Horizontal wafer box

Abstract

The utility model discloses a horizontally-placed wafer box, and relates to the technical field of wafer storage containers, the horizontally-placed wafer box comprises a bottom plate and a cover body, the bottom plate is provided with a plurality of first locking pieces at intervals around the center of the bottom plate, and the plurality of first locking pieces define an accommodating cavity for accommodating wafers; the cover body is detachably connected with the bottom plate, the cover body is provided with a plurality of second locking pieces, the first locking pieces correspond to the second locking pieces in a one-to-one mode, and inclined first abutting faces are formed at the ends, facing the center of the cover body, of the second locking pieces; when the cover body is detachably connected with the bottom plate, the first abutting face abuts against the second locking piece, the second locking piece enables the first locking pieces to deform in the direction close to the center of the bottom plate, and therefore the multiple first locking pieces are matched with one another to clamp the wafer in the containing cavity. The wafer box has the advantages that when the wafer is fixed, the movement of the wafer in the radial direction is reduced, and therefore the situation that the wafer is damaged due to collision between the wafer and the wafer box is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of wafer storage containers, and in particular to a horizontally placed wafer box. Background Art

[0002] Wafers are circular sheets made of semiconductors and used to manufacture integrated circuits. However, wafers are fragile and can be easily contaminated or chipped due to collisions during transportation.

[0003] In the related technology, a Chinese patent document with authorization announcement number CN211088229U discloses a multi-wafer horizontally placed wafer box and an isolation ring, including a bottom box and a top cover that are interlocked, at least two buffer pads, and two layers of isolation rings; the buffer pads are respectively attached to the inner sides of the bottom box and the top cover, and the two layers of isolation rings are placed between the upper and lower layers of buffer pads; the isolation ring includes a thicker outer ring and a plurality of thinner inner rings arranged in a concentric circle shape inside the outer ring, and the inner rings are connected to the inner wall of the outer ring through ribs that diverge from the inside to the outside.

[0004] During the storage and transportation of wafers, the buffer pad is under pressure and transmits the pressure to the annular surfaces of the two isolation rings. The thicker outer ring of the isolation ring presses on the thicker outer edge of the non-flat wafer stack, and the central concave part of the wafer is suspended, clamping all wafers to complete the protection action of the entire wafer, thereby achieving effective protection for non-flat thin wafers and solving the problem of fragility of non-flat wafers.

[0005] However, when the related technology fixes the wafer, the clamping force on the wafer is still in the axial direction of the wafer, and the buffer pad can be deformed. When vibration occurs during transportation, the wafer can still move in the radial direction of the wafer, causing the wafer to collide with the wafer box and damage the wafer. Utility Model Content

[0006] In order to reduce the radial movement of the wafer when the wafer is fixed, thereby reducing the damage to the wafer caused by the collision between the wafer and the wafer box, the present application provides a horizontally placed wafer box.

[0007] The present application provides a horizontally placed wafer box, which adopts the following technical solution:

[0008] A horizontally placed wafer box, comprising:

[0009] A bottom plate, wherein a plurality of first locking pieces are arranged at intervals around the center of the bottom plate, and the plurality of first locking pieces form a receiving cavity for receiving the wafer;

[0010] The cover body is detachably connected to the base plate, and the cover body is provided with a plurality of second locking pieces, and a first abutment surface is formed at one end of the second locking piece facing the center of the cover body. When the cover body is connected to the base plate, the second locking piece is located on the outer peripheral side of the accommodating cavity, and the first abutment surface is used to drive the first locking piece to deform toward the center of the accommodating cavity during the connection process between the cover body and the base plate.

[0011] By adopting the above technical solution, when storing wafers, the buffer pad and wafers are first stacked inside the accommodating cavity, and then the bottom plate is connected to the cover body. When the bottom plate is connected to the cover body, the second locking plate abuts against the first locking plate, and the first locking plate is deformed in the direction close to the axis of the accommodating cavity, so that multiple first locking plates abut against the side walls of the wafer at the same time, reducing the radial movement of the wafer. At the same time, the bottom plate and the cover body press the buffer pad to reduce the axial movement of the wafer, thereby reducing the situation where the wafer is damaged due to collision with the wafer box due to vibration during wafer transportation.

