Sensor device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a sensor device, which comprises a substrate, a lens module, an optical chip, a first light-transmitting glue layer and a second light-transmitting glue layer. The lens module is arranged on the substrate. The lens module comprises a bearing part, a cavity structure and a lens. The bearing part comprises at least two cavity structures. The optical chip is arranged on the substrate, in the cavity structure and below the lens. At least one optical chip is arranged in the cavity structure. The first light-transmitting glue layer is arranged in the cavity structure and below the lens and covers the optical chip. The second light-transmitting glue layer is tightly connected with the first light-transmitting glue layer and the lens. According to the sensor device provided by the utility model, the second light-transmitting glue layer is tightly arranged between the first light-transmitting glue layer and the lens, so that the Fresnel loss of light energy is reduced, and the light energy utilization rate is improved; and the light control effect of the three-layer lens structure is good, so that the precision of the sensor device is higher.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is composed of at least two optical chips that emit and receive light. The light emitting chip emits a light beam, which passes through the optical system and irradiates the object to be measured. The light beam reflected or absorbed by the object passes through the optical system and irradiates the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, which is finally processed by the signal processing circuit and then output.

[0003] Existing sensor devices have problems such as Fresnel loss, low light energy utilization, inaccurate light control, and low detection accuracy of sensor devices.

[0004] Based on the above, a sensor device with high light energy utilization rate, good light control effect and high detection accuracy is currently provided. Utility Model Content

[0005] The utility model aims to provide a sensor device, aiming to solve the problems of low light energy utilization rate, large Fresnel loss and low detection accuracy of the sensor device in the prior art.

[0006] The utility model is implemented as follows: a sensor device comprises:

[0007] substrate;

[0008] A lens module, which is arranged on the substrate; the lens module comprises a receiving portion, a cavity structure arranged in the receiving portion, and a lens arranged in the cavity structure; the receiving portion comprises at least two cavity structures;

[0009] An optical chip is disposed on the substrate, in the cavity structure, and below the lens; at least one optical chip is disposed in the cavity structure;

[0010] A first light-transmitting adhesive layer, which is disposed in the cavity structure, below the lens and covers the optical chip;

[0011] The second light-transmitting adhesive layer is tightly connected to the first light-transmitting adhesive layer and the lens.

[0012] Furthermore, the side surface of the first light-transmitting adhesive layer is configured as a first reflecting surface for reflecting edge large-angle light.

[0013] Furthermore, the first reflective surface or the first reflective surface and the side surface of the optical chip are tightly covered with a high-reflective adhesive layer.

[0014] Furthermore, the side surface of the second light-transmitting adhesive layer is configured as a second reflective surface for reflecting edge large-angle light.

[0015] Furthermore, the second reflective surface, the side surface of the first light-transmitting adhesive layer and the side surface of the optical chip are tightly covered with a high-reflective adhesive layer.

[0016] Furthermore, the top surface of the second light-transmissive adhesive layer is connected only to the lens or is connected to the lens and the receiving portion at the same time.

[0017] Furthermore, the upper surface of the lens is configured as a flat surface or a curved surface.

[0018] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0019] The sensor device of the utility model can reduce Fresnel loss and improve light energy utilization by sealing the second light-transmitting adhesive layer 5 between the first light-transmitting adhesive layer 4 and the lens 23. The "three-layer lens" structure can make light accurately reach the preset angle, with good light control effect, making the sensor device more accurate.

[0020] The first reflection surface 41 and the second reflection surface 51 can reflect the large-angle light on the edges of the four sides toward the direction close to the optical axis, further improving the utilization rate of light energy. The first reflection surface 41 and / or the second reflection surface 51 are tightly coated with a high-reflection adhesive layer 6. First, the high-reflection adhesive layer 6 fully reflects the light incident on the first reflection surface 41 and the second reflection surface 51, cuts off the refracted light, and thereby reduces the design difficulty and manufacturing accuracy of the first reflection surface 41 and the second reflection surface 51. Secondly, the high-reflection adhesive layer 6 can play a role in fixing the optical chip 3 and the receiving portion 21. Thirdly, the high-reflection adhesive layer 6 covers the side of the optical chip 3, so that the optical chip 3 can not only dissipate heat through the substrate 1 connected to the bottom surface, but also dissipate heat through the high-reflection adhesive layer 6 connected to the side, thereby making the heat dissipation effect of the optical chip 3 better and the product life longer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0022] In the figure: 1-substrate; 2-lens module; 21-receiving part; 22-cavity structure; 23-lens; 3-optical chip; 4-first light-transmitting adhesive layer; 41-first reflecting surface; 5-second light-transmitting adhesive layer; 51-second reflecting surface; 6-highly reflective adhesive layer. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0025] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0026] Reference Figure 1 As shown, it is a preferred embodiment provided by the utility model.

