Silicon wafer conveying device

Abstract

The utility model provides a silicon wafer conveying device which comprises a conveying line, a defective product storage table, a defective product removing assembly and a patch repairing assembly, the conveying line is used for conveying silicon wafers, the conveying line is provided with a defective product removing position and a patch repairing position, and the patch repairing position is located at the downstream of the defective product removing position. The defective product storage table is arranged on the side portion of the conveying line and arranged side by side with the defective product removing position, the defective product removing assembly is used for transferring unqualified silicon wafers at the defective product removing position to the defective product storage table, and the wafer patching assembly is arranged on the downstream of the defective product removing assembly at intervals. And the patch repairing assembly can take away the qualified silicon wafers at the patch repairing position and supplement the qualified silicon wafers into the patch repairing position. The silicon wafer conveying device provided by the utility model can be used for removing defective products and repairing a row of silicon wafers, and the defective product removing efficiency and the repairing efficiency of the silicon wafer conveying device are higher.

Description

Technical Field

[0001] The utility model relates to the technical field of automation, in particular to a silicon wafer conveying device. Background Art

[0002] During the manufacturing process of photovoltaic cells, silicon wafers will be placed in a flower basket. Before the silicon wafers are placed in the flower basket, unqualified silicon wafers need to be removed. For example, in the patent document with publication number CN117116826A, the device transports two silicon wafers side by side. If one of the silicon wafers is unqualified, the waste discharge and material replenishment mechanism will take away the unqualified silicon wafer and replace it with a qualified silicon wafer that was temporarily stored before. In this way, two qualified silicon wafers are always sent to the flower basket later, and the mechanism for sending silicon wafers into the flower basket can send a whole row of silicon wafers into the flower basket each time, which can ensure that the silicon wafers in the flower basket are all qualified products.

[0003] However, in the above patent document, the patch storage platform for temporarily storing qualified silicon wafers and the defective box for temporarily storing unqualified silicon wafers are arranged side by side, and the rejection of unqualified silicon wafers and the patching of qualified silicon wafers are realized at the same position and are realized by the same module. This results in low efficiency in patching silicon wafers and rejecting defective products. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a silicon wafer conveying device, which is conducive to improving the efficiency of patching silicon wafers and the efficiency of rejecting defective products.

[0005] According to an embodiment of the utility model, the silicon wafer conveying device includes: a conveying line for conveying silicon wafers, the conveying line having a defective rejection position and a patch position, the patch position being located downstream of the defective rejection position; a defective storage table, the defective storage table being arranged on the side of the conveying line and arranged side by side with the defective rejection position; a defective rejection component for transferring unqualified silicon wafers at the defective rejection position to the defective storage table; and a patch component, the patch component being arranged at intervals downstream of the defective rejection component, the patch component being capable of taking away qualified silicon wafers at the patch position and filling qualified silicon wafers into the patch position.

[0006] The silicon wafer conveying device according to the embodiment of the utility model has at least the following beneficial effects: the silicon wafer conveying device of the utility model has a defective rejection position and a patch position which are two different positions, and the two positions are arranged along the conveying direction of the conveyor line, and the patch assembly and the defective rejection assembly are independent of each other. Accordingly, when one row of silicon wafers is patched at the patch position, another row of silicon wafers can be rejected at the defective rejection position. Therefore, the silicon wafer conveying device of the utility model makes the two processes of defective rejection and patching more in line with the mode of assembly line production, and the device shortens the production cycle of defective rejection and patching, thereby improving the efficiency of patching and the efficiency of defective rejection.

[0007] According to some embodiments of the utility model, the defective product rejection component includes a first linear module and an adsorption unit that are interconnected, the adsorption unit includes at least one first suction cup, the first suction cup can adsorb the silicon wafer, and the first linear module can drive the first suction cup to move horizontally, so that the first suction cup can move back and forth between the defective product rejection position and the defective product storage table.

[0008] According to some embodiments of the utility model, the patch assembly includes a second linear module and at least one second suction cup connected to each other, the second suction cup can adsorb the silicon wafer, and the second linear module can drive the second suction cup to move horizontally, so that the second suction cup moves back and forth between the patch position and the avoidance position; wherein the avoidance position is located outside the conveying line, and the avoidance position and the patch position are arranged side by side.

