SMD (Surface Mount Device) solid-state laminated polymer capacitor

By designing a chip-type solid-state stacked polymer capacitor with L-pin and heat dissipation structure, the problem of poor heat dissipation in traditional capacitors in high and low temperature environments is solved, the stability and life of the capacitor are improved, and the production efficiency is improved.

CN223167346UActive Publication Date: 2025-07-29ZHAOQING BERYL ELECTRONICS TECH
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Patent Information

Application Number
CN202422182757.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-05
Publication Date
2025-07-29
Estimated Expiration
2034-09-05

AI Technical Summary

Technical Problem

When used in high and low temperature environments, the heat dissipation effect is poor, resulting in a shortened capacitor life, large ESR changes, and a poor ripple current resistance, affecting filtering and coupling functions.

Method used

The pin of the L-shaped structure is designed to lead out from both ends of the housing and protrude from the bottom to form a heat dissipation space with the circuit board. A heat dissipation structure is set on the pins to avoid the capacitor and the circuit board being directly bonded.

Benefits of technology

It improves the heat dissipation efficiency of the capacitor, extends the service life, reduces the impact of ambient temperature on the capacitor, and improves the production efficiency and the accuracy of positive and negative electrode judgments.

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Abstract

The utility model discloses a surface-mounted solid-state laminated polymer capacitor, which comprises a shell and a conducting medium, the conducting medium is packaged in the shell, and a pin structure is led out of the shell from the conducting medium; the shell comprises an upper shell body and a lower shell body, the lower shell body corresponds to an external circuit board, the pin structure comprises a first pin and a second pin which are both of an L-shaped structure, and the first pin and the second pin extend towards the bottom face of the lower shell body and protrude out of the bottom face after being led out from the upper end and the lower end of the shell body respectively. And when the first pin and the second pin are welded on an external circuit board, a heat dissipation space is formed between the bottom surface of the lower shell and the external circuit board. According to the utility model, the pin structure is arranged to be an outward L-shaped structure, and the length of the pin structure is increased, so that the pin structure protrudes out of the bottom surface of the lower shell, and a heat dissipation space can be formed between the lower shell and a circuit board during use, thereby avoiding the influence on the service life caused by too fast temperature rise of the capacitor due to direct attachment.
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