Low-cost surface-mounted SIP (Session Initiation Protocol) frequency source module

Abstract

The utility model relates to a low-cost surface-mounted SIP (Session Initiation Protocol) frequency source module, which comprises a shielding case and a PCB (Printed Circuit Board) substrate, the PCB substrate unit comprises an integrated VCO phase lock circuit, an amplifying circuit, a power supply control circuit and an enabling control direct current bias voltage input terminal; the integrated VCO phase lock circuit is connected with the amplifying circuit; the enabling control direct current bias voltage input terminal is connected with the integrated VCO phase-locked loop circuit and the amplifying circuit through the power supply control circuit unit; the power supply control circuit unit adopts a power supply conversion filter circuit; the power supply conversion filter circuit is respectively connected with an enabling control direct current bias voltage input terminal, an integrated VCO phase lock circuit and an amplifying circuit; surface-mounted installation is realized by adopting a substrate form, low cost is realized by adopting an integrated packaging device, and the surface-mounted LED display screen has the advantages of low cost, surface-mounted type, stability, reliability, convenience in installation, long service life and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of microwave communications, in particular to a surface-mounted frequency source module. Background Art

[0002] With the development of semiconductor and digital communication technologies, a variety of wireless communication technologies have emerged in recent years. Among these new technologies, UWB (ultra-wideband) technology offers significant advantages for high-speed data transmission over short distances. As a key component of UWB wireless transmitters, research on frequency source modules has garnered significant attention. Utility Model Content

[0003] The purpose of the utility model is to provide a low-cost surface-mount SIP frequency source module with the advantages of simple structure, wide effective bandwidth, stable and reliable operation, etc.

[0004] In order to solve the problems existing in the background technology, the utility model relates to a surface-mount frequency source module, comprising a shielding cover and a PCB substrate, wherein the shielding cover is a nickel silver metal shielding cover; the PCB substrate unit includes an integrated VCO phase-locked circuit, an amplifier circuit, a power supply control circuit and an enable control DC bias voltage input terminal; the integrated VCO phase-locked circuit and the amplifier circuit are connected; the enable control DC bias voltage input terminal is connected to the integrated VCO phase-locked loop circuit and the amplifier circuit through the power supply control circuit unit; the power supply control circuit unit adopts a power conversion filter circuit, and the power conversion filter circuit is respectively connected to the enable control DC bias voltage input terminal, the integrated VCO phase-locked circuit and the amplifier circuit; a substrate form is adopted to realize surface-mount installation, and an integrated surface-mount device is adopted to achieve low cost. The utility model has the advantages of low cost, surface mount, stability, reliability, easy installation, and long service life.

[0005] As a further improvement of the present invention, the power control circuit unit adopts a power conversion filter circuit, which is respectively connected to the enable control DC bias voltage input terminal and the amplifier circuit.

[0006] As a further improvement of the present invention, the surface-mount frequency source module adopts an integrated packaging device to achieve low cost.

[0007] As a further improvement of the present invention, the surface-mount frequency source module adopts a PCB substrate to achieve surface-mount installation of the module.

[0008] As a further improvement of the present invention, the surface-mount frequency source module has a simple structure and consists of a shielding cover and a PCB substrate.

[0009] As a further improvement of the present invention, the amplifier circuit chip is a high-gain, low-noise chip, and the chip integrating the VCO phase-locked circuit unit is a wide-band, high-FOM chip.

[0010] As a further improvement of the present invention, the radio frequency reference signal input terminal and the microwave radio frequency signal output terminal both adopt Pad output.

[0011] As a further improvement of the present invention, the shielding cover is made of nickel silver and has a nickel-plated inner surface.

[0012] After adopting the above technical solution, the utility model has the following beneficial effects:

[0013] 1. Use integrated packaging devices to achieve low cost;

[0014] 2. Use PCB substrate to achieve surface mount installation. This is beneficial for full grounding of the chip and achieves good heat dissipation effect;

[0015] 3. The structure is simple, consisting only of a shielding cover and a PCB substrate, with high reliability and easy installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic diagram of the external structure of an embodiment provided by the utility model;

[0018] Figure 2 A circuit diagram of an embodiment provided by the utility model;

[0019] Reference numerals:

[0020] PV—integrated VCO phase-locked circuit; A—amplifier circuit module; C—power supply control circuit unit. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0022] See also Figure 1-Figure 2This specific embodiment adopts the following technical solutions: a low-cost surface-mount SIP frequency source module, comprising a shielding cover and a PCB substrate, wherein the shielding cover is a nickel silver metal cover; the PCB substrate unit includes an integrated VCO phase-locked circuit unit PV, an amplifier circuit unit A, a power control circuit unit C and an enable control DC bias voltage input terminal DC IN, and the integrated VCO phase-locked circuit unit is connected to the amplifier circuit unit; the enable control DC bias voltage input terminal is connected to the integrated VCO phase-locked loop circuit unit and the amplifier circuit unit through the power control circuit unit; the power control circuit unit C adopts a power conversion filter circuit, which is respectively connected to the enable control DC bias voltage input terminal DC IN and the integrated VCO phase-locked loop circuit PV unit and the amplifier circuit A.

