Material receiving platform applied to chip on film
By designing the automatic smoothing and compression limiting mechanism of the crystal-covered film feeding platform, the problems of low flatness and efficiency in the docking operation of the crystal-covered film are solved, and efficient automatic docking of the crystal-covered film is achieved.
Patent Information
- Application Number
- CN202421388558.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-18
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-06-18
AI Technical Summary
The existing docking operations of crystal-covered films mainly rely on manual alignment, making it difficult to ensure the flatness of the docking and are low in efficiency.
A feeding platform applied to the crystal-covered film is designed, and an automatic smoothing mechanism and a compression limiting mechanism are adopted. Through the cooperation of cylinders, connecting rods, flattening rollers and springs, the automatic smoothing and positioning of the crystal-covered film is achieved.
Automatic smoothing at the crystal-covered film interface is achieved, avoiding distortion, improving docking efficiency, and simplifying workers' operations.
Smart Images
Figure CN222573837U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip-on-chip film material splicing, in particular to a material splicing platform applied to chip-on-chip film. Background Art
[0002] During the production process of chip-on-film, after a roll of chip-on-film is used up, it is necessary to replace it with another new roll of chip-on-film for processing. To ensure the continuity of processing, it is necessary to butt the tail end of the previous roll of film with the head end of the next roll of film with tape and stick them together with tape. However, the existing chip-on-film butting operation is mainly carried out by manual alignment and then bonding with tape. It is difficult to ensure the flatness of the chip-on-film joint and the butt joint efficiency is low. Therefore, in view of the above problems, a material splicing platform for chip-on-film is designed to better meet the actual use needs. Utility Model Content
[0003] The purpose of the utility model is to provide a material receiving platform for chip-on-film to solve the problems raised in the above-mentioned background technology.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a material receiving platform for chip-on-chip film, comprising an operating table, a fixing frame is symmetrically fixed to the upper end surface of the operating table, a pressure plate is arranged between the fixing frame and the operating table, and a cylinder is also symmetrically fixed to the lower end surface of the operating table, the output end of the cylinder passes through the operating table and is fixedly connected to a mounting plate, a connecting rod is connected to the lower end of the mounting plate, and the chip-on-chip film body is placed on the operating table.
[0005] Preferably, four legs are vertically fixed to the lower end surface of the operating table, and the length of the legs is greater than the length from the cylinder to the lower end surface of the operating table. The supporting function of the entire device can be achieved through the legs, and the installation of the cylinder can be facilitated by limiting the length of the legs.
[0006] Preferably, a vertical rod is fixed symmetrically front and back on the upper end surface of the pressure plate, and the vertical rod is slidably connected to the fixed frame, and one end of a spring is fixed on the vertical rod, and the other end of the spring is fixed to the fixed frame. The stability of the movement of the pressure plate can be guaranteed through the sliding guiding action between the vertical rod and the fixed frame, and the basic force can be provided for the automatic reset of the pressure plate in combination with the action of the spring.
[0007] Preferably, a fixing plate is fixed symmetrically to the front end surface of the mounting plate, and the fixing plate is located directly above the vertical rod. When the fixing plate contacts the vertical rod and applies force, a basic force can be provided for the movement of the pressure plate.
[0008] Preferably, the connecting rod and the mounting plate are rotatably connected, and a torsion spring is also connected between the connecting rod and the mounting plate, and the connecting rod is installed at an angle. At the same time, the length of the connecting rod is smaller than the distance between the flattening roller and the fixed frame. The normal operation of the device can be guaranteed by the rotation of the connecting rod, and the length of the connecting rod is limited to avoid the flattening roller from contacting the fixed frame and causing the device to fail to operate normally.
[0009] Preferably, the connecting rod is also connected to a flattening roller by a bearing, and the flattening roller is located above the operating table, and the flattening roller is symmetrically distributed about the center line of the operating table. Through the action of the flattening roller, the automatic smoothing effect of the chip-on-chip film can be achieved, which facilitates the docking of the chip-on-chip film.
[0010] Compared with the prior art, the beneficial effects of the utility model are: the material connection platform applied to the chip-on-chip film adopts an automatic smoothing mechanism, which can realize the automatic smoothing effect of the chip-on-chip film interface when the chip-on-chip film is connected, avoiding the distortion of the chip-on-chip film interface and affecting the connection effect of the chip-on-chip film, and can greatly improve the connection efficiency of the chip-on-chip film. In combination with the clamping and limiting mechanism, the smoothed chip-on-chip film can be positioned, which is convenient for workers to carry out the connection operation of the chip-on-chip film. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the device of the utility model;
[0012] Figure 2 It is a schematic diagram of a three-dimensional structure composed of the whole device of the utility model and the flip chip film body;
[0013] Figure 3 It is a schematic diagram of the three-dimensional structure of the connecting rod of the utility model from a side view.
[0014] In the figure: 1. operating table; 101. support foot; 2. fixing frame; 3. pressure plate; 301. vertical rod; 302. spring; 4. cylinder; 5. mounting plate; 501. fixing plate; 6. connecting rod; 601. torsion spring; 7. flattening roller; 8. chip-on-film body. DETAILED DESCRIPTION
[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0016] See also Figure 1-Figure 3The utility model provides a technical solution: a material receiving platform for chip-on-chip film, including an operating table 1, a fixing frame 2 is fixed symmetrically on the upper end surface of the operating table 1, a pressing plate 3 is arranged between the fixing frame 2 and the operating table 1, and a cylinder 4 is fixed symmetrically on the lower end surface of the operating table 1, the output end of the cylinder 4 passes through the operating table 1 and is fixedly connected with a mounting plate 5, a connecting rod 6 is connected to the lower end of the mounting plate 5, and a chip-on-chip film body 8 is placed on the operating table 1.
