution is adopted, it is necessary to distribute the multiple lifting assemblies 500 along the extension direction of the worm 420, and the rotating motor 310 is arranged on the outside of the multiple lifting assemblies 500.

[0051] In a specific embodiment of the present application, the number of lifting assemblies 500 can be two, and the two lifting assemblies 500 are evenly and spaced apart along the circumference of the cavity 110, which makes the driven stability of the gas uniforming member 210 relatively high and the number of components in the entire semiconductor process equipment relatively small, thereby reducing the device cost and assembly difficulty of the semiconductor process equipment.

[0052] When there are two lifting assemblies 500, the rotary motor 310 can achieve the purpose of driving the two lifting assemblies 500 through one worm 420 and two worm wheels 410. Figure 3As shown, the semiconductor process equipment further includes a dual-axis output device 320, which is transmission-connected to the rotating motor 310, and the two lifting assemblies 500 are respectively connected to the two output shafts of the dual-axis output device 320 through the transmission assembly 400. In this case, any transmission assembly 400 may include a worm wheel 410 and a worm 420 that are transmission-connected, so that the length of each worm 420 can be reduced to a certain extent, and the relative position between the rotating motor 310 and the lifting assembly 500 is more flexible, which is convenient for the layout of various devices.

[0053] More specifically, when the two lifting assemblies 500 are spaced and evenly distributed along the circumference of the cavity 110, the rotary motor 310 can be disposed between the two lifting assemblies 500, and the two output shafts of the dual-axis output device 320 are disposed on opposite sides of the rotary motor 310, so that each output shaft is connected to the lifting assembly 500 on its side. Accordingly, the two transmission assemblies 400 are disposed between the corresponding output shafts and the lifting assemblies 500, and provide a transmission connection function for the output shafts and the lifting assemblies 500.

[0054] As described above, the transmission assembly 400 may include a worm wheel 410 and a worm 420, and the worm 420 is directly connected to the output shaft of the rotating motor 310. In order to improve the transmission stability between the worm 420 and the rotating motor 310, in another embodiment of the present application, Figure 3 As shown, the transmission assembly 400 may also include a universal coupling 430 and a transmission shaft 440. In this case, the output shaft of the rotating motor 310 can be connected to one end of the transmission shaft 440 through the universal coupling 430, and the other end of the transmission shaft 440 is also connected to the worm 420 through another universal coupling 430, which makes it possible to more stably transmit the output force of the rotating motor 310 to the worm 420 and makes the arrangement direction of the worm 420 more flexible without having to be parallel to the output shaft of the rotating motor 310.

[0055] As described above, in the semiconductor process equipment disclosed in the embodiment of the present application, the gas leveling member 210 can be driven by the rotating motor 310 so that the gas leveling member 210 can move up and down relative to the cavity 110. Specifically, the lifting and lowering size range of the gas leveling member 210 can be determined according to actual conditions. For example, the lifting and lowering range of the gas leveling member 210 driven by the rotating motor 310 relative to the cavity 110 can be specifically 300mm to 600mm. In the actual working process, the parameters such as the driving stroke or working time of the rotating motor 310 can be controlled to ensure that the rotating motor 310 does not cause the lifting and lowering size of the gas leveling member 210 to exceed the preset range.

[0056] In order to further improve the reliability of the lifting and lowering of the gas uniforming member 210 within a preset range, in another embodiment of the present application, the semiconductor process equipment also includes an in-place detection component, which can detect the lifted size of the gas uniforming member 210 relative to the cavity 110, so that the actual lifting height of the gas uniforming member 210 can be detected by using the in-place detection component, and by connecting the in-place detection component to devices such as a control device of the semiconductor process equipment, or allowing the staff to obtain the detection result of the in-place detection component, it is ensured that before the lifting height of the gas uniforming member 210 exceeds its preset lifting range, the gas uniforming member 210 can be controlled to stop lifting by shutting down the rotating motor 310, etc., to prevent the gas uniforming member 210 from being lifted to a height exceeding its preset lifting height, causing damage to other devices or affecting the normal operation of other devices.

[0057] Specifically, the in-place detection component can be a device such as an infrared distance sensor that can detect the distance between two devices. By installing the in-place detection component on the cavity 110 or the gas leveling member 210, the lifting distance of the gas leveling member 210 can be detected.

[0058] In another embodiment of the present application, Figure 1 and Figure 2 As shown, in order to reduce the difficulty of control, the in-position detection component includes a photoelectric sensor 610, which can be installed on the gas leveling member 210. The photoelectric sensor 610 includes a transmitting part and a receiving part. When the light emitted by the transmitting part can be normally received by the receiving part, it means that there is no obstruction between the transmitting part and the receiving part. To this end, by installing the shielding member 620 at a position corresponding to the photoelectric sensor 610 on the cavity 110, when the gas leveling member 210 is lifted to a preset height, the shielding member 620 can be blocked between the transmitting part and the receiving part, so that the receiving part cannot normally receive the light signal emitted by the transmitting part, so as to use the photoelectric sensor 610 to determine whether the gas leveling member 210 has been lifted to the preset height, and when the gas leveling member 210 has been lifted to the preset height, the rotating motor 310 is correspondingly controlled to stop. More specifically, the shielding member 620 may be a light blocking sheet formed of a light blocking material, and the cavity 110 may also be provided with a bracket 140 , which may extend above the cavity 110 and the air leveling member 210 to provide an installation base for the shielding member 620 .