[0012] Optionally, a first reinforcement portion is fixedly connected to one end of the first locking piece away from the accommodating cavity, and the first reinforcement portion is fixedly connected to the bottom plate.

[0013] By adopting the above technical solution, the first reinforcement portion can improve the strength of the first locking piece and reduce the possibility of the first locking piece breaking.

[0014] Optionally, the first reinforcement portion and the second locking piece are staggered.

[0015] By adopting the above technical solution, the first reinforcement part and the second locking piece are staggered, thereby reducing the interference between the first reinforcement part and the second locking piece.

[0016] Optionally, when the bottom plate is connected to the cover body, in a direction perpendicular to the bottom plate, a length of the first reinforcing portion is smaller than a length of the first locking piece.

[0017] By adopting the above technical solution, the length of the first reinforcement portion is smaller than that of the first locking piece, so that the portion of the first locking piece away from the first reinforcement portion is easy to deform, while increasing the allowable deformation range of the first locking piece.

[0018] Optionally, the first locking piece is an arc-shaped piece, and the axis of the first locking piece is located at the center of the bottom plate.

[0019] By adopting the above technical solution, the first locking piece is arc-shaped, which increases the area where the first locking piece abuts the wafer, thereby improving the reliability of multiple first locking pieces locking the wafer and further reducing the situation where the wafer is damaged due to collision with the wafer box due to vibration.

[0020] Optionally, the base plate is provided with a snap-fitting portion, and the cover body is provided with a snap-fitting interface for snap-fitting with the snap-fitting portion.

[0021] By adopting the above technical solution, the bottom plate and the cover body are connected by a snap-fitting manner, which facilitates the assembly and disassembly of the bottom plate and the cover body, thereby improving the assembly efficiency and disassembly efficiency of the bottom plate and the cover body.

[0022] Optionally, the clamping portion includes a connecting plate and a clamping joint, and an insertion groove is provided on the inner wall of the card interface. When the clamping portion is clamped with the card interface, the length of the insertion groove is greater than the length of the clamping joint in a direction perpendicular to the base plate.

[0023] By adopting the above technical solution, when assembling the base plate and the cover body, the cover body is moved in the direction close to the base plate, so that the card connector is inserted into the card interface, so that the card connector part and the card interface are engaged with each other to complete the assembly of the base plate and the cover body; when disassembling the cover body and the base plate, a manipulator of the external device passes through the insertion slot and abuts against the card connector, and then the manipulator moves to deform the connecting plate, so that the card connector is separated from the card interface to release the engaging relationship between the card connector part and the card interface. The insertion slot can increase the area of ​​the card connector leaking out, thereby facilitating the manipulator to apply force to the card connector.

[0024] Optionally, the cover body is provided with a clearance groove, a first guide portion is arranged inside the clearance groove, a second abutment surface is formed at one end of the first guide portion away from the center of the cover body, and the second abutment surface is used to drive the card connector to move towards the direction close to the card interface during the connection process between the cover body and the base plate.

[0025] By adopting the above technical solution, when the cover moves toward the direction close to the base plate, the second abutting surface abuts against the card joint, and as the cover moves, the connecting plate gradually deforms, causing the card joint to move toward the direction close to the card interface, so that the card joint is aligned with the card interface, thereby facilitating the card joint to pass through the card interface; when the base plate and the cover are disassembled, the robot disengages the card joint from the card interface, and after the card joint is disengaged from the card interface, the connecting plate restores its deformation, causing the card joint to move to abut against the second abutting surface, and the first guide portion can reduce the travel of the card joint, thereby reducing the amplitude of the vibration of the cover relative to the base plate caused by the impact of the card joint, and reducing the situation in which the cover vibrates and causes the wafer to be damaged when the base plate and the cover are disassembled.

