Wafer optical identification device

Abstract

The utility model discloses a wafer optical identification device. Comprising a camera device, a light-emitting device, a circuit substrate and a light source refraction piece, wherein the camera device is used for shooting graphic and text information on a wafer semiconductor; the light-emitting device is provided with a plurality of light-emitting elements and is arranged at one side of the camera device; the circuit substrate can identify the graphic and text information and can control the light-emitting elements to act; the circuit substrate is arranged on one side of the light-emitting device and connected with the camera device and the light-emitting device, and the light source refraction piece is arranged on one side of the light-emitting device. When the image-text information on the wafer semiconductor cannot be clearly shot by the camera device due to the angle relation, the light source emitted by the light-emitting element on the light-emitting device is utilized to strengthen or optimize the light source where the image-text information is located after passing through the light source refracting piece, and a user can pass through the circuit substrate to obtain the image-text information. And the starting mode of the light-emitting element is changed according to the requirement, so that any light source problem related to graphic and text information can be solved.

Description

Technical Field

[0001] The utility model relates to a wafer optical recognition device that can clearly and unambiguously detect standardized text on a wafer semiconductor, and has built-in AI image recognition and automatic image training functions, as well as light sources at multiple different angles to achieve text recognition for a variety of different wafer semiconductors. Background Art

[0002] Generally, semiconductor wafers are engraved with numbers on their surfaces to indicate the identity of the semiconductor wafers, so as to facilitate the subsequent related processes and inspection operations. For example, the patent No. M632730 of Taiwan, China, for "marking identification device for wafers" mainly includes an optical identification element, a wafer carrier mechanism is provided on one side of the optical identification element, and an upper side reflective element and a lower side reflective element are provided on one side of the wafer carrier mechanism. In this way, the wafer can be placed on the wafer carrier mechanism to reflect the upper surface image of the wafer to the optical identification element via the upper side reflective element, and the lower surface image of the wafer is reflected to the optical identification element via the lower side reflective element, so that the upper surface mark and the lower surface mark can be identified from the upper surface image and the lower surface image via the optical identification element. In this way, the marks on the upper and lower surfaces of the wafer can be read at the same time, thereby improving the convenience of use.

[0003] However, the above-mentioned wafer marking identification device does have the following problems and deficiencies when in use and needs to be improved:

[0004] Although it has the function of identifying the markings, it cannot change the angle of light. That is, when different wafer semiconductors are used to identify the markings using the identification device, the different sizes or positions of the markings may cause the identification device to be unable to correctly identify them, and even increase the risk of misjudgment. It may also cause a reflective effect due to the problem of ambient light, which may lead to inaccurate identification.

[0005] Therefore, how to solve the above-mentioned problems and deficiencies of the prior art is the direction that the applicant of the present utility model and related manufacturers engaged in this industry are eager to study and improve. Utility Model Content

[0006] The main purpose of the present invention is to provide a method for controlling the light emission patterns of a plurality of light emitting elements by using a light source refraction member and a circuit substrate, so that the light emission patterns of the light emitting elements can be changed according to demand. In combination with the light source refraction member, the emitted light can be spread over a wider area, making the graphic information on the semiconductor wafer more clearly visible. In other words, the image information captured by the camera device can be clearer and reflection problems caused by insufficient light source or incorrect light source angle can be avoided.

[0007] To achieve the above-mentioned primary objectives, the present invention provides a wafer optical identification device comprising: a camera for capturing image information on a semiconductor wafer; a light-emitting device disposed on one side of the camera, comprising a plurality of light-emitting elements; a circuit substrate disposed on one side of the light-emitting device and connected to the camera and light-emitting devices, for acquiring image information captured by the camera and controlling the switching of each light-emitting element to enable each light-emitting element to operate independently or simultaneously; and a light-reflecting element disposed on one side of the light-emitting device to refract light emitted by each light-emitting element. When the image information captured by the camera is unclear due to light source problems, the circuit substrate controls the light emitted by the light-emitting elements on the light-emitting device to enhance or optimize the light source of the image information after passing through the light-reflecting element. Furthermore, the operating mode of the light-emitting elements can be adjusted to activate the light-emitting elements in the correct position, thereby eliminating problems such as insufficient light source or reflections on the image information and providing a clearer image.

