Inclined chip cooling fan box and equipment cooling structure

Abstract

The utility model provides an inclined chip heat radiation fan box and an equipment heat radiation structure, the heat radiation fan box comprises a fan box housing, the lower end of the fan box housing is fixed on a base plate, and the central axis of the fan box housing and the base plate are arranged in an included angle. A cooling fan is fixedly arranged on the inner wall of the upper end of the fan box shell. A chip is arranged on the bottom plate and located in the fan box shell, and the chip and the air outlet direction of the cooling fan are correspondingly arranged in an included angle mode. The cooling fan comprises a fan shell, and a motor support used for fixedly arranging a motor is fixedly arranged on the inner wall of the fan shell. A rotating shaft of the motor is fixedly connected with an impeller for air supply through a locking nut. The heat dissipation fan box structure is obliquely arranged relative to the chip, flowing of heat dissipation airflow is facilitated, airflow accumulation disorder is avoided, the heat exchange effect is improved, heat dissipation is conducted quickly, and wind noise can be reduced. In addition, the cooling fan box and the equipment shell are simple in structure and convenient to install, the service life of equipment cooling is long, and the cost of the overall cooling structure is low.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to an inclined chip heat dissipation fan box and an equipment heat dissipation structure. Background Art

[0002] With the advent of the intelligent era and the increasing electronicization of devices, the integration and process of circuits and control modules are also constantly improving. Chips are becoming increasingly widely used in production and daily life, from small household appliances to large industrial equipment. Chips control the operation of various modules and process information in devices. The performance of chips can directly affect the efficiency of operation. A major factor affecting chip performance is temperature. When chips operate, they generate a large amount of heat. The difficulty of dissipating this heat can cause the chip temperature to rise sharply, which can lead to chip burnout or reduce the operating frequency. Therefore, chip heat dissipation is a very important issue.

[0003] Existing chip heat dissipation methods generally include air flow, conduction, and thermal radiation. The air flow method generally achieves heat dissipation by setting a cooling fan at the chip to blow air to the chip. Currently, the fan is generally set directly above the chip to blow air directly to the chip, or to blow air to the heat sink above the chip. However, this layout will cause the airflow reaching the chip to flow upward, colliding with the airflow blowing towards the chip, resulting in turbulent airflow. The airflow after heat exchange with the chip is difficult to discharge or the discharge effect is poor, which greatly reduces the heat dissipation effect and may generate a lot of wind noise.

[0004] To improve cooling, the fan speed is increased by enlarging the heat sink. However, enlarging the heat sink and adding a vapor chamber increases installation complexity, creates shipping issues, introduces EMI (electromagnetic interference), and increases cooling costs. Increasing fan speed increases fan noise, and prolonged high-speed operation shortens the fan's lifespan.

[0005] Therefore, those skilled in the art continue to develop a heat dissipation structure with simple structure, high heat dissipation efficiency, low heat dissipation cost, and low noise. Utility Model Content

[0006] The purpose of the utility model is to overcome the shortcomings of the existing technology and provide an inclined chip cooling fan box and equipment cooling structure to solve the problems of high cooling noise, poor efficiency, high cooling cost and complex installation structure of the cooling fan in the existing technology.

[0007] The utility model provides an inclined chip cooling fan box, which includes: a fan box shell, the lower end of the fan box shell is fixed to the base plate, and the central axis of the fan box shell is set at an angle to the base plate; a cooling fan is fixedly provided on the inner wall of the upper end of the fan box shell; a chip is provided on the base plate, the chip is located inside the fan box shell, and is set at an angle corresponding to the air outlet direction of the cooling fan; the cooling fan includes a fan shell, and the inner wall of the fan shell is fixedly provided with a motor bracket for fixing the motor; the rotating shaft of the motor is fixedly connected to the impeller for supplying air by a locking nut.

[0008] Furthermore, an air outlet is provided on the lower portion of the outer wall of the longer side of the fan box housing. The direction of the airflow driven by the rotation of the impeller is parallel to the central axis direction of the fan box housing. The airflow contacts the chip and turns to move along the chip surface toward the air outlet.