[0026] Optionally, the bottom plate is provided with a guide groove, the guide groove is provided in a direction perpendicular to the bottom plate, the cover body is provided with a second guide portion corresponding to the guide groove, and the second guide portion is used to abut against the inner wall of the clearance groove.

[0027] By adopting the above technical solution, when the cover moves toward the bottom plate, the second guide portion abuts against the inner wall of the guide groove, so that the cover moves toward the bottom plate along the length direction of the guide groove.

[0028] Optionally, the cover body is provided with a clamping groove.

[0029] By adopting the above technical solution, when the robot moves a plurality of stacked wafer boxes one by one, the clamping groove can facilitate the robot to clamp the wafer boxes.

[0030] In summary, the present application includes at least one of the following beneficial effects:

[0031] 1. When storing wafers, firstly, the buffer pad and the wafers are stacked inside the accommodating cavity, and then the bottom plate and the cover body are connected. When the bottom plate and the cover body are connected, the second locking piece abuts against the first locking piece, and the first locking piece is deformed in the direction close to the center of the bottom plate, so that multiple first locking pieces abut against the side walls of the wafers at the same time, reducing the movement of the wafers in the radial direction. At the same time, the bottom plate and the cover body press the buffer pad to reduce the movement of the wafers in the axial direction, thereby reducing the situation where the wafers are damaged due to collision with the wafer box due to vibration during wafer transportation;

[0032] 2. The length of the first reinforcement portion is less than the length of the first locking piece, so that the portion of the first locking piece away from the first reinforcement portion is easy to deform, and the range of deformation allowed by the first locking piece is increased;

[0033] 3. The first locking piece is arc-shaped, which increases the contact area between the first locking piece and the wafer, thereby improving the reliability of multiple first locking pieces locking the wafer, and further reducing the situation where the wafer is damaged due to collision with the wafer box due to vibration;

[0034] 4. When removing the cover body and the base plate, the robot arm of the external device passes through the insertion slot and abuts against the card connector, and then the robot arm moves to deform the connecting plate, thereby causing the card connector to disengage from the card interface to release the card fitting relationship between the card connector and the card interface. The insertion slot can increase the leaking area of ​​the card connector, thereby facilitating the robot arm to apply force to the card connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0036] Figure 2 is a schematic diagram of an exploded structure of a first locking piece used to illustrate an embodiment of the present application;

[0037] Figure 3 It is a schematic diagram of the exploded structure of the second locking piece used to illustrate the embodiment of the present application.

[0038] Explanation of the accompanying drawings: 1. Base plate; 2. Cover body; 3. Accommodating cavity; 4. First locking piece; 5. First reinforcement portion; 6. Second locking piece; 7. First abutting surface; 8. Connecting plate; 9. Card connector; 10. Card interface; 11. Insertion slot; 12. Give way slot; 13. First guide portion; 14. Second abutting surface; 15. Guide slot; 16. Second guide portion; 17. Clamping slot. DETAILED DESCRIPTION

[0039] The following is combined with Figure 1-3 This application is described in further detail.

[0040] The embodiment of the present application discloses a horizontally placed wafer box, referring to Figure 1 The horizontally placed wafer box includes a bottom plate 1 and a cover body 2. The bottom plate 1 and the cover body 2 are detachably connected by a snap connection. The main body of the bottom plate 1 is square. A plurality of first locking pieces 4 are arranged around the center of the top surface of the bottom plate 1. The plurality of first locking pieces 4 form a cylindrical accommodating cavity 3 (combined with Figure 2 ), the receiving cavity 3 is used to place the wafer, and the diameter of the receiving cavity 3 is larger than the diameter of the corresponding wafer. The cover body 2 includes a square cover plate and four side plates, which are arranged along the edge of the cover plate and are perpendicular to the cover plate. When the cover body 2 and the bottom plate 1 are connected, the cover plate and the bottom plate 1 are parallel, and the axis of the receiving cavity 3 passes vertically through the middle of the cover plate. The surface of the cover plate facing the bottom plate 1 is fixedly connected with a plurality of second locking pieces 6 (combined with Figure 3 ), multiple second locking pieces 6 correspond one-to-one to multiple first locking pieces 4, and a first abutment surface 7 is formed at one end of the second locking piece 6 close to the axis of the accommodating cavity 3, and the first abutment surface 7 is inclined to the axis of the accommodating cavity 3.

