Novel efficient high-cleanliness drying system
By setting up a double filter unit in the air supply component of the drying system, the problem of external air impurities entering the drying space is solved, an efficient and high-cleanliness drying effect is achieved, and the cleanliness of the silicon wafer surface and the quality of the drying are ensured. promote.
Patent Information
- Application Number
- CN202421032460.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-13
AI Technical Summary
During the drying process of silicon wafers, it is difficult to avoid impurities in the external air entering the drying space, resulting in surface pollution of the silicon wafers and affecting the drying quality.
Design a new type of high-efficiency and high-cleanliness drying system. By setting up two filter units in the air supply component, including a fan filter unit and a chemical filter, it ensures that the air is double filtered before entering the drying space, thereby maintaining the drying space. of cleanliness.
Double filtration ensures that the air supplied to the drying equipment is clean, avoiding contamination of the silicon wafers, and improving drying quality and cleanliness.
Smart Images
Figure CN222378655U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of drying equipment, in particular to a novel high-efficiency and high-cleanliness drying system. Background Art
[0002] Crystalline silicon solar cells that work with the photovoltaic effect are the mainstream of current photovoltaic power generation. Cleaning is one of the important steps in the preparation of silicon-based cells. After the silicon wafers are treated with a series of chemicals, the surface of the silicon wafers needs to be blown dry. As a new process, heterojunction has relatively strict requirements on the surface of silicon wafers.
[0003] Chinese patent CN 207163110 discloses a silicon wafer drying oven that can form a circulating airflow in the inner box and effectively utilize the heat of the gas. In order to achieve the circulation of the airflow, the box must form a sealed space during operation, but in order to put in the silicon wafers and flower baskets, the box must be able to be opened, so a sealed door must be provided on the box. However, there will inevitably be gaps around the sealed door, and the outside air may enter the sealed space through the gaps, causing impurities in the air to stick to the surface of the silicon wafer, which may have an adverse effect on the drying quality of the silicon wafer.
[0004] Therefore need to improve the drying system to solve the above problems. Summary of the invention
[0005] The main purpose of the utility model is to provide a novel high-efficiency and high-cleanliness drying system, which can filter air through two filter units when supplying air, so that the air supplied to the drying equipment is clean and the silicon wafer is prevented from being contaminated.
[0006] The utility model achieves the above-mentioned purpose through the following technical solutions: a new type of high-efficiency and high-cleanliness drying system, including drying equipment and air supply components;
[0007] The drying device comprises a trough body and two sealed doors located above the trough body, wherein the two sealed doors form a drying space with the trough body when closed, a heat circulation fan is arranged in the drying space, and a plurality of air supply ports connected to the drying space are arranged at the bottom of the trough body;
[0008] The air supply component includes an air inlet filter unit, a fan and an air outlet filter unit which are connected in sequence, and the air outlet filter unit is connected to each air supply port through a plurality of hoses.
[0009] Specifically, the air inlet filter unit is a fan filter unit, and the air outlet filter unit is a chemical filter.
[0010] Specifically, the drying space is divided into a drying chamber, a return air chamber and two heating chambers. The lower part of the drying chamber is connected to the upper part of the return air chamber. The two heating chambers are respectively located on both sides of the drying chamber and the return air chamber. The two sides of the return air chamber are respectively connected to the lower part of the heating chamber. A number of heating tubes are arranged in the heating chamber. The drying chamber and the heating chamber are separated by an air equalizing plate. A number of ventilation holes are arranged on the air equalizing plate. The heat circulation fan is arranged in the return air chamber and below the connecting position between the drying chamber and the return air chamber. The two sealing doors are located above the drying chamber and can be rotated to both sides to open.
[0011] Furthermore, a plurality of channels are equidistantly arranged between the heating chamber and the return air chamber, a heat circulation fan is provided below each channel, and each air supply port is located between adjacent heat circulation fans.
[0012] Furthermore, a flower basket positioning bracket with a hollow bottom is provided in the drying chamber, a plurality of flower baskets are placed side by side on the flower basket positioning bracket, a blocking protrusion is provided on the flower basket positioning bracket for separating the flower baskets, a plurality of silicon wafers are vertically inserted in the flower basket, and the direction of the silicon wafers is parallel to the air outlet direction of the ventilation holes.
[0013] Furthermore, the ventilation holes are distributed in an array on the air balancing plate, and the ventilation holes are a plurality of narrow slit holes which are longer in the vertical direction than in the horizontal direction.
[0014] Furthermore, the trough body is provided with a bottom plate located at the bottom of the return air cavity, the bottom plate is in a channel-shaped structure with two sides higher than the middle, and a drainage outlet is provided at the lowest point of the bottom plate.