[0009] Furthermore, a wind volume adjustment plate is movably provided on the outer wall of the longer side of the fan box shell, and moving the wind volume adjustment plate can change the size of the air outlet; there are sliding grooves on the fan box shell on both sides of the air outlet, and the wind volume adjustment plates are slidably engaged in the sliding grooves on both sides.

[0010] Furthermore, a handle is provided on the air volume adjustment plate.

[0011] Furthermore, a plurality of counterweight holes for adjusting the rotational balance of the impeller are evenly arranged along the circumference of the impeller hub.

[0012] In another embodiment of the present invention, the heat dissipation fan box further includes a heat sink, and the heat sink is coated on the outside of the chip for heat transfer.

[0013] Furthermore, the heat dissipation fan box also includes heat dissipation fins, which are arranged on the heat sink on the upper part of the chip to increase the heat dissipation area.

[0014] In another embodiment of the present invention, the heat dissipation fan box further includes heat dissipation fins, and the heat dissipation fins are arranged on the upper part of the chip to increase the heat dissipation area.

[0015] The present utility model also provides a device heat dissipation structure, which includes a heat dissipation fan box, a device housing and an exhaust fan, wherein an air inlet is provided at one end of the device housing, and at least one exhaust fan is provided at the other end corresponding to the air inlet. The base plate is provided at the bottom of the device housing, and the heat dissipation fan box is provided inside the device housing and fixed on the upper part of the base plate, covering the chip, and is used to dissipate heat for the chip.

[0016] Furthermore, the air inlet of the fan box housing of the heat dissipation fan box faces the direction of the air inlet hole, and the air outlet faces the direction of the exhaust fan.

[0017] According to the above embodiments, the tilted chip cooling fan box and equipment cooling structure provided by the present invention have at least the following benefits:

[0018] The fan box is tilted relative to the chip, facilitating the flow of cooling air, preventing airflow turbulence and improving heat exchange, rapidly dissipating heat, and reducing wind noise. Furthermore, the heat sink on the chip further enhances heat dissipation and effectively protects the chip.

[0019] The exhaust fan installed on the device casing can create negative pressure inside the casing, quickly guide the airflow in the device casing, and assist the cooling fan box to dissipate heat from the chip, greatly improving the cooling effect.

[0020] The heat dissipation fan box and the device housing have simple structures and are easy to install. The device has a long heat dissipation life and the overall heat dissipation structure has low cost.

[0021] It should be understood that the above general description and the following detailed description are merely exemplary and illustrative and are not intended to limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The following drawings are part of the specification of the present utility model, which illustrate exemplary embodiments of the present utility model. The accompanying drawings and the description of the specification are used to explain the principles of the present utility model.

[0023] Figure 1 This is a cross-sectional view of Example 1 of the inclined chip cooling fan box provided by the present invention.

[0024] Figure 2 This is a top view of the first embodiment of the inclined chip cooling fan box provided by the present invention.

[0025] Figure 3 This is a cross-sectional view of the second embodiment of the inclined chip cooling fan box provided by the present invention.

[0026] Figure 4 This is a cross-sectional view of the third embodiment of the inclined chip cooling fan box provided by the present invention.

[0027] Figure 5 This is a top view of the third embodiment of the inclined chip cooling fan box provided by the present invention.

[0028] Figure 6 This is a cross-sectional view of a fourth embodiment of the inclined chip cooling fan box provided by the present invention.

[0029] Figure 7 This is a structural diagram of the chip heat conduction structure embodiment 1 of the inclined chip heat dissipation fan box provided by the present invention.

[0030] Figure 8 This is a structural diagram of the chip heat conduction structure embodiment 2 of the inclined chip heat dissipation fan box provided by the present invention.

[0031] Figure 9 This is a top view of the equipment heat dissipation structure provided by the utility model.

[0032] Figure 10 This is a side sectional view of the equipment heat dissipation structure provided by the utility model.

