Electronic device cutting device

Abstract

The utility model provides an electronic device cutting device, which relates to the technical field of electronic device cutting and comprises a cutting device, a sliding door arranged on two sides of the outer end of the cutting device and connected through a sliding rail in a sliding mode, a transparent observation window installed on the sliding door, and two supporting plates arranged on one side inside the cutting device and used for placing a semiconductor chip. According to the electronic device cutting device, a cut semiconductor chip is moved to the bottom of the grinding assembly through the moving assembly, the cutting part of the semiconductor chip is conveniently ground, the semiconductor chip does not need to be detached and replaced to the grinding equipment after being cut, operation is convenient and fast, the time and labor are saved, and the working efficiency is improved. The cutting working efficiency of the semiconductor chip is improved, burrs of the cutting part of the semiconductor chip can be polished cleanly through the polishing assembly, the purpose of cutting and polishing integrated treatment of the semiconductor chip is achieved, and then the cutting speed of the semiconductor chip is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic device cutting, in particular to an electronic device cutting device. Background Art

[0002] Electronic device cutting is a sophisticated manufacturing process, which is mainly used to cut electronic devices or materials such as semiconductor materials, ceramics, optical fibers, etc. into thin slices or specific shapes. This process is crucial to the precision and quality of electronic devices because it determines the performance and reliability of the devices. Cutting technology is usually used to manufacture a variety of electronic devices such as semiconductor chips, solar cells, displays, sensors, etc. However, the existing electronic device cutting devices still have certain defects and shortcomings in actual use. When cutting semiconductor chips, it is necessary to first install the semiconductor chip on the support plate of the cutting equipment, support it with the support plate, and clamp and fix the two ends of the semiconductor chip to prevent displacement during cutting. After the semiconductor chip is cut, the burrs on the cut part need to be polished clean, but the existing cutting equipment only has a cutting function. After cutting the semiconductor chip, the cut semiconductor chip is disassembled and taken out from the inside of the cutting equipment, and then the semiconductor chip is fixed on the polishing equipment for polishing. The operation is cumbersome, time-consuming and labor-intensive, which reduces the cutting efficiency of semiconductor chips. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide an electronic device cutting device, which moves the cut semiconductor chip to the bottom of the grinding component through a moving component. The semiconductor chip does not need to be disassembled and moved to the grinding equipment after cutting. The operation is convenient, and the burrs of the cut part of the semiconductor chip can be polished clean at the same time through the grinding component, so as to achieve the purpose of integrated processing of semiconductor chip cutting and grinding.

[0004] The technical problem to be solved by the utility model is achieved by adopting the following technical solutions:

[0005] An electronic device cutting device comprises: a cutting device, a sliding door slidably connected by slide rails on both sides of the outer end of the cutting device, a transparent observation window installed on the sliding door, two support plates for placing semiconductor chips arranged on one side of the interior of the cutting device, a polishing component arranged at the top end of the interior of the cutting device, used for polishing the semiconductor chips, and a moving component arranged at the bottom end of the interior of the cutting device, used for moving and adjusting the positions of the two support plates.

[0006] According to a further preferred embodiment, the grinding assembly includes: an electric push rod b arranged at the top end of the cutting device, a fixing frame b installed at the bottom of the electric push rod b, a servo motor b installed inside the fixing frame b, and two grinding discs installed on the motor shaft of the servo motor b.

[0007] According to a further preferred solution, the movable component includes: a chassis installed on one side of the outer end of the cutting device, a forward and reverse motor fixedly installed inside the chassis, a breathable net installed on the top of the chassis, a threaded screw installed on one end of the forward and reverse motor, a connecting head a installed on the middle of the bottom ends of the two support plates, a screw hole b opened inside the connecting head a, the threaded screw passing through the interior of the cutting device and being threadedly connected to the screw hole b, and one end of the threaded screw is rotatably connected to the inner wall of the cutting device through a bearing.

