Outflow test module based on internal insulation direct insertion type plastic package single tube

Abstract

An outflow test module based on internal insulation direct-insertion type plastic package single tubes comprises a heat dissipation bottom plate, a plurality of plastic package single tubes arranged on the heat dissipation bottom plate, a PCB arranged on one side of the plastic package single tubes, and a plurality of overcurrent copper bar assemblies arranged on the two sides of the PCB. The side, facing the plastic package single tubes, of the heat dissipation bottom plate is provided with bosses corresponding to the plastic package single tubes in a protruding mode, the plastic package single tubes are arranged on the bosses in a welded mode, and the PCB is provided with a plurality of holes located among the components. At least one U-shaped groove is formed in the edge position of the PCB and located at the interval of the three-phase alternating current modules. According to the outflow test module, the distance between the plastic package single tube and the heat dissipation bottom plate is controlled by changing the height of the boss, so that the electrical gap is controlled, and the test requirements that the voltage grade of the single tube module is 650-1700 V and the output current is 100-300 A can be met by matching with the overcurrent copper bar assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of power module testing, in particular to an outflow testing module of a straight-plug type plastic-sealed single tube based on internal insulation. Background Art

[0002] With the continuous development and advancement of power electronics, high-power conversion technology has been widely used and plays a vital role. The current and voltage specifications of traditional single-transistor packages are also constantly improving. Existing single-transistor test platforms cannot meet the testing requirements of both single-transistor single-row and dual-transistor double-row modules. Limited by the PCB board's overcurrent capacity, the single-transistor specification test capacity is less than 100A. Due to differences in heat sink baseplates, it cannot be compared horizontally with mainstream modules on the market. Furthermore, existing power module test platforms cannot control the appropriate electrical clearance and creepage distances, which greatly increases the failure rate during testing. Therefore, a stable, accurate, and efficient current measurement platform for testing the outflow capacity of high-current single-transistor packages is urgently needed. Utility Model Content

[0003] In view of this, the present invention provides an outflow test module based on an internally insulated straight-plug plastic-sealed single tube to solve the above problems.

[0004] A flow test module for an internally insulated, plug-in plastic-encapsulated single tube, comprising a heat dissipation baseplate, a plurality of plastic-encapsulated single tubes disposed on the heat dissipation baseplate, a PCB disposed on one side of the plastic-encapsulated single tubes, and a plurality of overcurrent copper busbar assemblies disposed on both sides of the PCB. A boss is protruding from a side of the heat dissipation baseplate facing the plastic-encapsulated single tubes, corresponding to each plastic-encapsulated single tube. The plastic-encapsulated single tubes are welded to the bosses. A plurality of holes are provided on the PCB board, located between various components. At least one U-shaped groove is provided on the edge of the PCB board and located at the interval between three-phase AC modules.

[0005] Furthermore, a plurality of heat dissipation fins are arranged at intervals on a side of the heat dissipation base plate away from the plastic-sealed single tube.

[0006] Furthermore, the plastic-sealed single tube is provided with at least three pins, the three pins are bent toward the PCB board, and the ends of the three pins pass through the PCB board.

[0007] Furthermore, the overcurrent copper busbar assembly includes at least three DC+ overcurrent copper busbars, at least three DC- overcurrent copper busbars respectively arranged on one side of the DC+ overcurrent copper busbar, and at least three AC overcurrent copper busbars correspondingly arranged at one end of the DC+ overcurrent copper busbar.

[0008] Furthermore, the welding end of the DC+ overcurrent copper busbar is bent and extended from a side of the PCB board away from the plastic-encapsulated single tube.

[0009] Furthermore, the welding end of the DC-overcurrent copper busbar is bent and extended from a side of the PCB board close to the plastic-sealed single tube.

[0010] Furthermore, the welding end of the AC overcurrent copper busbar is bent and extended from a side of the PCB board close to the plastic-sealed single tube.

[0011] Compared with the prior art, the outflow test module for a straight-plug, plastic-encapsulated single tube based on internal insulation provided by the present invention controls the distance between the plastic-encapsulated single tube and the heat sink by changing the height of the boss setting, thereby controlling the electrical clearance. Combined with the overcurrent copper busbar assembly, it can meet the test requirements of single-tube modules with a voltage level of 650V-1700V and an output current of 100A-300A. At the same time, the 12 bosses on the heat sink can meet the test requirements of single-tube single-row and double-tube double-row configurations. The holes and U-shaped grooves on the PCB board can control the creepage distance between various components on the PCB board, thereby improving the overall working performance and safety performance of the outflow test module. The position and height structure of the DC+, DC-, and AC overcurrent copper busbars relative to the PDC board are the same as those of the traditional HPD package, and are compatible with the same water channels and capacitor modules as the HPD package, reducing development and use costs. This ensures the overcurrent capability of high-current testing while also improving the compatibility of the module and facilitating testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a structural schematic diagram of the outflow test module based on the internally insulated straight-plug plastic-sealed single tube provided by the utility model.