[0033] Figure 11 This is a three-dimensional diagram of the equipment heat dissipation structure provided by the utility model.

[0034] Description of reference numerals:

[0035] 1-fan box housing, 2-fan housing, 3-motor, 4-motor bracket, 5-impeller, 6-base plate, 7-chip, 8-air volume adjustment plate, 9-heat sink, 10-heat sink, 11-equipment housing, 12-exhaust fan, 13-air inlet, 14-extension. DETAILED DESCRIPTION

[0036] Various exemplary embodiments of the present invention will now be described in detail. This description should not be considered as limiting the present invention, but should be understood as a more detailed description of certain aspects, features, and embodiments of the present invention.

[0037] It will be apparent to those skilled in the art that various modifications and variations may be made to the specific embodiments described herein without departing from the scope or spirit of the present invention. Other embodiments derived from the present invention will be apparent to those skilled in the art. The present description and examples are intended to be illustrative only.

[0038] The utility model provides a tilted chip cooling fan box, such as Figure 1 and 2The figure shows a schematic structural diagram of the first embodiment of the heat dissipation fan box. In a specific embodiment, the heat dissipation fan box includes: a fan box housing 1, the lower end of the fan box housing 1 is fixed to the base plate 6, and the central axis of the fan box housing 1 is set at an angle to the base plate 6, that is, the upper end opening of the fan box housing 1 is set obliquely upward. In this embodiment, the material of the fan box housing is preferably metal, such as aluminum or copper. The metal housing can achieve internal and external temperature exchange to a certain extent, and can produce some of the effects of heat dissipation fins, which is more conducive to heat dissipation. In this embodiment, the base plate 6 is a circuit board, which is fixed to the bottom of the device housing.

[0039] In addition, in this embodiment, the cross section of the fan box housing 1 is a quadrilateral, which is more convenient for installation.

[0040] A cooling fan is fixedly mounted on the inner wall of the upper end of the fan box housing 1 . The cooling fan is also tilted, and the axis of the cooling fan overlaps with the axis of the fan box housing.

[0041] Chip 7 is mounted on base plate 6 and located inside fan box housing 1. Chip 7 is positioned at an angle to the cooling fan's airflow direction. This ensures that the airflow from the cooling fan reaches directly onto the top surface of chip 7, and the airflow is angled, rather than perpendicular, to the top surface. This facilitates airflow across the top surface of chip 7 and out to the air outlet, preventing turbulence above the chip and improving heat exchange and cooling. Arrows in the diagram indicate the airflow direction.

[0042] Furthermore, the cooling fan includes a fan housing 2, the inner wall of which is fixedly provided with a motor bracket 4 for fixing a motor 3. The rotating shaft of the motor 3 is fixedly connected to the impeller 5 for supplying air via a locking nut. The rotation of the rotating shaft of the motor 3 drives the impeller 5 to rotate, thereby supplying air.

[0043] In a specific embodiment of the present invention, an air outlet is provided on the lower portion of the outer wall of the longer side of the fan box housing 1. The direction of the airflow driven by the rotation of the impeller 5 is parallel to the central axis direction of the fan box housing 1. The airflow contacts the chip 7 and turns to move along the surface of the chip toward the air outlet.

[0044] In this embodiment, the oblique direction blowing directly on the surface of the chip 7 can effectively reduce the fan impedance and ensure that the wind speed flowing to the chip 7 maintains a high flow rate, thereby taking away the heat on the chip surface more quickly and allowing the chip to obtain a lower junction temperature.

[0045] To address the shortcomings of existing heat dissipation technology, changing the horizontal orientation of the cooling fan to a vertical, downward orientation blowing directly at the chip results in increased impedance and reduced airflow. Furthermore, the vertical orientation of the fan's airflow doesn't create an angled relationship with the chip surface, so the fan's airflow largely avoids contact with the chip, making it difficult to remove heat from the chip surface. Existing technology typically adds cooling fins to the chip surface to increase the contact area with the fan's airflow. However, this also creates impedance when the fan blows directly downward at the fins, slowing the fan's airflow through the fins and reducing the chip's heat dissipation efficiency.