[0009] According to some embodiments of the utility model, the conveyor line is configured as follows: the number of silicon wafers entering the defective product rejection position each time is N, and the N silicon wafers entering the defective product rejection position are arranged side by side, and N is an integer not less than 2; there are N first suction cups, each of which is used to adsorb one silicon wafer, and all the first suction cups are arranged side by side.

[0010] According to some embodiments of the present invention, N≥3.

[0011] According to some embodiments of the present invention, the patch assembly includes (N-1) second suction cups, each of the second suction cups is used to absorb one of the silicon wafers, and all of the second suction cups are arranged side by side.

[0012] According to some embodiments of the utility model, the defective rejection component includes at least one first suction cup, which can absorb the silicon wafer, and the first suction cup is set as a Bernoulli suction cup; and / or the patch component includes at least one second suction cup, which can absorb the silicon wafer, and the second suction cup is set as a Bernoulli suction cup.

[0013] According to some embodiments of the utility model, the defective product storage platform includes: a bottom plate, which is inclined relative to a horizontal plane; a partition plate, at least three of which are arranged vertically, the bottom ends of the partition plates are connected to the bottom plate, and two adjacent partition plates are arranged at intervals; a blocking plate, which is connected to the bottom end of the bottom plate, and the blocking plate, the bottom plate and the two partition plates jointly define a groove for accommodating the silicon wafer, and the defective product storage platform has at least two of the grooves.

[0014] According to some embodiments of the utility model, the conveyor line is configured as follows: the number of silicon wafers entering the defective product rejection position each time is N, and the N silicon wafers entering the defective product rejection position at the same time are arranged side by side, and N is an integer not less than 2; the number of the grooves is also N, and all the grooves are arranged side by side, and the defective product rejection component includes a first linear module and an adsorption unit connected to each other, and the adsorption unit includes N first suction cups arranged side by side, and the first linear module can drive the adsorption unit to move above the defective product storage table, so that each of the first suction cups is correspondingly located above one of the grooves.

[0015] According to some embodiments of the utility model, the silicon wafer conveying device also includes a flower basket and a detection module, the flower basket is used to accommodate silicon wafers, and the detection module is used to detect whether the silicon wafers are qualified; along the direction of conveying the silicon wafers on the conveying line, the detection module, the defective rejection component, the patch component and the flower basket are arranged in sequence.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0018] Figure 1 A top view of a silicon wafer conveying device according to an embodiment of the utility model;

[0019] Figure 2 is a three-dimensional diagram of a silicon wafer conveying device carrying silicon wafers;

[0020] Figure 3 A stereoscopic view of components being rejected for defective products;

[0021] Figure 4 is a top view of the patch assembly;

[0022] Figure 5 This is a three-dimensional diagram of a defective product storage table;

[0023] Figure 6 It is a simplified schematic diagram of a silicon wafer conveying device in the prior art.

[0024] Reference numerals:

[0025] 100-wafer conveying device, 101-conveyor line, 102-defective product rejection position, 103-defective product rejection assembly, 104-patch position, 105-patch assembly, 106-flower basket, 107-avoidance position, 108-defective product storage table, 109-belt, 110-motor, 111-pulley, 112-first linear module, 113-first suction cup, 114-second linear module, 115-second suction cup, 116-partition plate, 117-blocking plate, 118-groove, 119-bottom plate, 120-support frame;

[0026] 201-silicon wafer;

