Laser degumming device

Abstract

The utility model discloses a laser degumming device, which relates to the technical field of laser degumming, and comprises an external refrigeration mechanism and a degumming mechanism, the external refrigeration mechanism is used for pre-refrigerating a magnet with glue, the degumming mechanism comprises a three-axis linear displacement mechanism and a laser emission mechanism, the three-axis linear displacement mechanism is provided with a moving end, and the laser emission mechanism is provided with a laser emission end. The moving end is provided with a glue removing platform, the glue removing platform is used for placing a pre-refrigerated magnet with glue, the glue removing platform is further provided with an internal refrigeration mechanism, the internal refrigeration mechanism is used for refrigerating the pre-refrigerated magnet with glue on the glue removing platform again, and the laser emitting mechanism is fixedly arranged. And the laser degumming mechanism is used for emitting laser when the internal refrigeration mechanism refrigerates the glued magnet and degumming the glued magnet. According to the utility model, the adhesive magnet is refrigerated through the external refrigeration mechanism and the internal refrigeration mechanism, so that the adhesive magnet is kept in a low-temperature state before and during the adhesive removal process, and the weakness of the surface magnetism of the magnet caused by high laser temperature is eliminated through the low temperature of the adhesive magnet.

Description

Technical Field

[0001] The utility model relates to the technical field of laser debonding, and particularly relates to a laser debonding device. Background Art

[0002] In the current debonding mechanism of the magnet with glue, the refrigeration mechanism often shares the power supply with the laser emission mechanism. Therefore, when the refrigeration mechanism is turned on, the laser emission mechanism will also be turned on to emit laser for debonding. However, when the laser emission mechanism emits laser, the refrigeration mechanism has just been turned on. Therefore, the magnet with glue has not been fully refrigerated yet, and the high temperature of the laser will weaken the surface magnetism of the magnet, which will cause harm to the magnet, and there will be a risk of magnet failure. Content of the Utility Model

[0003] The purpose of the utility model is to provide a laser debonding device, which can overcome the above defects and prevent the high temperature of the laser from weakening the surface magnetism of the magnet.

[0004] To achieve the above purpose, the solution of the utility model is as follows:

[0005] A laser debonding device is used for debonding the magnet with glue, and includes an external refrigeration mechanism and a debonding mechanism. The external refrigeration mechanism is used for pre-cooling the magnet with glue. The debonding mechanism includes a three-axis linear displacement mechanism and a laser emission mechanism. The three-axis linear displacement mechanism has a moving end with three-axis linear displacement. A debonding platform is arranged on the moving end. The debonding platform is used for placing the pre-cooled magnet with glue. An internal refrigeration mechanism is also arranged on the debonding platform. The internal refrigeration mechanism is used for refrigerating the pre-cooled magnet with glue on the debonding platform again. The laser emission mechanism is fixedly arranged and faces the debonding platform. It is used for emitting laser to debond the magnet with glue when the internal refrigeration mechanism refrigerates the magnet with glue.

[0006] Further, the external refrigeration mechanism includes a placement rack. The placement rack includes a horizontally arranged placement table and vertically arranged support plates on both sides of the placement table. The placement table is made of heat-conducting material and is used for placing the magnet with glue. A plurality of first heat dissipation grids are arranged on the lower surface of the placement table. The first heat dissipation grid includes a first heat dissipation plate and a plurality of first heat dissipation fins. The first heat dissipation plate is horizontally arranged on the lower surface of the placement table. The plurality of first heat dissipation fins are arranged and vertically arranged on the lower surface of the first heat dissipation plate, and there is a gap between adjacent two first heat dissipation fins. A first heat dissipation fan is arranged below the first heat dissipation grid. The first heat dissipation fan is connected to the first heat dissipation plate.

[0007] Further, the number of the first heat dissipation grids is three. The three first heat dissipation grids are arranged along the length direction of the placement table, and a first heat dissipation fan is arranged below each first heat dissipation grid.

[0008] Furthermore, the internal refrigeration mechanism includes a second heat dissipation grid, which includes a second heat dissipation plate and a plurality of second heat dissipation fins. The second heat dissipation plate is disposed at the bottom of the debonding platform. The plurality of second heat dissipation fins are perpendicular to the second heat dissipation plate and arranged on the lower surface of the second heat dissipation plate, and there is a gap between adjacent second heat dissipation fins. A second heat dissipation fan is disposed below the second heat dissipation grid, and the second heat dissipation fan is connected to the second heat dissipation plate.