[0041] Two buffer pads and multiple wafers are stacked inside the accommodating cavity 3 so that the buffer pads are located on both sides of the multiple wafers. When the cover body 2 is clamped with the base plate 1, the second locking plate 6 causes the first locking plate 4 to deform in the direction close to the axis of the accommodating cavity 3, so that the multiple first locking plates 4 jointly clamp the side walls of the wafers inside the accommodating cavity 3. At the same time, the cover body 2 and the base plate 1 jointly clamp the buffer pads, thereby fixing the wafers inside the accommodating cavity 3, reducing vibration during transportation that may cause the wafers to collide with the wafer box, causing damage to the wafers.

[0042] The diameter of the accommodating cavity 3 is larger than the diameter of the corresponding wafer, which facilitates the operator or external equipment to place the wafer inside the accommodating cavity 3 and reduces the possibility of the wafer being scratched against the first locking piece 4 when entering the accommodating cavity 3, causing damage to the wafer.

[0043] Reference Figure 2The four corners of the bottom plate 1 are fixedly connected with connecting plates 8 in a direction perpendicular to the bottom plate 1. A reinforcing rib is fixedly connected between the side wall of the connecting plate 8 and the bottom plate 1. A clamping joint 9 is fixedly connected to the end of the connecting plate 8 away from the bottom plate 1. The cross section of the clamping joint 9 is triangular, and the edge of the clamping joint 9 is rounded. Guide grooves 15 are provided on the four side walls of the bottom plate 1.

[0044] Reference Figure 2 and Figure 3 , the four corners of the cover plate are provided with card interfaces 10, which penetrate the cover plate in a direction perpendicular to the cover plate, and the four card interfaces 10 are corresponding to the four card connectors 9 for card fitting. The four corners of the cover body 2 are provided with clearance grooves 12 in a direction perpendicular to the cover plate, and the inner wall of the clearance groove 12 is fixedly connected with a first guide portion 13 in a direction perpendicular to the cover plate, and the first guide portion 13 is located between the card interface 10 and the center of the cover plate. A second abutting surface 14 is formed at one end of the first guide portion 13 close to the card interface 10. When the cover body 2 is clamped with the bottom plate 1, the second abutting surface 14 is inclined to the axial direction of the accommodating cavity 3, so that when the cover body 2 is clamped with the bottom plate 1, the second abutting surface 14 gradually approaches the card interface 10 in a direction away from the bottom plate 1. An insertion groove 11 is provided on the cover body 2 near the card interface 10, and the insertion groove 11 is connected with the card interface 10. The cross section of the insertion groove 11 is semicircular, and the axis is perpendicular to the center line of the cover body 2. The four side walls of the cover body 2 are fixedly connected with second guide parts 16, which are arranged in a direction perpendicular to the cover body 2, and the four second guide parts 16 correspond to the four guide grooves 15. The four side walls of the cover body 2 are all provided with clamping grooves 17.

[0045] In other embodiments of the present application, the cross-sectional shape of the insertion slot 11 may also be a rectangle or other shapes, as long as the leakage area of ​​the card connector 9 is increased to facilitate the robot arm to apply force to the card connector 9 .

[0046] When the base plate 1 is snapped with the cover body 2, the cover body 2 moves in a direction close to the base plate 1. During the movement of the cover body 2, the second abutting surface 14 abuts against the card connector 9, and the connecting plate 8 undergoes elastic deformation in a direction away from the accommodating cavity 3, so that the card connector 9 moves along the second abutting surface 14 in a direction close to the card interface 10 until the card connector 9 passes through the card interface 10. The connecting plate 8 restores its elastic deformation, so that the card connector 9 is snap-fitted with the card interface 10, thereby fixing the cover body 2 to the base plate 1, and during the movement of the cover body 2, the plurality of second guide portions 16 are inserted into the plurality of guide grooves 15 one by one, and the second guide portions 16 abut against the inner walls of the guide grooves 15, so that the cover body 2 moves in a direction perpendicular to the base plate 1, and when the cover body 2 moves, the center of the cover body 2 is always aligned with the center of the base plate 1, so that the plurality of card connectors 9 are matched one by one with the plurality of card interfaces 10, and the cover body 2 moves in a direction perpendicular to the base plate 1, thereby reducing the situation where the cover body 2 shakes and causes damage to the wafer when the cover body 2 moves.