[0027] 301-Qualified product storage table, 302-Silicon wafer transfer assembly. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0032] Figure 1A silicon wafer conveying device 100 according to an embodiment of the utility model is shown. The silicon wafer conveying device 100 includes a conveyor line 101, a defective product storage table 108, a defective product rejection assembly 103 and a patch assembly 105. The conveyor line 101 is used to convey silicon wafers 201. The conveyor line 101 has a defective product rejection position 102 and a patch position 104. The patch position 104 is located downstream of the defective product rejection position 102. The patch position 104 is located downstream of the defective product rejection position 102, which means that the silicon wafer 201 will first pass through the defective product rejection position 102 and then pass through the patch position 104. The defective product storage table 108 is arranged on the side of the conveyor line 101 and is arranged side by side with the defective product rejection position 102. In the present application, a plurality of objects (or positions) are arranged side by side, which means that these objects are distributed horizontally, and the arrangement direction of these objects is perpendicular to the direction in which the conveyor line 101 conveys the silicon wafer 201. For example, with Figure 2 For example, the conveyor line 101 moves the silicon wafer 201 from front to back, and the defective storage table 108 and the defective rejection position 102 are arranged in the left-right direction. The defective rejection component 103 is used to transfer the unqualified silicon wafer 201 at the defective rejection position 102 to the defective storage table 108. The patch component 105 can take away the qualified silicon wafer 201 at the patch position 104 (for example, transfer the silicon wafer 201 to the avoidance position 107), and fill the qualified silicon wafer 201 into the patch position 104 (for example, transfer the silicon wafer 201 at the avoidance position 107 to the patch position 104). In addition, the patch component 105 is arranged at intervals downstream of the defective rejection component 103.

[0033] The following is a description of the process of removing defective products and replenishing qualified products by the silicon wafer conveying device 100. In the present application, defective products refer to unqualified silicon wafers, and qualified products refer to qualified silicon wafers.

[0034] First, the conveyor line 101 conveys a row of silicon wafers 201 to the defective product removal position 102 each time. A row of silicon wafers 201 includes three silicon wafers 201 arranged side by side (such as Figure 2 Before the row of silicon wafers 201 is transported to the defective rejecting position 102, the inspection module (not shown) has inspected the row of silicon wafers 201 and identified which silicon wafer 201 is unqualified.

[0035] If there are no defective silicon wafers 201 in the row of silicon wafers 201 located at the defective rejecting position 102, the subsequent defective rejecting component 103 will not perform the defective rejecting operation, and the patching component 105 will not perform the patching operation.

[0036] If all the silicon wafers 201 in the row of defective wafers 201 at the defective wafer rejection position 102 are defective, the defective wafer rejection component 103 transfers all the silicon wafers 201 in this row to the defective wafer storage table 108 for temporary storage, and the patching component 105 does not perform the patching operation. The silicon wafers 201 stored in the defective wafer storage table 108 will be recycled later, and these unqualified silicon wafers 201 will not be transported to the flower basket 106 by the conveyor line 101.

[0037] If part of the row of silicon wafers 201 is defective and the other part is qualified, the defective rejection component 103 transfers the defective to the defective storage table 108, and the qualified products are subsequently transported to the patch position 104. After the remaining qualified products of the row of silicon wafers 201 are transported to the patch position 104, the patch component 105 puts the qualified silicon wafers 201 temporarily stored in advance on the patch position 104. In this way, the qualified products transported from the defective rejection position 102 and the qualified products supplemented by the patch component 105 are reassembled into a row of silicon wafers 201, and the reassembled row of silicon wafers 201 is subsequently transported to the flower basket 106.

[0038] The qualified silicon wafers 201 added by the patch assembly 105 to the patch position 104 in a certain working cycle come from the silicon wafers 201 taken away from the patch position 104 by the patch assembly 105 in the previous working cycle (the previous working cycle or the previous cycles). Let's use a relatively simple example to illustrate. Assuming that three silicon wafers 201 are in a row and there are two defective silicon wafers 201 in the first row, these two defective silicon wafers will be transferred to the defective storage table 108 by the defective rejection assembly 103. In the end, only one qualified silicon wafer 201 in the first row of silicon wafers 201 will be conveyed to the patch position 104. The patch assembly 105 takes away the only qualified silicon wafer 201, so that the silicon wafer 201 is temporarily separated from the conveyor line 101. Next, there is one defective silicon wafer 201 in the second row of silicon wafers 201 transported to the defective rejection position 102 (the first row of silicon wafers 201 and the second row of silicon wafers 201 have passed the defective rejection position 102 successively), and two qualified silicon wafers 201 in the second row of silicon wafers 201 are finally transported to the patch position 104. When the remaining two silicon wafers 201 in the second row are transported to the patch position 104, the patch assembly 105 puts the qualified silicon wafer 201 taken away from the first row of silicon wafers 201 back to the patch position 104, and puts the position to the empty position of the second row of silicon wafers 201. In this way, one silicon wafer 201 originally belonging to the first row of silicon wafers 201 and two silicon wafers 201 originally belonging to the second row of silicon wafers 201 form a new row of silicon wafers 201. In this newly formed row of silicon wafers 201, each silicon wafer 201 is a qualified product.