[0009] Furthermore, it further includes a fixture, and a plurality of grooves are provided on the fixture for the adhesive tape magnet to be embedded.

[0010] Furthermore, the laser emission mechanism is disposed above the three-axis linear displacement mechanism. The laser emission mechanism emits laser downward. The debonding platform is inclined and disposed on the moving end. The upper surface of the debonding platform is inclined towards the laser emission mechanism. A placement groove is recessed on the inclined upper surface of the debonding platform for the fixture carrying the adhesive tape magnet to be embedded.

[0011] After adopting the above solution, the beneficial effects of the present utility model are as follows:

[0012] The present utility model includes an external refrigeration mechanism, which pre-cools the adhesive tape magnet before putting the internal refrigeration mechanism, so that the temperature of the magnet is reduced. Then, the adhesive tape magnet is placed on the debonding platform, and the internal refrigeration mechanism and the laser emission device are turned on. When the internal refrigeration mechanism continuously cools the adhesive tape magnet, the laser emission device emits laser to debond the adhesive tape magnet. Therefore, the present utility model cools the adhesive tape magnet through the external refrigeration mechanism and the internal refrigeration mechanism, so that the adhesive tape magnet remains in a low-temperature state before and during the debonding process, and eliminates the attenuation of the surface magnetism of the magnet due to the high temperature of the laser by its own low temperature, avoiding magnet failure. Description of the Drawings

[0013] Figure 1 is the overall structural schematic diagram of the present utility model

[0014] Figure 2 is the structural schematic diagram of the debonding platform of the present utility model;

[0015] Figure 3 is the structural schematic diagram of the external refrigeration mechanism of the present utility model;

[0016] Figure 4 is Figure 3 the enlarged view of part A of

[0017] Figure 5 is the schematic diagram of the fixture carrying the adhesive tape magnet of the present utility model.

[0018] Label description: 10. External refrigeration mechanism; 11. Placing rack; 111. Placing table; 112. Support plate; 12. First heat dissipation grid; 121. First heat dissipation plate; 122. First heat dissipation fin; 13. First heat dissipation fan; 20. Glue removing mechanism; 21. Three-axis linear displacement mechanism; 211. Moving end; 22. Glue removing platform; 221. Placing groove; 23. Internal refrigeration mechanism; 231. Second heat dissipation grid; 2311. Second heat dissipation plate; 2312. Second heat dissipation fin; 232. Second heat dissipation fan; 30. Laser emitting mechanism; 40. Fixture; 41. Groove; 50. Magnet. Detailed implementation mode

[0019] The following combines the attached drawings and specific embodiments to make a detailed description of the present utility model.

[0020] As Figures 1 to 5 shown, the present utility model provides a laser glue removing device for removing glue from a glued magnet 50, which includes an external refrigeration mechanism 10 and a glue removing mechanism 20. The external refrigeration mechanism 10 is used to pre-cool the glued magnet 50. The glue removing mechanism 20 includes a three-axis linear displacement mechanism 21 and a laser emitting mechanism 30. The three-axis linear displacement mechanism 21 has a moving end 211 that performs three-axis linear displacement. A glue removing platform 22 is arranged on the moving end 211. The glue removing platform 22 is used to place the pre-cooled glued magnet 50. An internal refrigeration mechanism 23 is also arranged on the glue removing platform 22. The internal refrigeration mechanism 23 is used to cool the pre-cooled glued magnet 50 on the glue removing platform 22 again. The laser emitting mechanism 30 is fixedly arranged and faces the glue removing platform 22. It is used to emit laser when the internal refrigeration mechanism 23 cools the glued magnet 50, so as to remove the glue from the glued magnet 50;

[0021] The present utility model includes an external refrigeration mechanism 10, which pre-cools the glued magnet 50 before putting it into the internal refrigeration mechanism 23, so that the temperature of the magnet 50 decreases. Then, the glued magnet 50 is placed on the glue removing platform 22, and the internal refrigeration mechanism 23 and the laser emitting device are turned on. While the internal refrigeration mechanism 23 continuously cools the glued magnet 50, the laser emitting device emits laser to remove the glue from the glued magnet 50. Therefore, the present utility model cools the glued magnet 50 through the external refrigeration mechanism 10 and the internal refrigeration mechanism 23, so that the glued magnet 50 remains in a low-temperature state before and during the glue removing process, and eliminates the attenuation of the surface magnetism of the magnet 50 caused by the high temperature of the laser through its own low temperature, avoiding the failure of the magnet 50;

