Circuit board bearing jig and processing equipment

Abstract

The utility model discloses a circuit board bearing jig and processing equipment, and belongs to the technical field of laser engraving, in the circuit board bearing jig, a driving assembly drives a negative pressure adsorption platform to be lifted, so that the negative pressure adsorption platform jacks up a circuit board to be separated from a conveying mechanism, the circuit board is supported on the negative pressure adsorption platform, and the circuit board is clamped on the negative pressure adsorption platform; the adsorption force generated by the negative pressure adsorption platform enables the circuit board to be flatly laid on the negative pressure adsorption platform and to be fixed, thereby preventing the circuit board from warping, and improving the position precision and the yield of two-dimensional code engraving. In addition, the circuit board is fixed through pressure difference generated by adsorption, and compared with a mechanical clamping and fixing mode, the surface quality of the circuit board is protected.

Description

Technical Field

[0001] This application belongs to the technical field of laser engraving, and particularly relates to a circuit board carrying fixture and a processing device. Background Art

[0002] During the development of circuit boards, laser engraving technology is required to engrave two-dimensional codes on circuit boards. The conventional processing process is to transfer the circuit board to the engraving processing station through a transfer mechanism and clamp the circuit board through a clamping mechanism. However, the clamped circuit board will warp due to uneven stress, resulting in the offset of the engraved two-dimensional code. Summary of the Utility Model

[0003] Purpose of the Utility Model: The embodiments of this application provide a circuit board carrying fixture, aiming to solve the technical problem that the circuit board warps due to uneven stress after being clamped, resulting in the offset of the two-dimensional code; another purpose of this application is to provide a circuit board processing device.

[0004] Technical Solution: The circuit board carrying fixture described in the embodiments of this application includes:

[0005] Base;

[0006] Negative pressure adsorption platform, arranged on the base;

[0007] Drive assembly, connected to the base, the drive end of the drive assembly is connected to the negative pressure adsorption platform, the drive assembly is used to lift the negative pressure adsorption platform so that the negative pressure adsorption platform can support the circuit board on the transfer mechanism, and the negative pressure adsorption platform is used to adsorb and fix the supported circuit board.

[0008] In some embodiments, the circuit board carrying fixture further includes:

[0009] Pressing plate, arranged above the negative pressure adsorption platform, the pressing plate is used to press the circuit board on the negative pressure adsorption platform, the pressing plate has a hollowed-out area, and the hollowed-out area is used to expose a part of the circuit board.

[0010] In some embodiments, the negative pressure adsorption platform includes:

[0011] Body, connected to the drive end, the body has a vacuum chamber and suction holes communicating with the vacuum chamber, the body includes a support plane for supporting the circuit board, and the suction holes are arranged on the support plane;

[0012] Suction pipe, connected to the body and communicating with the vacuum chamber.

[0013] In some embodiments, the body includes

[0014] The base is connected to the driving end, and the suction pipe is connected to the base;

[0015] The supporting plate is connected to the base and encloses the vacuum chamber, and the supporting plane is arranged on the side of the supporting plate away from the base.

[0016] In some embodiments, a plurality of suction holes are provided and arranged at intervals along the length direction and / or width direction of the body.

[0017] In some embodiments, a plurality of vacuum chambers and a plurality of suction pipes are provided, and each suction pipe communicates with one of the vacuum chambers.

[0018] In some embodiments, the circuit board carrying fixture further includes:

[0019] The guiding mechanism is arranged on the base and connected to the negative pressure adsorption platform. The guiding mechanism is used to guide the negative pressure adsorption platform when the driving component lifts the negative pressure adsorption platform.

[0020] In some embodiments, the circuit board carrying fixture further includes:

[0021] The buffer assembly is used to buffer the negative pressure adsorption platform when the driving component drives the negative pressure adsorption platform to fall back.

[0022] In some embodiments, the buffer assembly includes:

[0023] A plurality of buffer pads are connected to the negative pressure adsorption platform, and the buffer pads are located on the side of the negative pressure adsorption platform facing the base;

[0024] The hydraulic buffer, the cylinder body of the hydraulic buffer is connected to the base, and the piston rod of the hydraulic buffer is connected to the negative pressure adsorption platform.