[0047] When the bottom plate 1 and the cover 2 need to be disassembled, the manipulator of the external device is inserted into the insertion slot 11, and moves in a direction perpendicular to the center line of the cover 2 in a direction away from the center line of the cover 2, so that the connecting plate 8 is elastically deformed in a direction away from the accommodating cavity 3, and the connecting plate 8 drives the card connector 9 to move in a direction away from the accommodating cavity 3, so that the card connector 9 is separated from the card interface 10, thereby releasing the card connection relationship between the bottom plate 1 and the cover 2. After the card connector 9 is separated from the card interface 10, the manipulator passes through the insertion slot 11, so that the connecting plate 8 restores its elastic deformation, and the connecting plate 8 drives the card connector 9 to move, and the card connector 9 abuts against the second abutting surface 14. The second abutting surface 14 can reduce the travel of the connecting plate 8 to restore the deformation, reduce the impact of the card connector 9 on the cover head, thereby reducing the amplitude of the vibration of the cover 2 relative to the bottom plate 1, and reduce the situation where the cover 2 vibrates and causes the cover 2 to damage the wafer when the bottom plate 1 and the cover 2 are disassembled. Since the second abutting surface 14 is inclined, when the connecting plate 8 recovers its elastic deformation, the cover body 2 moves away from the bottom plate 1 in a direction perpendicular to the bottom plate 1 , thereby facilitating the operator or external equipment to move the cover body 2 .

[0048] The insertion groove 11 can increase the leakage area of ​​the card connector 9, thereby making it easier for the robot to apply force to the card connector 9.

[0049] Reference Figure 3 The length direction of the first locking piece 4 is perpendicular to the bottom plate 1. The first locking piece 4 is arc-shaped, and its axis coincides with the axis of the accommodating cavity 3. The first locking piece 4 is fixedly connected to the bottom plate 1. A plurality of first reinforcing portions 5 are fixedly connected between an end surface of the first locking piece 4 away from the center of the bottom plate 1 and the bottom plate 1. The first reinforcing portions 5 are staggered with the second locking pieces 6. When the bottom plate 1 is connected to the cover body 2, in the direction perpendicular to the bottom plate 1, the length of the first reinforcing portion 5 is less than the length of the first locking piece 4.

[0050] In the present application, the number of the first reinforcement parts 5 is two. In other embodiments of the present application, the number of the first reinforcement parts 5 may be three, four or other numbers.

[0051] When the cover body 2 is engaged with the base plate 1, the cover body 2 moves toward the base plate 1. During the movement of the cover body 2, the first abutting surface 7 abuts against the first locking piece 4. Since the first abutting surface 7 is inclined, the first locking piece 4 is deformed toward the side close to the accommodating cavity 3 as the cover body 2 moves. When the cover body 2 is engaged with the base plate 1, multiple first locking pieces 4 simultaneously press against the side wall of the wafer inside the accommodating cavity 3 to fix the wafer along the circumference of the wafer. At the same time, the cover body 2 and the base plate 1 press the two buffer pads at both ends of the wafer to fix the wafer along the axial direction of the wafer, thereby reducing the situation where the wafer is damaged due to collision with the wafer box due to vibration during wafer transportation.

[0052] The first reinforcement portion 5 can improve the strength of the first locking piece 4 and reduce the possibility of the first locking piece 4 breaking.

[0053] The first reinforcement portion 5 and the second locking piece 6 are staggered to reduce the interference between the first reinforcement portion 5 and the second locking piece 6 .