[0008] According to a further preferred solution, a screw hole a is provided in the middle of the top ends of the two support plates, a screw rod is threadedly connected inside the screw hole a, a clamping block is installed at the bottom end of the screw rod, and a hand crank wheel is installed at the top end of the screw rod.

[0009] In a further preferred solution, an electric push rod a is provided on the top of the cutting device, a fixing frame a is installed at the bottom of the electric push rod a, a servo motor a is installed inside the fixing frame a, and a cutting blade is installed on the motor shaft of the servo motor a.

[0010] According to a further preferred scheme, a movable box is installed on both sides of the top of the cutting equipment, and the electric push rod a and the electric push rod b are located inside the movable box, a connecting head b is installed on the electric push rod a and the electric push rod b, an electric push rod c is installed on the outer end of the movable box, and the electric push rod c passes through the movable box and is fixedly connected to the connecting head b, sliding grooves are respectively opened on both sides of the interior of the movable box, and sliders slidably connected to the sliding grooves are respectively installed on both sides of the outer end of the connecting head b.

[0011] According to a further preferred solution, fixing rods are respectively installed on both sides of the outer end of the support plate, a cleaning brush is installed at the bottom of the fixing rod, and the cleaning brush is fitted with the top of the threaded screw, and a collection box is provided at the bottom of the cleaning brush.

[0012] The beneficial effects of the utility model are:

[0013] (1) The movable assembly of the utility model can move the cut semiconductor chip to the bottom of the grinding assembly, which is convenient for grinding the cut part of the semiconductor chip. After cutting, the semiconductor chip does not need to be disassembled and moved to the grinding equipment. The operation is convenient, which saves time and effort and improves the cutting efficiency of the semiconductor chip.

[0014] (2) The grinding assembly of the utility model can simultaneously grind away the burrs on the cut part of the semiconductor chip, thereby achieving the purpose of integrated processing of semiconductor chip cutting and grinding, thereby accelerating the cutting speed of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0016] Figure 2 It is an overall cross-sectional schematic diagram of the utility model.

[0017] Figure 3 This is a schematic diagram of the internal structure of the cutting device of the present utility model.

[0018] Figure 4 This is a schematic diagram of the support plate structure of the utility model.

[0019] Figure 5 This is a schematic diagram of the cutting blade structure of the utility model.

[0020] Figure 6 It is a schematic diagram of the structure of the grinding disc of the utility model.

[0021] Figure 7 For the utility model Figure 1 Enlarged structural diagram at A in the middle.

[0022] Figure 1-Figure 7 In: 1. Cutting equipment; 101. Sliding door; 102. Support plate; 103. Screw hole a; 104. Screw rod; 105. Clamp block; 106. Hand wheel; 2. Electric push rod a; 201. Fixing frame a; 202. Servo motor a; 203. Cutting blade; 3. Electric push rod b; 301. Fixing frame b; 302. Servo motor b; 303. Grinding disc; 4. Chassis; 401. Forward and reverse motor; 402. Breathable net; 403. Threaded screw; 5. Connector a; 501. Screw hole b; 6. Moving box; 601. Connector b; 602. Electric push rod c; 603. Slide; 604. Slider; 7. Fixing rod; 701. Cleaning brush; 702. Collection box. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work shall fall within the scope of protection of the present application.

[0024] The present application is described in detail below with reference to the accompanying drawings and specific implementation methods.

[0025] Example 1

[0026] like Figure 1-Figure 7As shown, an electronic device cutting device includes: a cutting device 1, a sliding door 101 arranged on both sides of the outer end of the cutting device 1 and slidably connected by a slide rail, a transparent observation window is installed on the sliding door 101, two support plates 102 for placing semiconductor chips are arranged on one side of the inside of the cutting device 1, a grinding component arranged at the top end of the inside of the cutting device 1, used for grinding the semiconductor chips, and a moving component arranged at the bottom end of the inside of the cutting device 1, used for moving and adjusting the positions of the two support plates 102.