[0039] It should be noted that during the process of rejecting defective products and patching, the conveying line 101 suspends conveying to ensure that the silicon wafer 201 can stay at the patching position 104 and the defective product rejecting position 102 .

[0040] The delivery device capable of patching in the prior art is as follows Figure 6 As shown, the conveying device includes a conveying line 101, a silicon wafer transfer assembly 302, a qualified product storage table 301 and a defective product storage table 108, and the defective product rejection position 102, the qualified product storage table 301 and the defective product storage table 108 are arranged side by side. The silicon wafer transfer assembly 302 mainly includes a linear module and a suction cup. When it is necessary to reject unqualified silicon wafers 201, the silicon wafer transfer assembly 302 transfers the unqualified silicon wafers 201 at the defective product rejection position 102 to the defective product storage table 108; in a row of silicon wafers 201, the remaining qualified silicon wafers 201 are transferred to the qualified product storage table 301 by the silicon wafer transfer assembly 302. When it is necessary to replenish qualified silicon wafers 201 next time, the silicon wafer transfer assembly 302 transfers the qualified silicon wafers 201 previously temporarily stored in the qualified product storage table 301 to the defective product rejection position 102.

[0041] like Figure 6 As shown, in the prior art, the rejection of defective products and the replenishment of qualified products are both achieved through the same silicon wafer transfer assembly 302, and the replenishment of qualified products is also achieved at the defective product rejection position 102, or in other words, the defective product rejection position 102 and the patching position 104 are actually completely overlapped. This means that a row of silicon wafers 201 needs to stay at the defective product rejection position 102 for a long time before the defective products can be rejected and patched, which is not conducive to improving the efficiency of patching and defective product rejection.

[0042] The silicon wafer conveying device 100 of the present invention has a defective rejecting position 102 and a patching position 104 which are two different positions. The two positions are arranged along the conveying direction of the conveying line 101, and the patching assembly 105 and the defective rejecting assembly 103 are independent of each other. When multiple rows of silicon wafers 201 need to be conveyed, when one row of silicon wafers 201 is patched at the patching position 104, another row of silicon wafers 201 can be rejected at the defective rejecting position 102. Therefore, the silicon wafer conveying device 100 of the present invention makes the two processes of defective rejecting and patching more in line with the production mode of the assembly line. The device shortens the production cycle of defective rejecting and patching, thereby improving the efficiency of patching and defective rejecting.

[0043] The specific structure of the silicon wafer conveying device 100 is introduced below.

[0044] like Figure 2 As shown, the conveyor line 101 includes a support frame 120, a motor 110, a belt 109 and a pulley 111. A plurality of pulleys 111 are provided, and the pulleys 111 are rotatably mounted on the support frame 120, and the belt 109 is wound around the pulleys 111. The motor 110 drives one of the pulleys 111 to rotate, thereby moving the belt 109, and further moving the silicon wafer 201 placed on the belt 109.

[0045] The silicon wafer conveying device 100 also includes a basket 106 and a detection module. The basket 106 is used to hold the silicon wafers 201, and the detection module is used to detect whether the silicon wafers 201 are qualified. More specifically, the detection module may include a camera, and the camera is used to capture images of the silicon wafers 201. The detection module determines whether there are defects on the outer surface of the silicon wafer 201 by visual detection, thereby determining whether the silicon wafer 201 is a qualified product. The detection module is not shown in the accompanying drawings. The detection module can be located at the front end of the conveying line 101, and the basket 106 can be located at the rear end of the conveying line 101 (such as Figure 2 As shown). Both the defective rejection component 103 and the patch component 105 are connected to the detection module for communication, and the defective rejection component 103 and the patch component 105 transfer the silicon wafer 201 according to the detection result of the detection module. Along the direction in which the silicon wafer 201 is conveyed by the conveyor line 101 (i.e., the conveying direction of the conveyor line 101 in the figure), the detection module, the defective rejection component 103, the patch component 105 and the flower basket 106 are arranged in sequence. In this way, after a row of silicon wafers 201 is inspected, defectives are rejected and patches are applied (if necessary) in sequence, and then they are sent to the flower basket 106. The silicon wafer conveying device 100 also includes a feeding module (not shown), which is arranged between the patch component 105 and the flower basket 106, and the feeding module is used to take the silicon wafer 201 on the conveyor line 101 and insert it into the flower basket 106.

