Optical package

Abstract

An optical package includes: a support substrate including a first electrical contact; a cap fixed to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material; and a separation structure disposed between the welding material and the adhesive.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to French Patent Application No. FR 23065056, filed on June 14, 2023, and U.S. Patent Application No. 18 / 734,573, filed on June 5, 2024, which are incorporated herein by reference in their entirety. Technical field

[0003] Embodiments and implementations relate to the field of electronics, particularly to the field of integrated circuit packaging, and more specifically to the connection between a cap (or lid) of an optical package and a support substrate. Background art

[0004] Optical packages typically provide an electrical connection between a cap and a support substrate in order to detect faults in the optical elements of the cap and control, for example, the cut - off of power within the optical package. In particular, the power supply to the electronic chips of the package can be cut off to prevent the emission of optical radiation through these faulty optical elements.

[0005] This electrical connection is established by soldering between electrical contacts of the cap and the substrate, which is performed when the cap is assembled onto the support substrate. The cap is typically attached to the substrate using an adhesive. However, for example, during the assembly of the cap, the solder material and the adhesive can come into contact and mix, resulting in electrical malfunctions such as short - circuits.

[0006] In this regard, the solder material can be deposited far enough away from the adhesive to avoid mixing. This type of conventional deposition method is restrictive because it requires a larger substrate surface area.

[0007] Therefore, it is advantageous to enable an electrical connection between the cap and the substrate without causing electrical malfunctions while limiting the surface area reserved for this electrical connection. Summary of the utility model

[0008] One aspect of the present disclosure provides an optical package, comprising: a support substrate including a first electrical contact; a cap fixed to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material; and a separation structure that separates the solder material from the adhesive.

[0009] In one example, the separation structure includes an arrangement of a portion of the second electrical contact that houses the solder material.

[0010] In one example, the arrangement in the second contact includes a first through - hole having a closed profile inside the second contact or an open profile outside the second contact, thereby forming a channel that allows a portion of the solder material to overflow to the outside of the cap or allows the solder material to be injected through the first hole.

[0011] In one example, the separation structure includes an arrangement in the cap and the substrate that separates the first contact from the second contact by a distance and accommodates a soldering material including a solder wire or solder bumps.

[0012] One aspect of the present disclosure provides an optical package including: a support substrate including a first electrical contact; a cap fixed to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a soldering material; and a separation structure that separates the soldering material from the adhesive, wherein the separation structure includes an arrangement in the substrate that accommodates a portion of the soldering material.

[0013] In one example, the arrangement in the support substrate includes a first trench and a second trench around the first contact, the first trench accommodating the adhesive and the second trench accommodating at least a portion of the soldering material.

[0014] In one example, the arrangement in the support substrate includes a second through-hole to allow injection of the soldering material through the second hole.

[0015] In one example, the second contact includes a protrusion engaged in the second hole, the protrusion facing the first contact disposed on the side of the second hole.

[0016] According to one aspect, there is provided an optical package including: a support substrate including a first electrical contact; a cap fixed to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a soldering material, wherein the assembled components are designed to provide separation between the soldering material and the adhesive.

[0017] More particularly, the assembled components enable separation to be provided, which can be separation by distance so as to prevent the soldering material from mixing with the adhesive, or separation obtained due to the nature of the adhesive so as to prevent such mixing even when the soldering material contacts the adhesive.

[0018] Thus, the first contact and the second contact can be soldered on the surface of the support substrate by the soldering material with a limited surface coverage area, and there is no risk of mixing of the soldering material and the adhesive.

[0019] According to one embodiment, the assembled components include an arrangement in the second electrical contact that is designed to accommodate a portion of the soldering material.

[0020] In this embodiment, the arrangement is a structural modification of the cap to allow removal of excess soldering material so as to prevent contact between the soldering material and the adhesive. The cap including such an arrangement is particularly designed to be electrically connected to a conventional support substrate.

[0021] According to one embodiment, the arrangement in the second contact includes a first through-hole that has a closed profile inside the second contact or an open profile outside the second contact, thereby forming a channel that allows a portion of the welding material to overflow to the outside of the cap or allows the welding material to be injected through the first hole.

