SMD (Surface Mount Device) solid-state laminated polymer capacitor

Abstract

The utility model discloses a surface-mounted solid-state laminated polymer capacitor, which comprises a shell and a conducting medium, the conducting medium is packaged in the shell, and a pin structure is led out of the shell from the conducting medium; the shell comprises an upper shell body and a lower shell body, the lower shell body corresponds to an external circuit board, the pin structure comprises a first pin and a second pin which are both of an L-shaped structure, and the first pin and the second pin extend towards the bottom face of the lower shell body and protrude out of the bottom face after being led out from the upper end and the lower end of the shell body respectively. And when the first pin and the second pin are welded on an external circuit board, a heat dissipation space is formed between the bottom surface of the lower shell and the external circuit board. According to the utility model, the pin structure is arranged to be an outward L-shaped structure, and the length of the pin structure is increased, so that the pin structure protrudes out of the bottom surface of the lower shell, and a heat dissipation space can be formed between the lower shell and a circuit board during use, thereby avoiding the influence on the service life caused by too fast temperature rise of the capacitor due to direct attachment.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a patch-type solid laminated polymer capacitor. Background Art

[0002] A laminated solid capacitor is formed by parallel welding multiple capacitor electrodes deposited with conductive polymers, and then encapsulated with resin and carbon paste silver paste to form a square-structured solid aluminum capacitor.

[0003] The pins of traditional solid laminated polymer capacitors are bent towards the capacitor. One side of the pins is in close contact with the capacitor, and the other side is in close contact with the PCB board. When operating in high and low temperature environments or in environments with limited space, the capacitor is easily affected by the ambient temperature, the service life of the capacitor will be shortened, the capacitor is greatly affected by the ambient temperature through the pins, its ESR will increase with the decrease of temperature and also increase with too high temperature, the ripple current withstand capacity becomes poor, and functions such as filtering and coupling will also be affected.

[0004] For example, Chinese Utility Model Patent CN 218241603 U discloses a laminated solid aluminum electrolytic capacitor with good sealing performance. The first connection part of the negative electrode lead-out terminal is electrically connected to the negative extreme of a single piece, the first connection part is connected to the negative electrode lead-out terminal located outside the plastic encapsulation resin, and the first connection part and the first connection part are connected through a first bending part so that the first connection part and the first connection part are located in different planes. Although in the above utility model, the first connection part and the first connection part are connected through the first bending part so that the first connection part and the first connection part are located in different planes, when there is a gap between the negative electrode lead-out terminal and the plastic encapsulation resin due to reasons such as thermal expansion and contraction, water vapor and air need to turn multiple times along the gap between the negative electrode lead-out terminal and the plastic encapsulation resin to enter the capacitor core, and the sealing performance of the capacitor is better. However, in actual use, the capacitor is greatly affected by the ambient temperature, and the life of the capacitor is not high under high and low temperature use conditions. Summary of the Utility Model

[0005] Based on this, in view of the above technical problems, it is necessary to provide a patch-type solid laminated polymer capacitor that can dissipate heat better.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A patch-type solid laminated polymer capacitor, comprising: a housing and a conductive medium, the conductive medium is encapsulated inside the housing, and a pin structure is led out from the conductive medium to the outside of the housing;

[0008] The housing includes an upper housing and a lower housing. The lower housing corresponds to an external circuit board. The pin structure includes a first pin and a second pin, both of which are in an L-shaped structure. The first pin and the second pin extend from the upper and lower ends of the housing respectively and then extend downward to the bottom surface of the lower housing and protrude from the bottom surface. When the first pin and the second pin are welded to the external circuit board, a heat dissipation space is formed between the bottom surface of the lower housing and the external circuit board.

[0009] Further, the first pin includes a first welding portion and a first connecting portion. The first connecting portion and the first welding portion are in an L-shaped structure, and the bottom of the first welding portion is welded to the external circuit board.

[0010] Further, the second pin includes a second welding portion and a second connecting portion. The second connecting portion and the second welding portion are in an L-shaped structure, and the bottom of the second welding portion is welded to the external circuit board.

[0011] Further, the height h from the bottoms of the first welding portion and the second welding portion to the bottom surface of the lower housing is 0.5 - 3 mm.

