Testing device for power circulation of lead bonding welding spot

Abstract

The utility model discloses a testing device for power circulation of a lead bonding welding spot. The testing device comprises a lead assembly; the wire assembly is connected with the current amplifier; the wire clamping tool bit extends in the vertical direction, the upper end of the wire clamping tool bit penetrates through the current amplifier, the lower end of the wire clamping tool bit is provided with a clamping opening, and the clamping opening is used for clamping a lead bonding welding spot; and the fastening jackscrew is matched with the fixing hole, and the wire clamping tool bit is fixedly connected with the current amplifier through the fastening jackscrew. Through the application of the utility model, the testing device for the power circulation of the lead bonding welding spot is provided, the power circulation test or verification can also be directly carried out on a semi-finished product which is subjected to lead bonding, the power circulation simulation test can also be carried out on a single bonding welding spot, the tedious degree of the test is reduced, and the timeliness of the verification is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a testing device for power cycle of wire bonding solder joints. Background Art

[0002] Power cycling is an important item in the reliability verification of power devices and power modules, and is also a key indicator for measuring the feasibility of wire bonding solutions. As testers pay more and more attention to the power cycling indicators of power devices and power modules, the requirements for the simplicity and accuracy of verification solutions are also increasing.

[0003] Existing testing and verification methods mostly test finished, packaged modules. This means that testing or verification must wait until the encapsulation process is complete before proceeding. Furthermore, after power cycling, if the bond wire condition needs to be checked, the finished module must be non-destructively opened. This results in a cumbersome testing process and poor timeliness in verification. Utility Model Content

[0004] In view of this, in order to solve the above problems, the purpose of the present invention is to provide a wire bonding solder joint power cycle testing device, comprising:

[0005] wire assembly;

[0006] A current amplifier, wherein the wire assembly is connected to the current amplifier, a fixing hole is axially provided in the middle of one end of the current amplifier, and an installation opening is radially provided through one end of the current amplifier, the installation opening being in communication with the fixing hole;

[0007] A wire clamping cutter head, wherein the wire clamping cutter head is extended in a vertical direction, the upper end of the wire clamping cutter head is arranged through the installation opening, and the lower end of the wire clamping cutter head has a clamping opening, and the clamping opening is used to clamp the lead wire bonding solder joint;

[0008] A fastening screw is matched with the fixing hole, and the wire clamping head is fixedly connected to the current amplifier through the fastening screw.

[0009] In another preferred embodiment, the current amplifier includes a main body and a connector, the main body is fixedly connected to the connector, the wire clamping head is fixedly arranged on the connector, and the main body is connected to the wire assembly.

[0010] In another preferred embodiment, the wire clamping head includes: a connecting part, a first clamping part and a second clamping part, the upper end of the connecting part passes through the current amplifier, the upper end of the first clamping part is connected to the lower end of the connecting part, the upper end of the second clamping part is connected to the lower end of the connecting part, and the clamping mouth is formed between the lower end of the first clamping part and the lower end of the second clamping part.

[0011] In another preferred embodiment, the inner contour of the mounting opening matches the outer contour of the thread clamping cutter head.

[0012] In another preferred embodiment, the wire bonding solder joint power cycle test device further comprises: a locking screw, wherein the locking screw is provided through the first clamping portion and the second clamping portion.

[0013] In another preferred embodiment, the outer contour of the main body is cylindrical, the outer contour of the connecting head is cylindrical, and the outer diameter of the main body is greater than the outer diameter of the connecting head.

[0014] In another preferred embodiment, a mounting hole is radially provided on the upper end of the first clamping portion, and a connecting hole is radially provided on the upper end of the second clamping portion, the mounting hole and the connecting hole are arranged opposite to each other, one end of the locking screw passes through the mounting hole and is rotatably connected to the first clamping portion, and the other end of the locking screw passes through the connecting hole and is rotatably connected to the second clamping portion.

[0015] Due to the adoption of the above technical solution, the present invention has the following positive effects compared with the prior art: through the application of the present invention, a test device for power cycling of wire bonding solder joints is provided, and power cycling testing or verification can be directly performed on semi-finished products that have completed wire bonding. Power cycling simulation tests can also be performed on single bonding solder joints, which reduces the complexity of the test and improves the timeliness of verification. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an overall schematic diagram of a wire bonding solder joint power cycle test device of the present invention;

[0017] Figure 2 This is a schematic diagram of the clamping of the wire bonding solder joint power cycle testing device of the present invention.