[0022] The first hole in the second contact of the cap allows the introduction of welding material after the cap is fixed to the substrate with an adhesive and also removes excess material.

[0023] According to one embodiment, the assembly component includes an arrangement in the substrate that is designed to accommodate a portion of the welding material.

[0024] In this embodiment, the arrangement is a structural modification of the support substrate such that excess welding material can be guided and accommodated away from the adhesive. The support substrate including such an arrangement is specifically designed to enable electrical connection of a conventional cap to this substrate.

[0025] According to one embodiment, the arrangement in the support substrate includes a first groove and a second groove around the first contact, the first groove accommodating the adhesive and the second groove accommodating at least a portion of the welding material.

[0026] The first groove accommodates excess adhesive and the second groove accommodates excess welding material. In this way, the adhesive and the welding material are kept away from each other, thereby preventing them from mixing.

[0027] According to one embodiment, the arrangement in the support substrate includes a second through-hole, thereby allowing the injection of welding material through the second hole.

[0028] The second hole allows the welding process to be performed independently of the fixing of the cap to the substrate during the manufacture of the optical package, thereby allowing the adhesive to be polymerized before injecting the welding material so as to avoid mixing of the welding material with the polymerized adhesive even if the welding material contacts the adhesive.

[0029] According to one embodiment, the second contact includes a protrusion engaged in the second hole, and the protrusion faces the first contact arranged on the side of the second hole.

[0030] In a male-female structure, the protrusion improves the electrical connection between the second contact of the cap and the first contact of the support substrate.

[0031] According to one embodiment, the assembly component includes arrangements in the cap and the substrate that can separate the first contact and the second contact by a distance and can accommodate welding material including solder wire or solder bumps.

[0032] In this embodiment, the arrangement is a structural modification of both the cap and the support substrate such that electrical connections can be established between the cap and the substrate using controlled connection components such as solder wires or solder bumps. Moreover, these connection components do not have the disadvantage of the risk of overflow and mixing with the adhesive.

[0033] According to another aspect, there is provided a method for assembling a support substrate and a cap, the support substrate including a first electrical contact and the cap including a second contact, the method including fixing the cap to the support substrate using an adhesive, connecting the second contact to the first electrical contact using a welding material, and the assembly component providing separation between the welding material and the adhesive during said fixing of the cap to the support substrate.

[0034] According to one embodiment, the assembly component includes an arrangement formed in the second electrical contact, and during said assembly of the cap and the substrate, a portion of the welding material is received in the arrangement.

[0035] According to one embodiment, the arrangement in the second contact includes a first through hole formed in the second contact, the first through hole having a closed profile inside or an open profile outside, and during said assembly, a portion of the welding material is received in the first hole.

[0036] According to one embodiment, said portion of the welding material is received in the first hole by allowing the welding material to overflow through the first hole to the outside of the cap.

[0037] According to one embodiment, said portion of the welding material is received in the first hole by injecting the welding material through the first hole during said connection of the electrical contacts.

[0038] According to one embodiment, the assembly component includes an arrangement formed in the substrate, and during said assembly of the cap and the substrate, a portion of the welding material is received in the arrangement.

[0039] According to one embodiment, the arrangement in the support substrate includes a first groove and a second groove formed in the support substrate around the first contact, and during said fixing of the cap, the adhesive is received in the first groove and at least a portion of the welding material is received in the second groove.

[0040] According to one embodiment, the arrangement in the support substrate includes a second through hole formed in the support substrate, and the method includes injecting the welding material through the second hole.

[0041] According to one embodiment, said fixing of the cap includes engaging a protrusion of the second contact in the second hole, the protrusion facing the first contact arranged on the side of the second hole.

[0042] According to one embodiment, the step of connecting the second contact to the first electrical contact using a welding material is performed after the adhesive that secures the cap to the support substrate has polymerized.