[0046] like Figure 4 As shown, the defective rejection assembly 103 includes a first linear module 112 and a suction unit connected to each other, and the suction unit includes at least one first suction cup 113, and the first suction cup 113 can suction the silicon wafer 201. The first linear module 112 can drive the first suction cup 113 to move horizontally, so that the first suction cup 113 can move back and forth between the defective rejection position 102 and the defective storage table 108. The first linear module 112 can be set as a belt module, and can also be set as a screw module. The process of the defective rejection component 103 removing the silicon wafer 201 from the defective rejection position 102 is roughly as follows: first, the first linear module 112 drives the first suction cup 113 to move to the defective rejection position 102, and makes the first suction cup 113 located directly above the silicon wafer 201; then, the first suction cup 113 adsorbs the silicon wafer 201; next, the first linear module 112 drives the first suction cup 113 to return to above the defective storage table 108; then, the first suction cup 113 releases the adsorption of the silicon wafer 201, and the silicon wafer 201 falls to the defective storage table 108.

[0047] In other embodiments, the defective rejection assembly 103 may further include a first lifting module (not shown). The first linear module 112 is used to drive the first lifting module and the first suction cup 113 to move horizontally synchronously, and the first lifting module can drive the first suction cup 113 to move up and down relative to the first linear module 112. After the first suction cup 113 absorbs the silicon wafer 201 at the defective rejection position 102, the first lifting module drives the first suction cup 113 and the absorbed silicon wafer 201 to rise, and then the first linear module 112 drives the first suction cup 113 to return to the defective storage table 108. In this way, when the first suction cup 113 moves horizontally, the first suction cup 113 and the silicon wafer 201 absorbed by it are not easy to scratch the belt 109 or other silicon wafers 201 that do not need to be absorbed.

[0048] In some embodiments, the first suction cup 113 may be configured as a Bernoulli suction cup; in other embodiments, the first suction cup 113 may also be configured as a vacuum suction cup. Relatively speaking, the advantage of configuring the first suction cup 113 as a Bernoulli suction cup is that the first suction cup 113 can absorb the silicon wafer 201 without directly contacting the silicon wafer 201, thereby reducing the risk of the silicon wafer 201 being contaminated or damaged by the first suction cup 113.

[0049] like Figure 5 As shown, the patch assembly 105 includes a second linear module 114 and at least one second suction cup 115 that are interconnected. The second suction cup 115 can absorb the silicon wafer 201, and the second linear module 114 can drive the second suction cup 115 to move horizontally, so that the second suction cup 115 can move back and forth between the patch position 104 and the avoidance position 107. Among them, the avoidance position 107 is located outside the conveyor line 101, and the avoidance position 107 and the patch position 104 are arranged side by side. The first linear module 112 can be set as a belt module or a screw module. The second suction cup 115 can be set as a Bernoulli suction cup or a vacuum suction cup. In addition, in other embodiments, the patch assembly can also include a second lifting module (not shown). The second linear module 114 is used to drive the second lifting module and the second suction cup 115 to move horizontally synchronously, and the second lifting module can drive the second suction cup 115 to rise and fall relative to the second linear module 114.

[0050] The patching process of the patch assembly 105 is roughly as follows: first, the second linear module 114 drives the second suction cup 115 to move to the patch position 104, and makes the second suction cup 115 located directly above the silicon wafer 201; then, the second suction cup 115 adsorbs the silicon wafer 201, and the adsorbed silicon wafer 201 is used to patch the next row of silicon wafers 201; next, the second linear module 114 drives the second suction cup 115 to move to the avoidance position 107; when the next row of silicon wafers 201 that need to be patched moves to the patch position 104, the second linear module 114 drives the second suction cup 115 to return to the patch position 104; then, the second suction cup 115 releases the adsorption of the silicon wafer 201, and the silicon wafer 201 falls back to the patch position 104.