[0018] In the attached figure:

[0019] 1. Wire assembly; 2. Current amplifier; 3. Wire clamping head; 4. Fastening screw; 5. Main body; 6. Connector; 7. Connecting part; 8. First clamping part; 9. Second clamping part; 10. Locking screw; 11. Bonding solder joint. DETAILED DESCRIPTION

[0020] The following is a clear and complete description of the technical solution of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "inside", "outside", "front", "back", "horizontal", and "vertical" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or component referred to must have a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0022] It should be noted that the terms “horizontal” and “vertical” in the present invention are used to describe a rough positional relationship, rather than a strict “horizontal plane” or “vertical plane”.

[0023] like Figure 1 and Figure 2 As shown, a test device for power cycling of wire bonding solder joints of a preferred embodiment is shown, comprising: a wire assembly 1; a current amplifier 2, the wire assembly 1 is connected to the current amplifier 2, a fixing hole is axially provided in the middle of one end of the current amplifier 2, and a mounting opening is radially provided through one end of the current amplifier 2, and the mounting opening is connected to the fixing hole; a wire clamping head 3, the wire clamping head 3 is extended in the vertical direction, the upper end of the wire clamping head 3 is passed through the mounting opening, and the lower end of the wire clamping head 3 has a clamping opening, and the clamping opening is used to clamp the wire bonding solder joint 11; a fastening screw 4, the fastening screw 4 matches the fixing hole, and the wire clamping head 3 is fixedly connected to the current amplifier 2 through the fastening screw 4. Furthermore, the tested bonding solder joint 11 is moved to the clamping opening of the wire clamping head 3 by a mechanical device, and the lead bonding solder joint 11 is clamped through the clamping opening of the wire clamping head 3, and then the minimum peeling force is applied to the bonding point by the mechanical device. According to the test requirements of the power cycle, the current amplifier 2 is controlled to output a current of a specific intensity to the bonding point. When the bonding surface of the bonding solder joint 11 has insufficient bonding force due to power cycle fatigue, the bonding solder joint 11 will be peeled off from the bonding surface. After the bonding solder joint 11 is peeled off, the current output stops, and information such as the number of power cycles is recorded.

[0024] Furthermore, as a preferred embodiment, the wire assembly 1 is electrically connected to the current amplifier 2 , and the current amplifier 2 is electrically connected to the wire clamping head 3 , so that the current can be transferred from the wire clamping head 3 to the bonding solder joint 11 .

[0025] Furthermore, as a preferred embodiment, the wire assembly 1 includes a first wire and a second wire, and both the first wire and the second wire are connected to the current amplifier 2 .

[0026] Furthermore, as a preferred embodiment, the mechanical device is preferably a robotic arm or a three-axis mobile platform.

[0027] Furthermore, as a preferred embodiment, the current amplifier 2 includes: a main body 5 and a connector 6, the main body 5 is fixedly connected to the connector 6, the wire clamping head 3 is fixedly arranged on the connector 6, and the main body 5 is connected to the wire assembly 1.

[0028] Furthermore, as a preferred embodiment, one end of the fastening screw 4 is arranged to abut against the wire clamping cutter head 3. Furthermore, the fastening screw 4 fixes the wire clamping cutter head 3 in the current amplifier 2, thereby preventing the wire clamping cutter head 3 from moving or loosening during the test process.

[0029] Furthermore, as a preferred embodiment, the upper end of the thread clamping cutter head 3 is provided with a groove, and the groove matches the fastening top screw 4.

[0030] Furthermore, as a preferred embodiment, the wire clamping head 3 includes: a connecting portion 7, a first clamping portion 8, and a second clamping portion 9. The upper end of the connecting portion 7 passes through the current amplifier 2, the upper end of the first clamping portion 8 is connected to the lower end of the connecting portion 7, and the upper end of the second clamping portion 9 is connected to the lower end of the connecting portion 7. A clamping opening is formed between the lower end of the first clamping portion 8 and the lower end of the second clamping portion 9. Furthermore, by controlling the width of the clamping opening between the first clamping portion 8 and the second clamping portion 9, different types of bonding points can be effectively clamped.