[0008] Wherein, a focus adjustment device for adjusting the focus distance of the camera device is provided on one side of the camera device.

[0009] Among them, the focus adjustment device has an adjustment driving member fixedly combined with the camera device, the adjustment driving member has several fixing parts fixedly combined with the camera device, several sliding groove parts arranged on one side of each fixing part, a driving member receiving groove part arranged between each sliding groove part, and a threaded adjustment part arranged on one side of the driving member receiving groove part, and a limiting member is provided on the side of the adjustment driving member away from the camera device, the limiting member has several guide parts that can be accommodated in the sliding groove part, and a limiting member receiving groove part corresponding to the position of the driving member receiving groove part is provided between each guide part, an elastic element is accommodated in the driving member receiving groove part and the limiting member receiving groove part, and an adjustment member is commonly passed through the limiting member, the adjustment driving member and the elastic element.

[0010] The camera device and the light emitting device are arranged on a bracket component, and the bracket component and the limiting component are locked and combined with an outer cover body.

[0011] Wherein, the camera device and the light emitting device are arranged on a bracket.

[0012] Wherein, a light source one-way piece is provided between the light emitting device and the light source refraction piece.

[0013] The light source one-way piece is provided with a reflective piece at different sides of the light emitting device and the light source refractive piece, and the reflective piece is located in front of the camera device.

[0014] Among them, an AI artificial intelligence chip is set on the circuit substrate to identify graphic information. The AI ​​artificial intelligence chip is a chip that can learn and record graphic information in image information.

[0015] Wherein, a light source intensified lighting group electrically connected to the circuit substrate is provided on at least one side of the light source refraction member.

[0016] The circuit substrate is electrically connected to a power supply element, and the circuit substrate is also electronically connected to a connector that complies with a network communication protocol.

[0017] Through the above technology, the problem that the existing mark recognition device for wafers has the function of recognizing marks but cannot change the angle of light, that is, when different wafer semiconductors use the recognition device for mark recognition, the different sizes or positions of the marks will cause the recognition device to be unable to correctly identify them, and even increase the risk of misjudgment. It is also possible that a reflective effect may be formed due to the problem of ambient light source, thereby causing an inability to accurately identify the problem. This problem can be overcome, thereby achieving the practical progress of the present invention as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional diagram of a preferred embodiment of the utility model.

[0019] Figure 2 It is a cross-sectional view of a preferred embodiment of the present invention.

[0020] Figure 3 This is an exploded view of a preferred embodiment of the present invention.

[0021] Figure 3A This is a structural block diagram of a preferred embodiment of the present utility model.

[0022] Figure 4 This is a schematic diagram of a preferred embodiment of the present invention.

[0023] Figure 5 This is a cross-sectional view of another preferred embodiment of the present invention.

[0024] Figure 6 This is another preferred embodiment of the present invention. Figure 1 .

[0025] Figure 6A This is another preferred embodiment of the present invention. Figure 2 .

[0026] Figure 7 This is a cross-sectional view of another preferred embodiment of the present invention.

[0027] Figure 8 This is a schematic diagram of adjustment of another preferred embodiment of the present utility model.

[0028] Figure 9 This is a schematic diagram of another preferred embodiment of the present invention.

[0029] Figure 10 This is a schematic diagram of light source enhancement according to another preferred embodiment of the present invention.