[0051] The second suction cup 115 moves to the avoidance position 107 mainly to prevent the second suction cup 115 or the silicon wafer 201 sucked by the second suction cup 115 from obstructing the conveying line 101 from conveying the silicon wafer 201. The avoidance position 107 does not have a qualified product storage table 301 for temporarily storing qualified silicon wafers 201. At the avoidance position 107, the second suction cup 115 can continue to suck the silicon wafer 201 until the next patch. Of course, in other embodiments, the avoidance position 107 can also be provided with a qualified product storage table 301.

[0052] In some embodiments, the conveyor line 101 is configured such that the number of silicon wafers 201 entering the defective rejection position 102 each time is N, and the N silicon wafers 201 entering the defective rejection position 102 are arranged side by side. That is, a row of silicon wafers 201 includes N silicon wafers 201. N is an integer not less than 2. Preferably, in order to improve the processing efficiency of the silicon wafer conveying device 100 for the silicon wafers 201, N can also satisfy: N ≥ 3. Accordingly, N first suction cups 113 are provided, each first suction cup 113 is used to absorb one silicon wafer 201, and all first suction cups 113 are arranged side by side. For example, Figure 2 The row of silicon wafers 201 includes 3 silicon wafers (N=3), and accordingly, the first suction cup 113 has 3 (eg Figure 3 As shown). This arrangement is mainly to facilitate the removal of all the silicon wafers 201 in a row (assuming that all the silicon wafers 201 in a row are defective). If the number of the first suction cups 113 is less than N, then when all the silicon wafers 201 in a row are defective, the first suction cups 113 need to go back and forth between the defective removal position 102 and the defective storage table 108 for multiple times to transfer all the silicon wafers 201 in this row to the defective storage table 108.

[0053] In some embodiments, the number of second suction cups 115 is (N-1), and each second suction cup 115 is used to absorb one silicon wafer 201. As described above, if a row of silicon wafers 201 entering the defective rejection position 102 are all defective or all qualified, then the patch assembly 105 does not need to remove a silicon wafer 201 from the row of silicon wafers 201, nor does it need to add a silicon wafer 201 to the row of silicon wafers 201. The patch assembly 105 needs to absorb and transfer a maximum of (N-1) silicon wafers 201 at a time. Therefore, in order to prevent the second suction cup 115 from having to travel back and forth between the avoidance position 107 and the patch position 104 multiple times to transfer (N-1) silicon wafers 201, the number of second suction cups 115 can be set to (N-1). More specifically, in Figure 4 In the illustrated embodiment, N=3, and a total of two second suction cups 115 are provided.

[0054] like Figure 5 As shown, the defective product storage platform 108 includes a bottom plate 119, a partition plate 116 and a blocking plate 117. The bottom plate 119 is tilted relative to the horizontal plane, four partition plates 116 are provided, and the partition plates 116 are vertically arranged. Four blocking plates 117 are also provided, and the blocking plates 117 are connected to the bottom end of the bottom plate 119. Two adjacent partition plates 116 are arranged at intervals, and the blocking plates 117, the bottom plate 119 and the two partition plates 116 jointly define a groove 118 for accommodating the silicon wafer 201. The defective product storage platform 108 has a total of three grooves 118. Since the bottom plate 119 is tilted, the silicon wafer 201 (defective product) placed in the groove 118 will also tilt, the silicon wafer 201 will slide down, and one side edge of the silicon wafer 201 will abut against the blocking plate 117, and the silicon wafer 201 is not easy to fall out of the groove 118 from the top of the bottom plate 119.

[0055] It should be noted that the number of the grooves 118 is not limited to three. In other embodiments, the grooves 118 may be provided with only two, or the number of the grooves 118 may be greater than three. More specifically, the number of the grooves 118 is also set to N, that is, the number of the grooves 118 is the same as the number of the first suction cups 113. All the grooves 118 are arranged side by side, and the first linear module 112 can drive the adsorption unit to move above the defective storage table 108, so that each first suction cup 113 is correspondingly located above a groove 118. In this way, if it is necessary to transfer all the silicon wafers 201 at the defective rejection position 102 to the defective storage table 108, the first linear module 112 can make each first suction cup 113 correspond to a groove 118, and then the first suction cup 113 adsorbing the silicon wafer 201 releases the adsorption of the silicon wafer 201, so that the silicon wafer 201 can fall into different grooves 118 accordingly, and the efficiency of defective rejection is high.