[0023] The amplifier chip of the amplifier circuit unit A is a high-gain, low-noise chip, and the phase-locked chip of the integrated VCO phase-locked circuit unit PV is a wide-band, high-FOM chip.

[0024] The enable control DC bias voltage input terminal DC IN is integrated on the PCB substrate. The signal input by the enable control DC bias voltage input terminal DC IN is processed by the power conversion filter circuit in the power control circuit unit C and directly provides a DC bias voltage to the integrated VCO phase-locked loop circuit PV and the amplifier circuit A.

[0025] The microwave radio frequency reference signal input terminal and the microwave radio frequency signal output terminal are both integrated on the PCB substrate in the form of a pad.

[0026] The surface-mount frequency source module circuit is composed of an integrated VCO phase-locked loop circuit unit PV and an amplifier circuit unit A. A radio frequency reference signal is input into the integrated VCO phase-locked loop circuit unit PV to generate a microwave radio frequency signal.

[0027] When the present invention is in operation, a DC supply voltage signal is input (DC IN) to the enable control DC bias voltage input terminal DC IN, the power conversion filter circuit includes a DC / DC converter and an LC filter circuit, the DC / DC converter uses DC+5V, the LC filter circuit outputs a signal to the DC supply input terminal of the amplifier circuit unit A and the DC supply input terminal of the amplifier circuit unit A to provide power, a 100 MHz radio frequency reference signal is input through the radio frequency reference signal input terminal (RF IN), and then passes through the integrated VCO phase-locked loop circuit unit PV and the amplifier circuit unit A in sequence, and outputs a 10-20 GHz signal (RF OUT).

[0028] Practice has proven that the low-cost surface-mount SIP frequency source module of this embodiment can achieve the following technical indicators:

[0029] (1) Working temperature: -40℃~+60℃;

[0030] (2) Storage temperature: -55℃~+70℃;

[0031] (3) Input reference frequency: 100MHz;

[0032] (4) Input reference power: 0dBm;

[0033] (5) Output RF frequency: 10~20GHz;

[0034] (6) Output RF power: 16±2dBm;

[0035] (7) RF output clutter suppression: ≥60dBc.

[0036] The utility model has the advantages of low cost, surface mount structure, easy assembly and use, stable and reliable signal output and long service life.

[0037] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced within the present invention.

[0038] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A low-cost surface-mount SIP frequency source module, characterized in that: It includes a shielding cover and a PCB substrate; the shielding cover is a nickel silver metal shielding cover; the PCB substrate includes an integrated VCO phase-locked circuit, an amplifier circuit, a power supply control circuit and an enable control DC bias voltage input terminal, and the integrated VCO phase-locked circuit and the amplifier circuit are connected; the enable control DC bias voltage input terminal is connected to the integrated VCO phase-locked loop circuit and the amplifier circuit through the power supply control circuit; the power supply control circuit adopts a power conversion filter circuit, and the power conversion filter circuit is respectively connected to the enable control DC bias voltage input terminal, the integrated VCO phase-locked circuit and the amplifier circuit.

2. A low-cost surface-mount SIP frequency source module according to claim 1, characterized in that: Low cost is achieved by using integrated packaged devices.

3. A low-cost surface-mount SIP frequency source module according to claim 1, characterized in that: The module is surface mounted using a PCB substrate.

4. A low-cost surface-mount SIP frequency source module according to claim 1, characterized in that: The low-cost surface-mount SIP frequency source module has a simple structure and consists of only two parts: a shielding cover and a PCB substrate.

5. The low-cost surface-mount SIP frequency source module according to claim 1, characterized in that: The amplifier circuit chip is a large chip with high gain and low noise, and the integrated VCO phase-locked circuit chip is a wide-band and high FOM chip.

6. The low-cost surface-mount SIP frequency source module according to claim 1, characterized in that: The shielding cover is made of nickel silver and has a nickel-plated inner surface.

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