Heat dissipation device for computer

Abstract

The utility model relates to a radiating device for a computer. The radiating device comprises a radiator, a cooling pipe and a radiating fan, a clamping groove is formed in the outer side end of the radiator; the cooling pipe is embedded in the radiator; the cooling fan comprises a shell and fan blades, the fan blades are rotationally arranged in the shell, the shell is provided with an extension plate, clamping blocks are arranged on the inner side of the extension plate and clamped into the clamping grooves, and the cooling fan is detachably connected with the radiator. The cooling fan and the radiator can be conveniently assembled and disassembled through the matching of the clamping blocks and the clamping grooves, so that the cooling fan can be quickly disassembled when the radiator needs to be subjected to ash removal treatment, and the problems that the existing cooling fan is inconvenient to disassemble, the radiator is subjected to the ash removal treatment, and the heat dissipation efficiency is high are effectively solved. Therefore, the heat dissipation effect of the computer host is influenced, and the computer host is easy to damage. Meanwhile, the heat dissipation speed can be increased, and the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation device for a computer. Background Art

[0002] Computers, commonly known as computers, are modern electronic computing machines used for high-speed calculations. They can perform both numerical and logical calculations, and also have storage and memory functions. They are modern intelligent electronic devices that can run according to programs and automatically and rapidly process massive amounts of data. Computer use is becoming increasingly common in China, with the number of Chinese computer users constantly climbing and the level of computer application continuously improving. This has particularly achieved remarkable results in the fields of the internet, communications, and multimedia. Naturally, computer heat dissipation is inseparable from the computer host heat dissipation device.

[0003] The computer host cooling device is used to cool the computer host. The cooling device generally includes a cooling fan and a radiator composed of multiple cooling fins. However, the current cooling device generally fixes the cooling fan and the radiator by screwing, which makes it inconvenient to remove the cooling fan and clean the radiator, affecting the cooling effect of the computer host and easily causing damage to the computer host. Utility Model Content

[0004] Based on this, it is necessary to provide a computer cooling device to address the problem that the cooling fan and the radiator in the current cooling device are fixed by screws, which makes it inconvenient to remove the cooling fan and clean the radiator, affecting the cooling effect of the computer host and easily causing damage to the computer host.

[0005] A heat dissipation device for a computer, comprising:

[0006] A radiator, wherein the outer end of the radiator is provided with a snap-in groove;

[0007] a cooling pipe embedded in the radiator; and

[0008] A cooling fan includes a shell and fan blades, the fan blades are rotatably arranged in the shell, the shell is provided with an extension plate, the inner side of the extension plate is provided with a clamping block, the clamping block is clamped into the clamping groove, and the cooling fan is detachably connected to the radiator.

[0009] The above-mentioned computer heat dissipation device can realize convenient assembly and disassembly between the cooling fan and the radiator through the cooperation of the clamping block and the clamping slot. In this way, when the radiator needs to be cleaned, the cooling fan can be quickly removed, which effectively solves the problem that the current cooling fan is inconvenient to remove and clean the radiator, thereby affecting the heat dissipation effect of the computer host and easily causing damage to the computer host; at the same time, the cooperation of the radiator, cooling pipe and cooling fan can accelerate the heat dissipation speed and achieve good heat dissipation effect.

[0010] In one embodiment, the heat sink includes a connecting plate, a base plate and a heat dissipation member, the connecting plate is fixedly connected to the base plate, the bottom of the connecting plate extends out from the bottom of the base plate, and the heat dissipation member is fixedly connected to the base plate.

[0011] In one embodiment, the heat sink includes a plurality of heat sink fins, the plurality of heat sink fins are arranged at equal intervals along the length direction of the base plate, and the cooling pipe is passed through the plurality of heat sink fins.

[0012] In one embodiment, the heat dissipation fins are provided with heat dissipation holes, and the heat dissipation holes are arranged obliquely from top to bottom along the width direction of the base plate.

[0013] In one embodiment, the cooling pipe includes a liquid inlet section, a first bending section, a fixed section, a second bending section and a liquid outlet section, one end of the liquid inlet section extends out of the heat dissipation fin, and the other end of the liquid inlet section is connected to the first bending section, a fixing groove is provided on the bottom plate and the connecting plate, the fixed section is fixed in the fixing groove, the fixed section connects the first bending section and the second bending section, one end of the liquid outlet section is connected to the second bending section, and the other end of the liquid outlet section extends out of the heat dissipation fin.