[0027] Among them, reference Figure 2-Figure 4 A screw hole a103 is provided in the middle of the top of the two support plates 102, a screw rod 104 is threadedly connected inside the screw hole a103, a clamping block 105 is installed at the bottom end of the screw rod 104, and a hand-cranked wheel 106 is installed at the top end of the screw rod 104.

[0028] When cutting a semiconductor chip, push open the sliding door 101 of the cutting device 1, place the semiconductor chip between the two support plates 102, so that the two support plates 102 hold the two ends of the semiconductor chip, hold the hand wheel 106 by hand and turn the screw 104 clockwise, so that the screw 104 and the screw hole a103 rotate and move downward, driving the clamp 105 to move onto the semiconductor chip, and then fix the semiconductor chip on the support plate 102 to prevent displacement when cutting the semiconductor chip.

[0029] Among them, reference Figure 2 and Figure 5 An electric push rod a2 is provided on the top of the cutting device 1, a fixing frame a201 is installed at the bottom of the electric push rod a2, a servo motor a202 is installed inside the fixing frame a201, and a cutting blade 203 is installed on the motor shaft of the servo motor a202.

[0030] After the semiconductor chip is fixedly clamped on the two support plates 102, the semiconductor chip is located at the bottom of the cutting blade 203. The electric push rod a2 is started to push the fixing frame a201 to move downward. The fixing frame a201 drives the servo motor a202 and the cutting blade 203 to move downward, so that the cutting blade 203 contacts the semiconductor chip. The servo motor a202 is started again, and the servo motor a202 drives the motor shaft to drive the cutting blade 203 to rotate. The semiconductor chip is cut and processed by the cutting blade 203, and the semiconductor chip is cut and separated, which is convenient for the production of semiconductor chips.

[0031] Among them, reference Figure 2-Figure 4The moving component includes: a chassis 4 installed on one side of the outer end of the cutting device 1, a forward and reverse motor 401 is fixedly installed inside the chassis 4, a breathable net 402 is installed on the top of the chassis 4, a threaded screw 403 installed on one end of the forward and reverse motor 401, a connecting head a5 installed in the middle of the bottom ends of the two support plates 102, a screw hole b501 is opened inside the connecting head a5, the threaded screw 403 passes through the inside of the cutting device 1 and is threadedly connected to the screw hole b501, and one end of the threaded screw 403 is rotatably connected to the inner wall of the cutting device 1 through a bearing.

[0032] After the semiconductor chip is cut and separated, the forward and reverse motor 401 is started to rotate forward. The forward and reverse motor 401 drives the threaded screw 403 to rotate at the screw hole b501 inside the connector a5, driving the connector a5 to drive the two support plates 102 to move toward the grinding disk 303. When the two support plates 102 move to the bottom of the grinding disk 303, two semiconductor chips will be formed when the semiconductor chip is cut and separated, so that the cut part of the semiconductor chip is aligned with the two grinding disks 303 and is on the same vertical line. At this time, the forward and reverse motor 401 is turned off to facilitate the grinding of the cut part of the semiconductor chip. After cutting, the semiconductor chip does not need to be disassembled and transferred to the grinding equipment. It is easy to operate, saves time and effort, and improves the cutting efficiency of the semiconductor chip.

[0033] When the forward and reverse motor 401 drives the threaded screw 403 to rotate, one end of the threaded screw 403 is rotatably connected to the inner wall of the cutting device 1 through a bearing, which ensures the normal rotation of the threaded screw 403 while avoiding wear between the threaded screw 403 and the inner wall of the cutting device 1, thereby preventing damage to the threaded screw 403.

[0034] Among them, reference Figure 2 A fixing rod 7 is installed on both sides of the outer end of the support plate 102, a cleaning brush 701 is installed at the bottom of the fixing rod 7, and the cleaning brush 701 is in contact with the top of the threaded screw 403, and a collecting box 702 is provided at the bottom of the cleaning brush 701.