[0030] Explanation of the accompanying drawings: 1-camera device; 11-image information; 2-light-emitting device; 21-light-emitting element; 211-light source; 3-circuit substrate; 31-AI artificial intelligence chip; 32-processing module; 4-light source refractive member; 51-bracket member; 52-outer cover; 6-light source one-way member; 7-focus adjustment device; 71-adjustment driving member; 711-fixing part; 712-slide groove part; 713-driving member receiving groove part; 714-thread adjustment part; 72-limiting member; 721-guide part; 722-limiting member receiving groove part; 73-elastic element; 74-adjusting member; 8-reflecting member; 91-light source enhanced lighting group; 92-power supply element; 93-connector; A-wafer semiconductor; A1-graphic information; B-manual tool; C-image information path. DETAILED DESCRIPTION

[0031] See also Figures 1 to 4 As shown, it is a three-dimensional diagram and a schematic diagram of a preferred embodiment of the utility model. It can be clearly seen from the figure that the utility model includes:

[0032] A camera device 1 for capturing image and text information A1 on a semiconductor wafer A;

[0033] A light emitting device 2 provided at one side of the camera device 1, comprising a plurality of light emitting elements 21;

[0034] A circuit board 3 provided on one side of the light emitting device 2 and connected to the camera device 1 and the light emitting device 2, for acquiring the image information 11 captured by the camera device 1, performing image and text information A1 recognition, and controlling the operation of each light emitting element 21, so that each light emitting element 21 can operate independently or simultaneously;

[0035] An AI chip 31 provided on the circuit substrate 3 can identify the graphic information A1 and learn and record the graphic information A1 in the image information 11;

[0036] A light source refraction member 4 provided on one side of the light emitting device 2 to refract the light emitted by each light emitting element 21;

[0037] A bracket 51 , on which the camera device 1 and the light emitting device 2 are mounted.

[0038] The graphic information A1 and the image information 11 are the model of the semiconductor wafer A, and include at least one of text, numbers or graphics.

[0039] The imaging device 1 is a video camera or a still camera.

[0040] The light emitting elements 21 are LED lights, and eight of them are arranged neatly as an example. The camera device 1 of this embodiment is arranged in the center of each light emitting element 21 as an example.

[0041] Wherein, the light source refraction member 4 is a convex lens.

[0042] Among them, the image and text information A1 is recognized by optical character recognition technology (OCR). The so-called optical character recognition technology refers to the process of processing and recognizing images or videos containing text content and extracting the text and layout information contained therein. This is an existing known technology and can be implemented using existing chips, so it will not be repeated.

[0043] The circuit substrate 3 has a processing module 32 which can be an integrated circuit or an IC chip. The processing module 32 can identify the graphic information A1 and receive user instructions to control the on / off switching of the light emitting element 21 .

[0044] To identify the graphic information A1 on the semiconductor wafer A, the semiconductor wafer A is first placed in front of the camera device 1. At this time, all the light-emitting elements 21 can be activated to emit light 211. The light source 211 will produce a refraction effect through the light source refraction member 4, similar to a light diffusion function, so that the area illuminated by the light source 211 becomes wider. Correspondingly, the image information 11 captured by the camera device 1 will also be close to the area illuminated by the light source 211. In this way, taking all the light-emitting elements 21 as an example, if the graphic information A1 in the image information 11 is clearly visible and successfully recognized by the optical character recognition technology of the processing module 32, it means that the graphic information A1 has been correctly recognized. Furthermore, if all the light-emitting elements 21 are turned on, but the graphic information A1 in the image information 11 cannot be recognized by the optical character recognition technology of the processing module 32, it means that the correct recognition may be impossible due to insufficient light source 211 or reflection problems. In this case, the user can use the computer's operating interface or physical operation panel to operate and issue instructions to the processing module 32, allowing the processing module 32 to control the light-emitting elements 21 to change modes.