[0017] Four legs 101 are vertically fixed to the lower end surface of the operating table 1, and the length of the legs 101 is greater than the length between the cylinder 4 and the lower end surface of the operating table 1; the connecting rod 6 and the mounting plate 5 are rotatably connected, and a torsion spring 601 is also connected between the connecting rod 6 and the mounting plate 5, and the connecting rod 6 is installed obliquely, and the length of the connecting rod 6 is less than the distance between the flattening roller 7 and the fixed frame 2; the flattening roller 7 is also connected to the connecting rod 6 by a bearing, and the flattening roller 7 is located above the operating table 1, and the flattening roller 7 is symmetrically distributed about the center line of the operating table 1;
[0018] When using the chip-on-film splicing platform, Figure 1-Figure 3 As shown, the tail end of the previous coil of chip-covered film body 8 and the head end of the next coil of chip-covered film body 8 are placed on the operating table 1, and at this time the chip-covered film body 8 is located between the operating table 1 and the pressure plate 3, and then the cylinder 4 is controlled to contract, and the mounting plate 5, the connecting rod 6 and the flattening roller 7 can be driven to move downward through the cylinder 4. When the flattening roller 7 contacts the chip-covered film body 8, the rotation of the connecting rod 6 can make the flattening roller 7 roll on the chip-covered film body 8, and the torsion spring 601 is used to apply a force to the connecting rod 6 and the flattening roller 7, so that the flattening roller 7 can generate pressure on the chip-covered film body 8, so that when the flattening roller 7 rolls, it can generate a pulling force on both sides of the chip-covered film body 8, thereby realizing the straightening and flattening effect of the chip-covered film body 8, which is convenient for the subsequent docking of the chip-covered film body 8.
[0019] A vertical rod 301 is also fixed symmetrically on the upper end surface of the pressing plate 3, and the vertical rod 301 is slidably connected to the fixing frame 2, and one end of a spring 302 is fixed on the vertical rod 301, while the other end of the spring 302 is fixed on the fixing frame 2; a fixing plate 501 is also fixed symmetrically on the front end surface of the mounting plate 5, and the fixing plate 501 is located directly above the vertical rod 301;
[0020] When the mounting plate 5 is forced to move downward, Figure 1 and Figure 2As shown, at this time, the fixed plate 501 moves downward synchronously, and when the fixed plate 501 contacts the vertical rod 301 and generates pressure, the vertical rod 301 is forced to move downward and drive the pressure plate 3 to move downward, and at this time the spring 302 is forced to contract until the pressure plate 3 contacts the chip-on-film body 8 and generates pressure, thereby realizing the clamping and fixing effect of the chip-on-film body 8. At this time, the flattening roller 7 just smoothes the chip-on-film body 8. The worker only needs to use tape to bond the tail end of the previous roll of chip-on-film body 8 and the head end of the next roll of chip-on-film body 8 to realize the docking effect of the chip-on-film body 8. The operation is convenient and simple. After the docking is completed, by controlling the extension of the cylinder 4, the spring 302 and the torsion spring 601 can be used to automatically reset the pressure plate 3, the connecting rod 6 and the flattening roller 7 to facilitate the next docking process. This is the working principle of the material receiving platform applied to the chip-on-film.
[0021] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A material receiving platform for chip-on-film, comprising an operating table (1), characterized in that: A fixing frame (2) is fixed symmetrically on the upper end surface of the operating table (1), a pressure plate (3) is arranged between the fixing frame (2) and the operating table (1), and a cylinder (4) is also fixed symmetrically on the lower end surface of the operating table (1), the output end of the cylinder (4) passes through the operating table (1) and is fixedly connected to a mounting plate (5), the lower end of the mounting plate (5) is connected to a connecting rod (6), and a chip-on-film body (8) is placed on the operating table (1).
2. A material receiving platform for chip-on-film according to claim 1, characterized in that: Four supporting legs (101) are vertically fixed to the lower end surface of the operating table (1), and the length of the supporting legs (101) is greater than the length between the cylinder (4) and the lower end surface of the operating table (1).
3. The material receiving platform for chip-on-film according to claim 1, characterized in that: A vertical rod (301) is also fixed symmetrically on the upper end surface of the pressing plate (3), and the vertical rod (301) is slidably connected to the fixing frame (2). One end of a spring (302) is fixed on the vertical rod (301), and the other end of the spring (302) is fixed on the fixing frame (2).
4. The material receiving platform for chip-on-film according to claim 1, characterized in that: A fixing plate (501) is also fixed to the front end surface of the mounting plate (5) in a left-right symmetrical manner, and the fixing plate (501) is located directly above the vertical rod (301).
5. The material receiving platform for chip-on-film according to claim 1, characterized in that: The connecting rod (6) and the mounting plate (5) are rotatably connected, and a torsion spring (601) is also connected between the connecting rod (6) and the mounting plate (5). The connecting rod (6) is installed at an angle, and the length of the connecting rod (6) is smaller than the distance between the flattening roller (7) and the fixing frame (2).
6. The material receiving platform for chip-on-film according to claim 5, characterized in that: The connecting rod (6) is also bearing-connected with a flattening roller (7), and the flattening roller (7) is located above the operating table (1), and the flattening roller (7) is symmetrically distributed with respect to the center line of the operating table (1).