[0043] According to one embodiment, the assembly includes an arrangement in the cap and in the substrate that separates the first contact from the second contact by a distance, and the method includes forming a welding material in the space between the arrangement by a solder wire or a solder bump. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] After examining the detailed description of non-limiting embodiments and implementations and in accordance with the drawings, other advantages and features of the present disclosure will become apparent, in which:

[0045] Figure 1 Schematically illustrates a cross-sectional view of an optical package according to a first embodiment;

[0046] Figure 2 Schematically illustrates a top view of a support substrate of an optical package according to the first embodiment described with reference to Figure 1 ;

[0047] Figure 3 Schematically illustrates a bottom view of a cap that can be fixed and connected to a support substrate as described with reference to Figure 1 and Figure 2 ;

[0048] Figure 4 Schematically illustrates a bottom view of another cap according to a second embodiment;

[0049] Figure 5 Schematically illustrates a bottom view of a cap according to a third embodiment;

[0050] Figure 6 Schematically illustrates an oblique view of a cap described with reference to Figure 5 ;

[0051] Figure 7 Schematically illustrates a cross-sectional view of an optical package according to a fourth embodiment;

[0052] Figure 8 Schematically illustrates a cross-sectional view of an optical package according to a fifth embodiment;

[0053] Figure 9 Schematically illustrates a cross-sectional view of an optical package according to a sixth embodiment;

[0054] Figure 10 Schematically illustrates a cross-sectional view of an optical package according to a seventh embodiment;

[0055] Figure 11 Schematically illustrates a method for manufacturing the above-described with reference toFigure 1 and Figure 2 the steps of an exemplary method of an optical package as described

[0056] Figure 12 Schematically illustrates the steps of an exemplary method for manufacturing the optical package referred to above with reference to Figure 7 and Figure 8 the steps of an exemplary method of an optical package as described

[0057] Figure 13 Schematically illustrates the steps of an exemplary method for manufacturing the optical package referred to above with reference to Figure 4 and Figure 5 the steps of an exemplary method of an optical package as described; and

[0058] Figure 14 Schematically illustrates the steps of an exemplary method for manufacturing the optical package referred to above with reference to Figure 9 and Figure 10 the steps of an exemplary method of an optical package as described. DETAILED DESCRIPTION

[0059] Figure 1 Schematically illustrates a cross - sectional view of an optical package BT according to a first embodiment. The package BT includes a support substrate SUB having a mounting surface FM, and a cap CPT having side walls PRL1 and PRL2. The side walls PRL1 and PRL2 are fixed to the mounting surface FM of the support substrate SUB by adhesives GL1 and GL2. The adhesives GL1, GL2 can be, for example, epoxy adhesives. In particular, for example, the side walls PRL1 and PRL2 define a cavity that can accommodate electronic chips CHP1 and CHP2.

[0060] The electronic chips CHP1 and CHP2 are mounted and connected on the mounting surface FM of the support substrate SUB in a "wire - bonding" type assembly manner known to those skilled in the art. In this type of package, the electronic chips CHP1 and CHP2 can be designed to emit or receive optical radiation. For example, the optical radiation passes through holes FNT1 and FNT2 of the cap CPT that are opposite to the electronic chips CHP1 and CHP2 on the optical path of the optical radiation.

[0061] Moreover, the optical package BT includes a metal structure (commonly referred to as a "lead frame"), which can be embedded, for example, in the cap CPT and enables electrical connection of elements of the cap CPT (such as a filter (not shown)) to the support substrate SUB. The electrical connection between the cap CPT and the substrate SUB enables detection of cap CPT failures, such as filter delamination. Thus, for example, by cutting off the power supply to the electronic chips CHP1 and / or CHP2 in the event of a detected failure, the risk of malfunction of the optical package BT caused by such a failure can be avoided.

[0062] To establish this electrical connection between the cap CPT and the substrate SUB, the support substrate SUB includes a first electrical contact PAD, and the cap CPT includes a second electrical contact LF that is connected to the first electrical contact PAD by a welding material SLD. The welding material SLD can be a metal in the form of solder paste, which is deposited on the first contact PAD and the second contact LF of the cap CPT is located on the solder paste.

[0063] However, the welding material SLD may be incompatible with the adhesive GL2, and it is desirable to prevent the welding material SLD from mixing with the adhesive GL2.