[0012] Further, the first connecting portion and the second connecting portion have the same length, and the first welding portion and the second welding portion extend outward from the housing.

[0013] Further, a heat dissipation structure is provided on the upper surface of the first pin.

[0014] Further, the heat dissipation structure is a protrusion or a depression on the upper surface of the first pin.

[0015] Further, the conductive medium includes a plurality of capacitor layers and a frame. The pin structure extends from the frame to the outside of the housing, and the capacitor layers and the frame are fixed by a fixing layer.

[0016] Further, a plurality of capacitor layers are stacked on the front and back surfaces of the frame, and the capacitor layers are solid capacitor layers containing a conductive polymer.

[0017] Further, the first pin is a positive electrode pin, and the second pin is a negative electrode pin.

[0018] Compared with the prior art, the present utility model has the following beneficial effects:

[0019] By setting the pin structure of the surface-mounted solid-state laminated polymer capacitor proposed by the present utility model into an outward L-shaped structure, the welding operation is facilitated. At the same time, the length of the pin structure is lengthened so that it protrudes from the bottom surface of the lower housing. During use, a heat dissipation space can be formed between the lower housing and the circuit board, avoiding the rapid rise in the temperature of the capacitor caused by direct contact, which affects the service life, and improving the stability of the capacitor.

[0020] At the same time, the patch-type solid laminated polymer capacitor proposed by the present utility model also further accelerates the heat dissipation of the capacitor by arranging a heat dissipation structure on the upper surface of the first pin. At the same time, it can also be used as a mark to distinguish the positive and negative pins, which facilitates production operations, reduces the incidence of incorrect positive and negative judgments, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. is a schematic structural diagram of the patch-type solid laminated polymer capacitor provided by the present utility model;

[0022] Figure 2 FIG. is an exploded structural diagram of the patch-type solid laminated polymer capacitor provided by the present utility model;

[0023] Figure 3 FIG. is a side view of the patch-type solid laminated polymer capacitor provided by the present utility model.

[0024] The reference numerals in the figures are explained as follows:

[0025] Upper housing 1, lower housing 2, bottom surface 21, capacitor layer 3, fixing layer 4, frame 5, first pin 6, second pin 7, first welding part 61, first connecting part 62, second welding part 71, second connecting part 72. SPECIFIC EMBODIMENTS

[0026] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0027] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.

[0028] In addition, the terms "first", "second", and "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0029] As described in the background art, the existing patch-type solid-state laminated polymer capacitors have poor heat dissipation effects, which affect the service life of the capacitors.

[0030] To solve this technical problem, the present utility model provides a patch-type solid-state laminated polymer capacitor, as Figures 1 to 3 shown, which includes: a housing and a conductive medium, the conductive medium is encapsulated inside the housing, and a lead structure is led out from the conductive medium to the outside of the housing;

[0031] The housing includes an upper housing 1 and a lower housing 2, the lower housing 2 corresponds to an external circuit board, the lead structure includes a first lead 6 and a second lead 7 both in an L-shaped structure, the first lead 6 and the second lead 7 are respectively led out from the upper and lower ends of the housing and extend downward to the bottom surface 21 of the lower housing 2 and protrude from the bottom surface 21. When the first lead 6 and the second lead 7 are welded to the external circuit board, a heat dissipation space is formed between the bottom surface 21 of the lower housing 2 and the external circuit board.

[0032] For the patch-type solid-state laminated polymer capacitor provided by the present utility model, by leading the first lead 6 and the second lead 7 out from the upper and lower ends of the housing respectively and extending them downward to the bottom surface 21 of the lower housing 2 and protruding from the bottom surface 21, when the capacitor is welded to the external circuit board, a heat dissipation space is formed between the bottom surface 21 of the lower housing 2 and the circuit board, the capacitor housing will not be in contact with the circuit board, reducing the influence of the ambient temperature on the capacitor, accelerating the heat dissipation speed of the capacitor itself, and prolonging the life of the capacitor. At the same time, a heat dissipation structure is added to one of the leads of the capacitor, further accelerating the heat dissipation rate of the capacitor, and at the same time, it can also play a marking role to facilitate employees to distinguish the positive and negative poles.