[0054] The length of the first reinforcement portion 5 is smaller than that of the first locking piece 4 , so that the end of the first locking piece 4 away from the first reinforcement portion 5 is easily deformed, and the deformation range of the first locking piece 4 is increased.

[0055] The implementation principle of a horizontally placed wafer box in an embodiment of the present application is as follows: when the cover body 2 is clamped with the base plate 1, the second locking plate 6 causes the first locking plate 4 to deform toward the center of the base plate 1, so that multiple first locking plates 4 jointly clamp the side wall of the wafer inside the accommodating cavity 3 to fix the wafer along the radial direction of the wafer. At the same time, the cover body 2 and the base plate 1 jointly clamp the buffer pad to fix the wafer along the axial direction of the wafer, thereby improving the reliability of fixing the wafer and reducing the vibration during transportation that causes the wafer to collide with the wafer box, resulting in damage to the wafer.

[0056] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A horizontally placed wafer box, characterized in that: include: A bottom plate (1), the bottom plate (1) having a plurality of first locking pieces (4) arranged at intervals around the center of the top surface thereof, the plurality of first locking pieces (4) forming a receiving cavity (3) for receiving a wafer; A cover body (2), wherein the cover body (2) is detachably connected to the base plate (1), the cover body (2) is provided with a plurality of second locking pieces (6), one end of the second locking piece (6) facing the center of the cover body (2) is formed with a first abutment surface (7), when the cover body (2) is connected to the base plate (1), the second locking piece (6) is located on the outer peripheral side of the accommodating cavity (3), and the first abutment surface (7) is used to drive the first locking piece (4) to deform toward the center of the accommodating cavity (3) during the connection process between the cover body (2) and the base plate (1).

2. The horizontally placed wafer box according to claim 1, characterized in that: A first reinforcement portion (5) is fixedly connected to one end of the first locking piece (4) away from the accommodating cavity (3), and the first reinforcement portion (5) is fixedly connected to the bottom plate (1).

3. The horizontally placed wafer box according to claim 2, characterized in that: The first reinforcement portion (5) and the second locking piece (6) are arranged in a staggered manner.

4. The horizontally placed wafer box according to claim 2, characterized in that: When the bottom plate (1) is connected to the cover body (2), in a direction perpendicular to the bottom plate (1), the length of the first reinforcement portion (5) is smaller than the length of the first locking piece (4).

5. The horizontally placed wafer box according to claim 1, characterized in that: The first locking piece (4) is in the shape of an arc-shaped piece, and the axis of the first locking piece (4) is located at the center of the bottom plate (1).

6. The horizontally placed wafer box according to claim 1, characterized in that: The bottom plate (1) is provided with a clamping portion, and the cover body (2) is provided with a clamping interface (10) for clamping and cooperating with the clamping portion.

7. The horizontally placed wafer box according to claim 6, characterized in that: The clamping portion comprises a connecting plate (8) and a clamping joint (9); an insertion groove (11) is provided on an inner wall of the clamping interface (10); when the clamping portion is clamped with the clamping interface (10), the length of the insertion groove (11) is greater than the length of the clamping joint (9) in a direction perpendicular to the bottom plate (1).

8. The horizontally placed wafer box according to claim 7, characterized in that: The cover body (2) is provided with a clearance groove (12), a first guide portion (13) is arranged inside the clearance groove (12), a second abutment surface (14) is formed at one end of the first guide portion (13) away from the center of the cover body (2), and the second abutment surface (14) is used to drive the card connector (9) to move in a direction close to the card interface (10) during the connection process between the cover body (2) and the base plate (1).

9. The horizontally placed wafer box according to claim 1, characterized in that: The bottom plate (1) is provided with a guide groove (15), the guide groove (15) being provided in a direction perpendicular to the bottom plate (1), the cover body (2) being provided with a second guide portion (16) corresponding to the guide groove (15), the second guide portion (16) being used for abutting against the inner wall of the clearance groove (12).

10. The horizontally placed wafer box according to claim 1, characterized in that: The cover body (2) is provided with a clamping groove (17).

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