[0014] In one embodiment, the liquid inlet section, the liquid outlet section and the fixed section are arranged in parallel, the liquid inlet section and the liquid outlet section are located on the same horizontal plane, and the fixed section is located below the liquid inlet section and the liquid outlet section.

[0015] In one embodiment, the computer heat dissipation device further includes a mounting plate, the mounting plate is fixedly connected to the base plate, and the mounting plate is provided with a mounting hole for fixed connection to a computer processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an assembly structure diagram of a heat dissipation device for a computer in one embodiment of the present utility model;

[0017] Figure 2 For example Figure 1 The internal structure diagram of the heat dissipation device for the computer shown;

[0018] Figure 3 For example Figure 1 The diagram shows the structure of the cooling pipe in the heat dissipation device for computers.

[0019] The meanings of the numbers in the accompanying drawings are:

[0020] 100-computer cooling device;

[0021] 10- radiator, 11- connecting plate, 12- bottom plate, 13- heat sink, 131- heat dissipation fins, 1311- heat dissipation through hole, 132- card slot, 14- fixing slot;

[0022] 20-cooling pipe, 21-liquid inlet section, 22-first bending section, 23-fixed section, 24-second bending section, 25-liquid outlet section;

[0023] 30-cooling fan, 31-housing, 311-extension plate, 312-clamping block, 32-fan blade;

[0024] 40-Mounting plate. DETAILED DESCRIPTION

[0025] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0028] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0029] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0031] See also Figure 1 and Figure 2 , is a computer heat dissipation device 100 according to an embodiment of the present invention, comprising a radiator 10, a cooling pipe 20 and a cooling fan 30; the cooling pipe 20 is embedded in the radiator 10, and the cooling fan 30 is arranged above the radiator 10.

[0032] See also Figure 1 and Figure 2The heat sink 10 includes a connecting plate 11, a base plate 12, and a heat sink 13. The connecting plate 11 is fixedly connected to the base plate 12, with the bottom of the connecting plate 11 extending beyond the bottom of the base plate 12. The heat sink 13 is fixedly connected to the base plate 12 and includes a plurality of heat sink fins 131. Each heat sink 131 has a recess at its outer end. The plurality of heat sink fins 131 are arranged equidistantly along the length of the base plate 12, and a snap-in slot 132 is provided at the outer end of the heat sink 13. The cooling pipe 20 passes through the plurality of heat sink fins 131. The heat sink fins 131 are provided with heat dissipation holes 1311, which are arranged obliquely from top to bottom along the width of the base plate 12. In this way, when the cooling fan 30 delivers cooling air to the heat sink fins 131, the cooling air passes through the heat sink 1311, accelerating the heat dissipation and improving the heat dissipation effect.

[0033] See also Figure 3 The cooling pipe 20 includes a liquid inlet section 21, a first bent section 22, a fixed section 23, a second bent section 24, and a liquid outlet section 25. The liquid inlet section 21, the liquid outlet section 25, and the fixed section 23 are arranged in parallel. The liquid inlet section 21 and the liquid outlet section 25 are located on the same horizontal plane. The fixed section 23 is located below the liquid inlet section 21 and the liquid outlet section 25. One end of the liquid inlet section 21 extends outside the heat dissipation fins 131, and the other end of the liquid inlet section 21 is connected to the first bent section 22. The bottom plate 12 and the connecting plate 11 are provided with a fixing groove 14. The fixed section 23 is fixedly disposed in the fixing groove 14. The fixed section 23 connects the first bent section 22 and the second bent section 24. One end of the liquid outlet section 25 is connected to the second bent section 24, and the other end of the liquid outlet section 25 extends outside the heat dissipation fins 131.

[0034] See also Figure 1 and Figure 2 The cooling fan 30 includes a shell 31 and fan blades 32. The fan blades 32 are rotatably arranged in the shell 31. The shell 31 is provided with an extension plate 311. The inner side of the extension plate 311 is provided with a clamping block 312. The clamping block 312 is clamped into the clamping groove 132. The cooling fan 30 is detachably connected to the radiator 10.