[0022] Specifically, the external refrigeration mechanism 10 includes a placement rack 11. The placement rack 11 includes a horizontally arranged placement table 111 and vertically arranged support plates 112 on both sides of the placement table 111. The placement table 111 is made of a heat-conducting material and is used to place the adhesive magnet 50. A plurality of first heat dissipation grids 12 are provided on the lower surface of the placement table 111. Each first heat dissipation grid 12 includes a first heat dissipation plate 121 and a plurality of first heat dissipation fins 122. The first heat dissipation plate 121 is horizontally arranged on the lower surface of the placement table 111, and the plurality of first heat dissipation fins 122 are arranged and vertically provided on the lower surface of the first heat dissipation plate 121, and there is a gap between adjacent first heat dissipation fins 122. A first heat dissipation fan 13 is provided below the first heat dissipation grid 12. The first heat dissipation fan 13 is connected to the first heat dissipation plate 121. The first heat dissipation fan 13 is used to draw away the hot air between the first heat dissipation fins 122, so that the temperature of the first heat dissipation grid 12 is rapidly reduced, thereby rapidly reducing the temperature of the placement table 111. Specifically, the placement table 111 is made of aluminum alloy. While having good heat conductivity, the aluminum alloy can also prevent the magnet 50 from adsorbing to the placement table 111.

[0023] Specifically, the number of the first heat dissipation grids 12 is three. The three first heat dissipation grids 12 are arranged along the length direction of the placement table 111, and a first heat dissipation fan 13 is provided below each first heat dissipation grid 12 to enhance the efficiency of pre-cooling the adhesive magnet 50 and rapidly cool the adhesive magnet 50. Specifically, the power of the heat dissipation fan is not limited and can be determined according to the actual situation of the user.

[0024] Specifically, the internal refrigeration mechanism 23 includes a second heat dissipation grid 231. The second heat dissipation grid 231 includes a second heat dissipation plate 2311 and a plurality of second heat dissipation fins 2312. The second heat dissipation plate 2311 is arranged at the bottom of the glue removal platform 22. The plurality of second heat dissipation fins 2312 are perpendicular to the second heat dissipation plate 2311 and arranged on the lower surface of the second heat dissipation plate 2311, and there is a gap between adjacent second heat dissipation fins 2312. A second heat dissipation fan 232 is provided below the second heat dissipation grid 231. The second heat dissipation fan 232 is connected to the second heat dissipation plate 2311. The second heat dissipation fan 232 is used to draw away the hot air between the second heat dissipation fins 2312, so that the temperature of the second heat dissipation grid 231 is rapidly reduced, so as to rapidly reduce the temperature of the glue removal platform 22. Specifically, the above-mentioned first heat dissipation grid 12 and the second heat dissipation grid 231 are both made of aluminum. Aluminum has good heat dissipation performance, so the heat dissipation efficiency can be improved.

[0025] Specifically, the external refrigeration mechanism 10 and the internal refrigeration mechanism 23 can also be components in the prior art that can refrigerate and cool the placement table 111 or the glue removal platform 22, which is not limited herein.

[0026] Further, it further includes a jig 40. Multiple grooves 41 are provided on the jig 40 for the adhesive tape magnets 50 to be embedded therein, so as to pre-cool multiple adhesive tape magnets 50 at one time through the external refrigeration mechanism 10, improving the efficiency of pre-cooling. Specifically, the jig 40 is made of aluminum alloy to prevent the magnets 50 from adsorbing to the jig 40. Specifically, during use, first turn on the external refrigeration mechanism 10 and wait for 120 seconds until the external refrigeration mechanism 10 cools to the lowest temperature. Then place the jig 40 carrying the adhesive tape magnets 50 into the external refrigeration mechanism 10 and wait for 40 seconds to pre-cool the adhesive tape magnets 50, causing the adhesive tape magnets 50 to cool down. Then place the adhesive tape magnets 50 on the degumming platform 22 for degumming operation.