[0064] In this regard, an assembly component or a separation structure is provided to allow the cap CPT to be electrically connected to the substrate SUB without the risk of malfunction, and without the need to reserve a larger surface for the electrical connection and bonding of the cap CPT.

[0065] The assembly component or separation structure can take the form of a structure that supports the substrate SUB and / or the cap CPT, hereinafter referred to as an "arrangement", which can be produced according to various embodiments and implementations described in the reference Figures 1 to 14 described.

[0066] In fact, the assembly component or separation structure is designed to provide a separation between the welding material SLD and the adhesive GL2. For example, the separation is a distance in the case where the welding material SLD is kept away from the adhesive GL2. The separation can also be structural to prevent the welding material SLD from mixing with the adhesive GL2 during the manufacture of the package BT (including if they come into contact).

[0067] To create these separations, the separation structure includes an arrangement in the support substrate SUB, as shown in Figure 1 、 Figure 2 、 Figure 7 and Figure 8 shown, or an arrangement in the support substrate SUB and the cap CPT, as shown in Figures 4 - 6 、 Figure 9 and Figure 10 shown.

[0068] Figure 2 Schematically illustrates a top view of the support substrate SUB of the optical package BT according to the first embodiment described above with reference to Figure 1 described, and more particularly illustrates the arrangement of the substrate SUB such that a distance D1 can be maintained between the welding material SLD and the adhesive GL2. Figure 2 The view in Figure 1 is in the plane II-II of

[0069] The arrangement in the support substrate SUB includes a first trench TRC1 and a second trench TRC2 around the first contact PAD. The first trench TRC1 accommodates an adhesive GL2, such as an excess of the adhesive GL2 that overflows from the mounting surface FM. The second trench TRC2 accommodates at least a portion of the solder material SLD, such as an excess of the solder material SLD that overflows from the first electrical contact PAD.

[0070] In this way, the package BT has a cap CPT, such as a conventional cap in the prior art having electrical contacts, which is connected to the support substrate SUB by the solder material SLD, and by means of this arrangement, the solder material SLD is kept at a distance D1 from the adhesive GL2.

[0071] The distance D1, which can be set according to the excess amount that can be deposited and according to the dimensions of the product and the available surface area on the substrate, is for example greater than or equal to 200 μm.

[0072] Figure 3 Schematically illustrates the bottom view of the cap CPT that can be fixed and connected to the support substrate SUB as described above with reference to Figure 1 and Figure 2 The side walls PRL1 and PRL2 of the cap CPT can in particular be fixed by an adhesive GL located on the contour of the substrate SUB and surround the electrical contacts LF of the cap CPT.

[0073] The cap CPT is intended to be assembled with the substrate SUB, and the walls PRL1, PRL2 are arranged in this regard to contact the part of the substrate for receiving the adhesive layer. In particular, the wall PRL2 is intended to be positioned opposite the trench TRC1 and outside the contour of the trench TRC2.

[0074] Figure 4 Schematically illustrates the bottom view of another cap CPT according to a second embodiment. The same elements as the cap CPT in Figure 3 have the same reference numerals and will not be described in detail again.

[0075] In this second embodiment, the arrangement in the second electrical contact LF is designed to accommodate a portion of the solder material SLD. This arrangement allows a portion of the solder material SLD to overflow outside the cap CPT and also allows the introduction of the solder material SLD.

[0076] The arrangement in the second contact LF includes a first through-hole that has an open contour on the outer side CRX of the second contact LF.

[0077] Figure 5 Schematically illustrates the bottom view of the cap CPT according to a third embodiment. The same elements as the cap CPT in Figure 3 have the same reference numerals and will not be described in detail again.

[0078] In the second and third embodiments, a first through-hole having a closed or open profile forms a channel that allows a portion of the soldering material SLD to overflow outside the cap CPT or allows the soldering material to be injected through the first hole.

[0079] In addition, a first hole ORF1 in the second contact LF of the cap CPT constitutes a relatively simple means of allowing the introduction of the soldering material SLD and / or the removal of excess soldering material SLD after the cap CPT is fixed to the substrate SUB (especially after the adhesive polymerizes during chemical treatment).