[0025] Correspondingly, a circuit board processing device according to an embodiment of the present application includes the above-mentioned circuit board carrying fixture and a conveying mechanism. The circuit board carrying fixture is arranged in the conveying mechanism, and the conveying mechanism is used to convey the circuit board.

[0026] Beneficial effects: The circuit board carrying fixture in the embodiment of the present application drives the negative pressure adsorption platform to lift through the driving component, so that the negative pressure adsorption platform lifts the circuit board and separates it from the conveying mechanism. The circuit board is supported on the negative pressure adsorption platform, and the adsorption force generated by the negative pressure adsorption platform makes the circuit board lie flat on the negative pressure adsorption platform and fixed, avoiding the situation of warping of the circuit board, thereby improving the position accuracy and the yield rate of the QR code engraving; in addition, the circuit board is fixed by the pressure difference generated by adsorption, which is beneficial to protecting the surface quality of the circuit board compared with the mechanical clamping and fixing method.

[0027] The circuit board processing equipment of the embodiment of the present application includes the above-mentioned circuit board carrying fixture, so it can have all the technical features and beneficial effects of the above-mentioned circuit board carrying fixture. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 It is a schematic three-dimensional structure diagram of the circuit board carrying fixture provided by the embodiment of the present application;

[0030] Figure 2 It is an exploded view of the body provided by the embodiment of the present application;

[0031] Figure 3 It is a schematic diagram of the distribution of the suction holes provided by the embodiment of the present application;

[0032] Figure 4 It is a front view of the circuit board carrying fixture provided by the embodiment of the present application;

[0033] Figure 5 It is a schematic three-dimensional structure diagram of the buffer assembly provided by the embodiment of the present application;

[0034] Reference Numerals: 1, base; 2, negative pressure adsorption platform; 21, body; 211, vacuum chamber; 212, suction hole; 213, support plane; 214, base; 215, supporting plate; 22, suction pipe; 3, driving assembly; 4, pressing plate; 41, hollowed-out area; 5, guiding mechanism; 6, buffer assembly; 61, buffer pad; 62, hydraulic buffer. Detailed Embodiments

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0036] In the description of the present application, it should be understood that the terms "height", "thickness", "up", "down", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, "multiple" means two or more, and at least one means one, two or more, unless otherwise clearly and specifically defined.

[0037] In the related technology, the process of laser engraving QR codes on circuit boards is as follows: the conveying mechanism conveys the circuit board from the previous process to the engraving processing station, the two sides of the circuit board are clamped and fixed by the clamping mechanism, and the laser head is located above the circuit board, which emits laser downward onto the circuit board to complete the engraving operation. After the operation is completed, the clamping mechanism releases the circuit board, and the belt conveyor conveys the circuit board to the next process.

[0038] Please refer to Figure 1 The circuit board supporting fixture of the embodiment of the present application is used to fix the circuit board transmitted by the conveying mechanism. It can be set on the side of the conveying mechanism or below the conveying mechanism. The circuit board supporting fixture includes a base 1, a negative pressure adsorption platform 2 and a driving component 3. The negative pressure adsorption platform 2 is set on the base 1.

[0039] The driving component 3 is connected to the base 1, and the driving end of the driving component 3 is connected to the negative pressure adsorption platform 2. The driving component 3 is used to lift the negative pressure adsorption platform 2 so that the negative pressure adsorption platform 2 can support the circuit board located on the conveying mechanism, and the negative pressure adsorption platform 2 is used to adsorb and fix the circuit board it supports; the driving component 3 is also used to drive the negative pressure adsorption platform 2 to fall back so that the negative pressure adsorption platform 2 can drive the circuit board to fall onto the conveying mechanism.

[0040] The adsorption force of the negative pressure adsorption platform 2 on the circuit board is generated by the pressure difference between the inside and outside. The circuit board is flattened on the negative pressure adsorption platform 2 under the action of external pressure, and the external pressure acts in a covering form rather than at one or more points. This can make the circuit board bear the force evenly and avoid warping of the circuit board, thereby improving the position accuracy of the QR code engraving on the circuit board.