[0035] When the connecting head a5 drives the two support plates 102 to move left and right on the threaded screw 403, it will also drive the fixed rod 7 and the cleaning brush 701 installed on both sides of the outer end of the support plate 102 to move left and right. Since the cleaning brush 701 is located at the top of the threaded screw 403 and fits against it, the cleaning brush 701 can clean up the cut debris and grinding powder on the threaded screw 403 during its movement, preventing the threaded screw 403 and the screw hole b501 from forming resistance when rotating, thereby avoiding the debris and powder from causing wear of the threaded screw 403 and the screw hole b501.

[0036] After the cutting debris and grinding powder on the threaded screw 403 are cleaned, the debris and powder will fall into the collection box 702 for collection and storage, making it easy to clean them.

[0037] Example 2

[0038] Based on Example 1, Figure 2 and Figure 6 The grinding assembly includes: an electric push rod b3 arranged at the top of the cutting device 1, a fixing frame b301 installed at the bottom of the electric push rod b3, a servo motor b302 installed inside the fixing frame b301, and two grinding discs 303 installed on the motor shaft of the servo motor b302.

[0039] After the semiconductor chip is cut and separated and moved to the bottom of the grinding disk 303, the two grinding disks 303 are opposite to the cutting part of the semiconductor chip. At this time, the electric push rod b3 is started to push the fixed frame b301 to move downward, and the fixed frame b301 drives the servo motor b302 and the two grinding disks 303 to move downward, so that the two grinding disks 303 contact the cutting part of the semiconductor chip, and then the servo motor b302 is started to drive the motor shaft to drive the two grinding disks 303 to rotate. The burrs on the cutting part of the semiconductor chip are polished clean by the two grinding disks 303 at the same time, so as to achieve the purpose of integrated processing of cutting and polishing of semiconductor chips, thereby accelerating the cutting speed of semiconductor chips.

[0040] Among them, reference Figure 1-Figure 2 A moving box 6 is installed on both sides of the top of the cutting equipment 1, and the electric push rods a2 and the electric push rods b3 are located inside the moving box 6, and a connecting head b601 is installed on the electric push rods a2 and the electric push rods b3, an electric push rod c602 is installed on the outer end of the moving box 6, and the electric push rod c602 penetrates the moving box 6 and is fixedly connected to the connecting head b601, and sliding grooves 603 are respectively opened on both sides of the inside of the moving box 6, and sliders 604 slidably connected to the sliding grooves 603 are respectively installed on both sides of the outer end of the connecting head b601.

[0041] When the electric push rod a2 pushes the fixed frame a201, the servo motor a202 and the cutting blade 203 to move downward to cut the semiconductor chip, the electric push rod c602 is started at the same time to push the connector b601 and the electric push rod a2 to move back and forth inside the movable box 6, so that the cutting blade 203 can move back and forth to complete the cutting and cutting of the semiconductor chip.

[0042] When the electric push rod b3 pushes the fixed frame b301, the servo motor b302 and the two grinding discs 303 to move downward to the cutting part of the semiconductor chip for grinding, the electric push rod c602 is started at the same time to push the connecting head b601 and the electric push rod b3 to move back and forth inside the moving box 6, so that the two grinding discs 303 can move back and forth to grind the cutting part of the semiconductor chip clean.

[0043] When the electric push rod a2 and the electric push rod b3 move back and forth inside the moving box 6, the sliders 604 on both sides of the outer end of the connecting head b601 are slidably connected with the slide groove 603, maintaining the stability of the electric push rod a2 and the electric push rod b3 during movement, thereby ensuring the cutting stability of the cutting blade 203 and the grinding stability of the grinding disc 303.

