Miniaturized high-reliability equalizer

Abstract

The utility model discloses a miniaturized high-reliability equalizer, which is based on a GaAs IPD process and comprises an equivalent capacitor C1, one end of the equivalent capacitor C1 is used as an input end of the equalizer, and the other end of the equivalent capacitor C1 is used as an output end of the equalizer; one end of the equivalent capacitor C1 is also connected with one end of the equivalent resistor R1, the other end of the equivalent capacitor C1 is also connected with one end of the equivalent resistor R2, the other end of the equivalent resistor R1 is respectively connected with the other end of the equivalent resistor R2 and the grounding equivalent resistor R3, the resistors, the capacitors and the inductors are improved to form an equalization network, and the overall performance of the equalizer is improved.

Description

Technical Field

[0001] The utility model relates to the field of monolithic microwave integrated circuits, and particularly relates to a miniaturized high-reliability equalizer. Background Art

[0002] An equalizer is a device that improves the in-band flatness index by different amplitudes in each frequency band within a frequency band. It is manufactured using GaAs technology, miniaturizes and densifies discrete devices and microstrips, making such devices have broad application prospects in the military field.

[0003] Equalizers are generally divided into two structures: fixed-resistance type and non-fixed-resistance type. The non-fixed-resistance type amplitude equalizer has a simple structure, fewer components, and fewer parasitic parameters generated by the layout. The disadvantage is that the standing wave is poor and it needs to be used in combination with an attenuator. The fixed-resistance type amplitude equalizer has a relatively complex structure, more components, and electromagnetic field simulation should be carried out during layout to adjust the layout to reduce the mutual interference between components. Content of the Utility Model

[0004] Aiming at the above deficiencies in the prior art, a miniaturized high-reliability equalizer provided by the utility model solves the problem that the existing equalizer design cannot take into account both a simple structure and an excellent standing wave.

[0005] In order to achieve the above utility model purpose, the technical solution adopted by the utility model is: a miniaturized high-reliability equalizer, including an equivalent capacitor C1, one end of the equivalent capacitor C1 serves as the input end of the equalizer, and the other end of the equivalent capacitor C1 serves as the output end of the equalizer;

[0006] One end of the equivalent capacitor C1 is also connected to one end of an equivalent resistor R1, the other end of the equivalent capacitor C1 is also connected to one end of an equivalent resistor R2, and the other end of the equivalent resistor R1 is respectively connected to the other end of the equivalent resistor R2 and a grounded equivalent resistor R3.

[0007] Further: both the equivalent capacitor C1 and the equivalent capacitor C2 are MIM capacitors, using MMIC technology, and their equivalent models are the same. The equivalent model of the equivalent capacitor C1 includes a main capacitor C c1 , one end of the main capacitor C c1 serves as one end of the equivalent capacitor C1, one end of the equivalent resistor R1 is also connected to a grounded parasitic capacitor C c2 , the other end of the main capacitor C c1 is connected to one end of a parasitic resistor R c , one end of the parasitic resistor R c is connected to one end of a parasitic inductor L c , one end of the parasitic inductor L cThe other end of which serves as the other end of the equivalent resistor, and the parasitic inductance L c The other end is also connected to the grounded parasitic capacitance C c3 Connect.

[0008] Furthermore: The capacitance per square millimeter of the equivalent capacitances C1 and C2 is 250 pF.

[0009] Furthermore: The equivalent resistors R1, R2, and R3 are all thin-film capacitors with the same structure. The equivalent model of the equivalent resistor R1 includes the main resistor R R , and one end of the main resistor R R serves as one end of the equivalent resistor R1, and the other end of the main resistor R R is connected to the parasitic inductance L R One end of the main resistor R R is also connected to the grounded parasitic capacitance C R1 connected, and the other end of the main resistor R R is also connected to the grounded parasitic capacitance C R2 connected.

[0010] The beneficial effects of the present utility model are as follows:

[0011] 1. Simple structure, fewer components, and fewer parasitic parameters generated by the layout;

[0012] 2. It can improve the chip bandwidth and has good equalization;

[0013] 3. The layout is symmetrical, and the standing wave values of the input and output are basically equivalent. Description of the Drawings

[0014] Figure 1 is the topological structure diagram of a miniaturized high-reliability equalizer.

[0015] Figure 2 is the equivalent model diagram of the equivalent resistor.

[0016] Figure 3 is the equivalent model diagram of the equivalent resistor.

[0017] Figure 4 is the simulation result diagram of the insertion loss of the equalizer.

[0018] Figure 5 is the simulation result diagram of the input and output return losses of the equalizer. Specific Embodiments

[0019] The following describes the specific embodiments of the present invention to facilitate those skilled in the art to understand the present invention. However, it should be clear that the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions made using the concept of the present invention are within the scope of protection.