[0059] As described above, during the process, it is usually necessary to use the gas leveling member 210 to transport process gas into the process chamber, and then, when the semiconductor process equipment needs to be maintained, the process gas delivery pipeline can be closed in advance. In order to further improve safety and automation, in an embodiment of the present application, the semiconductor process equipment also includes an opening and closing detection member, which can detect the separation state between the gas leveling member 210 and the cavity 110, and when the gas leveling member 210 and the cavity 110 are separated, a separation signal is output, so that the staff and the control device of the semiconductor process equipment can obtain the state that the gas leveling member 210 and the cavity 110 are separated from each other, so as to correspondingly control the stop of continuing to transport the process gas into the process chamber.

[0060] Specifically, Figure 1 and Figure 2 As shown, the opening and closing detection part may include a first detection part 630 and a second detection part 640, the first detection part 630 is installed on the cavity 110, and the second detection part 640 is installed on the gas leveling part 210. When the gas leveling part 210 is supported on the cavity 110, the first detection part 630 and the second detection part 640 are connected to each other, so that no separation signal is issued. When the gas leveling part 210 is separated from the cavity 110, the first detection part 630 and the second detection part 640 are also separated from each other, so that the first detection part 630 and the second detection part 640 send a separation signal. The opening and closing detection part may specifically include an optical sensor or a distance sensor, etc., which is not limited in this article.

[0061] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0062] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor process equipment, characterized in that: The invention comprises a cavity (110), a gas homogenizing member (210), a rotating motor (310), a transmission assembly (400) and a lifting assembly (500), wherein: There are a plurality of lifting assemblies (500), and the plurality of lifting assemblies (500) are spaced apart along the circumference of the cavity (110); each of the lifting assemblies (500) is connected to the gas leveling member (210), and each of the lifting assemblies (500) is connected to the rotating motor (310) via the transmission assembly (400), so that the rotating motor (310) drives each of the lifting assemblies (500) via the transmission assembly (400) to drive the gas leveling member (210) to perform lifting motion relative to the cavity (110).

2. The semiconductor process equipment according to claim 1, characterized in that: Each of the lifting assemblies (500) comprises a threaded screw (510) and a nut (520), one of the screw (510) and the nut (520) being connected to the transmission assembly (400), and the other being matched with the gas leveling member (210).

3. The semiconductor process equipment according to claim 2, characterized in that: Each of the lifting assemblies (500) further includes a lifting rod (530), wherein the lifting rod (530) and the nut (520) are relatively fixed in the axial direction of the cavity (110), and the lifting rod (530) is sleeved outside the lead screw (510), and the lifting rod (530) is used to cooperate with the gas uniforming member (210), and the lead screw (510) is transmission-connected to the transmission assembly (400).

4. The semiconductor process equipment according to claim 3, characterized in that: The nut (520) is provided with an external thread, the lifting rod (530) is provided with an internal thread, and the lifting rod (530) is threadedly connected to the nut (520).

5. The semiconductor process equipment according to claim 4, characterized in that: The outer surface of the nut (520) is provided with a step surface (521), and the step surface (521) is perpendicular to the axial direction. In the axial direction, the lifting rod (530) is supported and limited on the step surface (521).

6. The semiconductor process equipment according to claim 3, characterized in that: The semiconductor process equipment also includes a support seat (230), the gas leveling member (210) is provided with a through hole, the support seat (230) is fixedly installed on the side of the gas leveling member (210) away from the chamber (110), and the support seat (230) is arranged opposite to the through hole, and the lifting rod (530) can pass through the through hole and be supported on the support seat (230).

7. The semiconductor process equipment according to claim 6, characterized in that: The lifting rod (530) and the support seat (230) can be separately arranged, and when the gas uniformizing member (210) is supported on the cavity (110), the rotating motor (310) can drive the lifting rod (530) to move a preset distance in a direction away from the support seat (230).

8. The semiconductor process equipment according to claim 6, characterized in that: The rotating motor (310) is arranged outside the bottom of the cavity (110), and the cavity (110) is provided with a through hole, the lifting rod (530) is inserted into the through hole and the through hole, and a linear bearing (800) is provided between the through hole and the through hole and each of the lifting rod (530).

9. The semiconductor process equipment according to claim 3, characterized in that: The transmission assembly (400) comprises a worm wheel (410) and a worm (420) which are transmission-connected, wherein the worm wheel (410) is fixedly connected to the lead screw (510), and the worm (420) is transmission-connected to the output shaft of the rotating motor (310).

10. The semiconductor process equipment according to claim 9, characterized in that: The transmission assembly (400) further comprises a universal coupling (430) and a transmission shaft (440), wherein the output shaft of the rotating motor (310) is connected to one end of the transmission shaft (440) via the universal coupling (430), and the other end of the transmission shaft (440) is connected to the worm (420) via another universal coupling (430).

11. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment also includes a dual-axis output device (320), which is connected to the rotating motor (310) in a transmission manner. The number of the lifting components (500) is two, and the two lifting components (500) are connected to the two output shafts of the dual-axis output device (320) in a one-to-one correspondence through the transmission component (400).

12. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment further comprises an in-place detection component, wherein the in-place detection component is used to detect the lifting dimension of the gas homogenizing member (210) relative to the chamber (110); The semiconductor process equipment further comprises an opening and closing detection component, and the opening and closing detection component is used to output a separation signal when the gas homogenizing component (210) is separated from the chamber (110).

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