[0080] Figure 6 A schematic illustration shows an oblique view of the cap CPT as described above with reference to Figure 5 such that the assembly structure BT of the cap CPT and the substrate SUB can be distinguished.

[0081] In particular, the second contact LF is surrounded by a side wall PRL2 that extends beyond the height of the cap, while leaving a space in the extension of the first hole, thus allowing an instrument for depositing the soldering material SLD to be placed in position.

[0082] Figure 7 A schematic cross-sectional view of an optical package BT according to a fourth embodiment is illustrated. Elements identical to those in the Figure 1 package BT have the same reference numerals and will not be described in detail again.

[0083] This fourth embodiment includes an arrangement in the substrate SUB that includes a second through-hole ORF2 and allows the injection of the soldering material SLD through the second hole ORF2.

[0084] The second hole ORF2 can also be used to establish an electrical connection with an electronic component by means of electrical contacts arranged on the side of the hole. In fact, a first electrical contact PAD of the substrate SUB is arranged on the side of the second hole ORF2. Thus, the soldering material SLD can be introduced into the second hole ORF2 during the manufacturing process of the package BT so as to contact the first electrical contact PAD and the second electrical contact LF of the cap CPT after the adhesive polymerizes.

[0085] In addition, the second hole ORF2 can accommodate only the soldering material SLD or can accommodate the adhesive GL3 in addition to the soldering material SLD.

[0086] Thus, the soldering material SLD introduced after the cap CPT is fixed can contact the already polymerized adhesive GL, for example when excess soldering material SLD overflows onto the mounting surface FM of the substrate SUB, without mixing with the adhesive. Therefore, this makes it possible to electrically connect the cap CPT to the substrate SUB without the risk of electrical malfunction within the package BT.

[0087] Figure 8 Schematically shows a cross-sectional view of an optical package BT according to a fifth embodiment. Elements identical to those in the package BT in Figure 1 have the same reference numerals and will not be described in detail again.

[0088] Figure 8 Illustrates a variant of the fourth embodiment described with reference to Figure 7 In this variant, the second contact LF includes a protrusion engaged in the second hole ORF2, which protrusion faces the first contact PAD disposed on the side of the second hole ORF2.

[0089] In a male-female structure, the protrusion improves the electrical connection between the second contact LF of the cap CPT and the first contact PAD of the support substrate SUB.

[0090] Figure 9 Schematically shows a cross-sectional view of an optical package BT according to a sixth embodiment. Elements identical to those in the package BT in Figure 1 have the same reference numerals and will not be described in detail again.

[0091] The assembly components provided in this sixth embodiment include an arrangement in the cap CPT and the support substrate SUB that can separate the first contact PAD from the second contact LF by a distance. In addition, this arrangement can accommodate solder bumps SLD_BP (commonly referred to as "stud bumps").

[0092] Figure 10 Schematically shows a cross-sectional view of an optical package BT according to a seventh embodiment. Elements identical to those in the package BT in Figure 1 have the same reference numerals and will not be described in detail again.

[0093] This arrangement is similar to the arrangement in the cap CPT and the substrate SUB of the package BT described above with reference to Figure 9 except that the second electrical contact LF is arranged laterally on the side wall PRL2 of the cap CPT, and this arrangement accommodates a solder wire WB. The solder wire WB is, for example, embedded in a glob top to protect it from the outside.

[0094] Therefore, this arrangement enables an electrical connection to be established by a technique called "wire bonding" that is commonly used to connect electronic chips. In particular, this electrical connection can be established by passing the solder wire through a third hole ORF3 in the cap CPT that is opposite to the first contact PAD of the substrate SUB after the cap CPT is fixed.

[0095] Thus, the arrangement can include a simple structure that provides a distance between the welding material (such as solder bumps SLD_BP or solder wire WB) and the adhesive. Additionally, this can enable an electrical connection to be established in a controlled manner between the first contact PAD and the second contact LF, i.e., there is no risk of the welding material overflowing and mixing with the formed adhesive GL2.

[0096] Figure 11 Schematically illustrates exemplary steps of a method for manufacturing the optical package BT described in reference Figure 1 and Figure 2 Description.

[0097] The method includes step 110 of forming a support substrate SUB including a first electrical contact PAD.