[0027] A sensor device, referring to Figure 1 , including a substrate 1, a lens module 2, an optical chip 3, a first light-transmitting adhesive layer 4, and a second light-transmitting adhesive layer 5. The lens module 2 is arranged on the substrate 1. The lens module 2 includes a receiving portion 21, a cavity structure 22 arranged in the receiving portion 21, and a lens 23 arranged in the cavity structure 22 and away from the substrate 1. The receiving portion 21 includes at least two cavity structures 22. The cavity structure 22 is used to accommodate the optical chip 3 and light propagation. The optical chip 3 is arranged in the cavity structure 22 on the substrate 1, and at least one optical chip 3 is arranged in each cavity structure 22. The utility model only takes two cavity structures 22 corresponding to two optical chips 3 as an example, and three or more cavity structures 22 can also be arranged as needed, and each cavity structure 22 can accommodate multiple optical chips 3, and multiple optical chips 3 are regularly displayed or irregularly arrayed in the cavity structure 22. The above situations are all within the concept of the utility model.

[0028] The optical chip 3 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The sensor device of the present utility model integrates one light-emitting chip for emitting light. When the emitted light is incident on the object to be detected or the object to be sensed, it is reflected. The emitted light is incident on the photosensitive area of the photosensitive chip and is received. The photosensitive chip converts the optical signal into an electrical signal, thereby making a corresponding feedback. To prevent the emitted light and the received light of the light-emitting chip and the photosensitive chip from interfering with each other and crosstalking, the承接部21 can be set as a light-absorbing part made of a light-impermeable material (such as black glue). According to the different functional requirements of different application scenarios, the承接部21 can also be set as a light-transmitting material. The height of the承接部21 is not limited.

[0029] To improve light extraction, a first light-transmitting glue layer 4 is coated on the optical chip 3. The first light-transmitting glue layer 4 can be set to only cover the upper surface of the optical chip 3; it can also be set to cover the upper surface of the optical chip 3, as well as part or all of the side surfaces. The first light-transmitting glue layer 4 can also extend to the upper surface of the substrate 1. The lens 23 is arranged on the side of the cavity structure 22 away from the substrate 1 and corresponding to the upper side of the first light-transmitting glue layer 4. The lens 23 performs optical shaping on the emitted light or the incident light to meet the preset angles, brightness, uniformity, and spot shapes of the emitted light / incident light. Specifically, the lens 23 includes a first lens corresponding to the light-emitting chip 3 and a second lens corresponding to the photosensitive chip. The first lens and the second lens are respectively used to perform optical adjustment on the emitted light of the light-emitting chip and the received light of the photosensitive chip. The first lens and the second lens can be set as the same or different types of lenses to meet the needs of different optical functions.

[0030] To reduce Fresnel loss and perform optical shaping, a second light-transmitting glue layer 5 is arranged between the first light-transmitting glue layer 4 and the lens 23 and is tightly connected to both of them. The top of the second light-transmitting glue layer 5 can be set to only be connected to the bottom of the lens 23; it can also be set to be connected to the bottom of the lens 23 and the bottom of the承接部21 at the same time. The path of the light emitted by the light-emitting chip: the first light-transmitting glue layer 4 - the second light-transmitting glue layer 5 - the lens 23. The refractive indices of the first light-transmitting glue layer 4, the second light-transmitting glue layer 5, and the lens 23 are A1, A2, and A3 respectively. Set A1 < A2 < A3. When the light enters the second light-transmitting glue layer 5 from the first light-transmitting glue layer 4, from an optically thinner medium to an optically denser medium, total internal reflection is not likely to occur, greatly reducing the Fresnel loss and greatly improving the utilization of light energy. When the light of the second light-transmitting glue layer 5 enters the lens 23, the Fresnel loss can also be reduced, and the principle is the same as above. The path of the light received by the photosensitive chip: the lens 23 - the second light-transmitting glue layer 5 - the first light-transmitting glue layer 4, and the refractive index can be set as A1 > A2 > A3.

[0031] It should be noted that the "承接部21" in the original text seems to be an undefined or misspelled term. If there is a correct specific name for it, please provide it for a more accurate translation.Comparative example: Instead of filling the second light-transmitting adhesive layer 5 between the first light-transmitting adhesive layer 4 and the lens 23, it is a gas layer. The light path through which the light emitted by the light-emitting chip passes: the first light-transmitting adhesive layer 4 - the gas layer - the lens 23. The refractive index of the air layer is A4, and A4 < A1 < A3. When the light enters the gas layer of the cavity structure 22 from the first light-transmitting adhesive layer 4, that is, from an optically denser medium to an optically thinner medium, the Fresnel loss is relatively large, which means that part of the light is prone to total internal reflection and absorption. Therefore, the light energy utilization rate of the present invention is high.