[0045] Taking the aforementioned reflection situation as an example, because the light source refraction member 4 is a convex lens, the light source 211 emitted by the light-emitting element 21 will produce a refraction phenomenon. That is, based on the position of the camera device 1, the captured image information 11 may produce a reflection effect on the graphic information A1 due to the refracted light source 211. When the reflection effect occurs, the graphic information A1 in the image information 11 becomes unclear, making it impossible for the processing module 32 to correctly identify it. Therefore, the user must use the processing module 32 to control the operation of the light-emitting elements 21. For example, out of the eight light-emitting elements 21, only the three light-emitting elements 21 in the top row, or only the three light-emitting elements 21 in the left row, or only two light-emitting elements 21 in the top row and two light-emitting elements 21 in the bottom row can be activated, etc. This means that each light-emitting element 21 in this embodiment can be controlled individually or as a group by the processing module 32. The purpose of changing the lighting mode of the light-emitting elements 21 is that when the user activates the three light-emitting elements 21 in the upper row but still cannot clearly illuminate the graphic information A1, the mode can be changed to only activate the three light-emitting elements 21 in the left vertical row. In other words, the user can freely control the opening and closing of each light-emitting element 21 through the processing module 32 according to needs to achieve the most suitable angle of the light source 211 so that the graphic information A1 can be smoothly recognized by the processing module 32.

[0046] In addition, the AI ​​chip 31 can record the image and text information A1 completed by each optical character recognition performed by the processing module 32, or the user can define the image and text information A1 (such as text) and store it in the record to help speed up the recognition results. In other words, after the processing module 32 is combined with the AI ​​chip 31, it becomes an artificial intelligence optical character recognition (AIOCR). When the image and text information A1 recognized by the processing module 32 is slightly unclear, which may cause the recognition processing time to increase, the AI ​​chip 31 will assist in recognition and comparison by reading the stored image and text information A1 record and comparing it with the unclear image and text information A1. When the AI ​​chip 31 interactively compares and finds the matching image and text information A1 record, it immediately extracts the image and text information A1 record, thereby further achieving the advantage of accelerating the recognition results.

[0047] See also Figure 5As shown in the figure, it is a cross-sectional view of another preferred embodiment of the present invention. It can be clearly seen from the figure that a light source one-way member 6 is provided between the light emitting device 2 and the light source refractive member 4, and the camera device 1 of this embodiment is located below the light source one-way member 6, that is, the relative position relationship between the camera device 1 and the light emitting device 2 is at a right angle and perpendicular to each other, as shown in the figure, and one side of the light source one-way member 6 allows the light source to pass through the light source one-way member 6 to the other side, while the light source incident from the other side of the light source one-way member 6 cannot pass through the light source one-way member 6 to the other side, which means that the light emitted by the light emitting device 2 can pass through the light source one-way member 6 and illuminate the image and text information through the light source refractive member 4, and the camera device 1 uses the reflection effect to shoot the image and text information through the light source one-way member 6 on the other side, which means that the position of the camera device 1 in this case is not limited to its position, and through the design of the light source one-way member 6, the camera device 1 can be moved out of the light emitting device 2, thereby further enhancing the clarity of the image information.

[0048] See also Figures 6 to 10 As shown, it is a decomposition of another preferred embodiment of the utility model Figure 1 As for the schematic diagram of light source enhancement, it can be clearly seen from the figure that the difference between this embodiment and the above-mentioned preferred embodiment is that a focus adjustment device 7 for adjusting the focus distance of the camera device 1 is provided on one side of the camera device 1 of this embodiment, and the focus adjustment device 7 has an adjustment driving member 71 fixedly combined with the camera device 1, and the adjustment driving member 71 has several fixing parts 711 fixedly combined with the camera device 1, several sliding groove parts 712 provided on one side of each fixing part 711, a driving member receiving groove part 713 provided between each sliding groove part 712, and a threaded adjustment part 714 provided on one side of the driving member receiving groove part 713, and a limiting member 72 is provided on the side of the adjustment driving member 71 facing away from the camera device 1, and the limiting member 72 has several guide parts 721 that can be accommodated in the sliding groove part 712, and a screw thread adjustment part 714 is provided between each guide part 721. The position of the driving member groove portion 713 corresponds to the limiting member groove portion 722, and the driving member groove portion 713 and the limiting member groove portion 722 accommodate an elastic element 73, and an adjustment member 74 is commonly provided on the limiting member 72, the adjustment driving member 71 and the elastic element 73. The camera device 1 and the light-emitting device 2 are arranged on a bracket member 51, and the bracket member 51 and the limiting member 72 are locked and combined with an outer cover body 52. ​​In addition, the light source one-way member 6 is provided with a reflective member 8 on different sides of the light-emitting device 2 and the light source refractive member 4, and the reflective member 8 is located in front of the camera device 1. At least one side of the light source refractive member 4 is provided with a light source enhanced light-emitting group 91 electrically connected to the circuit substrate 3, and the circuit substrate 3 is electrically connected to a power supply element 92, and the circuit substrate 3 is informationally connected to a connector 93 that complies with the network communication protocol.