[0046] Furthermore, an air volume adjustment plate 8 is movably provided on the outer wall of the longer side of the fan box housing 1 , and the size of the air outlet can be changed by moving the air volume adjustment plate 8 .

[0047] Sliding grooves are provided on the fan box housing 1 on both sides of the air outlet, and both sides of the air volume adjustment plate 8 are slidably engaged in the sliding grooves.

[0048] In addition, a handle is provided on the air volume adjustment plate 8, and the air volume adjustment plate 8 can be conveniently moved by the handle.

[0049] In a specific embodiment of the present invention, a plurality of counterweight holes for adjusting the rotation balance of the impeller 5 are evenly arranged along the circumference of the hub of the impeller 5, so that the rotation of the impeller 5 is more stable and the generation of vibration is reduced.

[0050] like Figure 3 The figure shows the structure of the second embodiment of the tilted chip cooling fan box provided by the present invention. Figure 1 The difference between the embodiments shown is that, in this embodiment, Figure 7 As shown, the heat dissipation fan box further includes a heat sink 9, which is coated on the outside of the chip 7 for heat transfer. Preferably, the heat sink 9 is a diamond sheet.

[0051] There is an inclined airflow passing through the surface of the chip 7, and the airflow will also produce air turbidity, which will cause certain damage to the chip packaging. Therefore, adding a diamond heat sink 9 on the surface of the chip 7 can greatly reduce the air turbidity phenomenon, which can both quickly conduct heat and protect the chip from the influence of air turbidity.

[0052] like Figure 4 and 5 The figure shows the structure of the third embodiment of the tilted chip cooling fan box provided by the utility model. Figure 3The difference between the illustrated embodiment and the illustrated embodiment is that, in this embodiment, an extension 14 is provided on the outer wall of the fan box housing 1 on the side facing the cooling fan air inlet. The extension 14 can be tilted downward to contact and secure the bottom plate 6. The provision of the extension 14 can facilitate the upward flow of air along the extension 14 and reach the cooling fan air inlet, making the airflow process smoother and reducing the significant impedance experienced by the airflow on the outer wall of the fan box housing 1 on the side facing the cooling fan air inlet.

[0053] like Figure 6 The figure shows the structure of the fourth embodiment of the tilted chip cooling fan box provided by the present invention. Figure 3 The embodiment shown differs in that the cooling fan box further includes cooling fins 10, which are positioned on heat sink 9 above chip 7 to increase the heat dissipation area. The extension direction of cooling fins 10 aligns with the direction of airflow over chip 7, reducing airflow impedance and improving heat dissipation efficiency.

[0054] The utility model also provides an embodiment of the fifth embodiment of the tilted chip cooling fan box. Figure 1 The difference of the embodiment shown is that Figure 8 As shown, the cooling fan box also includes a heat dissipation fin 10, which is arranged above the chip 7 to increase the heat dissipation area. The fin extension direction of the heat dissipation fin 10 is the same as the flow direction of the airflow at the chip 7, which can reduce the impedance of the airflow and improve the heat dissipation efficiency.

[0055] The utility model provides a device heat dissipation structure, such as Figure 9-11 Schematic diagram of the heat dissipation structure. In a specific embodiment, the heat dissipation structure includes the above-mentioned heat dissipation fan box, device housing 11 and exhaust fan 12. Among them, an air inlet 13 is provided at one end of the device housing 11, and at least one exhaust fan 12 is provided at the other end corresponding to the air inlet 13. The base plate 6 is provided at the bottom of the device housing 11. The heat dissipation fan box is provided inside the device housing 11 and fixed on the upper part of the base plate 6, and covers the chip 7 for heat dissipation of the chip 7. In this embodiment, the base plate 6 is a circuit board, and the chip 7 is fixed on the circuit board, and the circuit board is fixed at the bottom of the device housing.