[0033] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0034] It should be noted that, without conflict, the embodiments in the present utility model and the features and technical solutions in the embodiments may be combined with each other.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0036] Embodiment 1

[0037] Please refer to Figures 1 - 3 , this embodiment proposes a patch-type solid-state laminated capacitor, which includes a housing and a conductive medium, and the conductive medium is encapsulated inside the housing; the housing includes an upper housing 1 and a lower housing 2, and the upper housing 1 and the lower housing 2 enclose the conductive medium inside. Further, the conductive medium leads out a pin structure to the outside of the housing. During use, the pin structure is welded to an external circuit board. Further, the housing is made of a resin material.

[0038] Further, the conductive medium includes a capacitor layer 3 and a frame 5. The capacitor layer 3 is a solid-state capacitor layer containing a conductive polymer. A plurality of capacitor layers 3 are stacked on the front and back of the frame 5. The capacitor layer 3 and the frame 5 are fixed by a fixing layer 4. The fixing layer 4 can be a conventional fixing material such as solder, rivet or conductive adhesive. The plurality of capacitor layers 3 are stacked in parallel according to the capacitor specifications to form a conductive medium with low impedance.

[0039] Further, the pin structure includes a first pin 6 and a second pin 7. The first pin 6 and the second pin 7 are respectively led out from the upper and lower ends of the frame 5 for welding to an external circuit board. Specifically, the first pin 6 is a positive pin, and the second pin 7 is a negative pin.

[0040] Further, after the first pin 6 and the second pin 7 are respectively led out from the upper and lower ends of the housing, they extend downward to the bottom surface 21 of the lower housing 2 and protrude from the bottom surface 21.

[0041] Specifically, the first pin 6 has an L-shaped structure. Specifically, the first pin 6 includes a first welding portion 61 and a first connecting portion 62. The first connecting portion 62 is led out from the upper end of the frame 5, bent downward toward the lower housing 2, and horizontally extends outward at the other end of the first connecting portion 62 to form the first welding portion 61. That is, the first connecting portion 62 and the first welding portion 61 have an L-shaped structure, and the bottom surface of the first welding portion 61 is welded to an external circuit board.

[0042] Further, the second pin 7 has an L-shaped structure. Specifically, the second pin 6 includes a second welding portion 71 and a second connecting portion 72. The second connecting portion 72 is led out from the lower end of the frame 5, bent downward toward the lower housing 2, and horizontally extends outward at the other end of the second connecting portion 72 to form the second welding portion 71. That is, the second connecting portion 72 and the second welding portion 71 have an L-shaped structure, and the bottom surface of the second welding portion 71 is welded to an external circuit board.

[0043] Further, when the first welding portion 61 and the second welding portion 71 are welded to the circuit board, a heat dissipation space is formed between the bottom surface 21 of the lower housing 2 and the external circuit board. Specifically, the ends of the first connecting portion 62 and the second connecting portion 72 away from the frame 5 protrude from the bottom surface 21 of the lower housing 2. When the bottom surfaces of the first welding portion 61 and the second welding portion 71 are welded to the external circuit board, the bottom surface 21 will not directly contact the external circuit board. Thus, a heat dissipation space is formed between the bottom surface 21 and the external circuit board, accelerating the heat dissipation of the capacitor.

[0044] Further, the first connecting portion 62 and the second connecting portion 72 have the same length, and the height h from the bottom of the first welding portion 61 and the second welding portion 71 to the bottom surface 21 of the lower housing 2 is 0.5 mm.

[0045] Further, a heat dissipation structure is provided on the upper surface of the first lead 6. Specifically, the heat dissipation structure is a protrusion on the upper surface of the first lead 6, and the shape of the protrusion is not limited and can be stripes, patterns or other identification patterns. On the one hand, it increases the surface area of the lead structure, which can accelerate heat dissipation. On the other hand, it serves as a marking function, enabling the operator to quickly determine the positive and negative poles.

[0046] Embodiment 2

[0047] Reference Figures 1 - 3 In this embodiment, a surface-mounted solid-state stacked capacitor is proposed. The difference between this embodiment and Embodiment 1 is that the height h from the bottom surface of the first welding portion 61 and the second welding portion 71 to the bottom surface 21 of the lower housing 2 is 3 mm; the heat dissipation structure is a depression on the upper surface of the first lead 6, and the shape of the depression is not limited and can be stripes, patterns or other identification patterns.

