Frequency crack trimming device suitable for hemispherical harmonic oscillator
By designing a frequency splitting adjustment device suitable for a hemispherical resonator and using ion beam sputtering technology to add mass to the hemispherical resonator, the problem of frequency splitting in the existing technology is solved, and efficient frequency adjustment and gyroscope accuracy improvement are achieved.
Patent Information
- Application Number
- CN202422801864.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2034-11-15
AI Technical Summary
Existing technologies make it difficult to effectively adjust frequency decomposition by increasing the mass of the high-frequency axis in a hemispherical resonator, resulting in limited gyroscope accuracy. Existing methods such as laser leveling are prone to thermal damage, and chemical leveling has limited accuracy.
A frequency cracking adjustment device is designed, which includes a quartz cone, a clamping mechanism, a grating mesh and an aperture. Based on the principle of ion beam sputtering, the ion beam is dispersed by the grating mesh to bombard the inner wall of the quartz cone to peel off the quartz particles, and then deposited on the high-frequency axis of the hemispherical resonator through a specific aperture to add mass.
It realizes simple and convenient hemispherical resonator mass adjustment, improves the frequency cracking adjustment efficiency, avoids thermal effect damage, and improves the accuracy and stability of the gyroscope.