[0035] See also Figure 1 and Figure 2The computer heat sink 100 further includes a mounting plate 40, which is fixedly connected to the base plate 12 and has mounting holes for securing the computer processor. Four mounting plates 40 are provided, each positioned around the base plate 12. These mounting plates 40 allow the computer heat sink 100 to be secured to the computer CPU, dissipating heat and cooling the CPU.

[0036] The computer heat sink 100 of this embodiment operates as follows: during operation, the connecting plate 11 is in direct contact with the computer CPU. The computer heat sink 100 is fixed to the computer CPU via the mounting plate 40. Heat from the computer CPU is thereby transferred to the connecting plate 11. The heat from the connecting plate 11 is then transferred to the heat sink fins 131 via the base plate 12. Coolant is injected into the cooling tube 20 to cool the heat sink fins 131, accelerating heat dissipation and achieving a better heat dissipation effect. The cooling fan 30 delivers cooling air to the heat sink fins 131, which passes through the heat dissipation holes 1311, accelerating heat dissipation and achieving a better heat dissipation effect. When the radiator 10 needs to be cleaned, the extension plate 311 can be manually pulled out to remove the engaging block 312 from the engaging slot 132. This facilitates assembly and disassembly, effectively resolving the problem of the current heat sink 30 being difficult to remove and clean, thereby affecting the heat dissipation effect of the computer host and easily causing damage to the computer host.

[0037] The beneficial effects of the present invention are as follows: the cooperation between the clamping block 312 and the clamping slot 132 can realize convenient assembly and disassembly between the cooling fan 30 and the radiator 10, so that when the radiator 10 needs to be cleaned, the cooling fan 30 can be quickly removed, which effectively solves the problem that the current cooling fan 30 is inconvenient to remove and clean the radiator 10, thereby affecting the cooling effect of the computer host and easily causing damage to the computer host; at the same time, the cooperation of the radiator 10, the cooling pipe 20 and the cooling fan 30 can accelerate the heat dissipation speed and achieve a good heat dissipation effect.

[0038] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A heat dissipation device for a computer, characterized in that: include: A radiator, wherein the outer end of the radiator is provided with a snap-in groove; A cooling pipe, wherein the cooling pipe is embedded in the radiator; as well as A cooling fan includes a shell and fan blades, the fan blades are rotatably arranged in the shell, the shell is provided with an extension plate, the inner side of the extension plate is provided with a clamping block, the clamping block is clamped into the clamping groove, and the cooling fan is detachably connected to the radiator.

2. The computer heat dissipation device according to claim 1, wherein: The radiator includes a connecting plate, a bottom plate and a heat dissipation member, the connecting plate is fixedly connected to the bottom plate, the bottom of the connecting plate extends out from the bottom of the bottom plate, and the heat dissipation member is fixedly connected to the bottom plate.

3. The computer heat dissipation device according to claim 2, wherein: The heat sink comprises a plurality of heat sink fins, which are arranged at equal intervals along the length direction of the base plate, and the cooling pipe is passed through the plurality of heat sink fins.

4. The computer heat dissipation device according to claim 3, wherein: The heat dissipation fins are provided with heat dissipation through holes, and the heat dissipation through holes are arranged obliquely from top to bottom along the width direction of the bottom plate.

5. The computer heat dissipation device according to claim 3, wherein: The cooling pipe includes a liquid inlet section, a first bending section, a fixed section, a second bending section and a liquid outlet section, one end of the liquid inlet section extends out of the heat dissipation fins, and the other end of the liquid inlet section is connected to the first bending section. The bottom plate and the connecting plate are provided with a fixing groove, the fixed section is fixedly provided in the fixing groove, the fixed section connects the first bending section and the second bending section, one end of the liquid outlet section is connected to the second bending section, and the other end of the liquid outlet section extends out of the heat dissipation fins.

6. The computer heat dissipation device according to claim 5, wherein: The liquid inlet section, the liquid outlet section and the fixed section are arranged in parallel, the liquid inlet section and the liquid outlet section are located on the same horizontal plane, and the fixed section is located below the liquid inlet section and the liquid outlet section.

7. The computer heat dissipation device according to claim 2, wherein: It also includes a mounting plate, which is fixedly connected to the base plate and is provided with mounting holes for fixed connection with a computer processor.

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