[0049] The fixing portion 711 may be a screw hole, so that a screw can pass through the camera device 1 and the fixing portion 711 to lock the camera device 1 and the adjustment driving member 71 together.

[0050] The threaded adjustment portion 714 is a screw hole, and the adjustment member 74 is a screw, so that the adjustment member 74 can be screwed in the threaded adjustment portion 714 and rotated.

[0051] Among them, when the driving member groove portion 713 corresponds to the limiting member groove portion 722, it becomes a receiving space, and this receiving space can be used to accommodate the elastic element 73, and one end of the elastic element 73 abuts the bottom of the limiting member groove portion 722, and the other end abuts the bottom of the driving member groove portion 713, so that the tension between the adjustment driving member 71 and the limiting member 72 is subjected to the elastic element 73, and the two are supported in reverse.

[0052] Reflector 8 is a mirror. Regarding the placement of this embodiment, the light-emitting device 2, the light-source isolating member 6, and the light-source refraction member 4 are arranged on the same plane and in a horizontal arrangement. Furthermore, the light-source isolating member 6 and reflector 8 are arranged vertically, while the reflector 8 and the camera device 1 are arranged horizontally, as shown in the figure.

[0053] Because the camera device 1 and the light emitting device 2 are mounted on the bracket 51, stability is effectively increased. For example, the design of the bracket 51 makes the camera device 1 more stable and less likely to shake. This helps to increase the clarity of the image and text information. Conversely, it also helps to accelerate the speed of image and text information recognition on the circuit substrate 3, significantly improving performance. As for the light emitting device 2, the light emitting device 2 can also output light more stably, making it less likely that the light source 211 will shake, causing the image and text information in the image information to reflect. Even the image and text information located at the edge of the semiconductor wafer A is less likely to suffer from insufficient light.

[0054] Among them, when the bracket member 51 and the limiting member 72 are locked and combined with the outer cover body 52, the case can be carried and moved without being restricted by geographical location, which greatly increases convenience.

[0055] Let's take adjusting the focus state of the camera device 1 as an example:

[0056] When the focus of the camera device 1 is offset, a manual tool B can be used to engage with the adjustment member 74. At this time, the manual tool B will drive the adjustment member 74 to rotate while rotating, and the adjustment member 74 will also drive the threaded adjustment portion 714 of the focus adjustment device 7 and rotate. At this time, the nut part of the adjustment member 74 is against the outer part of the limit member 72, and the screw part penetrates into the limit member 72 and the adjustment drive member 71, so that when the adjustment member 74 is rotated, it will not move forward due to the cooperation between the nut and the limit member 72, and the adjustment drive member 71 will move forward or backward due to the rotation of the adjustment member 74. At the same time, with the assistance of the elastic element 73, the user can rotate more easily. In this way, when the camera device 1 is out of focus, manual focus adjustment can be performed through the focus adjustment device 7, so that the image information can be kept in the best state at any time and the graphic information can be clearly seen.

[0057] Let’s take the path of light source and the path of captured image information as an example:

[0058] The light source 211 emitted by the light-emitting element 21 can pass through the light source one-way member 6 and the light source refractive member 4 in sequence and illuminate the image and text information on the wafer semiconductor A. The image information path C obtained by the camera device 1 reaches the camera device 1 in sequence through the light source refractive member 4, the light source one-way member 6 and the reflective member 8. In short, the camera device 1 utilizes the longitudinal arrangement of the reflective member 8 and the light source one-way member 6 to allow the camera device 1 to capture the environment outside the light source refractive member 4 when it is arranged below the light-emitting device 2. This positional arrangement can change the overall volume and provide different designs and arrangements based on the environmental space requirements to achieve specific volume requirements.