[0041] Specifically, the driving component 3 can be a cylinder, and the driving end is the piston rod of the cylinder. The cylinder block of the cylinder is connected to the base 1, and the piston rod of the cylinder is connected to the bottom surface of the negative pressure adsorption platform 2. The piston rod of the cylinder expands and contracts to drive the negative pressure platform to rise or fall. Alternatively, the driving component 3 can be a servo cylinder. A servo cylinder is a modular product that integrates a servo motor and a lead screw. The housing of the servo cylinder is connected to the base 1, and the push rod of the servo cylinder is connected to the bottom surface of the negative pressure adsorption platform 2. The push rod of the servo cylinder reciprocates to drive the negative pressure platform to rise or fall.

[0042] Please refer to Figure 1 , in some embodiments, the circuit board carrying fixture further includes a pressing plate 4. The pressing plate 4 is disposed above the negative pressure adsorption platform 2 and is used to press the circuit board onto the negative pressure adsorption platform 2. The pressing plate 4 has a hollow area 41. The hollow area 41 is used to expose a part of the circuit board. The shape and number of the hollow areas 41 can be determined according to the specific specifications of the circuit board, so that the pressing plate 4 exposes the area to be engraved on the basis of fitting with the circuit board.

[0043] When the negative pressure adsorption platform 2 rises, the circuit board abuts against the pressing plate 4 under the drive of the negative pressure adsorption platform 2. The pressing plate 4 and the negative pressure adsorption platform 2 clamp the circuit board, so that the circuit board is further flattened, keeping the laser engraving surface flat, which is beneficial to improving the engraving quality.

[0044] Specifically, the pressing plate 4 can be fixed on the conveying mechanism, making full use of the existing structure as a fixing carrier.

[0045] In some other embodiments, the number or area of the hollow areas 41 can be increased to enable the pressing plate 4 to meet the engraving requirements of different circuit boards.

[0046] Please refer to Figure 2 , in some embodiments, the negative pressure adsorption platform 2 includes a main body 21 and an air suction pipe 22. The main body 21 is connected to the driving end. The main body 21 includes a supporting plane 213 for supporting the circuit board. The main body 21 has a vacuum chamber 211 and air suction holes 212 communicating with the vacuum chamber 211. The vacuum chamber 211 is located inside the main body 21, and the air suction holes 212 are disposed on the supporting plane 213; the air suction pipe 22 is connected to the main body 21 and communicates with the vacuum chamber 211. The air suction pipe 22 is used to be connected to a vacuum pumping device, and the vacuum pumping device can be a vacuum pump or a molecular pump.

[0047] The air suction pipe 22 pumps the air in the vacuum chamber 211 outwards through the vacuum pumping device, so that the air pressure in the vacuum chamber 211 decreases, forming a pressure difference with the external air pressure. The pressure difference generates a downward acting force, pushing the circuit board towards the supporting plane 213 and keeping it fixed. The supporting plane 213 can be used as a reference plane for the circuit board, so that the position references of each circuit board are kept consistent, improving the QR code engraving accuracy.

[0048] Please refer to Figure 2 , in some embodiments, the body 21 includes a base 214 and a supporting plate 215. The base 214 is connected to the driving end, the suction pipe 22 is connected to the base 214, the supporting plate 215 is connected to the base 214 and encloses a vacuum chamber 211, and the supporting plane 213 is arranged on the side of the supporting plate 215 away from the base 214.

[0049] The base 214 and the supporting plate 215 can be fixed by screws. To ensure the airtightness between the two, a sealing structure can be provided accordingly. By setting the body 21 as a split type, it is convenient to inspect and repair the body 21.

[0050] Please refer to Figure 3 , in some embodiments, the body 21 has a length direction and a width direction. There are multiple suction holes 212, which are arranged at intervals along the length direction and / or the width direction of the body 21, that is, the multiple suction holes 212 are evenly arranged in multiple rows and columns, and the suction holes 212 in each row and each column are equally spaced.

[0051] Using multiple suction holes 212 can expand the coverage rate of the supporting plane 213, increase the adsorption area between the circuit board and the suction holes 212, distribute the adsorption force more evenly, and provide a more stable adsorption effect, so as to prevent the circuit board from deforming due to too concentrated adsorption force.

[0052] Please refer to together with Figure 2 and Figure 3 , in some embodiments, there are multiple vacuum chambers 211 and suction pipes 22. Each suction pipe 22 communicates with a vacuum chamber 211. The multiple vacuum chambers 211 are arranged at intervals along the length direction of the body 21, and adjacent two vacuum chambers 211 are independent of each other, that is, the respective vacuum chambers 211 are not connected and are sealed separately.