[0031] Furthermore, as a preferred embodiment, the inner contour of the mounting opening matches the outer contour of the thread clamping cutter head 3 .

[0032] Furthermore, as a preferred embodiment, the present invention further comprises a locking screw 10, which is provided through the first clamping portion 8 and the second clamping portion 9. Furthermore, the locking screw 10 is used to limit the relative position of the first clamping portion 8 and the second clamping portion 9, that is, the size of the opening of the clamping opening.

[0033] Furthermore, as a preferred embodiment, the locking screw 10 is preferably a half-thread screw.

[0034] Furthermore, as a preferred embodiment, the outer contour of the main body 5 is cylindrical, the outer contour of the connecting head 6 is cylindrical, and the outer diameter of the main body 5 is greater than the outer diameter of the connecting head 6.

[0035] Furthermore, as a preferred embodiment, a mounting hole is provided through the upper end of the first clamping portion 8, and a connecting hole is provided through the upper end of the second clamping portion 9. The mounting hole and the connecting hole are arranged opposite to each other. One end of the locking screw 10 passes through the mounting hole and is rotatably connected to the first clamping portion 8, and the other end of the locking screw 10 passes through the connecting hole and is rotatably connected to the second clamping portion 9.

[0036] Furthermore, as a preferred embodiment, the threaded end of the locking screw 10 passes through the mounting hole, and the unthreaded end of the locking screw 10 passes through the connecting hole. By screwing the locking screw 10, the cap head of the locking screw 10 is abutted against the outer side of the second clamping portion 9, and the threaded end of the locking screw 10 is rotated relative to the mounting hole, and a matching internal thread is provided in the mounting hole to drive the first clamping portion 8 closer to or away from the second clamping portion 9, thereby adjusting the opening size of the clamping mouth.

[0037] The above description is only a preferred embodiment of the present invention and does not limit the implementation method and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A test device for wire bonding solder joint power cycling, characterized in that: include: wire assembly; A current amplifier, wherein the wire assembly is connected to the current amplifier, a fixing hole is axially provided in the middle of one end of the current amplifier, and an installation opening is radially provided through one end of the current amplifier, the installation opening being in communication with the fixing hole; A wire clamping cutter head, wherein the wire clamping cutter head is extended in a vertical direction, the upper end of the wire clamping cutter head is arranged through the installation opening, and the lower end of the wire clamping cutter head has a clamping opening, and the clamping opening is used to clamp the lead wire bonding solder joint; A fastening screw is matched with the fixing hole, and the wire clamping head is fixedly connected to the current amplifier through the fastening screw.

2. The wire bonding solder joint power cycle testing device according to claim 1, wherein: The current amplifier comprises a main body and a connector, wherein the main body is fixedly connected to the connector, the wire clamping head is fixedly arranged on the connector, and the main body is connected to the wire assembly.

3. The wire bonding solder joint power cycle testing device according to claim 1, wherein: The wire clamping cutter head includes: a connecting part, a first clamping part and a second clamping part, the upper end of the connecting part passes through the current amplifier, the upper end of the first clamping part is connected to the lower end of the connecting part, the upper end of the second clamping part is connected to the lower end of the connecting part, and the clamping port is formed between the lower end of the first clamping part and the lower end of the second clamping part.

4. The wire bonding solder joint power cycle testing device according to claim 1, wherein: The inner contour of the installation opening matches the outer contour of the thread clamping cutter head.

5. The wire bonding solder joint power cycle testing device according to claim 1, wherein: Also includes: A locking screw is provided through the first clamping portion and the second clamping portion.

6. The wire bonding solder joint power cycle testing device according to claim 2, wherein: The outer contour of the main body is cylindrical, the outer contour of the connecting head is cylindrical, and the outer diameter of the main body is greater than the outer diameter of the connecting head.

7. The wire bonding solder joint power cycle testing device according to claim 3, wherein: A mounting hole is provided through the upper end of the first clamping part, and a connecting hole is provided through the upper end of the second clamping part. The mounting hole and the connecting hole are arranged opposite to each other, one end of the locking screw passes through the mounting hole and is rotatably connected to the first clamping part, and the other end of the locking screw passes through the connecting hole and is rotatably connected to the second clamping part.

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