[0059] Let’s take the case of insufficient light source as an example:

[0060] When the image or text on the semiconductor wafer A is located too close to the edge of the image, resulting in insufficient illumination from the light source of the light-emitting device 2, or when the brightness of the original light source 211 is insufficient, the processing module 32 of the circuit substrate 3 can control the light-enhancing light-emitting group 91 to provide supplemental illumination. In other words, because the light-enhancing light-emitting group 91 is positioned at a relatively angle, it can effectively illuminate the image or text located close to the edge of the image or that is insufficiently bright, thereby compensating for the problem of the light-emitting device 2 having a limited illumination angle or insufficient brightness. Of course, this embodiment uses only one light-enhancing light-emitting group 91 as an example. If multiple light-enhancing light-emitting groups 91 are provided, they can be positioned around the light-refraction member 4.

[0061] In addition, the power supply element 92 takes a power socket as an example, which can provide external power to the circuit substrate 3. Of course, if there is no power supply element 92 that can provide external power, the built-in battery can be used for driving.

[0062] In addition, any information received by the circuit substrate 3, including image information, can be transmitted to an external device, such as a computer system, via an electrical connection line connected to the connector 93, so that the user can remotely control it, which is highly convenient and practical. Of course, if there is no connector 93, a wireless transmission module can be added to the circuit substrate 3 for wireless transmission to an external device, such as a WIFI or Bluetooth antenna.

[0063] Therefore, the key to improving the existing technology of the wafer optical identification device of the present invention lies in:

[0064] First, the light-emitting pattern of the plurality of light-emitting elements 21 is controlled by the light-reflecting member 4 and the circuit substrate 3, so that the light-emitting pattern of the light-emitting elements 21 can be changed according to demand. In combination with the light-reflecting member 4, the emitted light 211 can be spread over a wider area, making the graphic information A1 on the semiconductor wafer A more clearly visible. In other words, the image information 11 captured by the camera device 1 can be clearer, and reflection problems caused by insufficient light source 211 or incorrect angle of the light source 211 will not occur.

[0065] Second, the optical character recognition (OCR) technology of the circuit substrate 3 can achieve the advantages of fast, clear and stable recognition.

[0066] Thirdly, the design of the focus adjustment device 7 provides an advantage of manually adjusting the focus when the image information 11 captured by the camera device 1 is not clear enough and has a focus problem.

[0067] Fourth, by adjusting the design of the driving member 71, the fixing portion 711, the sliding groove portion 712, the driving member receiving groove portion 713, the threaded adjustment portion 714, the limiting member 72, the guiding portion 721, the limiting member receiving groove portion 722, the elastic element 73 and the adjusting member 74, the user can rotate more easily, and through the cooperation of the sliding groove portion 712 and the guiding portion 721, it has a certain sliding stability and is not prone to violent shaking. Accordingly, the image information 11 can be kept in the best state at any time, and the graphic information A1 can be clearly seen.

[0068] Fifth, the design of the bracket 51 stabilizes the camera device 1, preventing it from shaking. This improves the clarity of the image and text information A1 and, in turn, accelerates the speed at which the circuit board 3 recognizes the image and text information A1, significantly enhancing performance. Furthermore, the design of the outer housing 52 not only facilitates the device's relocation without geographical restrictions, but also effectively protects the internal components, including the camera device 1, light-emitting device 2, circuit board 3, light-source refraction member 4, light-source one-way member 6, reflector 8, and light-source enhanced light-emitting assembly 91, from external impact and environmental contamination.

[0069] Sixth, through the design of the light source one-way member 6 , the camera device 1 can be moved out of the light emitting device 2 , so that the design volume of the light emitting device 2 can be effectively reduced.