[0032] To further improve the light energy utilization rate and increase the brightness, the side surface of the first light-transmitting adhesive layer 4 is provided with a first reflecting surface 41 for reflecting large-angle light at the edge. The first reflecting surface 41 is an inverted conical plane or curved surface, that is, the side surface of the first light-transmitting adhesive layer 4 is provided as a plane or curved surface at a certain angle with the upper surface of the light chip 3. The above setting increases the incident angle. When the large-angle light at the edge is incident on the first reflecting surface 41, it satisfies that the incident angle is greater than or equal to the critical angle, and total internal reflection is likely to occur. After total internal reflection, the light propagates towards the direction close to the optical axis and finally exits from the front surface of the light chip 3 or is incident on the photosensitive area. This setting utilizes the large-angle light at the edge that is not easily utilized around, improves the light energy utilization rate, and increases the overall brightness.

[0033] The side surface of the second light-transmitting adhesive layer 5 is provided with a second reflecting surface 51 for reflecting large-angle light at the edge. Specifically, the second reflecting surface 51 is an inverted conical plane or curved surface, that is, the side surface of the second light-transmitting adhesive layer 5 is provided as a plane or curved surface at a certain angle with the upper surface of the light chip 3. It further reflects the large-angle light at the edge incident from the first light-transmitting adhesive layer 4 towards the direction closer to the optical axis, improving the light energy utilization rate.

[0034] The first reflecting surface 41 and / or the second reflecting surface 51 is closely coated with a high-reflection adhesive layer 6, and the high-reflection adhesive layer 6 is arranged in the cavity structure 22 on the substrate 1. The high-reflection adhesive layer 6 covers part or all of the upper surface of the substrate 1 and can be arranged to be connected to the inner wall of the receiving portion 21. First, the high-reflection adhesive layer 6 enables the light incident on the first reflecting surface 41 and the second reflecting surface 51 to be fully reflected, blocking the refracted light, thereby reducing the design difficulty and manufacturing precision of the first reflecting surface 41 and the second reflecting surface 51. Second, the high-reflection adhesive layer 6 can play a role in fixing the light chip 3 and the receiving portion 21. Third, the high-reflection adhesive layer 6 covers the side surface of the light chip 3, so that in addition to dissipating heat through the substrate 1 connected to the bottom surface, the light chip 3 can also dissipate heat through the high-reflection adhesive layer 6 connected to the side surface, thereby making the heat dissipation effect of the light chip 3 better and the product service life longer.

[0035] In addition, the first light-transmitting adhesive layer 4, the second light-transmitting adhesive layer 5 and the lens 23 form a "three-layer lens" structure, which utilizes the principle of refraction due to the different refractive indices of the first light-transmitting adhesive layer 4, the second light-transmitting adhesive layer 5 and the lens 23 to facilitate optical adjustment of light, so that the light reaches the preset angle accurately, the light control effect is better, and it is easier to design optically. The lens 23, the first light-transmitting adhesive layer 4, the second light-transmitting adhesive layer 5 and the high-reflective adhesive layer 6 in each cavity structure 22 of the sensor device of the utility model can be arranged the same or different, and various forms can be combined and designed, which are not listed here one by one.

[0036] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: substrate(1); A lens module (2) arranged on the substrate (1); the lens module (2) comprises a receiving portion (21), a cavity structure (22) arranged in the receiving portion (21), and a lens (23) arranged in the cavity structure (22); the receiving portion (21) comprises at least two cavity structures (22); An optical chip (3) is arranged on the substrate (1), in the cavity structure (22), and below the lens (23); at least one optical chip (3) is arranged in the cavity structure (22); A first light-transmitting adhesive layer (4), which is arranged in the cavity structure (22), below the lens (23) and covers the optical chip (3); A second light-transmitting adhesive layer (5) tightly connects the first light-transmitting adhesive layer (4) and the lens (23).

2. The sensor device according to claim 1, characterized in that The side surface of the first light-transmitting adhesive layer (4) is arranged as a first reflection surface (41) for reflecting edge large-angle light.

3. The sensor device according to claim 2, characterized in that: The first reflection surface (41) or the first reflection surface (41) and the side surface of the optical chip (3) are tightly covered with a high-reflection adhesive layer (6).

4. The sensor device according to claim 1, characterized in that: The side surface of the second light-transmitting adhesive layer (5) is arranged as a second reflection surface (51) for reflecting edge large-angle light.

5. The sensor device according to claim 4, characterized in that: The second reflective surface (51), the side surface of the first light-transmitting adhesive layer (4) and the side surface of the optical chip (3) are tightly covered with a high-reflective adhesive layer (6).

6. The sensor device according to claim 1, characterized in that The top surface of the second light-transmitting adhesive layer (5) is connected only to the lens (23) or is connected to both the lens (23) and the receiving portion (21).

7. The sensor device according to claim 1, characterized in that: The upper surface of the lens (23) is configured as a flat surface or a curved surface.

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