[0044] When the electric push rod a, servo motor a, electric push rod b, servo motor b, forward and reverse motor and electric push rod c are in use, a control panel is fixedly installed on the outside of the cutting equipment 1, and the electric push rod a, servo motor a, electric push rod b, servo motor b, forward and reverse motor and electric push rod c are connected to the control panel through wires, and the control panel is powered by an external power cord, so that the control panel, electric push rod a, servo motor a, electric push rod b, servo motor b, forward and reverse motor and electric push rod c are powered on and used. Control buttons are provided on the control panel to control the start and stop of the electric push rod a, servo motor a, electric push rod b, servo motor b, forward and reverse motor and electric push rod c, as well as to control the up and down movement of the electric push rod a and the electric push rod b, and to control the forward and backward movement of the electric push rod c. The control procedures involved in the utility model can be implemented by those skilled in the art according to the same or similar principles in the prior art, and this part is not the innovation of the utility model.

[0045] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0046] The above is a detailed introduction to an electronic device cutting device provided in an embodiment of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device cutting device, characterized in that: include: Cutting equipment (1); Sliding doors (101) are arranged on both sides of the outer ends of the cutting device (1) and are slidably connected via sliding rails, and a transparent observation window is installed on the sliding door (101); Two support plates (102) arranged on one side of the interior of the cutting device (1) for placing semiconductor chips; A grinding component disposed at the top of the cutting device (1) and used for grinding semiconductor chips; A moving component arranged at the bottom end of the cutting device (1) is used to move and adjust the positions of the two support plates (102).

2. The electronic device cutting device according to claim 1, characterized in that: The grinding assembly comprises: An electric push rod b (3) disposed at the top end of the cutting device (1); A fixing frame b (301) installed at the bottom of the electric push rod b (3); A servo motor b (302) installed inside the fixing frame b (301); Two grinding discs (303) are mounted on the motor shaft of the servo motor b (302).

3. The electronic device cutting device according to claim 1, characterized in that: The mobile assembly comprises: A chassis (4) installed on one side of the outer end of the cutting device (1), a forward and reverse motor (401) being fixedly installed inside the chassis (4), and a breathable net (402) being installed on the top of the chassis (4); A threaded screw (403) mounted on one end of the forward and reverse motor (401); A connector a (5) installed at the middle of the bottom ends of the two support plates (102); A screw hole b (501) is provided inside the connector a (5), the threaded screw rod (403) passes through the inside of the cutting device (1) and is threadedly connected to the screw hole b (501), and one end of the threaded screw rod (403) is rotatably connected to the inner wall of the cutting device (1) via a bearing.

4. The electronic device cutting device according to claim 1, characterized in that: A screw hole a (103) is provided in the middle of the top ends of the two support plates (102), a screw rod (104) is threadedly connected inside the screw hole a (103), a clamping block (105) is installed at the bottom end of the screw rod (104), and a hand-cranked wheel (106) is installed at the top end of the screw rod (104).

5. The electronic device cutting device according to claim 2, characterized in that: The cutting device (1) is provided with an electric push rod a (2) at the top, a fixing frame a (201) is installed at the bottom of the electric push rod a (2), a servo motor a (202) is installed inside the fixing frame a (201), and a cutting blade (203) is installed on the motor shaft of the servo motor a (202).

6. The electronic device cutting device according to claim 5, characterized in that: A movable box (6) is installed on both sides of the top of the cutting device (1), and the electric push rod a (2) and the electric push rod b (3) are located inside the movable box (6), and a connector b (601) is installed on the electric push rod a (2) and the electric push rod b (3). An electric push rod c (602) is installed on the outer end of the movable box (6), and the electric push rod c (602) passes through the movable box (6) and is fixedly connected to the connector b (601). Slide grooves (603) are respectively opened on both sides of the interior of the movable box (6), and sliders (604) slidably connected to the slide grooves (603) are respectively installed on both sides of the outer end of the connector b (601).

7. The electronic device cutting device according to claim 3, characterized in that: Fixed rods (7) are respectively installed on both sides of the outer end of the support plate (102), a cleaning brush (701) is installed at the bottom of the fixed rod (7), and the cleaning brush (701) is in contact with the top of the threaded screw (403), and a collection box (702) is provided at the bottom of the cleaning brush (701).

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