[0027] Specifically, the laser emitting mechanism 30 is arranged above the three-axis linear displacement mechanism 21. The laser emitting mechanism 30 emits laser downward. The degumming platform 22 is inclined and arranged on the moving end 211. The upper surface of the degumming platform 22 is inclined towards the laser emitting mechanism 30. A placement groove 221 is recessed on the inclined upper surface of the degumming platform 22 for the jig 40 carrying the adhesive tape magnets 50 to be embedded. It can be understood that since the adhesive tape magnets 50 are inclined and embedded in the grooves 41, the inclined arrangement of the degumming platform 22 can make the adhesive part of the adhesive tape magnets 50 face the laser directly, which is beneficial to improving the degumming efficiency.

[0028] To further illustrate the embodiments, the present invention provides drawings. These drawings are a part of the disclosure of the present invention, mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those of ordinary skill in the art should be able to understand other possible implementation manners and the advantages of the present invention. The components in the drawings are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0029] At the same time, the front, rear, left, right and other orientations involved in this embodiment are only for reference of an orientation and do not represent the orientation in actual use. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0030] The above are only the preferred embodiments of the present utility model and do not limit the design of this case. All equivalent changes made according to the key design of this case fall within the protection scope of this case.

Claims

1. A laser debonding device for debonding a magnet with adhesive, characterized in that: It includes an external refrigeration mechanism and a debonding mechanism. The external refrigeration mechanism is used to pre-cool the adhesive magnet. The debonding mechanism includes a three-axis linear displacement mechanism and a laser emission mechanism. The three-axis linear displacement mechanism has a moving end that performs three-axis linear displacement. A debonding platform is provided on the moving end. The debonding platform is used to place the pre-cooled adhesive magnet. An internal refrigeration mechanism is also provided on the debonding platform. The internal refrigeration mechanism is used to cool the pre-cooled adhesive magnet on the debonding platform again. The laser emission mechanism is fixedly arranged and faces the debonding platform. It is used to emit laser when the internal refrigeration mechanism cools the adhesive magnet, so as to debond the adhesive magnet.

2. The laser debonding device according to claim 1, wherein: The external refrigeration mechanism includes a placement rack. The placement rack includes a horizontally arranged placement table and vertically arranged support plates on both sides of the placement table. The placement table is made of a heat-conducting material and is used to place the adhesive magnet. A plurality of first heat dissipation grids are provided on the lower surface of the placement table. The first heat dissipation grid includes a first heat dissipation plate and a plurality of first heat dissipation fins. The first heat dissipation plate is horizontally arranged on the lower surface of the placement table. The plurality of first heat dissipation fins are arranged and vertically arranged on the lower surface of the first heat dissipation plate, and there is a gap between adjacent two first heat dissipation fins. A first heat dissipation fan is provided below the first heat dissipation grid. The first heat dissipation fan is connected to the first heat dissipation plate.

3. A laser debonding device according to claim 2, wherein: The number of the first heat dissipation grids is three. The three first heat dissipation grids are arranged along the length direction of the placement table, and a first heat dissipation fan is provided below each first heat dissipation grid.

4. A laser debonding device according to claim 1, characterized in that: The internal refrigeration mechanism includes a second heat dissipation grid. The second heat dissipation grid includes a second heat dissipation plate and a plurality of second heat dissipation fins. The second heat dissipation plate is arranged at the bottom of the debonding platform. The plurality of second heat dissipation fins are perpendicular to the second heat dissipation plate and are arranged on the lower surface of the second heat dissipation plate, and there is a gap between adjacent second heat dissipation fins. A second heat dissipation fan is provided below the second heat dissipation grid. The second heat dissipation fan is connected to the second heat dissipation plate.

5. The laser debonding device according to claim 1, wherein: It also includes a fixture. A plurality of grooves are provided on the fixture, and the grooves are used for the adhesive magnet to be embedded.

6. A laser debonding device as claimed in claim 5, wherein: The laser emission mechanism is arranged above the three-axis linear displacement mechanism. The laser emission mechanism emits laser downward. The debonding platform is inclinedly arranged on the moving end. The upper surface of the debonding platform is inclined towards the laser emission mechanism. A placement groove is recessed on the inclined upper surface of the debonding platform, and the placement groove is used for the fixture carrying the adhesive magnet to be embedded.

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