[0013] Figure 2 for Figure 1 Schematic diagram of the structure of the heat dissipation base plate of the outflow test module based on the internal insulation straight-plug plastic-sealed single tube.

[0014] Figure 3 for Figure 1 Schematic diagram of the structure of the plastic-sealed single tube of the outflow test module based on the internal insulation straight-plug plastic-sealed single tube.

[0015] Figure 4 for Figure 1 A schematic diagram of the structure of the PCB board of the outflow test module based on the internal insulation straight-plug plastic-sealed single tube.

[0016] Figure 5 for Figure 1 Schematic diagram of the structure of the outflow test module based on the internal insulation straight-plug plastic-sealed single tube without the PCB board. DETAILED DESCRIPTION

[0017] The following is a further detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0018] like Figure 1 As shown, it is a structural schematic diagram of the outflow test module of the straight-plug type plastic-sealed single tube based on internal insulation provided by the present invention. The outflow test module of the straight-plug type plastic-sealed single tube based on internal insulation includes a heat dissipation base plate 10, a plurality of plastic-sealed single tubes 20 arranged on the heat dissipation base plate 10, a PCB board 30 arranged on one side of the plastic-sealed single tube 20, and a plurality of overcurrent copper busbar assemblies 40 arranged on both sides of the PCB board 30. It can be imagined that the outflow test module of the straight-plug type plastic-sealed single tube based on internal insulation also includes some other functional modules, such as a discharge module, a temperature measurement module, a test module, etc., which are technologies already known to those skilled in the art and will not be described one by one here.

[0019] Please also refer to Figures 2 to 5 A plurality of heat dissipation fins 11 are arranged at intervals on one side of the heat dissipation base plate 10 away from the plastic-encapsulated single tube 20. The heat dissipation fins 11 are used to cooperate with a heat dissipation channel (not shown in the figure) so that the coolant can flow through these heat dissipation fins 11, thereby dissipating the heat of the plastic-encapsulated single tube 20 arranged on the heat dissipation base plate 10.

[0020] A boss 12 is provided on the side of the heat sink baseplate 10 facing away from the heat sink fins 11, corresponding to each plastic-encapsulated single tube 20. Each plastic-encapsulated single tube 20 is welded to the boss 12. The height of the boss 12 controls the distance between the plastic-encapsulated single tube 20 and the PCD board 30, thereby controlling electrical clearance, reducing module failure rates during use, extending module life, and ensuring the highest quality and performance standards. There are twelve plastic-encapsulated single tubes 20 and twelve bosses 12, respectively, meeting the testing requirements for single-tube, single-row, and dual-tube, double-row configurations.

[0021] The plastic-encapsulated single tube 20 is provided with at least three pins 21. These three pins 21 are bent toward the PCB 30, with their ends extending through the PCB 30 to ensure proper soldering to the PCB 30. The plastic-encapsulated single tube 20 is soldered to the PCB 30 and the overcurrent busbar assembly 40 via the three pins 21, thereby achieving electrical connection and enabling current and signal transmission. The specific operating principle of the plastic-encapsulated single tube 20 is conventional and will not be further elaborated here.

[0022] Several components (not shown) are distributed on the PCB 30, some of which are soldered to the pins 21 to complete the electrical connection. The PCB 30 is provided with a plurality of holes 31, which are arranged between the components. The size and number of holes 31 control the creepage distance between the components, thereby improving the overall performance and safety of the module.

[0023] At least one U-shaped groove 32 is provided at the edge of the PCB board 30 and at the interval between the three-phase AC modules. The opening size of the U-shaped groove 32 can directly affect the creepage distance between components. By changing the opening size of the U-shaped groove 32, the creepage distance between these components can be controlled, thereby further improving the overall operating performance and safety performance of the module.

[0024] The overcurrent copper busbar assembly 40 includes at least three DC+ overcurrent copper busbars 41, at least three DC- overcurrent copper busbars 42 respectively arranged on one side of the DC+ overcurrent copper busbar 41, and at least three AC overcurrent copper busbars 43 correspondingly arranged at one end of the DC+ overcurrent copper busbar 41.