[0053] The multiple vacuum chambers 211 are independent of each other, and each vacuum chamber 211 forms a negative pressure by being sucked by its corresponding suction pipe 22, thus forming an adsorption area corresponding to each vacuum chamber 211 respectively. When a certain vacuum chamber 211 is contaminated or fails, the remaining vacuum chambers 211 can still work normally. In addition, after dividing the multiple vacuum chambers 211, the space of each vacuum chamber 211 is relatively reduced, so that the vacuum pumping time required for the vacuum chamber 211 is also shortened, which is beneficial to improving production efficiency.

[0054] Please refer to together with Figure 4 and Figure 5 , in some embodiments, the circuit board carrying fixture further includes a guiding mechanism 5. The guiding mechanism 5 is arranged on the base 1 and is connected to the negative pressure adsorption platform 2. The guiding mechanism 5 is used to guide the negative pressure adsorption platform 2 when the driving component 3 lifts the negative pressure adsorption platform 2.

[0055] The guiding mechanism 5 can adopt linear bearings. The bearing sleeve of the linear bearing is connected to the base 1, and the guiding shaft of the linear bearing passes through the bearing sleeve and is connected to the negative pressure adsorption platform 2. When the negative pressure adsorption platform 2 moves up and down, it drives the guiding shaft to slide along the bearing sleeve, playing a guiding role for the negative pressure adsorption platform 2 and also stabilizing the movement of the negative pressure adsorption platform 2 to prevent the negative pressure adsorption platform 2 from shifting or shaking during the movement process.

[0056] Alternatively, the guiding mechanism 5 can adopt linear guide rails. The positioning track of the linear guide rails is arranged on the base 1, and the guide rail slider is connected to the negative pressure adsorption platform 2. When the negative pressure adsorption platform 2 moves up and down, it drives the guide rail slider to move along the linear guide rails, playing a guiding role for the negative pressure adsorption platform 2.

[0057] In some embodiments, multiple groups of guiding mechanisms 5 can be provided. The multiple groups of guiding mechanisms 5 are symmetrically arranged with respect to the driving component 3 to keep the negative pressure adsorption platform 2 balanced during the movement process.

[0058] Please also refer to Figure 4 and Figure 5 , in some embodiments, the circuit board carrying fixture further includes a buffer component 6. The buffer component 6 is used to buffer the negative pressure adsorption platform 2 when the driving component 3 drives the negative pressure adsorption platform 2 to fall back, so as to prevent the negative pressure adsorption platform 2 from making hard contact with the base 1, thereby reducing the impact on the overall structure of the fixture.

[0059] Please also refer to Figure 4 and Figure 5 , in some embodiments, the buffer component 6 includes a buffer pad 61 and a hydraulic buffer 62. The number of buffer pads 61 is multiple. The multiple buffer pads 61 are connected to the side of the negative pressure adsorption platform 2 facing the base 1. The multiple buffer pads 61 are distributed on both sides of the driving component 3. The buffer pad 61 can be made of materials such as silicone rubber, polyurethane, or polyethylene. When the negative pressure adsorption platform 2 falls back, the buffer pad 61 abuts against the base 1 to absorb the impact or vibration from the base 1 and then quickly return to its original state.

[0060] The hydraulic buffer 62, the cylinder body of the hydraulic buffer 62 is connected to the base 1, and the piston rod of the hydraulic buffer 62 is connected to the negative pressure adsorption platform 2. The hydraulic buffer 62 relies on hydraulic damping to buffer and decelerate the negative pressure adsorption platform 2 acting on it until it stops, which is beneficial to improving the movement stability of the negative pressure adsorption platform 2.

[0061] Correspondingly, a circuit board processing device provided by an embodiment of the present application includes a conveying mechanism and the circuit board carrying fixture in the above embodiment. The circuit board carrying fixture is arranged in the conveying mechanism, and the conveying mechanism is used to convey the circuit board.

[0062] Specifically, the conveying mechanism includes two sets of belt conveyors arranged at intervals. The circuit board is supported and conveyed on the two belt conveyors. The fixture is arranged between the two sets of belt conveyors. The negative pressure adsorption platform 2 is located below the circuit board, and the pressing plate 4 is located above the circuit board and connected to the outer shell of the belt conveyor.