[0020] As Figure 1 shown, in an embodiment of the present invention, a miniaturized and highly reliable equalizer is provided, including an equivalent capacitor C1. One end of the equivalent capacitor C1 serves as the input end of the equalizer, and the other end of the equivalent capacitor C1 serves as the output end of the equalizer;

[0021] One end of the equivalent capacitor C1 is also connected to one end of an equivalent resistor R1, the other end of the equivalent capacitor C1 is also connected to one end of an equivalent resistor R2, and the other end of the equivalent resistor R1 is respectively connected to the other end of the equivalent resistor R2 and a grounded equivalent resistor R3.

[0022] As Figure 2 shown, both the equivalent capacitor C1 and the equivalent capacitor C2 are MIM capacitors, using MMIC technology, and their equivalent models are the same. The equivalent model of the equivalent capacitor C1 includes a main capacitor C c1 , one end of the main capacitor C c1 serves as one end of the equivalent capacitor C1, one end of the equivalent resistor R1 is also connected to a grounded parasitic capacitor C c2 , the other end of the main capacitor C c1 is connected to one end of a parasitic resistor R c , one end of the parasitic resistor R c is connected to one end of a parasitic inductor L c , the other end of the parasitic inductor L c serves as the other end of the equivalent resistor, and the other end of the parasitic inductor L c is also connected to a grounded parasitic capacitor C c3 .

[0023] Among them, the parasitic resistor R c and the parasitic inductor L c are caused by the length and width of the upper electrode; the parasitic capacitors C c2 and C c3 are generated between two layers of metal and the back metal.

[0024] The capacitance per square millimeter of the equivalent capacitor C1 and the equivalent capacitor C2 is 250 pF.

[0025] As Figure 3As shown, the equivalent resistors R1, R2, and R3 are all thin-film capacitors with the same structure. The equivalent model of the equivalent resistor R1 includes a main resistor R R , and one end of the main resistor R R serves as one end of the equivalent resistor R1. The other end of the main resistor R R is connected to the parasitic inductor L R . One end of the main resistor R R is also connected to the ground parasitic capacitor C R1 . The other end of the main resistor R R is also connected to the ground parasitic capacitor C R2 .

[0026] Among them, the parasitic inductor L R is caused by the length and width of the resistive metal, and the parasitic capacitors C R1 and C R2 are generated between the resistive metal and the back metal.

[0027] In an embodiment of the present invention, through the model analysis of the MIM capacitor and the thin-film resistor, the fixed attenuator chip is optimized using ADS software, and the simulation results are as follows Figure 4 and Figure 5 shown. According to Figure 4 and Figure 5 , it can be known that according to Figure 4 and Figure 5 , it can be known that the equalizer has characteristics such as a wide bandwidth and good return loss.

[0028] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "thickness", "upper", "lower", "horizontal", "top", "bottom", "inner", "outer", "radial", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Therefore, the features defined by "first", "second", "third" may explicitly or implicitly include one or more of such features.

Claims

1. A miniaturized high reliability equalizer, characterized in that: An equivalent capacitor C1 is included, one end of the equivalent capacitor C1 is used as the input end of the equalizer, and the other end of the equivalent capacitor C1 is used as the output end of the equalizer; One end of the equivalent capacitor C1 is also connected to one end of the equivalent resistor R1, the other end of the equivalent capacitor C1 is also connected to one end of the equivalent resistor R2, and the other end of the equivalent resistor R1 is respectively connected to the other end of the equivalent resistor R2 and the grounding equivalent resistor R3.

2. The miniaturized high reliability equalizer according to claim 1, characterized in that: The equivalent capacitor C1 and the equivalent capacitor C2 are both MIM capacitors, using MMIC technology, and have the same equivalent model. The equivalent model of the equivalent capacitor C1 includes the main capacitor C c1 , the main capacitor C c1 One end of the equivalent resistor R1 is connected to the ground parasitic capacitor C c2 Connect the main capacitor C c1 The other end of the parasitic resistance R c One end of the parasitic resistance R c One end is connected to the parasitic inductance L c One end of the parasitic inductance L c The other end of the equivalent resistor is used as the other end of the parasitic inductance L c The other end is also connected to the ground parasitic capacitance C c3 connect.

3. The miniaturized high reliability equalizer according to claim 1, characterized in that: The capacitance per square millimeter of the equivalent capacitor C1 and the equivalent capacitor C2 is 250 pF.

4. The miniaturized high reliability equalizer according to claim 1, characterized in that: The equivalent resistors R1, R2 and R3 are all thin film capacitors with the same structure. The equivalent model of the equivalent resistor R1 includes a main resistor R R , the main resistance R R As one end of the equivalent resistor R1, the main resistor R R The other end of the parasitic inductance L R Connect the main resistor R R One end of the parasitic capacitance C R1 Connect the main resistor R R The other end is also connected to the ground parasitic capacitance C R2 connect.

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