[0015] The beneficial effects of the technical solution of the utility model are:
[0016] In this drying system, the air supply component is used to provide clean air to the drying space. When the air passes through the air supply component, it will first undergo a first filtration at the air inlet filter unit, and then undergo a second filtration at the air outlet filter unit. When the air is delivered, the drying space will present a certain high-pressure atmosphere, so even if there is a leak in the drying equipment, the air will only overflow outward and will not enter the drying space in reverse, so the drying space can be kept clean and the quality of drying can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is the structural diagram of the drying system;
[0018] Figure 2 This is a cross-sectional view of the drying equipment.
[0019] The numbers in the figure represent:
[0020] 1-drying equipment, 11-tank body, 111-drying chamber, 112-return air chamber, 113-heating chamber, 114-air supply port, 115-bottom plate, 116-drain port, 12-sealed door, 13-heating pipe, 14-heat circulation fan, 15-flower basket positioning bracket, 151-partition protrusion, 16-air balancing plate, 161-ventilation hole;
[0021] 2-air supply component, 21-air inlet filter unit, 22-fan, 23-air outlet filter unit, 24-hose;
[0022] 3- Flower basket;
[0023] 4-Silicon wafer. DETAILED DESCRIPTION
[0024] The utility model is further described in detail below in conjunction with specific embodiments.
[0025] Example:
[0026] like Figure 1 and Figure 2 As shown, a new type of high-efficiency and high-cleanliness drying system of the utility model includes a drying device 1 and an air supply component 2. The drying device 1 includes a tank body 11 and two sealed doors 12 located above the tank body 11. When the two sealed doors 12 are closed, they form a drying space with the tank body 11. A heat circulation fan 14 is provided in the drying space. The bottom of the tank body 11 is provided with a plurality of air supply ports 114 connected to the drying space. The air supply component 2 includes an air inlet filter unit 21, a fan 22 and an air outlet filter unit 23 connected in sequence. The air outlet filter unit 23 is connected to each air supply port 114 through a plurality of hoses 24. The air inlet filter unit 21 is a fan filter unit, and the air outlet filter unit 23 is a chemical filter.
[0027] When the system is loaded, the two sealing doors 12 are opened, so that the basket 3 loaded with silicon wafers 4 can be placed in the tank body 11. After closing the sealing door 12, a drying space that is basically isolated from the inside and outside is formed. The air supply component 2 is used to provide clean air to the drying space. When the air passes through the air supply component 2, it will first be filtered at the air inlet filter unit 21, and then filtered at the air outlet filter unit 23. When the air inlet filter unit 21 is a fan filter unit, it can reduce the content of particulate impurities and protect the fan 22 to avoid blockage; when the air outlet filter unit 23 is a chemical filter, it can remove some gas impurities that are harmful to the silicon wafer 4. When the air is sent in, the drying space will present a certain high-pressure atmosphere, so even if there is a leak on the drying equipment 1, the air will only overflow and will not enter the drying space in the opposite direction, so the drying space can be kept clean and the quality of drying can be guaranteed.
[0028] like Figure 1 and Figure 2As shown, the drying space is divided into a drying chamber 111, a return air chamber 112 and two heating chambers 113. The lower part of the drying chamber 111 is connected to the upper part of the return air chamber 112. The two heating chambers 113 are respectively located on both sides of the drying chamber 111 and the return air chamber 112. The two sides of the return air chamber 112 are respectively connected to the lower part of the heating chamber 113. A plurality of heating tubes 13 are arranged in the heating chamber 113. The drying chamber 111 and the heating chamber 113 are separated by an air balancing plate 16. A plurality of ventilation holes 161 are arranged on the air balancing plate 16. The heat circulation fan 14 is arranged in the return air chamber 112 and is located below the connecting position between the drying chamber 111 and the return air chamber 112. The two sealing doors 12 are located above the drying chamber 111 and can be rotated to both sides to open.
[0029] The heat circulation fan 14 is a centrifugal fan that can suck air from the axial direction and then spray it from both sides. Therefore, in the installed state, the air in the drying space is sucked downward into the heat circulation fan 14, and then flows to the left and right sides after acceleration. Therefore, the circulation method of the air in the drying space is that the air enters the return air chamber 112 downward from the middle of the drying chamber 111, and then is divided into two streams from the return air chamber 112 and flows to the heating chamber 113. The air is heated by the heating tube 13 in the heating chamber 113 and reaches the drying temperature. Then, it passes through the ventilation holes 161 on the air balancing plate 16 and sprays onto the silicon wafer 4, so that the silicon wafer 4 can be dried.
[0030] like Figure 1 As shown, the drying chamber 111 and the return air chamber 112 are connected through a plurality of equally spaced channels, a heat circulation fan 14 is provided under each channel, and each air supply port 114 is located between adjacent heat circulation fans 14 .
[0031] When one horizontal direction of the drying space structure is longer than the other horizontal direction, in order to make the wind speed uniform, multiple heat circulation fans 14 need to be arranged along the length direction of the drying device 1. The air supply port 114 is arranged between two heat circulation fans 14 with weaker wind force, so that the air pressure at the air supply port 114 will not cause great resistance, so that the energy of the fan 22 can be used more effectively.