[0098] The method includes step 111 of forming a first trench TRC1 and a second trench TRC2 around the first electrical contact PAD.

[0099] The method includes step 112 of depositing a welding material SLD and an adhesive GL on the substrate SUB. In particular, the welding material SLD is deposited on the first electrical contact PAD.

[0100] The method includes step 113 of fixing a cap CPT. In particular, a connection between the second contact LF of the cap CPT and the first contact PAD of the substrate SUB is established while fixing the cap CPT. During this fixing operation, the adhesive GL can overflow into the first trench TRC1, and at least a portion of the welding material SLD can overflow into the second trench TRC2. In this way, after fixing the cap CPT, the welding material SLD and the adhesive GL2 remaining on the mounting surface FM are separated by a distance D1.

[0101] Figure 12 Schematically illustrates steps of an exemplary method for manufacturing the optical package BT described in reference Figure 7 and Figure 8 Description.

[0102] The method starts from step 120, corresponding to step 110 of forming the substrate SUB of the method described in reference Figure 11 Description.

[0103] The method includes step 121 of forming a second hole ORF2. The first electrical contact PAD is formed on the side of the second hole ORF2, for example, by metallizing the side of the hole using conventional techniques.

[0104] Then, the method includes step 122, corresponding to the above reference Figure 11Step 113 of the fixed cap CPT of the described method corresponds. After the fixed cap CPT, the adhesive GL can be polymerized during the heat treatment of the optical package BT.

[0105] After the heat treatment, the method includes step 123 of injecting a welding material SLD through a second hole ORF2 such that the welding material SLD passes through the second hole ORF2 and electrically connects a second contact LF and a first contact PAD. An adhesive GL3 or resin can also be injected to plug the second hole ORF2.

[0106] Alternatively, the cap CPT can include a second contact LF having a protrusion, in which case, before injecting the welding material SLD in step 123, step 122 of completing the fixed cap CPT is performed so that the protrusion of the second contact LF engages in the second hole ORF2 facing the first contact PAD, as Figure 8 shown.

[0107] Thus, the second hole ORF2 enables an electrical connection to be established between the first contact and the second contact, regardless of the fixing of the cap CPT to the substrate SUB, thereby allowing the adhesive to be polymerized before injecting the welding material so as to avoid mixing of the welding material with the polymerized adhesive even if the welding material contacts the adhesive.

[0108] Figure 13 Schematically illustrates the steps of an exemplary method for manufacturing the optical package BT referenced Figure 4 and Figure 5 described.

[0109] The method includes step 130 of forming a cap CPT including a second electrical contact LF and step 131 of forming a first through hole in the second electrical contact LF. More particularly, the first hole has an open profile on an outer CRX or an open profile ORF1 formed in the second contact LF.

[0110] The method includes step 132 of depositing an adhesive GL on a substrate SUB (such as a conventional substrate), and step 133 of fixing the cap CPT in a manner similar to steps 113 and 122 referenced above Figure 11 and 12 described. After fixing the cap CPT, the adhesive GL can be polymerized during the heat treatment of the optical package BT.

[0111] After the heat treatment, the method includes step 134 of injecting a welding material SLD through the first hole such that the welding material SLD passes through the first hole and electrically connects the second contact LF and the first contact PAD.

[0112] Figure 14 Schematically illustrates for manufacturing the above referenced Figure 9 and Figure 10Steps of an exemplary method of the described optical package BT.

[0113] The method includes step 140 of forming a support substrate SUB and a cap CPT. The formation of the cap CPT may include forming 141 a third hole ORF3 and forming 142 a second electrical contact LF on the sidewall PRL2 of the cap CPT such that the second contact is vertically oriented.

[0114] As an alternative to steps 141 and 142, the method includes step 143 of forming solder bumps. Such solder bumps can be obtained by first depositing a soldering material SLD in the form of balls on a first contact PAD and, once the material is fixed to the first contact, it is stretched and torn to form a point on which the second contact LF can be located when the cap CPT is fixed.