[0056] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A silicon wafer conveying device, characterized in that: include: A conveyor line, used for conveying silicon wafers, wherein the conveyor line has a defective product rejection position and a patch position, and the patch position is located downstream of the defective product rejection position; A defective product storage table, which is arranged on the side of the conveyor line and arranged side by side with the defective product rejection position; A defective product rejection component, used for transferring unqualified silicon wafers at the defective product rejection position to the defective product storage table; A patch assembly is arranged at intervals downstream of the defective rejection assembly, and the patch assembly can take away qualified silicon wafers at the patch position and replenish qualified silicon wafers into the patch position.

2. The silicon wafer conveying device according to claim 1, characterized in that: The defective product rejection component includes a first linear module and an adsorption unit that are interconnected. The adsorption unit includes at least one first suction cup, which can adsorb the silicon wafer. The first linear module can drive the first suction cup to move horizontally, so that the first suction cup can move back and forth between the defective product rejection position and the defective product storage table.

3. The silicon wafer conveying device according to claim 1, characterized in that: The patch assembly comprises a second linear module and at least one second suction cup connected to each other, the second suction cup can absorb the silicon wafer, and the second linear module can drive the second suction cup to move horizontally, so that the second suction cup moves back and forth between the patch position and the avoidance position; Wherein, the avoidance position is located outside the conveying line, and the avoidance position and the patch position are arranged side by side.

4. The silicon wafer conveying device according to claim 2, characterized in that: The conveyor line is configured such that: the number of silicon wafers entering the defective product rejection position each time is N, and the N silicon wafers entering the defective product rejection position are arranged side by side at the same time, and N is an integer not less than 2; There are N first suction cups, each of which is used to absorb one silicon wafer, and all the first suction cups are arranged side by side.

5. The silicon wafer conveying device according to claim 4, characterized in that: N≥3。 6. The silicon wafer conveying device according to claim 5, characterized in that: The patch assembly includes (N-1) second suction cups, each of which is used to absorb one of the silicon wafers, and all of the second suction cups are arranged side by side.

7. The silicon wafer conveying device according to claim 1, characterized in that: The defective rejection component includes at least one first suction cup, the first suction cup can absorb the silicon wafer, and the first suction cup is configured as a Bernoulli suction cup; And / or, the patch assembly includes at least one second suction cup, the second suction cup is capable of sucking the silicon wafer, and the second suction cup is configured as a Bernoulli suction cup.

8. The silicon wafer conveying device according to claim 1, characterized in that: The defective product storage station comprises: A bottom plate, the bottom plate being arranged obliquely relative to a horizontal plane; A partition plate, wherein at least three partition plates are provided, the partition plates are vertically arranged, the bottom ends of the partition plates are connected to the bottom plate, and two adjacent partition plates are arranged at intervals; A blocking plate is connected to the bottom end of the base plate. The blocking plate, the base plate and the two partition plates together define a groove for accommodating the silicon wafer. The defective product storage platform has at least two grooves.

9. The silicon wafer conveying device according to claim 8, characterized in that: The conveyor line is configured such that: the number of silicon wafers entering the defective product rejection position each time is N, and the N silicon wafers entering the defective product rejection position are arranged side by side at the same time, and N is an integer not less than 2; The number of the grooves is also N, and all the grooves are arranged side by side. The defective product rejection component includes a first linear module and an adsorption unit that are connected to each other. The adsorption unit includes N first suction cups arranged side by side. The first linear module can drive the adsorption unit to move above the defective product storage table, so that each of the first suction cups is correspondingly located above one of the grooves.

10. The silicon wafer conveying device according to any one of claims 1 to 9, characterized in that: The silicon wafer conveying device further comprises a flower basket and a detection module, wherein the flower basket is used to hold the silicon wafers, and the detection module is used to detect whether the silicon wafers are qualified; Along the direction of conveying silicon wafers on the conveyor line, the detection module, the defective product rejection component, the patch component and the flower basket are arranged in sequence.

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