[0063] During processing, the driving component 3 drives the negative pressure adsorption platform 2 to lift. The negative pressure adsorption platform 2 passes through the conveyor belts of the two belt conveyors and jacks up the circuit board until it abuts against the pressing plate 4, so that the circuit board is clamped between the pressing plate 4 and the negative pressure adsorption platform 2. Subsequently, the negative pressure adsorption platform 2 adsorbs and fixes the circuit board, and the laser head emits laser downward to engrave the circuit board.

[0064] The fixture is arranged between the two sets of belt conveyors, which can make full use of the existing structural space, and the negative pressure adsorption platform 2 stops moving upward when it reaches the pressing plate 4, avoiding interference with the laser head above.

[0065] The above has introduced in detail the circuit board carrying fixture provided by the embodiments of the present application, and specific examples are used to elaborate the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board supporting fixture, characterized in that: include: Base (1); A negative pressure adsorption platform (2) is arranged on the base (1); A driving component (3) is connected to the base (1), and a driving end of the driving component (3) is connected to the negative pressure adsorption platform (2). The driving component (3) is used to lift the negative pressure adsorption platform (2) so that the negative pressure adsorption platform (2) can support the circuit board located on the conveying mechanism, and the negative pressure adsorption platform (2) is used to adsorb and fix the supported circuit board.

2. The circuit board supporting fixture according to claim 1, characterized in that: The circuit board supporting fixture further includes: A pressing plate (4) is arranged above the negative pressure adsorption platform (2), and the pressing plate (4) is used to press the circuit board onto the negative pressure adsorption platform (2). The pressing plate (4) has a hollow area (41), and the hollow area (41) is used to expose a portion of the circuit board.

3. The circuit board supporting fixture according to claim 1, characterized in that: The negative pressure adsorption platform (2) comprises: A body (21) connected to the driving end, the body (21) having a vacuum cavity (211) and an air suction hole (212) connected to the vacuum cavity (211), the body (21) comprising a supporting plane (213) for supporting the circuit board, and the air suction hole (212) being arranged on the supporting plane (213); An air suction pipe (22) is connected to the body (21) and communicates with the vacuum chamber (211).

4. The circuit board supporting fixture according to claim 3, characterized in that: The body (21) comprises A base (214) connected to the driving end, and the suction pipe (22) is connected to the base (214); The supporting plate (215) is connected to the base (214) and surrounds the vacuum chamber (211); the supporting plane (213) is arranged on a side of the supporting plate (215) away from the base (214).

5. The circuit board supporting fixture according to claim 3, characterized in that: A plurality of the air suction holes (212) are provided and are arranged at intervals along the length direction and / or the width direction of the body (21).

6. The circuit board supporting fixture according to claim 3, characterized in that: The vacuum chamber (211) and the suction pipe (22) are both provided in plurality, and each suction pipe (22) is connected to a vacuum chamber (211).

7. The circuit board supporting fixture according to claim 1, characterized in that: The circuit board supporting fixture further includes: A guide mechanism (5), wherein the guide mechanism (5) is arranged on the base (1) and connected to the negative pressure adsorption platform (2), and the guide mechanism (5) is used to guide the negative pressure adsorption platform (2) when the driving component (3) lifts the negative pressure adsorption platform (2).

8. The circuit board supporting fixture according to claim 1, characterized in that: The circuit board supporting fixture further includes: A buffer component (6), wherein the buffer component (6) is used to buffer the negative pressure adsorption platform (2) when the driving component (3) drives the negative pressure adsorption platform (2) to fall back.

9. The circuit board supporting fixture according to claim 8, characterized in that: The buffer component (6) comprises: A plurality of buffer pads (61) connected to the negative pressure adsorption platform (2), the buffer pads (61) being located on a side of the negative pressure adsorption platform (2) facing the base (1); A hydraulic buffer (62), wherein a cylinder body of the hydraulic buffer (62) is connected to the base (1), and a piston rod of the hydraulic buffer (62) is connected to the negative pressure adsorption platform (2).

10. A circuit board processing device, characterized in that: It comprises the circuit board carrying jig and the conveying mechanism according to any one of claims 1 to 9, wherein the circuit board carrying jig is arranged in the conveying mechanism, and the conveying mechanism is used to transport the circuit board.

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