[0070] Seventh, by longitudinally disposing the reflective member 8 and the one-way light source member 6, the camera device 1 can still capture the environment outside the light source refraction member 4 when it is disposed below the light-emitting device 2. This positional design can change the overall volume and, based on the environmental space requirements, perform different design arrangements to achieve specific volume requirements.

[0071] Eighth, the design of the AI ​​artificial intelligence chip 31 can help speed up the recognition results.

[0072] Ninth, the light-enhancing lighting assembly 91 effectively illuminates the image and text information A1 located in the corners, compensating for the limited illumination angle of the lighting device 2. Furthermore, the power supply element 92 provides external power to the circuit board 3, achieving a stable power output. Furthermore, the connector 93 allows for remote user control, providing a high level of convenience and practicality.

[0073] Although various embodiments of the present invention have been shown and described in this specification, these embodiments are provided by way of example only, and any theories of operation or benefits provided in this specification are intended only as an aid in describing the present invention; such theories and explanations do not bind or limit the claims regarding tissue remodeling achieved by practicing the present invention. A person skilled in the art can now conceive of many changes, modifications, or substitutions without departing from the present invention. It should be understood that various alternatives to the embodiments of the invention described in the specification can be adopted in practicing the present invention. The scope of the present invention, and the methods and structures within the scope of the present invention are intended to include equivalent forms.

[0074] In summary, the wafer optical identification device of the present invention can truly achieve its efficacy and purpose when used, so the present invention is truly a utility model with excellent practicality.

Claims

1. A wafer optical identification device, characterized in that: include: A camera device for capturing image and text information on a semiconductor wafer; a light emitting device provided at one side of the camera device, comprising a plurality of light emitting elements; a circuit board provided on one side of the light emitting device and connected to the camera device and the light emitting device, for obtaining image information captured by the camera device and for controlling the switching of each light emitting element so that each light emitting element operates independently or simultaneously; and A light source refraction member is arranged on one side of the light emitting device to refract the light source emitted by each light emitting element.

2. The wafer optical identification device according to claim 1, wherein: A focus adjustment device for adjusting the focus distance of the camera device is provided on one side of the camera device.

3. The wafer optical identification device according to claim 2, wherein: The focus adjustment device has an adjustment driving member fixedly combined with the camera device, the adjustment driving member has several fixing parts fixedly combined with the camera device, several sliding groove parts arranged on one side of each of the fixing parts, a driving member receiving groove part arranged between each of the sliding groove parts, and a threaded adjustment part arranged on one side of the driving member receiving groove part, and a limiting member is provided at the side of the adjustment driving member away from the camera device, the limiting member has several guide parts that can be accommodated in the sliding groove part, and a limiting member receiving groove part corresponding to the position of the driving member receiving groove part is provided between each of the guide parts, an elastic element is accommodated in the driving member receiving groove part and the limiting member receiving groove part, and an adjustment member is commonly passed through the limiting member, the adjustment driving member and the elastic element.

4. The wafer optical identification device according to claim 3, wherein: The camera device and the light emitting device are arranged on a bracket component, and the bracket component and the limiting component are locked and combined with an outer cover body.

5. The wafer optical identification device according to claim 1, wherein: The camera device and the light emitting device are arranged on a bracket.

6. The wafer optical identification device according to claim 1, wherein: A light source one-way piece is provided between the light emitting device and the light source refraction piece.

7. The wafer optical identification device according to claim 6, wherein: The light source one-way piece is provided with a reflective piece at different sides of the light emitting device and the light source refraction piece, and the reflective piece is located in front of the camera device.

8. The wafer optical identification device according to claim 1, wherein: An AI chip is provided on the circuit substrate for identifying graphic information. The AI ​​chip is a chip capable of learning and recording the graphic information in the image information.

9. The wafer optical identification device according to claim 1, wherein: A light source intensified lighting group electrically connected to the circuit substrate is provided on at least one side of the light source refraction component.

10. The wafer optical identification device according to claim 1, wherein: The circuit substrate is electrically connected to a power supply element, and the circuit substrate is also electronically connected to a connector that complies with a network communication protocol.

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