[0025] The soldering end of the DC+ overcurrent copper busbar 41 is bent from the side of the PCB board 30 away from the plastic-encapsulated single tube 20 and extends to the pin 21 of a portion of the plastic-encapsulated single tube 20, thereby performing a soldering operation with the pin 21 at that location to complete an electrical connection. The soldering end of the DC- overcurrent copper busbar 42 is bent from the side of the PCB board 30 close to the plastic-encapsulated single tube 20 and extends to the pin 21 of a portion of the plastic-encapsulated single tube 20, thereby performing a soldering operation with the pin 21 at that location to complete an electrical connection. The soldering end of the AC overcurrent copper busbar 43 is bent from the side of the PCB board 30 close to the plastic-encapsulated single tube 20 and extends to the pin 21 of a portion of the plastic-encapsulated single tube 20, thereby performing a soldering operation with the pin 21 at that location to complete an electrical connection. It should be noted that the heat dissipation base plate 10 in the outflow test module based on internal insulation and plug-in plastic-sealed single tube is suitable for the traditional HPD packaging structure, and the size of the bent terminals of the DC+, DC-, AC overcurrent copper busbars 41, 42, and 43 and the welding position are the same as those of the traditional HPD packaging structure. In this way, while ensuring the high-current test overcurrent capability, it can also improve the compatibility of the module and facilitate testing.

[0026] Compared with the prior art, the outflow test module of the straight-plug plastic-encapsulated single tube based on internal insulation provided by the present invention controls the distance between the plastic-encapsulated single tube 20 and the heat dissipation base plate 10 by changing the height of the boss 12, thereby controlling the electrical clearance. When used with the overcurrent copper busbar assembly 40, it can meet the test requirements of the single-tube module voltage level of 650V-1700V and the output current of 100A-300A. At the same time, the 12 bosses 12 on the heat dissipation base plate 10 can meet the test requirements of the single-tube single-row and double-tube double-row configurations of the single-tube module. The holes 31 and the U-shaped grooves 32 on the PCB board 30 can control the creepage distance between the various components on the PCB board 30, thereby improving the overall working performance and safety performance of the outflow test module. The position and height structure of the DC+, DC-, and AC overcurrent copper bars 41, 42, and 43 relative to the PDC plate 30 are the same as those of the traditional HPD package, and are compatible with the same water channels and capacitor modules as the HPD package, thereby reducing development and use costs. In this way, while ensuring the overcurrent capability of large current testing, the compatibility of the module can also be improved, making testing more convenient.

[0027] The above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements or improvements within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A flow test module based on an internally insulated, plug-in, plastic-sealed single tube, characterized by: The outflow test module of the straight-plug plastic-encapsulated single tube based on internal insulation includes a heat dissipation base plate, several plastic-encapsulated single tubes arranged on the heat dissipation base plate, a PCB board arranged on one side of the plastic-encapsulated single tube, and several overcurrent copper busbar assemblies arranged on both sides of the PCB board. A boss is protruded from the side of the heat dissipation base plate facing the plastic-encapsulated single tube corresponding to each plastic-encapsulated single tube. The plastic-encapsulated single tube is welded on the boss. Several holes are opened on the PCB board between the various components. At least one U-shaped groove is opened at the edge of the PCB board and at the interval of the three-phase AC module.

2. The outflow test module based on an internally insulated, plug-in plastic-sealed single tube according to claim 1, characterized in that: A plurality of heat dissipation fins are arranged at intervals on one side of the heat dissipation base plate away from the plastic-sealed single tube.

3. The outflow test module based on an internally insulated, plug-in plastic-sealed single tube according to claim 1, characterized in that: The plastic-sealed single tube is provided with at least three pins, which are bent toward the PCB board, and the ends of the three pins pass through the PCB board.

4. The outflow test module based on an internally insulated, plug-in, plastic-sealed single tube according to claim 1, characterized in that: The overcurrent copper busbar assembly includes at least three DC+ overcurrent copper busbars, at least three DC- overcurrent copper busbars respectively arranged on one side of the DC+ overcurrent copper busbar, and at least three AC overcurrent copper busbars correspondingly arranged at one end of the DC+ overcurrent copper busbar.

5. The outflow test module based on an internally insulated, plug-in, plastic-sealed single tube according to claim 4, characterized in that: The welding end of the DC+ overcurrent copper busbar is bent and extended from a side of the PCB board away from the plastic-sealed single tube.

6. The outflow test module based on an internally insulated, plug-in, plastic-sealed single tube according to claim 4, characterized in that: The welding end of the DC-overcurrent copper bar is bent and extended from a side of the PCB board close to the plastic-sealed single tube.

7. The outflow test module based on an internally insulated, plug-in plastic-sealed single tube according to claim 4, characterized in that: The welding end of the AC overcurrent copper busbar is bent and extended from a side of the PCB board close to the plastic-sealed single tube.

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