[0056] The exhaust fan 12 provided on the device housing 11 can form a negative pressure inside the device housing 11, thereby increasing the speed of airflow entering from the air inlet 13 and the efficiency of air discharge, reducing heat accumulation, and achieving a better heat dissipation effect.

[0057] Furthermore, the air inlet of the fan box housing 1 of the cooling fan box faces the air inlet hole, and the air outlet faces the exhaust fan 12. Since the fan box housing 1 is tilted, its air inlet is also tilted, so in order to ensure smooth airflow, its air inlet is facing the air inlet hole 13.

[0058] The above description is only an illustrative embodiment of the present invention. Without departing from the concept and principle of the present invention, any equivalent changes and modifications made by those skilled in the art should fall within the scope of protection of the present invention.

Claims

1. A tilted chip cooling fan box, characterized in that: The heat dissipation fan box comprises: a fan box housing (1), the lower end of the fan box housing (1) is fixed on a base plate (6), and the central axis of the fan box housing (1) is arranged at an angle to the base plate (6); A heat dissipation fan is fixedly arranged on the inner wall of the upper end of the fan box housing (1); A chip (7) is provided on the bottom plate (6), and the chip (7) is located inside the fan box housing (1) and is arranged at an angle corresponding to the air outlet direction of the cooling fan; The heat dissipation fan comprises a fan housing (2), and a motor bracket (4) for fixing a motor (3) is fixedly provided on the inner wall of the fan housing (2); The rotating shaft of the motor (3) is fixedly connected to an impeller (5) for supplying air via a locking nut.

2. The inclined chip cooling fan box according to claim 1, characterized in that: An air outlet is provided at the lower portion of the outer wall of the longer side of the fan box housing (1); the direction of the airflow driven by the rotation of the impeller (5) is parallel to the central axis direction of the fan box housing (1); the airflow contacts the chip (7) and turns to move along the surface of the chip toward the air outlet.

3. The inclined chip cooling fan box according to claim 2, characterized in that: An air volume adjustment plate (8) is movably provided on the outer wall of the longer side of the fan box housing (1); the size of the air outlet can be changed by moving the air volume adjustment plate (8); The fan box housing (1) is provided with sliding grooves on both sides of the air outlet, and both sides of the air volume adjustment plate (8) are slidably engaged in the sliding grooves.

4. The inclined chip cooling fan box according to claim 3, characterized in that: The air volume adjustment plate (8) is provided with a handle.

5. The inclined chip cooling fan box according to claim 1, characterized in that: A plurality of counterweight holes for adjusting the rotational balance of the impeller (5) are evenly arranged along the circumference of the hub of the impeller (5).

6. The inclined chip cooling fan box according to claim 2, characterized in that: The heat dissipation fan box further comprises a heat sink (9), which is wrapped around the outside of the chip (7) and is used for heat transfer.

7. The inclined chip cooling fan box according to claim 6, characterized in that: The heat dissipation fan box further comprises heat dissipation fins (10), which are arranged on the heat sink (9) on the upper part of the chip (7) to increase the heat dissipation area.

8. The inclined chip cooling fan box according to claim 2, characterized in that: The heat dissipation fan box further comprises heat dissipation fins (10), which are arranged on the upper part of the chip (7) to increase the heat dissipation area.

9. A device heat dissipation structure, characterized in that: The heat dissipation structure comprises a heat dissipation fan box, a device housing (11) and an exhaust fan (12) as described in any one of claims 1 to 8, wherein: An air inlet (13) is provided at one end of the device housing (11), and at least one exhaust fan (12) is provided at the other end corresponding to the air inlet (13). The base plate (6) is provided at the bottom of the device housing (11). The cooling fan box is provided inside the device housing (11) and fixed on the upper part of the base plate (6), covering the chip (7) and used for dissipating heat for the chip (7).

10. The device heat dissipation structure according to claim 9, characterized in that: The air inlet of the fan box housing (1) of the heat dissipation fan box faces the direction of the air inlet hole, and the air outlet faces the direction of the exhaust fan (12).

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