[0032] like Figure 1 and Figure 2 As shown, a flower basket positioning bracket 15 with a hollow bottom is provided in the drying chamber 111, and a plurality of flower baskets 3 are placed side by side on the flower basket positioning bracket 15. The flower basket positioning bracket 15 is provided with a blocking protrusion 151 for separating the flower baskets 3. A plurality of silicon wafers 4 are vertically inserted in the flower baskets 3, and the direction of the silicon wafers 4 is parallel to the air outlet direction of the ventilation holes 161. The ventilation holes 161 are distributed in an array on the air distribution plate 16, and the ventilation holes 161 are a plurality of narrow slit holes that are longer in the vertical direction than in the horizontal direction.
[0033] The flower basket 3 is generally arranged in the drying space along the length direction, and the flower basket positioning bracket 15 serves as a support and positioning structure for the flower basket 3. The silicon wafer 4 is inserted in the plane perpendicular to the length direction of the flower basket 3, and its plane will follow the flow direction of the air to prevent the silicon wafer 4 from breaking under the wind pressure. In order to adapt to the position of the silicon wafer 4, the ventilation hole 161 will also be designed as a vertical narrow slit hole, so that the air ejection range is a vertical thin strip structure, which can just enter the space between adjacent silicon wafers 4. The bottom of the flower basket positioning bracket 15 is hollowed out so as not to block the air from circulating downward, and the partition protrusion 151 positions the flower basket 15 horizontally, so that the silicon wafer 4 is in a state along the wind outlet direction.
[0034] like Figure 2 As shown, a bottom plate 115 located at the bottom of the return air chamber 112 is disposed on the tank body 11 . The bottom plate 115 is in a channel-shaped structure with two sides higher than the middle. A drainage port 116 is disposed at the lowest point of the bottom plate 115 .
[0035] When loading, some liquid will remain on the surface of the silicon wafer 4, which will drip onto the bottom plate 115. In order to make this part of the liquid leave the drying space as soon as possible, the liquid will flow along the structure of the bottom plate 115 to the lower drain port 116, and then be drained away to avoid it from increasing the humidity in the drying space after contacting the air, thereby making the drying efficiency higher.
[0036] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present invention, which all belong to the protection scope of the present invention.
Claims
1. A new type of high efficiency and high cleanliness drying system, characterized by: Including drying equipment and air supply components; The drying device comprises a trough body and two sealed doors located above the trough body, wherein the two sealed doors form a drying space with the trough body when closed, a heat circulation fan is arranged in the drying space, and a plurality of air supply ports connected to the drying space are arranged at the bottom of the trough body; The air supply component includes an air inlet filter unit, a fan and an air outlet filter unit which are connected in sequence, and the air outlet filter unit is connected to each air supply port through a plurality of hoses.
2. The novel high efficiency and high cleanliness drying system according to claim 1 is characterized in that: The air inlet filter unit is a fan filter unit, and the air outlet filter unit is a chemical filter.
3. The novel high efficiency and high cleanliness drying system according to claim 1 is characterized in that: The drying space is divided into a drying chamber, a return air chamber and two heating chambers. The lower part of the drying chamber is connected to the upper part of the return air chamber. The two heating chambers are respectively located on both sides of the drying chamber and the return air chamber. The two sides of the return air chamber are respectively connected to the lower part of the heating chamber. A plurality of heating tubes are arranged in the heating chamber. The drying chamber and the heating chamber are separated by an air equalizing plate. A plurality of ventilation holes are arranged on the air equalizing plate. The heat circulation fan is arranged in the return air chamber and below the connecting position between the drying chamber and the return air chamber. The two sealing doors are located above the drying chamber and can be rotated to both sides to open.
4. The novel high efficiency and high cleanliness drying system according to claim 3 is characterized by: The drying chamber is connected to the return air chamber through a plurality of equally spaced channels, a heat circulation fan is provided below each channel, and each air supply port is located between adjacent heat circulation fans.
5. The novel high efficiency and high cleanliness drying system according to claim 3 is characterized by: A flower basket positioning bracket with a hollow bottom is provided in the drying chamber, a plurality of flower baskets are placed side by side on the flower basket positioning bracket, a blocking protrusion is provided on the flower basket positioning bracket for separating the flower baskets, a plurality of silicon wafers are vertically inserted in the flower baskets, and the direction of the silicon wafers is parallel to the air outlet direction of the ventilation holes.
6. The novel high efficiency and high cleanliness drying system according to claim 5 is characterized in that: The ventilation holes are distributed in an array on the air balancing plate, and the ventilation holes are a plurality of narrow slit holes which are longer in the vertical direction than in the horizontal direction.
7. The novel high efficiency and high cleanliness drying system according to claim 3 is characterized by: The trough body is provided with a bottom plate located at the bottom of the return air cavity. The bottom plate is in a channel-shaped structure with two sides higher than the middle. A drainage outlet is provided at the lowest point of the bottom plate.