[0115] Then, the method includes step 144 of fixing the cap CPT, similar to the steps 113, 122 and 133 described above with reference to Figure 11 、 Figure 12 、 Figure 13 In the case of the package BT shown in Figure 9 , an electrical connection between the first contact PAD and the second contact LF is established during the fixing step.

[0116] In Figure 10 In the case of the package BT shown in, the first contact PAD is connected to the second contact LF using wire bonding technology. In fact, the method further includes step 144 of forming a solder wire WB through the third hole ORF3 between the first contact PAD and the second contact LF and forming a top encapsulation introduced through the third hole ORF3 to embed the solder wire WB.

[0117] One aspect of the present disclosure provides a method including: assembling a support substrate including a first electrical contact and a cap including a second electrical contact, the assembling including fixing the cap to the support substrate using an adhesive, connecting the second contact to the first electrical contact using a soldering material, and a separation structure providing separation between the soldering material and the adhesive during the fixing of the cap to the support substrate.

[0118] In one example, the separation structure includes an arrangement formed in the second electrical contact, and during the assembly of the cap and the substrate, a portion of the soldering material is received in the arrangement.

[0119] In one example, the arrangement in the second contact includes a first through hole formed in the second contact having a closed profile internally or an open profile externally, and during the assembly, a portion of the soldering material is received in the first hole.

[0120] In one example, the portion of the welding material is received in the first hole by the welding material overflowing through the first hole to the outside of the cap.

[0121] In one example, the portion of the welding material is received in the first hole by injecting the welding material through the first hole during the connection of the electrical contact.

[0122] In one example, the separation structure includes an arrangement formed in the substrate, and during the assembly of the cap and the substrate, a portion of the welding material is received in the arrangement.

[0123] In one example, the arrangement in the support substrate includes a first trench and a second trench formed in the support substrate around the first contact. During the fixing of the cap, the adhesive is received in the first trench and at least a portion of the welding material is received in the second trench.

[0124] In one example, the arrangement in the support substrate includes a second through-hole formed in the support substrate, and the method includes injecting the welding material through the second through-hole.

[0125] In one example, the fixing of the cap includes engaging the protrusion of the second electrical contact in the second through-hole, and the protrusion faces the first contact arranged on the side of the second through-hole.

[0126] In one example, after the adhesive for fixing the cap to the support substrate is polymerized, the second contact is connected to the first electrical contact using the welding material.

[0127] In one example, the separation structure includes arrangements located in the cap and the substrate, and the arrangements separate the first contact from the second contact by a distance.

[0128] In one example, the above method further includes forming the welding material in the interval of the arrangement by a solder wire or a solder bump.

Claims

1. An optical package, characterized in that: include: a support substrate including a first electrical contact; a cap secured to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material; as well as Separate the structure to separate the solder material from the adhesive. 2 . The optical package of claim 1 , wherein the separation structure comprises an arrangement of a portion of the second electrical contact that accommodates the solder material.

3. The optical package of claim 2 , wherein the arrangement in the second contact comprises a first through hole having a closed profile inside the second contact or an open profile outside the second contact, thereby forming a channel allowing a portion of the soldering material to overflow to the outside of the cap or allowing the soldering material to be injected through the first hole.

4. The optical package of claim 1, wherein the separation structure comprises an arrangement in the cap and in the substrate, the arrangement separating the first contact from the second contact by a distance and accommodating a solder material comprising a solder wire or a solder bump.

5. An optical package, characterized in that: include: a support substrate including a first electrical contact; a cap secured to the support substrate by an adhesive and including a second electrical contact connected to the first electrical contact by a solder material; as well as A separation structure separates the solder material from the adhesive, wherein the separation structure includes an arrangement of a portion of the substrate that accommodates the solder material.

6. The optical package of claim 5, wherein the arrangement in the support substrate comprises a first groove and a second groove surrounding the first contact, the first groove accommodating an adhesive and the second groove accommodating at least a portion of a solder material.

7. The optical package of claim 5, wherein the arrangement in the support substrate comprises a second through hole, thereby allowing injection of solder material through the second hole. 8 . The optical package of claim 7 , wherein the second contact comprises a protrusion engaged in the second hole, the protrusion facing the first contact arranged on a side of the second hole.

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