[0048] The manufacturing method of the surface-mounted solid-state stacked capacitor is as follows: The capacitor layer 3 is fixed on the front and back sides of the frame 5 by welding, riveting or conductive adhesive. The frame 5 leads out the first lead 6 and the second lead 7. The upper surface of the first lead 6 is provided with upwardly protruding stripes. The capacitor layer 3 is repeatedly stacked according to the specification requirements to form a stable parallel stacked conductive medium. The conductive medium is placed in a packaging mold, and a resin packaging material is injection-molded to form an upper housing 1 and a lower housing 2 with good sealing performance, encapsulating the conductive medium inside the housing. The first lead 6 and the second lead 7 are bent so that the first welding portion 61 and the first connecting portion 62 and the second welding portion 71 and the second connecting portion 72 form an L shape. The ends of the first connecting portion 62 and the second connecting portion 72 away from the frame 5 protrude from the bottom surface 21 of the lower housing 2, and the height h from the bottom surfaces of the first welding portion 61 and the second welding portion 71 to the bottom surface 21 of the lower housing 2 is 0.5 - 3 mm.

[0049] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or communication with each other; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0050] Obviously, the embodiments described above are only a part of the embodiments of the present utility model, rather than all embodiments. The accompanying drawings show preferred embodiments of the present utility model, but do not limit the patent scope of the present utility model. The present utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present utility model in other related technical fields shall be within the scope of the patent protection of the present utility model by the same token.

Claims

1. A patch-type solid laminated polymer capacitor, characterized in that, It includes: a housing and a conductive medium, the conductive medium is encapsulated inside the housing, and lead pin structures are led out from the conductive medium to the outside of the housing; the housing includes an upper housing (1) and a lower housing (2), the lower housing (2) corresponds to an external circuit board, the lead pin structures include a first lead pin (6) and a second lead pin (7) both in an L-shaped structure, the first lead pin (6) and the second lead pin (7) are respectively led out from the upper and lower ends of the housing and extend downward to the bottom surface (21) of the lower housing (2) and protrude from the bottom surface (21). When the first lead pin (6) and the second lead pin (7) are welded to the external circuit board, a heat dissipation space is formed between the bottom surface (21) of the lower housing (2) and the external circuit board.

2. The chip-type solid laminated polymer capacitor according to claim 1, wherein The first lead pin (6) includes a first welding portion (61) and a first connecting portion (62), the first connecting portion (62) and the first welding portion (61) are in an L-shaped structure, and the bottom of the first welding portion (61) is welded to the external circuit board.

3. The patch-type solid laminated polymer capacitor according to claim 2, characterized in that, The second lead pin (7) includes a second welding portion (71) and a second connecting portion (72), the second connecting portion (72) and the second welding portion (71) are in an L-shaped structure, and the bottom of the second welding portion (71) is welded to the external circuit board.

4. The chip-type solid laminated polymer capacitor according to claim 3, wherein The height h from the bottoms of the first welding portion (61) and the second welding portion (71) to the bottom surface (21) of the lower housing (2) is 0.5 - 3 mm.

5. The chip-type solid laminated polymer capacitor according to claim 3, wherein The first connecting portion (62) and the second connecting portion (72) are of the same length, and the first welding portion (61) and the second welding portion (71) extend towards the outside of the housing.

6. The chip-type solid laminated polymer capacitor according to claim 1, characterized in that, The upper surface of the first lead pin (6) is provided with a heat dissipation structure.

7. The chip-type solid laminated polymer capacitor according to claim 6, characterized in that, The heat dissipation structure is a protrusion or a depression on the upper surface of the first lead pin (6).

8. The chip-type solid laminated polymer capacitor according to claim 1, wherein The conductive medium includes a plurality of capacitor layers (3) and a frame (5), the lead pin structures are led out from the frame (5) to the outside of the housing, and the capacitor layers (3) and the frame (5) are fixed by a fixing layer (4).

9. The chip-type solid laminated polymer capacitor according to claim 8, characterized in that, A plurality of capacitor layers (3) are stacked on the front and back of the frame (5), and the capacitor layers (3) are solid capacitor layers containing conductive polymers.

10. The patch-type solid laminated polymer capacitor according to claim 1, wherein The first lead pin (6) is a positive electrode lead pin, and the second lead pin (7) is a negative electrode lead pin.

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